Patent Application
20150082890
1. Technical Field
Embodiments generally relate to fingerprint sensing. More particularly, embodiments relate to the use of flexible substrates to deploy ultrasonic fingerprint sensors in curved structures and/or pre-existing design elements.
2. Discussion
Fingerprint sensors may be used to identify and/or authenticate users in a variety of settings. Ultrasonic imaging systems may provide better accuracy and/or quality relative to optical scanners due to an ability to more effectively identify fingerprint ridges (as well as the areas between ridges) in sub-optimal conditions (e.g., environmental contamination). Conventional ultrasonic solutions, however, may be limited to bulky probe designs.
The various advantages of the embodiments of the present invention will become apparent to one skilled in the art by reading the following specification and appended claims, and by referencing the following drawings, in which:
The top electrode 22 may generally function as a read surface for the identification of fingerprints. More particularly, the top electrode 22 and the bottom electrode 14 may form capacitors around the vacuum cavities 16, wherein application of a direct current (DC) and/or alternating current (AC) voltage across the vacuum cavities 16 may cause the membranes 20 to vibrate. The return echo may be captured and analyzed to identify a fingerprint, a toeprint and/or heartbeat characteristics of a human finger and/or toe. For example, a binary determination may be made for each capacitor as to whether the corresponding membrane 20 is resonating after a given excitation. The binary results may be used to create a highly accurate map of the ridges and valleys of the fingerprint and/or toeprint, as well as the unique heartbeat trace of an individual.
The flexible substrate 12 may be initially deposited on a photoresist layer (not shown) that rests on a silicon carrier wafer (not shown). In such a case, the silicon carrier wafer may be removed and the photoresist layer may be etched away as final steps to the fabrication process. As will be discussed in greater detail, the use of the flexible substrate 12 may enable the ultrasonic transducer array 10 to be installed and/or deployed in a wide variety of settings and/or devices.
For example, the ultrasonic transducer array 10 may be embedded in an external component 24 such as, for example, the skin of a computing platform, the grip of a security device (e.g., handgun, knife, electroshock weapon, pepper spray, etc.), the handle of a vehicle door, and so forth. The external component 24 may also be a button/key of a keyboard, wherein the button/key has an additional function that is separate from identification of fingerprints.
For example,
Moreover,
Additionally,
As will be discussed in greater detail, the electronics may selectively activate/deactivate one or more features of the security devices based on the fingerprint identification and/or user authentication results. For example, the ability to fire the handgun 28 (
The button 58, which may or may not include a curved profile, may generally have a function that is separate from the identification of fingerprints. In the illustrated example, the separate function is that of a shift key on a keyboard. Thus, the illustrated approach incorporates the fingerprint reader into an existing design element. Moreover, embedding the ultrasonic transducer array 60 into the button 58 may enable existing usage patterns to be leveraged—for example, pushing the button 58 (or any other button on the keyboard) may already be used to wake a device from a power saving mode (e.g., sleep, hibernate, etc.). In such a case, pushing the button 58 may also initiate an authentication of the user based on the fingerprint that is read during the push of the button 58, wherein the authentication may bypass other authentication methods such as password or PIN (personal identification number) based solutions.
The illustrated button 58 also includes a target indicator (e.g., logo, illustration) 62 adjacent to the read surface of the ultrasonic transducer array 60. The target indicator 62 may visually inform the user as to where on the external profile of the button 58 the user may place his or her finger to conduct a fingerprint scan, and where on the external profile of the button 58 the user may place his or her finger to activate the other function of the button 58 (e.g., the shift function). Other buttons such as, for example, Home buttons on smart phones and/or tablet computers, may also use the illustrated approach.
