Patent Grant
11958677
Embodiments of the subject invention relate to a method and apparatus to isolate the thermal environment of a payload using an environmentally friendly apparatus, such as an environmentally friendly packaging system for temperature sensitive products, in order to protect the payload from undesirable temperatures without the use of harmful and resource consuming Expanded polystyrene (EPS).
The most common packaging systems for transporting temperature sensitive products use an insulated container and a cold bank, to provide thermal protection for a load, product, or payload. Typically, an environment of the load is maintained in a temperature range of 2-8° C., 20-25° C., 0-4° C., or below −18° C. in order to provide thermal protection of the load. The food and pharmaceutical industries have relied on insulated shipping containers, such as Expanded Polystyrene (EPS), Polyurethane foam (PUR), mylar bubble wrap, polypropylene foam, and vacuum insulated panels (VIP) to ship and distribute temperature sensitive products. To produce these materials significant amounts of resources are required, such as energy and water consumption, use of non-renewable fossil fuels and synthetic chemicals, as well as emitting high levels of carbon dioxide (carbon footprint). The finished insulation products are often only used one time and when their end of the lifecycle occurs, they are often not recyclable and/or are minimally biodegradable, causing significant amounts of waste and accumulation in landfills. Due to the large amount of waste generated by the production, use, and disposable of traditional insulation materials, consumers desire alternative solutions and cities have implemented ordinances on fully or partially banning the certain materials.
Embodiments of the invention relate to a biotic material structure (BMS) that is formed by a plurality of pieces of biotic material (PPBM), positioned with respect to each other and mechanically interacting with each other so as to have a plurality of voids between the individual pieces of biotic material. The individual pieces of biotic material (PBM) can be filaments, particles, and/or other structural forms of biotic material. The individual pieces of biotic material can be positioned with respect to each other and mechanically interacting with each other so as to: push against each other, intertwine with each other, attach to each other (e.g., via adhesive or other material), pull against each other, and/or torque each other, so as to maintain voids between each other even when forces are applied to the BMS formed by the PPBM. Embodiments relate to a biotic material insulation medium (BMIM) that is formed by the biotic material structure and a gas or gas mixture (such as air) filling the plurality of voids between the individual PBM. As the default gas filling the voids between the individual PMS is air, the assumption in the description throughout the subject application is that air fills such voids, unless another gas or gas mixture is identified, with the understanding that the air can be replaced with another gas or gas mixture in other specific embodiments having the same BMS.
Embodiments relate to a biotic material insulating structure (BMIS), incorporating a BMIM in accordance with an embodiment of the invention and a mechanical structure positioned with respect to the BMIM so as to contain the BMIM to a desired BMS (e.g., having a desired volumetric shape or range of shapes). An embodiment of the subject BMIS, such as an insulating pad, panel, container, blanket, or other structure, can then be used to insulate products during storage or transport, and/or be incorporated into an insulating packaging container used to insulate products during storage or transport. In an embodiment such an insulating packaging container can incorporate an insulating panel for insulating a load. In an embodiment, an insulating packaging container assembly can incorporate the insulating packaging container for insulating a load. Embodiments relate to methods for insulating a load that utilize the biotic material structure, the BMIM, the BMIS, the insulating packaging container, and/or the insulating packaging container assembly.
Embodiments provide the temperature sensitive transportation industry with an environmentally friendly alternative to the current insulation materials. Embodiments are useful for insulation, as well as environmentally friendly, and meet one or more, and preferably all, of the following parameters: being an effective insulator, having a low cost, being lightweight so as to reduce handling difficulties and shipping costs, and efficiently utilizing storage space. Embodiments of the subject biotic material structure incorporate a renewable resource that has been minimally modified from its natural structure, requires no, or an inconsequential amount of, water to produce, utilize minimal energy to produce, and do not usually involve the use of unnatural products, pesticides, or chemicals. Once the biotic material structure reaches the end of its life cycle, the biotic material structure can be naturally biodegraded and decomposed. Embodiments of the biotic material structure meet the ASTM D6400 standard for compostability, the ASTM D5338 standard for compostability, the EN 13432:2000 packaging composting standard, and/or the EN 14995:2006 plastics composting standard. Embodiments of the biotic material structure can be used for personal compost or commercial compost. Embodiments of the biotic material structure (BMS) can be disposed of in a traditional trash system or yard waste collection, such that the BMS naturally decomposes. Micales and Skog (1997) reported that the placement of forest products in landfills serves as an important carbon sink, and a large portion of this sinked carbon is permanently sequestered in the soil where its impact on global warming is negligible.
Embodiments of the subject invention relate to a method and apparatus, incorporating the subject BMS, for shipping products so as to control the temperatures the products are exposed to. Embodiments can increase the amount of time the product and/or portions of the product experience a desired temperature range and/or reduce the amount of time the product and/or portions of the product experience temperatures outside of the desired temperature range and/or experience an undesirable temperature range. Embodiments of the BMS can incorporate biotic materials, such as wood fibers or moss, and can be positioned around and/or near the product positioned by itself, inside a packaging container or around a pallet load, such that the biotic material structure restricts heat flow from one or more locations on the exterior of the package to one or more other locations in the interior of the package, and/or vice versa.
