Claims
- 1. Block copolyetheramide suitable for injection molding, having a melting point ranging from 215.degree. C. to 223.degree. C. an apparent viscosity, at 230.degree. C., ranging from 50 to 150 Pa.sec., a number average molecular weight ranging from 4,300 to 50,000 and a yellow degree lower than or equal to 20 measured by means of an Elrepho apparatus, said copolyetheramide comprising two types of blocks or segments, one of which being polyamide and the other polyalkylene ether, chemically bound to each other, the polyamide block being produced in the presence of catalytic amounts of hypophosphorous acid or metahypophosphorous acid and in the absence of a polyalkylene ether, and the polycondensation between the polyamide blocks and the polyalkylene ether blocks being carried out, in the absence of a polycondensation catalyst and under vacuum lower than 100 mm Hg at temperatures higher than the polyamide block melting temperature, wherein the polyamidic blocks are produced by polymerization of lactams having the formula: ##STR3## wherein p is an integer ranging from 2 to 11, wherein the polyalkylene ether is of poly(ethylene oxide)glycol and its amount ranges from 1 to 15% by weight.
- 2. Block copolyetheramide according to claim 1, wherein the polyamide blocks have a number average molecular weight ranging from 2,000 to 20,000, and the poly(ethylene oxide) blocks have a number average molecular weight ranging from 160 to 10,000.
- 3. Block copolyetheramide according to claim 1, wherein the polyamide blocks have a number average molecular weight ranging from 4,000 to 16,000, and the poly(ethylene oxide) blocks have a number average molecular weight ranging from 300 to 4,000.
- 4. Block copolyetheramide according to any one of claims 1 or 2 or 3, having a number average molecular weight ranging from 15,000 to 30,000.
- 5. Block copolyetheramide according to any one of claims 1, 2 or 3, wherein the polyamidic blocks are poly-epsilon-caprolactam.
Priority Claims (1)
Number |
Date |
Country |
Kind |
20873 A/90 |
Jul 1990 |
ITX |
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Parent Case Info
This application is a continuation of application Ser. No. 07/725,444, filed on Jul. 3, 1991, now abandoned.
US Referenced Citations (9)
Foreign Referenced Citations (1)
Number |
Date |
Country |
156035 |
Oct 1985 |
EPX |
Continuations (1)
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Number |
Date |
Country |
Parent |
725444 |
Jul 1991 |
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