Turning now to
Moreover, an inertial sensor such as an accelerometer or gyroscope may output the orientation of the system containing the architecture 64. In such a case, the processor 64b may compare that orientation to known orientations determine if the system is being held properly (e.g., pointing away from the user, up, down, etc.). If the signals from the position sensor 64c indicate that, for example, the system is not located in an approved place or the system not being held properly, the processor 64b may deactivate one or more features of the system as a safety measure. Signals from one or more radio modules 64d (e.g., WiFi/Wireless Fidelity, e.g., Institute of Electrical and Electronics Engineers/IEEE 802.11-2007, Wireless Local Area Network/LAN Medium Access Control (MAC) and Physical Layer (PHY) Specifications, Bluetooth, e.g., IEEE 802.15.1-2005, Wireless Personal Area Networks, etc.) may also be used to determine position and other characteristics that may be useful in the fingerprint identification and/or user authentication processes. Moreover, after a predetermined number of unsuccessful attempts to “login”, a signal from the radio module may be used to send a “panic” or “attempted break-in” signal to a central monitoring system. The illustrated architecture 64 also includes a power module 64e to manage, balance, supply and/or harvest power for the architecture 64.
Illustrated block 68 provides a flexible substrate such as, for example a polymer layer deposited on a photoresist layer, which is deposited on a silicon carrier wafer. An ultrasonic transducer array may be coupled to the flexible substrate at block 70, wherein the silicon carrier wafer and photoresist layer may be removed from the flexible substrate once the ultrasonic transducer array has been coupled to the flexible substrate. Block 72 may embed the ultrasonic transducer array into an external component having a curved profile. In one example, the ultrasonic transducer array includes a read surface that conforms to the curved profile. If the external component is a button having a function that is separate from identification of fingerprints, block 72 might also involve disposing (e.g., printing, stamping, engraving, etc.) a target indicator on the curved profile adjacent to the read surface. In addition, a processor may be configured at block 74 to identify fingerprints based on signals from the ultrasonic transducer array. The processor may be coupled to the ultrasonic transducer array at block 76.
Turning now to
If, on the other hand, the device is in a valid position, illustrated block 86 receives a signal from an ultrasonic transducer array embedded in an external component of the mobile device. The external component may include, for example, a grip of a security device, a skin of a computing platform, a button, and so forth. As already noted, the external component may have a curved profile, wherein the ultrasonic transducer array is embedded in the external component and includes a read surface that conforms to the curved profile.
The signal from the ultrasonic transducer array may be used at block 88 to identify a fingerprint and conduct an authentication of a user of the device. Thus, the illustrated approach effectively uses the signal from the position sensor and/or radio module to trigger the authentication. The authentication may involve comparing the identified fingerprint to the fingerprints of one or more known individuals. In this regard, the authentication system may be trained. For example, the training may be particularly advantageous for systems in which the ultrasonic transducer array is embedded in a button, as some individuals may not always type on a keyboard or mouse button using the “same” finger every time. If it is determined at block 90 that the authentication was unsuccessful (e.g., no fingerprint match or a match to an unauthorized individual was found), block 84 may deactivate one or more features of the device. If the authentication was successful (e.g., a fingerprint match to an authorized individual was found), illustrated block 92 activates one or more features of the device.
If it is determined at block 104 that the authentication was unsuccessful, illustrated block 84 deactivates one or more features of the mobile device. If, on the other hand, the authentication was successful, one or more features of the mobile device may be activated at block 92.
Turning now to
The illustrated IO module 112, sometimes referred to as a Southbridge or South Complex of a chipset, functions as a host controller and communicates with the radio module 116, which could provide off-platform communication functionality for a wide variety of purposes such as, for example, cellular telephone (e.g., Wideband Code Division Multiple Access/W-CDMA (Universal Mobile Telecommunications System/UMTS), CDMA2000 (IS-856/IS-2000), etc.), WiFi, 4G LTE (Fourth Generation Long Term Evolution), Bluetooth, WiMax (e.g., IEEE 802.16-2004, LAN/MAN Broadband Wireless LANS), Global Positioning System (GPS), spread spectrum (e.g., 900 MHz), and other radio frequency (RF) telephony purposes. Other standards and/or technologies may also be implemented in the radio module 116. The IO module 112 may also include one or more wireless hardware circuit blocks to support such functionality. Although the processor 108 and IO module 112 are illustrated as separate blocks, the processor 108 and IO module 112 may be implemented as a system on chip (SoC) on the same semiconductor die.