Embodiment 1. A method of providing a thermal environment to a payload transported and/or stored in a surrounding environment, comprising:
Embodiment 2. The method according to embodiment 1,
Embodiment 3. The method according to embodiment 2,
Embodiment 4. The method according to any of embodiments 2-3,
Embodiment 5. The method according to any of embodiments 2-4,
Embodiment 6. The method according to any of embodiments 2-5,
Embodiment 7. The method according to any of embodiments 2-6,
Embodiment 8. The method according to any of embodiments 2-7,
Embodiment 9. The method according to any of embodiments 2-8,
Embodiment 10. The method according to embodiment 9,
Embodiment 11. The method according to any of embodiments 2-10,
Embodiment 12. The method according to any of embodiments 2-11,
Embodiment 13. The method according to any of embodiments 2-12,
Embodiment 14. The method according to any preceding embodiment,
Embodiment 15. The method according to any of embodiments 2-14,
Embodiment 16. The method according to any of embodiments 2-15,
Embodiment 17. The method according to any of embodiments 2-16,
Embodiment 18. The method according to any of embodiments 2-17,
Embodiment 19. The method according to any of embodiments 2-18,
Embodiment 20. The method according to any of embodiments 2-19,
Embodiment 21. The method according to any of embodiments 2-20,
Embodiment 22. The method according to any of embodiments 2-21,
Embodiment 23. The method according to any of embodiments 2-22,
Embodiment 24. The method according to any preceding embodiment,
Embodiment 25. The method according to any of embodiments 2-24,
Embodiment 26. The method according to any preceding embodiment,
Embodiment 27. The method according to any of embodiments 2-26,
Embodiment 28. The method according to any of embodiments 2-27,
Embodiment 29. The method according to any of embodiments 2-28,
Embodiment 30. The method according to any of embodiments 2-29,
Embodiment 31. The method according to any preceding embodiment,
Embodiment 32. The method according to any of embodiments 2-31,
Embodiment 33. The method according to embodiment 32,
Embodiment 34. The method according to any of embodiments 2-33,
Embodiment 35. The method according to any of embodiments 2-34,
Embodiment 36. The method according to any of embodiments 2-35,
Embodiment 37. The method according to any of embodiments 2-36,
Embodiment 38. The method according to any of embodiments 2-37,
Embodiment 39. The method according to any of embodiments 2-38,
Embodiment 40. The method according to any of embodiments 2-39,
Embodiment 41. The method according to any of embodiments 2-40,
Embodiment 42. The method according to any of embodiments 2-41,
Embodiment 43. The method according to any of embodiments 2-42,
Embodiment 44. The method according to any of embodiments 2-43,
Embodiment 45. The method according to any of embodiments 2-44,
Embodiment 46. The method according to any of embodiments 2-45,
Embodiment 47. The method according to any of embodiments 2-46.
Embodiment 48. The method according to any of embodiments 2-47,
Embodiment 49. The method according to any of embodiments 2-48,
Embodiment 50. The method according to any of embodiments 2-49,
Embodiment 51. The method according to any of embodiments 2-50,
Embodiment 52. The method according to any of embodiments 2-51,
Embodiment 53. The method according to any of embodiments 2-52,
Embodiment 54. The method according to any of embodiments 2-53,
Embodiment 55. The method according to any of embodiments 2-54,
Embodiment 56. The method according to any of embodiments 2-55,
Embodiment 57. The method according to any of embodiments 2-56,
Embodiment 58. The method according to any of embodiments 2-57,
Embodiment 59. The method according to any of embodiments 2-58,
Embodiment 60. The method according to any of embodiments 2-59,
Embodiment 61. The method according to any of embodiments 2-60,
Embodiment 62. The method according to any of embodiments 2-61,
Embodiment 63. The method according to any of embodiments 2-62,
Embodiment 64. The method according to any of embodiments 2-63,
Embodiment 65. The method according to any of embodiments 2-64,
Embodiment 66. The method according to any of embodiments 2-65,
Embodiment 67. The method according to any of embodiments 2-66,
Embodiment 68. The method according to any of embodiments 2-67,
Embodiment 69. The method according to any of embodiments 2-68,
Embodiment 70. The method according to any of embodiments 2-69,
Embodiment 71. The method according to any of embodiments 2-70,
Embodiment 72. The method according to embodiment 71,
Embodiment 73. The method according to embodiment 71,
Embodiment 74. The method accordingly to any of the preceding embodiments,
Embodiment 75. The method according to any preceding embodiment,
Embodiment 76. A method of providing a thermal environment to a payload transported and/or stored in a surrounding environment, comprising:
Embodiment 77. The method according to embodiment 76,
Embodiment 78. The method according to embodiment 76,
Embodiment 79. The method accordingly to embodiment 76,
Embodiment 80. The method according to any of embodiments 76 to 79,
Embodiment 81. A packaging container assembly, comprising:
Embodiment 82. The assembly according to embodiment 81,
Embodiment 83. The assembly according to embodiment 82,
Embodiment 84. The assembly according to any of embodiments 82-83,
Embodiment 85. The assembly according to any of embodiments 82-84,
Embodiment 86. The assembly according to any of embodiments 82-85,
Embodiment 87. The assembly according to any of embodiments 82-86,
Embodiment 88. The assembly according to any of embodiments 82-87,
Embodiment 89. The assembly according to any of embodiments 82-88,
Embodiment 90. The assembly according to embodiment 89,
Embodiment 91. The assembly according to any of embodiments 82-90,
Embodiment 92. The assembly according to any of embodiments 82-91,
Embodiment 93. The assembly according to any of embodiments 82-92,
Embodiment 94. The assembly according to any of embodiments 82-93,
Embodiment 95. The assembly according to any of embodiments 82-94,
Embodiment 96. The assembly according to any of embodiments 82-95,
Embodiment 97. The assembly according to any of embodiments 82-96,
Embodiment 98. The assembly according to any of embodiments 82-97,
Embodiment 99. The assembly according to any of embodiments 82-98,
Embodiment 100. The assembly according to any of embodiments 82-99,
Embodiment 101. The assembly according to any of embodiments 82-100,
Embodiment 102. The assembly according to any of embodiments 82-101,
Embodiment 103. The assembly according to any of embodiments 82-102,
Embodiment 104. The assembly according to any of embodiments 82-103,
Embodiment 105. The assembly according to any of embodiments 82-104,
Embodiment 106. The assembly according to any of embodiments 82-105,
Embodiment 107. The assembly according to any of embodiments 82-106,
Embodiment 108. The assembly according to any of embodiments 82-107,
Embodiment 109. The assembly according to any of embodiments 82-108.
