Claims
- 1. A curative for perfluoroelastomeric compositions having formula (I):
- 2. The curative according to claim 1, wherein Y is a perfluorinated alkyl group having about 1 to about 9 carbon atoms.
- 3. The curative according to claim 1, wherein Y is selected from the group consisting of perfluoroalkyl, perfluoroalkoxy, substituted and unsubstituted aryl groups and substituted and unsubstituted halogenated aryl groups.
- 4. The curative according to claim 1, wherein the curative is selected from the group consisting of perfluorooctanamidine, heptafluorobutyrylamidine, benzamidine, trifluoromethylbenzamidoxime, trifluoromethoxylbenzamidoxime, and combinations thereof.
- 5. The curative according to claim 1, wherein the curative is capable of curing perfluoroelastomeric compositions comprising at least one cyano curesite monomer.
- 6. The curative according to claim 1, wherein R2 is hydroxyl, hydrogen or a substituted or unsubstituted alkyl group of from 1 to about 6 carbon atoms.
- 7. The curative according to claim 6, wherein R2 is hydroxyl or hydrogen.
- 8. The curative according to claim 1, wherein R1 is hydrogen or a substituted or unsubstituted lower alkyl group of from 1 to about 6 carbon atoms and R2 is hydroxyl or hydrogen.
- 9. The curative according to claim 8, wherein R1 is hydrogen.
- 10. The curative according to claim 1, wherein the curative is a perfluoroalkylamidine.
- 11. The curative according to claim 1, wherein the curative is an arylamidine.
- 12. The curative according to claim 1, wherein the curative is an arylamidoxime.
- 13. A cure accelerator for perfluoroelastomeric compositions having formula (I):
- 14. The cure accelerator according to claim 13, wherein Y is a perfluorinated alkyl group having about 1 to about 9 carbon atoms.
- 15. The cure accelerator according to claim 13, wherein the cure accelerator is selected from the group consisting of perfluorooctanamidine, heptafluorobutyrylamidine, benzamidine, trifluoromethylbenzamidoxime, trifluoromethoxylbenzamidoxime, and combinations thereof.
- 16. The monoamidine-based cure accelerator according to claim 13, wherein the cure accelerator is capable of accelerating the cure of perfluoroelastomeric compositions comprising at least one cyano curesite monomer.
- 17. The monoamidine-based cure accelerator according to claim 13, wherein the cure accelerator is capable of accelerating the cure of perfluoroelastomeric compositions comprising bisaminophenol and its derivatives.
- 18. A bisamidine-based cure accelerator for perfluoroelastomeric compositions as represented by formula (II):
- 19. The bisamidine-based cure accelerator according to claim 18, wherein R1 and R2 are both hydrogen.
- 20. The bisamidine-based cure accelerator according to claim 18, wherein the cure accelerator is capable of accelerating the cure of perfluoroelastomers comprising at least one cyano curesite monomer.
- 21. The bisamidine-based cure accelerator according to claim 18, wherein the cure accelerator is selected from the group consisting of perfluorosuberamidine and perfluorosebacamidine.
- 22. A curable perfluoroelastomeric composition, comprising:
(a) a perfluoropolymer having at least one curesite monomer comprising a cyano functional group; (b) at least one monoamidine-based or monoamidoxime-based curative.
- 23. The curable perfluoroelastomeric composition according to claim 22, wherein the perfluoropolymer is a tetrapolymer of tetrafluoroethylene, perfluoroalkylvinylether, a primary cyano curesite monomer and a secondary cyano curesite monomer.
- 24. The curable perfluoroelastomeric composition according to claim 22, further comprising a bisamidine-based cure accelerator.
- 25. The curable curable perfluoroelastomeric composition according to claim 22, further comprising bisaminophenol and its derivatives.
- 26. A curable perfluoroelastomeric composition, comprising:
(a) a perfluoropolymer having at least one curesite monomer comprising a cyano functional group; (b) a functionalized diphenyl-based curative; and (c) a cure accelerator selected from the group consisting of at least one monoamidine-based cure accelerator, at least one monoamidoxime-based cure accelerator, at least one bisamidine-based cure accelerator and combinations thereof.
- 27. The curable perfluoroelastomeric composition according to claim 26, wherein wherein the perfluoropolymer is a perfluoropolymer that is a tetrapolymer of tetrafluoroethylene, perfluoroalkylvinylether, a primary cyano curesite monomer and a secondary cyano curesite monomer.
- 28. The curable perfluoroelastomeric composition according to claim 26, wherein the diphenyl-based curative has a sufficiently high molecular weight so that the melting point is no greater than about 240° C.
- 29. The curable perfluoroelastomeric composition according co claim 28, wherein the melting point is no greater than about 230° C.
- 30. The curable perfluoroelastomeric composition according to claim 29, wherein the melting point is no greater than about 225° C.
- 31. The curable perfluoroelastomeric composition according to claim 26, wherein the functionalized diphenyl-based curative has formula (III):
- 32. The curable perfluoroelastomeric composition according to claim 31, wherein the diphenyl-based formula has formula III wherein r is 0, R3 is a carbon atom, J is formula IV, one A is trifluoromethyl and the other A is selected from the group consisting of linear and branched chain perfluoroalkyl and perfluoroalkylether groups of from 2 to 22 carbon atoms.
- 33. The curable perfluoroelastomeric composition according to claim 31, wherein r is 1, each A and each J are a fluorine atom, R3 is a carbon atom and R4 is selected from the group consisting of linear and branched chain perfluoroalkylene and perfluoroalkylether groups of from 2 to 22 carbon atoms, and wherein one A and one J are both bonded to the terminal carbon atom of R4.
- 34. The curable perfluorelastomeric composition according to claim 32, wherein the Z-substituted aminophenyl group on R4 is also bonded to the terminal carbon of R4 which has the A and the J.
- 35. A curative for a perfluoroelastomeric composition, the curative having formula (III):
- 36. A curative for a perfluoroelastomeric composition, comprising a functionalized diphenyl-based curative which has a sufficiently high molecular weight so that the melting point is no greater than about 240° C.
- 37. The curative according to claim 36, wherein the melting point is no greater than about 230° C.
- 38. The curative according to claim 37, wherein the melting point is no greater than about 225° C.
- 39. The curative according to claim 36, wherein the perfluoroelastomeric composition comprises a perfluoropolymer having at least one cyano group containing curesite monomer.
- 40. A method for using a compound having formula (I):
- 41. The method according to claim 40, wherein the perfluoroelastomeric composition comprises a perfluoropolymer having at least one cyano-group containing curesite monomer.
- 42. A method for curing a perfluoroelastomeric composition comprising using a mixture of (i) at least one compound selected from the group consisting of monoamidine-based compounds, monoamidoxime-based compounds, and mixtures thereof and (ii) at least one bisamidine-based compound as co-curatives for the perfluoroelastomeric composition.
- 43. A method for accelerating curing of a perfluoroelastomeric composition, comprising using a cure accelerator for a curative, wherein the cure accelerator is selected from the group consisting of a monoamidine-based compound, a monoamidoxime-based compound, a bisamidine-based compound and combinations thereof.
- 44. A method for curing a perfluoroelastomeric composition comprising using a functionalized diphenyl-based curative having a sufficiently high molecular weight such that the melting point is no greater than about 240° C as a curative for the perfluoroelastomeric composition.
- 45. The method according to claim 44, wherein the melting point is no greater than about 230° C.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefit under 35 U.S.C. 119(e) of U.S. Provisional Application No. 60/443,718, filed Jan. 29, 2003.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60443718 |
Jan 2003 |
US |