The system memory 114 may include, for example, double data rate (DDR) synchronous dynamic random access memory (SDRAM, e.g., DDR3 SDRAM JEDEC Standard JESD79-3C, April 2008) modules. The modules of the system memory 114 may be incorporated into a single inline memory module (SIMM), dual inline memory module (DIMM), small outline DIMM (SODIMM), and so forth.
The illustrated IO module 112 includes logic 130 to identify fingerprints based on signals from the UT array 118, which may have a wired connection 119 to the IO module 112 that includes leads, connectors, contacts, and so forth. The logic 130 may also use the identified fingerprints and signals from the one or more position sensors 132 and/or the radio module 116 to conduct authentications of users of the platform 106. In one example, the logic 130 deactivates one or more features of the platform 106 if a given authentication is unsuccessful and activates one or more features of the platform 106 if the authentication is successful.
Example 1 may include a fingerprint identification system comprising a flexible substrate, an ultrasonic transducer array coupled to the flexible substrate and a processor coupled to the ultrasonic transducer array, the processor to identify a fingerprint based on a signal from the ultrasonic transducer array. The system may also include an external component having a curved profile, wherein the ultrasonic transducer array is embedded in the external component and includes a read surface that conforms to the curved profile.
Example 2 may include the system of Example 1, wherein the external component includes one of a grip of a security device or a skin of a computing platform.
Example 3 may include the system of Example 1, wherein the external component includes a button having a function that is separate from identification of the fingerprint.
Example 4 may include the system of Example 3, wherein the button includes a target indicator adjacent to the read surface.
Example 5 may include the system of any one of Examples 1 to 4, further including a position sensor coupled to the processor, the processor to use the fingerprint and a signal from the position sensor to conduct an authentication of a user.
Example 6 may include the system of Example 5, wherein the processor is to deactivate one or more features of a system containing the apparatus if the authentication is unsuccessful.
Example 7 may include the system of Example 5, wherein the signal from the position sensor is to trigger the authentication.
Example 8 may include the system of Example 5, wherein the processor is to use the signal from the position sensor to verify an identity of the user.
Example 9 may include the system of Example 5, wherein the position sensor includes one or more of a geographic location sensor and an inertial sensor.
Example 10 may include the system of Example 1, wherein the ultrasonic transducer array is a capacitive micromachined ultrasonic transducer (CMUT) array.
Example 11 may include the system of Example 1, further including a semiconductor chip that contains the processor, and a wired connection coupled to the semiconductor chip and the ultrasonic transducer array.
Example 12 may include the system of Example 1, further including a power module to manage power delivered to the apparatus, and a radio module coupled to the processor.
Example 13 may include a method of fabricating a fingerprint identification system, comprising providing a flexible substrate, coupling an ultrasonic transducer array to the flexible substrate, configuring a processor to identify a fingerprint based on a signal from the ultrasonic transducer array and coupling the processor to the ultrasonic transducer array.
Example 14 may include the method of Example 13, further including embedding the ultrasonic transducer array into an external component having a curved profile, wherein the ultrasonic transducer array includes a read surface that conforms to the curved profile.
Example 15 may include the method of Example 14, wherein the ultrasonic transducer array is embedded into one of a button having a function that is separate from identification of the fingerprint, a grip of a security device or a skin of a computing platform.
Example 16 may include the method of Example 15, further including disposing a target indicator on the curved profile adjacent to the read surface.
Example 17 may include a fingerprint identification apparatus comprising a flexible substrate, an ultrasonic transducer array coupled to the flexible substrate and a processor coupled to the ultrasonic transducer array, the processor to identify a fingerprint based on a signal from the ultrasonic transducer array.
Example 18 may include the apparatus of Example 17, further including a position sensor coupled to the processor, the processor to use the fingerprint and a signal from the position sensor to conduct an authentication of a user.
Example 19 may include the apparatus of Example 18, wherein the processor is to deactivate one or more features of a system containing the apparatus if the authentication is unsuccessful.