Embodiment 110. The assembly according to any of embodiments 82-109,
Embodiment 111. The assembly according to any of embodiments 82-110,
Embodiment 112. The assembly according to any of embodiments 82-111,
Embodiment 113. The assembly according to embodiment 112,
Embodiment 114. The assembly according to any of embodiments 82-113,
Embodiment 115. The assembly according to any of embodiments 82-114,
Embodiment 116. The assembly according to any of embodiments 82-115,
Embodiment 117. The assembly according to any of embodiments 82-116,
Embodiment 118. The assembly according to any of embodiments 82-117,
Embodiment 119. The assembly according to any of embodiments 82-118,
Embodiment 120. The assembly according to any of embodiments 82-119,
Embodiment 121. The assembly according to any of embodiments 82-120,
Embodiment 122. The assembly according to any of embodiments 82-121,
Embodiment 123. The assembly according to any of embodiments 82-122,
Embodiment 124. The assembly according to any of embodiments 82-123,
Embodiment 125. The assembly according to any of embodiments 82-124,
Embodiment 126. The assembly according to any of embodiments 82-125,
Embodiment 127. The assembly according to any of embodiments 82-126,
Embodiment 128. The assembly according to any of embodiments 82-127,
Embodiment 129. The assembly according to any of embodiments 82-128,
Embodiment 130. The assembly according to any of embodiments 82-129,
Embodiment 131. The assembly according to any of embodiments 82-130,
Embodiment 132. The assembly according to any of embodiments 82-131,
Embodiment 133. The assembly according to any of embodiments 82-132,
Embodiment 134. The assembly according to any of embodiments 82-133,
Embodiment 135. The assembly according to any of embodiments 82-134,
Embodiment 136. The assembly according to any of embodiments 82-135,
Embodiment 137. The assembly according to any of embodiments 82-136,
Embodiment 138. The assembly according to any of embodiments 82-137,
Embodiment 139. The assembly according to any of embodiments 82-138,
Embodiment 140. The assembly according to any of embodiments 82-139,
Embodiment 141. The assembly according to any of embodiments 82-140,
Embodiment 142. The assembly according to any of embodiments 82-141,
Embodiment 143. The assembly according to any of embodiments 82-142,
Embodiment 144. The assembly according to any of embodiments 82-143,
Embodiment 145. The assembly according to any of embodiments 82-144,
Embodiment 146. The assembly according to any of embodiments 82-145,
Embodiment 147. The assembly according to any of embodiments 82-146,
Embodiment 148. The assembly according to any of embodiments 82-147,
Embodiment 149. The assembly according to any of embodiments 82-148,
Embodiment 150. The assembly according to any of embodiments 82-149,
Embodiment 151. The assembly according to any of embodiments 82-150,
Embodiment 152. The assembly according to embodiment 151,
Embodiment 153. The assembly according to embodiment 151,
Embodiment 154. The assembly accordingly to any of embodiments 82-153,
Embodiment 155. The assembly according to any preceding embodiment,
Embodiment 156. A pallet covering system, comprising:
Embodiment 157. The system according to embodiment 156,
Embodiment 158. The system according to embodiment 156,
Embodiment 159. The system accordingly to embodiment 156,
Embodiment 160. The system according to any of embodiments 156 to 159,
Biotic materials are bio-based and compostable, and are healthy, renewable nutrients to the ecosystem. Under a managed composting program in accordance with ASTM D6400 composting standards set by the American Society for Testing and Materials, a compostable product must: (1) break down to carbon dioxide, water, inorganic compounds, and biomass at a rate similar to paper, (2) disintegrate into small pieces within 90 days, so that the original product is not visually distinguishable in the compost, and (3) leave no toxic residue. Embodiments of the subject invention relate to a compostable product, such as a BMS, or an insulating container incorporating a BMIM, that meets composting standards such as the ASTM D6400 composting standards, the ASTM D5338 composting standards, the EN 13432:2000 packaging composting standards, and/or the EN 14995:2006 plastics composting standards.
Most of the insulation materials currently available in the industry are considered biodegradable, which means these insulation materials are capable of disintegration by biological means. Technically, a biodegradable product can be composed of almost any material, since after enough time, some microorganisms can decompose almost anything. As an example, aluminum cans will biodegrade in the ocean after about 175 years, and plastic, such as expanded polystyrene, will biodegrade in the ocean after about 400 years.
In order to provide insulation materials that are truly in the scope of an environmentally friendly solution, embodiments of the invention utilize one or more biotic materials that have been produced by mechanically and/or hydrationally modifying one or more raw biotic materials from the biotic materials' natural structures. A biotic material is any material that originates from a living organism. Such a material contains carbon and is capable of decay. Specific biotic materials used in accordance with embodiments of the invention are considered “biotic primary raw materials,” as these biotic materials use the natural form of raw biotic materials with no, or negligible, physical transformation of the natural form of the biotic materials' natural structure (e.g., with only mechanical and/or hydrational modification). As an example, sphagnum moss can be used as a biotic material for insulation in accordance with an embodiment of the invention, after drying (i.e., dehydrating) the sphagnum moss, such that the dehydrated sphagnum moss retains the natural structure of the natural form of the sphagnum moss. Dehydration of the sphagnum moss can be accomplished by drying the sphagnum moss in the sun for many days prior to use in embodiments of the subject invention. Biotic materials that can be used in accordance with specific embodiments of the subject invention include: woody biotic materials, bryophyte biotic materials, herbaceous biotic materials, fungi materials, and other similar biotic materials.
Embodiments pertain to biotic material insulating structures that incorporate a plurality of pieces of one or more biotic materials that have properties that enhance thermal protection provided by the biotic material insulating structures for use in the temperature sensitive transportation industry, such as a thermal conductivity of the biotic materials, which facilitates achieving the thermal protection required by temperature sensitive transportation industry. As shown in
A material insulation medium (e.g., an ensemble of multiple pieces of solid material having voids between the pieces of solid material) that has a high proportion of voids between the pieces of solid material, where the voids contain a gas or gas mixture, such as air, typically have a low thermal conductivity, where the proportion of voids refers to the proportion of the volume the material insulating medium occupies that is voids. A material insulation medium can be configured to achieve a desired (effective) thermal conductivity for the material insulating medium by controlling the shape, size, cross-sectional shape, and solid material of the plurality of pieces of solid material, controlling the size, shape, distribution, and/or proportion of voids in the material insulating medium, as well as controlling the gas and/or gas mixture filling the voids. In addition, altering the moisture content of solid materials that can have a range of moisture content can alter the effective thermal conductivity of the material insulation medium incorporating the plurality of pieces of solid material. Referring to
Embodiments of the invention provide a biotic material insulation medium that is at least 85%, at least 90%, at least 95%, at least 96%, at least 97%, at least 98%, at least 99%, and/or 100% compostable (e.g., meets the ASTM D6400, ASTM D5338, EN 13432:2000, and/or EN 14995:2006 plastic composting standards), which can be positioned with respect to products during shipping, distribution, and/or storage, in order to control the temperature, and/or control the temperature as a function of time, that the products experience, for various external temperatures and/or conditions to which shipped products are exposed (e.g., the temperature of the surrounding environment an insulating packaging container the product is packaged within is positioned in). Specific embodiments relate to a method of using such a biotic material insulation medium in the shipping, distribution, and/or storage of products that are required to be maintained in a specific temperature range during shipping, distribution, and/or storage.
