The invention relates to a blister pack with radio frequency identification means and a process for its manufacture.
Using blister packs for holding sensitive packaged articles such as tablets, capsules, and the like is known. In this connection a carrier body is produced from flat material, which within a plane region has several depressions produced by deformation of this material for holding the packaged article, and is connected two-dimensionally to an aluminum sealing foil in the plane region.
The aforementioned production process of a blister pack conventionally takes place in the course of the packing process. This means that the packaged articles, such as tablets or capsules, are placed in the depressions of the carrier material, and after placement, the sealing foil is fed onto the carrier material by application of pressure and elevated temperature, so that a connection is formed between the carrier material and the sealing foil.
After unpacking, it is therefore only possible more by destroying the package to achieve safety over genuineness or quality of the packaged article.
As claimed in WO-A1-01/63368, therefore to improve quality control there has been a transition to attaching radio frequency identification means to the blister pack. Radio frequency identification systems are recognition systems as are used for example in chip cards. In any case the technical processes for this purpose have been adopted from radio and radar so that the radio frequency identification system consists altogether of two components, specifically of a transponder which is attached to the objects to be identified, and a reader or detection device.
As claimed in WO-A1-01/63368, the transponder is attached directly to the blister pack. The aluminum foil in the blister pack attenuates the electromagnetic field of the reader to such an extent that the readability of the RFID transponder is greatly reduced.
It is here that the invention will provide a remedy.
As claimed in the invention, a blister pack with radio frequency identification means is suggested which comprises the following components:
Advantageous embodiments of the blister pack as claimed in the invention with radio frequency identification means are disclosed according to the dependent claims.
The invention furthermore relates to a process for producing the blister pack as claimed in the invention with radio frequency identification means comprising the following process steps:
Advantageous embodiments of the process as claimed in the invention are disclosed according to the dependent claims.
The invention is detailed below using
To produce the blister pack 1 as claimed in the invention, for example the carrier body 3 is produced from a for example transparent plastic film by a thermal deep drawing process. The parent products are for example PVC or PP films in a thickness of roughly 0.2-0.3 mm, and they can be present as monofilms or film composites. The thermal deep drawing process is a shaping process with which the depressions 5 are formed within the plane region 4 of the carrier body 3.
In a further process step the aluminum sealing foil 7 is produced. The parent product is an aluminum foil in a thickness of roughly 0.01-0.04 mm which is advantageously provided on the bottom with a hot adhesive varnish layer 6. The coating thickness of the hot adhesive varnish layer 6 is roughly in the range of 0.003-0.02 mm. Due to this hot adhesive varnish layer 6, in the flat region 4 of the carrier body 3 a connection is produced between it and the aluminum sealing foil 7.
The radio frequency identification means 2, 2′ is advantageously intended as a so-called RFID transponder which is located in a housing 9. The important transponder components are a coupling element or an antenna 10 in the form of copper wires and a microchip 11.
The RFID transponder 2 and 2′ is now attached in the region 8 of the plastic carrier material 3 which projects over the aluminum sealing foil 7. This takes place for example by the RFID transponder being purchased in label form and being cemented onto the carrier material 3 in the region 8 by means of commercial automatic labelling machines.
Furthermore it is possible to buy the RFID transponder in tape goods and to cut off according to the dimensions of the region 8 and to apply it in this region.
Furthermore it is possible to imprint parts of the RFID transponder 2, 2′ such as the antenna and the coupling element 10 as well as the contact surface for the microchip 11 in the region 8 of the carrier material 3. Then the microchip 11 is inserted mechanically into the imprinted contact surfaces. This process is also called “pending”.
In series production it is recommended that all parts of the RFID transponder 2, 2′, i.e. the antenna or the coupling element 10 and also the microchip 11, be imprinted onto the carrier material 3 using printing technology.
As is apparent from
Furthermore, it is possible, as shown in
Both for the version as shown in
Number | Date | Country | Kind |
---|---|---|---|
A2048/2005 | Dec 2005 | AT | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
---|---|---|---|---|
PCT/AT06/00515 | 12/14/2006 | WO | 00 | 2/1/2008 |