Example 20 may include the apparatus of Example 18, wherein the signal from the position sensor is to trigger the authentication.
Example 21 may include the apparatus of Example 18, wherein the processor is to use the signal from the position sensor to verify an identity of the user.
Example 22 may include the apparatus of Example 18, wherein the position sensor includes one or more of a geographic location sensor and an inertial sensor.
Example 23 may include the apparatus of Example 17, wherein the ultrasonic transducer array is a capacitive micromachined ultrasonic transducer (CMUT) array.
Example 24 may include the apparatus of Example 17, further including a semiconductor chip that contains the processor, and a wired connection coupled to the semiconductor chip and the ultrasonic transducer array.
Example 25 may include the apparatus of any one of Examples 17 to 24, further including a power module to manage power delivered to the apparatus, and a radio module coupled to the processor.
Example 26 may include an apparatus to fabricate a fingerprint identification system, comprising means for performing the method of any one of Examples 13 to 16.
Thus, techniques described herein may enable secure personal identification in a low cost, low power solution that scales across multiple applications and devices. Additionally, any need for users to remember multiple passwords or experience delayed access to devices may be obviated. The instantaneous and secure access may be particularly advantageous in personal security scenarios involving weaponry, self defense sprays, etc. For example, “smart” personal handheld security devices may automatically limit their usage to their rightful owners or against specifically designated targets. Moreover, embedding ultrasonic transducer arrays in buttons having functions separate from fingerprint identification may facilitate enhanced security with no impact on the overall form factor design (e.g., physical size of the button is unaltered from standard buttons).
Embodiments of the present invention are applicable for use with all types of semiconductor integrated circuit (“IC”) chips. Examples of these IC chips include but are not limited to processors, controllers, chipset components, programmable logic arrays (PLAs), memory chips, network chips, systems on chip (SoCs), SSD/NAND controller ASICs, and the like. In addition, in some of the drawings, signal conductor lines are represented with lines. Some may be different, to indicate more constituent signal paths, have a number label, to indicate a number of constituent signal paths, and/or have arrows at one or more ends, to indicate primary information flow direction. This, however, should not be construed in a limiting manner. Rather, such added detail may be used in connection with one or more exemplary embodiments to facilitate easier understanding of a circuit. Any represented signal lines, whether or not having additional information, may actually comprise one or more signals that may travel in multiple directions and may be implemented with any suitable type of signal scheme, e.g., digital or analog lines implemented with differential pairs, optical fiber lines, and/or single-ended lines.
Example sizes/models/values/ranges may have been given, although embodiments of the present invention are not limited to the same. As manufacturing techniques (e.g., photolithography) evolve over time, it is expected that devices of smaller size could be manufactured. In addition, well known power/ground connections to IC chips and other components may or may not be shown within the figures, for simplicity of illustration and discussion, and so as not to obscure certain aspects of the embodiments of the invention. Further, arrangements may be shown in block diagram form in order to avoid obscuring embodiments of the invention, and also in view of the fact that specifics with respect to implementation of such block diagram arrangements are highly dependent upon the platform within which the embodiment is to be implemented, i.e., such specifics should be well within purview of one skilled in the art. Where specific details (e.g., circuits) are set forth in order to describe example embodiments of the invention, it should be apparent to one skilled in the art that embodiments of the invention can be practiced without, or with variation of, these specific details. The description is thus to be regarded as illustrative instead of limiting.
The term “coupled” may be used herein to refer to any type of relationship, direct or indirect, between the components in question, and may apply to electrical, mechanical, fluid, optical, electromagnetic, electromechanical or other connections. In addition, the terms “first”, “second”, etc. may be used herein only to facilitate discussion, and carry no particular temporal or chronological significance unless otherwise indicated.
Those skilled in the art will appreciate from the foregoing description that the broad techniques of the embodiments of the present invention can be implemented in a variety of forms. Therefore, while the embodiments of this invention have been described in connection with particular examples thereof, the true scope of the embodiments of the invention should not be so limited since other modifications will become apparent to the skilled practitioner upon a study of the drawings, specification, and following claims.