Thermal properties of the “biotic material insulation medium” meeting one or more criteria are achieved by using select types of biotic materials, pieces of biotic material having select structures, shapes, humidity, and/or other characteristics, and assembling the pieces of biotic material in a way so as to create a biotic material insulation medium that has a high proportion of voids containing a gas and/or gas mixture, such as air, and a density distribution of the biotic material (i.e., solid material) that meets one or more additional criteria. The assembly of the plurality of pieces of biotic material into a biotic material structure, and the proportions of the volume of the biotic material and the volume of voids between the biotic material, where the biotic material structure having the voids filled with a gas or gas mixture is used to form the subject biotic material insulation medium having an effective thermal conductivity, such that an insulating structure incorporating the BMIM achieves a level of effective thermal conductivity that provides the thermal protection required for insulation shipping containers (e.g., insulating packaging container assemblies).
An embodiment of a “biotic material insulation medium” in accordance with the invention has a non-woven biotic material structure composed of filaments of a biotic material (“biotic filaments”), and has a high proportion of voids the filaments containing a gas and/or gas mixture, such as air, filling the voids in the biotic material structure. In specific embodiments, these biotic filaments can be: (a) threadlike wood, such as incorporated in wood wool or excelsior, (b) fibers or fibrils of a plant material, such as sphagnum moss, and/or (c) portions of a stalk of a plant or other types of filaments found in herbaceous plants. In specific embodiments, wood wool, excelsior, sphagnum moss, or a combination thereof can be used in the biotic material insulation medium.
Embodiments incorporate biotic filaments having a shape similar to a random three-dimensional shape (see
Toverall=T(x)*T(y)*T(z)
The followings are measurements done on woody biotic filaments:
The thermal insulation performance of a biotic material insulating medium formed with biotic filaments, (i.e., “biotic filament insulation medium”) in accordance with the invention is accomplished by achieving physical properties, such as apparent bulk density, apparent porosity, moisture content, effective thermal conductivity, effective thermal effusivity, and compressibility, that meet one or more respective criteria.
The apparent bulk density of the biotic filament insulation medium is defined as the mass of the many particles of the solid material (i.e., the mass of the plurality of filaments) divided by the volume of the biotic filament insulation medium. The volume of the biotic filament insulation medium includes the particle volume (i.e., the summation of the volumes of the biotic filaments) and the inter-particle void volume (i.e., the summation of the volumes of all of the voids between the biotic filaments). In the case of a “biotic filament insulation medium,” the apparent bulk density is the mass of the biotic filaments divided by the total volume that the interlocking biotic filaments occupy to create the biotic filament insulation medium, such as the volume of the interior of an insulation pad incorporating the biotic filament insulation medium in the interior of the insulation pad.
Specific embodiments can utilize wood excelsior produced by American Excelsior Company, Wood Fibers Division, in accordance with the Material Specifications for Excelsior package pads (“wood excelsior by AEC”), using Great Lakes Aspen (“wood excelsior by AEC”), where the wood excelsior by AEC need not be part of the excelsior package pad described therein.
The biotic material package pads made of wood excelsior fibers, such as the wood excelsior by AEC used therein, have the following physical properties:
The wood excelsior by AEC can also undergo additional processing prior to use in embodiments of the subject application. In a specific embodiment, the wood excelsior by AEC is dried to a moisture content of 9-14%, 15-20%, 20-22%, 22-24%, 20-24%, 20-28%, 21-27%, 22-26%, 23-25%, and preferably about 20%. In a specific embodiment, the wood excelsior by AEC is dried via furnace, and in preferred embodiments, is dried naturally, e.g., by the sun to a moisture content of 9-14%, 15-20%, 20-22%, 22-24%, 20-24%, 20-28%, 21-27%, 22-26%, 23-25%, and preferably about 20%, rather than furnace drying, which can change the structure of the wood (e.g., make the fibers/filaments more brittle, so that the filaments retain spring (elasticity) by sun drying the filaments). Specific embodiments can compress the same amount of wood excelsior by AEC fibers/filaments as in the 0.5 inch (or 1 inch) thick pad, of known area, of the American Excelsior Company, but reduce the compressive pressure to produce a 1½ inch thick pad, of the same known area, such that the density of fibers/filaments is ⅓ (or ½) of the density in the 0.5 inch(or 1 inch) pad of the American Excelsior Company (the #of filaments counted in a volume 20 cubic inches was 456 filaments, which translates into about 41,000 wood filaments per cubic feet). In additional embodiments, any multiple (such as c, where c is a positive real number) of the amount of fibers per 1000 sq in (area of pad) (e.g., weight #lbs/1000 sq in) that is compressed to 1″ thick by the American Excelsior Company can be used, and a pressure that would be needed to compress the same number of fibers per 1000 sq in (e.g., weight #lbs/1000 sq in) to 3c inches (or 3c/2 inches), such as where 3c (or 3c/2) is 1½ inch, 1¼-1¾ inch, 1¼-2 inch, 1⅛-1 1/2 inch, 1¼-1½ inch, 1½- 1¾ inch, and/or 1⅜-1⅝ inch, can be applied, resulting in a fiber/filament density that is less than the density of the American Excelsior Company pad, in the range of ⅓-⅔, in the range of ½-⅔, in the range of ⅔-¾, in the range of ⅓-0.75, and/or in the range of 0.33-0.75, in the range of 0.6-0.75, of the density of the American Excelsior Company pad.
In a specific embodiment, the BMIM can utilize woody filaments, such as great Lakes Aspen, where 80% of the woody filaments ≥3.0 inches (0.076 m) or 6.0 inches (15.2 cm) long, with woody filament cross-sectional dimensions of 0.018″±0.003″×0.038″±0.008″ (0.46 mm±0.08 mm×0.97 mm±0.20 mm), with a woody filament moisture content in the range of 9-14%, 15-29%, 16-28%, 17-27%, 18-26%, 19-25%, 20-24%, 21-23%, 18-22%, 19-21%, and/or approximately 20%. The percentage of filaments≥L″ can be lower or higher, such that at least 60%, at least 70%, at least 80%, and/or at least 90%, of the filaments are ≥3″; ≥4″; ≥5″; ≥6″; ≥7″; ≥8″; ≥9″; and/or ≥10″.
As an example, a BMIM composed of woody filaments (a woody biotic filament insulation medium), where 80% of the woody filaments 3.0 inches (0.076 n) long, with woody filament cross-sectional dimensions of 0.018″±0.003″×0.038″±0.008″ (0.46 mm±0.08 mm×0.97 mm±0.20 mm), with a woody filament moisture content in the range of 9-14%. 15-29%, 16-28%, 17-27%, 18-26%, 19-25%, 20-24%, 21-23%, and/or approximately 20%, can be arranged in a way to achieve a biotic material insulation medium having dimensions of 11″×29″×1″ (280 mm×740 mm×25.4 mm) with a total weight of 0.55 lbs (0.25 kg), when air is filling the voids between the filaments. This total weight (mass) of the BMIM includes the weight (mass) of the filaments and the weight (mass) of the air filling the voids between the filaments (noting that one cannot weigh the filaments “by themselves” unless weighing the filaments in a vacuum). The apparent bulk density of such a biotic material insulation medium is 0.00172 lb/in3 (48 kg/m3). This biotic material insulation medium can be incorporated into an insulation pad. The thickness of an insulation pad incorporating this biotic material insulation medium can be modified in order to achieve a different apparent bulk density, while maintaining the same weight of woody biotic filaments in the biotic material insulation medium. However, changing the apparent bulk density can significantly affect the thermal performance of an insulation pad incorporating the biotic material insulation medium. The apparent bulk density provides thermal performance and physical cushioning protection of an insulation pad incorporating the biotic material insulation medium.
This example, similar to the embodiment shown in
The results in Table 1 show that the package using Pad #1 was able to maintain the product temperature in the required temperature range for 37 hours, whereas the package using Pad #2 was only able to maintain the product temperature in the required temperature range for 32 hours, providing an indication that the apparent bulk density of the biotic filament insulation medium, for a given humidity, and the insulation pad incorporating the same, has a significant effect on temperature maintenance (i.e., effective thermal conductivity across the thickness of the BMIM).
The apparent bulk density is highly dependent of the apparent porosity of the biotic material insulation medium (BMIM). Interlocking biotic filaments create the BMS, which when the voids are filled with a gas or gas mixture form the biotic material insulation medium, and the manner of interlocking the biotic filaments creates the inter-particle void volume that will determine most, if not all, of the BMIM's insulation properties.
In the subject application, the biotic filaments in the BMIM are referred to as solid biotic materials even though such biotic filaments often have internal pores see (9) in
The porosity of a material is the percentage of the void fraction of the material, i.e., fraction of total void volume over total volume of the material.
The apparent porosity (AP) of the biotic filament insulation medium, where the porosity of the filaments is considered zero and apparent porosity of the BMIM using filaments is the open void volume of the BMIM divided by the total volume of the BMIM, can be defined as follows:
AP=(Ps−Pbm)/(Ps−Po)
where
The apparent porosity of the biotic filament insulation medium will have a significant impact of the effective thermal conductivity of the biotic filament insulation medium. Characterizing the effective thermal conductivity of the biotic filament insulation medium can allow adjustments of the physical characteristics of the BMIM (e.g., biotic material; size, shape, and other properties of the biotic filaments; the number, size, and shape of the voids; and the gas or gas mixture in the voids) to enhance thermal insulation provided by the BMIM.
In addition to determining the apparent porosity of the biotic filament insulation medium by using the equation above, the filaments can be weighed in a vacuum and weighed in air, and the difference in these weights and the density of air can then be used to determine the total open volume of the voids (and hence apparent porosity of the biotic filament insulation medium (AP)). Just the same, the filaments can be weighed in air and weighed in another gas or gas mixture, such as argon, and these two weights and the difference in densities of air and argon can then used to determine the total open volume of the voids (and hence apparent porosity of the biotic filament insulation medium (AP)). The apparent porosity can also be measured by putting the biotic filament insulation medium in a container with a known volume and filling the container with water. The amount of water required to fill the voids between the filaments can be translated into the total open void volume (note, care must be taken to take measurements before the water “infiltrates” portions of the filaments, and not just the voids between the filaments, to obtain an accurate measurement). The apparent porosity could then be determined as the total open void volume divided by the total volume of the BMIM.
Using Russel's equation* for a porous medium, it is possible to use the apparent porosity to estimate the effective thermal conductivity of the biotic filament insulation medium (kbm), where Russel's equation is as follows:
ks/kbm=1−AP1/3+AP1/3((ko/ks)AP2/3+1−AP2/3)
Using the same woody biotic filament insulation medium presented in Example 2, i.e., Pad #1 in table 1, it is possible to calculate the effective thermal conductivity of the biotic filament insulation medium.
The apparent porosity (AP) can be calculated via AP=(Ps−Pbm)/(Ps−Po), where
Due to the nature of the biotic filament insulation medium, the thermal properties of the biotic filament insulation medium can be described using a property that takes into account the type(s) of biotic filament(s) used, the type of gas in the voids between biotic filaments, as well as the global moisture content of the BFIM. An effective thermal effusivity (EffE), based on the concept of the thermal effusivity (E) of a material, is a property that can be used to describe embodiments of the subject biotic filament insulation medium. Thermal effusivity (E) is defined as the square root of the product of the material's thermal conductivity and the material's volumetric heat capacity. Thermal effusivity (sometimes called the heat penetration coefficient) is the rate at which a material can absorb heat. Thermal effusivity is the property that determines the contact temperature of two bodies that touch each other. The heat penetration coefficient is practically experienceable when one feels different materials of same temperature with the bare hand. Materials with a high heat penetration coefficient (e.g., metals) are felt as particularly cold, when their temperature is less than the skin temperature. Materials with a low heat penetration coefficient (e.g., wood), when at the same temperature as the metal, are felt as warmer.
Thermal effusivity is a heat transfer property that characterizes the transient thermal behavior at the surface of an object when the surface of the object is in contact with a gaseous environment, or external object, which is at a different temperature than the surface of the object, such that thermal effusivity characterizes the transient thermal behavior that occurs when two or more materials are brought into contact with each other. As an example, the thermal effusivities of two semi-infinite objects determine the interfacial temperature when the two semi-infinite objects are at different temperatures and in contact with each other. The thermal effusivities of different materials differ due to the differing ability of the materials to transfer heat. This is due to differences in heat transfer through and between particles, and is therefore a function of particle size, particle shape, density, morphology, and moisture content.
The Thermal effusivity (E) of a material is defined as
E=(kp Cp)1/2
Using the same biotic filament insulation medium as in Example 3, it is possible to calculate the Effective thermal effusivity (EffE) of the biotic filament insulation medium:
The Effective thermal effusivity of the biotic filament insulation medium, which depends on the specific biotic filament materials, the interlocking arrangement of the biotic filaments, and the gas or gas mixture filling the voids, provides a very good indication of the thermal protection that is provided when the biotic filament insulation medium is used in insulating structures such as insulation pads. In general, the lower the value of the effective thermal effusivity of the biotic filament insulation medium is, the better the thermal insulation performance of the biotic filament insulation medium provides.
Table 2 presents data regarding the effective thermal effusivity of a biotic filament insulation medium of Example 1 and Example 2, using different biotic filament materials and corresponding interlocking arrangements, and apparent bulk density.
As seen in Table 2 the effective thermal effusivity of the biotic filament insulation pad #1 (first pad listed in Table 1), having an apparent bulk density of 48 kg/m3, is 39.8 W-s1/2/m2-K, where Pad #2 (second pad listed in Table 1) having an apparent bulk density of 121 kg/m3, has an effective thermal effusivity of 80.1 W-s1/2/m2-K (not listed in Table 2). This shows that the effective thermal effusivity is a good indicator of the thermal performance of a biotic filament insulation medium.
Embodiments of the subject invention relate to a method and apparatus for shipping products so as to control the temperatures the products are exposed to, using a biotic filament insulation medium to thermally insulate the products from the environment. Embodiments can increase the amount of time the product and/or portions of the product experience a desired temperature range and/or reduce the amount of time the product and/or portions of the product experience temperatures outside of the desired temperature range and/or experience an undesirable temperature range. A specific embodiment maintains the product temperatures within a desired temperature range for a desired amount of time when the insulating packaging container the product is within is positioned in a surrounding environment having a surrounding temperature that is higher than the desired temperature (e.g., within an expected surrounding temperature range) for at least an expected time period (e.g., maximum expected delivery time period).
Embodiments can incorporate a biotic filament insulation medium (BFIM), such as sphagnum moss, positioned around and/or near the product, where the product is positioned inside a packaging container, such that the biotic filament insulation medium creates a protective layer (thermally insulating layer) that slows down heat transfer from the surrounding environment to one or more other locations in the interior of the packaging container. The biotic filament insulation medium can reduce the transfer of heat from the outside of the packaging container to portions of the interior of the container desired to be kept cool (e.g., by a cold bank placed inside), and/or reduce the transfer of heat from portions of the interior of the packaging container desired to be kept warm (e.g., by a heat bank placed inside) to the outside of the packaging container (in the case of cold weather protection), and/or reduce the transfer of heat caused by frictional movement or solar radiation. Specific embodiments of the biotic filament insulation medium can be permanent or temporary and can incorporate a biotic material structure (BMS) made of filaments of one biotic material, or a BMS made of filaments of a combination of different biotic materials, and can have the voids between the filaments filled with one gas or gas mixture or with two or more different gases or gas mixtures.
Embodiments of the invention can be used for shipping products in an environment that is colder than the interior of packaging, such as during cold weather. In such embodiments, a warm bank, or a room temperature bank, such as gel packs, can be used inside the packaging container. The heat will move from the warm bank toward the outside of the packaging container, where the biotic filament insulation medium, having a low thermal conductivity and positioned to thermally insulate the product from the environment, reduces, or possibly prevents, the payload (product) from losing heat to the cold surroundings (environment).
Embodiments of the invention can use biotic materials in the subject biotic material insulation medium (e.g., use biotic filaments in the subject biotic filament insulation medium), rather than using environmentally unfriendly materials such as Expanded Polystyrene (EPS), Polyurethane foam (PUR), mylar bubble wrap, polypropylene foam, and vacuum insulated panels (VIP), to thermally protect a payload (product). Specific embodiments can also incorporate such environmentally less friendly materials for portions of the assembly, but have portions using biotic materials to enhance environmental friendliness. Specific embodiments can incorporate one or more thermal banks, such as cold banks, room temperature banks, and/or warm banks. Further embodiments can utilize multiple insulating structures, such as insulation mats, incorporating a biotic filament insulation medium, placed between flexible, semi-rigid, or rigid walls, where the walls contain, or partially contain, the position, orientation, and/or shape of the BFIM, to thermally protect the payload (product). Embodiments also incorporate BFIMs with or without a bounding agent or BFIMs that are contained, or partially contained, by an adhesive, such as glue, positioned on the biotic filaments to enhance the engaging interaction of the filaments, such as adhering the filaments to each other. Specific embodiments incorporate compostable glues positioned on the biotic filaments, to create adhesion of the filaments to each other, and/or compostable glues can be used to aid in forming the mechanical structure containing the BFIM's, such as for gluing a paper outer layer of an insulating pad. Protein glues have high water solubility but are insoluble in oils, waxes, organic solvents and absolute alcohol. They may be emulsified in water-oil or oil-water systems. The various other raw materials used to compound compostable glues are from the sugar, starch, polyol and salt families. All of the ingredients used to modify the adhesives are water-soluble. Other raw materials like corn syrup (glucose), sodium chloride (table salt), glycerin USP grade can be used for compostable glues. Commercial products such as Epotal® Eco (BASF) can be used as compostable glues.
The biotic filament insulation medium used in specific embodiments of the invention functions as a heat sink by absorbing at least a portion of the heat passing through the BFIM. By partially, or completely, surrounding the payload (product) with the biotic filament insulation medium, in a surrounding environment warmer than the payload, at least a portion of the heat absorbed by the biotic filament insulation medium will not reach the products (payload).
In a specific embodiment, a shipping container (packaging container) incorporates a biotic filament insulation medium positioned to substantially surround, and preferably completely surround, the cold bank and payload. In specific embodiments, the BFIM at least 70%, at least 80%, at least 85%, at least 90%, at least 95%, and/or at least 97% surrounds the payload.
This embodiment is designed for use with the packaging container assembly, having the payload (product) within, being positioned in a hot, or cold, external environment, such as being transported and/or stored in a shipping and/or storage environment. The biotic filament insulation medium incorporated into each flexible pad has a low effective thermal effusivity, which slows the heat penetration into the biotic filament insulation medium, thus decreasing the chances for heat from the environment to reach the temperature sensitive product. Specific embodiments can incorporate a biotic filament insulation medium having a thickness of at least 5 mm, at least 10 mm, at least 15 mm, at least 20 mm, at least 25 mm, at least 30 mm, less than 200 mm, less than 10 mm, and/or in a range between any two of the listed thicknesses. Specific embodiments can use a biotic filament insulation medium having an effective thermal effusivity less than or equal to 125 W-su1/2/m2-K, less than or equal to 100 W-sm1/2/m2-K, less than or equal to 80 W-s1/2/m2-K, less than or equal to 60 W-s1/2/m2-K, less than or equal to 50 W-s1/2/m2-K, and/or in a range between any two of the listed values.
There are many variables with respect to the biotic filament insulation medium, and/or any outer mechanical structure (e.g., outer covering) the biotic filament insulation medium may be positioned with respect to (e.g., within), which can be adjusted to achieve a different thermal effusivity. The thermal effusivities of materials vary due to each material's differing ability to transfer heat. This is due to differences in heat transfer through and between particles, and is therefore a function of particle size, particle shape, density, morphology, and moisture content. Examples of biotic filament materials that can be incorporated into, and/or form, a biotic filament insulation medium having an effective thermal effusivity within a desired range, which can be utilized in embodiments of the subject invention include, but are not limited to: aspen wood wool (39.8 W-s1/2/m2-K), sphagnum moss (32.1 W-s1/2/2/m2-K), and oak wood wool (55.4 W-s1/2/m2-K). Other biotic filament materials can also be used alone, layered, or mixed together in order to achieve the desirable thermal and mechanical properties. In an embodiment, mixing two biotic materials can increase the insulation thermal properties of the resulting BMIM, when compared to a biotic material insulation medium using either biotic materials alone, such as mixing biotic sphagnum moss and aspen woody biotic filaments (50/50), where the thermal conductivity of Aspen Woody Biotic Medium “thickness=58.5 mW/m-K, the thermal conductivity of Sphagnum Moss Biotic Medium 1” thickness=45.7 mW/m-K, and thermal conductivity of Aspen Woody/Moss Biotic Medium (50/50) 1″ thick=35.6 mW/m-K.
The apparent bulk density of a biotic filament insulation medium (BFIM) can be selected by its capacity to resist heat flow, which is known as R-value (m2-K/W), where R-value is provide per inch of thickness. The higher the R-value, the greater is its insulating power. Biotic filament insulation mediums have an optimal apparent bulk density where the highest R-value can be achieved. Knowing the relationship between R-value and the apparent bulk density can help when selecting the right R-value when looking to find a compromise between total weight of the solution (i.e., the biotic filament insulation medium and its thermal insulation properties.
Three biotic material insulation mediums had moisture added and the resulting expansion due to moisture measured as follows:
expansion ratio for a 1 inch thick woody biotic medium pad (thickness)
expansion ratio for a 1 inch thick biotic Sphagnopsida moss medium pad (thickness)
expansion ratio for biotic Sphagnopsida moss (50%) and woody (50%) medium pad (thickness)
noting that the maximum moisture content of a woody biotic medium pad (Populus tremuloides)=330%, and the maximum moisture content of a Sphagnopsida moss biotic pad=2,300%.
A variety of methods of measuring thermal conductivity can be used. For data presented in the subject application, the comparative cut bar method, which is widely used for determining axial thermal conductivity, was used. This method is based on the principle of comparing thermal gradients between cold and warm surfaces. In this method, heat flux is passed through samples of known and unknown materials. A sample of unknown material is sandwiched between two reference samples. Knowing the thermal conductivity of the reference samples, the heat flux through the unknown sample can be calculated and its thermal conductivity determined. An example of another method that can be used is the probe method, which was used to provide a quicker measurement, and in which the thermal conductivity of a sample is determined by inserting a ‘hypodermic needle probe’ into the sample and measuring its response. A thermocouple and a heater are attached to the probe. This method is suitable for measurement of thermal conductivity in materials that are in semi rigid form, such as loose biotic material medium.
Tests were conducted on multiple embodiments of BFIM's, and the tests show significant improvement in the efficiency of a biotic filament insulation medium when the apparent porosity of the biotic filament insulation medium is increased. Table 3 shows data for the testing of an insulated packaging system (e.g., packaging container assembly) utilizing three different biotic filament insulation mediums that have different apparent porosities. The best result was obtained for the BFIM having an apparent porosity of 88.6%. Specific embodiments can have an apparent porosity of at least 50%, at least 60%, at least 70%, at least 80%, at least 85%, at least 90%, at least 95%, less than 60%, and/or within a range between any two of these listed values. The tests were conducted using a packaging container assembly shown in
There are many ways to implement the use of a biotic filament insulation medium in a packaging system in accordance with embodiments of the invention. Embodiments of the invention also pertain to a biotic filament insulation medium that can be created by positioning loose biotic materials, such as biotic filaments, between portions of one or more mechanical structures (e.g., walls, covers, and meshes) made of materials such as paper, plastic, or other enclosure materials that have the structural capability to hold the biotic materials of the BMIM in a fixed relative position or within a range of potential relative positions, such that the loose biotic filaments remain in a desired biotic material structure or within a range of desired BMS's.
Applications to which embodiments of the invention can be utilized include, but are not limited to, using the biotic filament insulation medium wrapped in paper (15), such as kraft paper, in a pouch system (25) for mail order shipping as shown in
Specific embodiments of the invention can form, using a biotic filament insulation medium, an insulated shipping container having a volume of at least 1 cubic foot, at least 2 cubic feet, at least 3 cubic feet, at least 4 cubic feet, at least 5 cubic feet, at least 10 cubic feet, at least 15 cubic feet, at least 20 cubic feet, at least 25 cubic feet, at least 30 cubic feet, at least 35 cubic feet, at least 40 cubic feet, at least 45 cubic feet, at least 50 cubic feet, at least 55 cubic feet, at least 60 cubic feet, at least 64 cubic feet and/or having a volume in a range between any two of the listed values. A specific embodiment can be utilized in a pallet shipper system, for shipping product on a pallet, where the pallet shipper system is configured for the following: the pallet can be approximately 4 feet long by 4 feet wide and the height of the load can be approximately 6 feet, creating a volume of approximately 96 cubic feet, where the pallet shipper system can optionally incorporate no thermal bank, or at least one thermal bank, such as a cold bank, room temperature bank, or warm bank, and the payload can be fully, substantially fully, or partially surrounded, or be incorporated inside a pallet load that is fully, substantially fully, or partially surrounded, either permanently or temporarily, by a biotic filament insulation medium and/or the sides and top of the payload can be fully, substantially fully, or partially separated from the external environment (where the bottom of the payload is separated from the external environment to the extent the pallet accomplishes such separation). The biotic filament insulation medium can have an outer covering, and can surround the product (payload or pallet load), so as to provide thermal insulation between the product and the environment and between the thermal bank (room temperature bank, cold bank, or warm bank) and the environment outside of the package.
Embodiments of the invention can maintain the product shipped within the packaging container in a temperature range of 2-8° C. (e.g., for non-frozen shipments); in a temperature range of less than or equal to 0° C. (e.g., for frozen shipments where the cold bank can utilize liquid nitrogen, dry ice, and/or ice); and/or in a temperature range of 15° C. to 25° C. (e.g., for shipping controlled room temperature (CRT) products), and/or in a temperature range of 20° C. to 25° C., and/or in a temperature range of 0° C. to 5° C., and/or in a temperature range of 2° C. to 4° C., and/or in a temperature range of 10° C. to 15° C., and/or in a temperature range of 15.C to 30° C., and/or in a temperature range of 2° C. to 30° C. where the packaging container assembly, with payload, is exposed to a shipping environment that is variable temperature changes. Embodiments can also be used for shipping products so as to maintain a higher temperature range than the environment.
Embodiments of the invention can combine biotic filament insulation materials to non-biotic insulation materials such as polystyrene, polyurethane foam or cornstarch foam, corn based insulation, fungi based insulations, aerogels, or paper in order to reduce the environmental impact of an insulated packaging container to ship temperature sensitive products, modify the thermal insulation properties, modify the physical structural properties, or provide additional features.
Specific embodiments of the invention can form, using a biotic filament insulation medium, an insulation pad, an insulated packaging container, insulated packaging pouch, or an insulated shipping container, where composting accelerator or activator is incorporated with the biotic filament insulation medium (e.g., embedded in the biotic filament insulation medium), to increase the speed of composting after the pad or container are used and disposed for composting. Specific embodiments can also be placed on/in the ground after initial use and become a garden mat where flowers and vegetables can grow, and can optionally have seeds (28) embedded in the biotic insulation medium prior to use.
This application is a National Stage Application of International Application Number PCT/US2019/039897, filed Jun. 28, 2019; which claims priority to U.S. Provisional Application No. 62/691,378, filed Jun. 28, 2018.
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/US2019/039897 | 6/28/2019 | WO |
| Publishing Document | Publishing Date | Country | Kind |
|---|---|---|---|
| WO2020/006460 | 1/20/2020 | WO | A |
| Number | Name | Date | Kind |
|---|---|---|---|
| 2523145 | Robinson | Sep 1950 | A |
| 5669233 | Cook | Sep 1997 | A |
| 20050214537 | Pohlmann | Sep 2005 | A1 |
| 20080086982 | Parenteau et al. | Apr 2008 | A1 |
| 20090068430 | Troger | Mar 2009 | A1 |
| 20160355320 | Maier-Eschenlohr et al. | Dec 2016 | A1 |
| Number | Date | Country |
|---|---|---|
| 2014118821 | Aug 2014 | WO |
| Entry |
|---|
| Suresh, Babu R. “Investigation of Thermal Insulation on Ice Coolers,” IOSR-JMCE, vol. 12, Issue 1:75-79, Jan.-Feb. 2015. |
| Gaiselmann, Gerd “Extraction of Curved Fibers from 3D Data,” Image Anal Stereol 32:57-63, 2013. |
| Woodside, William “Calculation of the Thermal Conductivity of Porous Media,” Can. J. Phys. 36(7): 815-823, Jul. 1958. |
| International Search Report dated Oct. 29, 2019 in Internation Application No. PCT/US2019/039897. |
| Number | Date | Country | |
|---|---|---|---|
| 20210269225 A1 | Sep 2021 | US |
| Number | Date | Country | |
|---|---|---|---|
| 62691378 | Jun 2018 | US |
