Claims
- 1. A thermoplastic molding composition, which consists essentially of from 55% to 95% by weight of a solidified melt blend of a block polysiloxane-polycarbonate copolymer which is the reaction product of (A) a halogen chain-stopped polydiorganosiloxane composed of from about 5 to 200 chemically combined diorganosiloxy units consisting essentially of dialkylsiloxy units which are connected to each other by silicon-oxygen-silicon linkages wherein each of the silicon atoms has two organo radicals attached through a carbon-silicon bond, and (B) a dihydric phenol having the formula: ##STR4## where Z is a member selected from the group consisting of hydrogen, lower alkyl and halogen and combinations, thereof, and R is a member selected from the group consisting of hydrogen, hydrocarbyl and halogenated hydrocarbyl; and phosgenating the purified reaction product with or without additional dihydric phenol until the resulting copolymer achieves a maximum intrinsic viscosity and from 45% to 5% by weight of a thermoplastic polyamide resin having a number average molecular weight of from about 12,000 to about 60,000 g/mole whereby articles molded therefrom are resistant to delamination and have a notched Izod impact of at least about 630 J/m when tested according to ASTM D-256.
- 2. The composition of claim 1 wherein the copolymer has recurring chain units of the formula: ##STR5## wherein Z is a member selected from the group consisting of hydrogen, lower alkyl and halogen and combinations, thereof, and R is a member selected from the group consisting of hydrogen, hydrocarbyl and halogenated hydrocarbyl; R' represents lower alkyl; x is an integer of 1 to 200 and y represents an integer such that x+y is 2 to 1000.
- 3. The composition of claim 1 wherein the polyamide resin comprises the polymerization product of:
- (a) terephthalic acid with, trimethylhexamethylenediamine; or
- (b) isophthalic acid with trimethylhexamethylenediamine; or
- (c) adipic acid, azelaic acid and 2,2-bis(p-aminocyclohexyl)propane; or
- (d) terephthalic acid with bis (4-amino cyclohexyl)methane; or
- (e) isophthalic acid with hexamethylenediamine; or
- (f) terephthalic acid/isophthalic acid with hexamethylenediamine; or
- (g) isophthalic and with hexamethylene diamine and metaxylylene diamine; or
- (h) adipic acid/azelaic acid with diphenyl methane diisocyanate.
- 4. The composition of claim 1 wherein the polyamide resin is Nylon 6/6, Nylon 6/3, Nylon 6/4, Nylon 6/9, Nylon 6/10, Nylon 6/12, Nylon 6, Nylon 11, Nylon 12 or Nylon 4/6.
- 5. An article molded from the composition of claim 1.
Parent Case Info
This is a continuation of Ser. No. 08/255,835 filed on Jun. 7, 1994 now abandoned, which is a continuation of Ser. No. 08/065,074 filed May 19,1993 now abandoned, which is a continuation of Ser. No. 07/397,334 filed Aug. 22, 1989 now abandoned, which is a continuation of Ser. No. 07/109,121 filed Oct. 16, 1987 now abandoned.
US Referenced Citations (6)
Foreign Referenced Citations (1)
Number |
Date |
Country |
0068368 |
Apr 1984 |
JPX |
Continuations (4)
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Number |
Date |
Country |
Parent |
255835 |
Jun 1994 |
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Parent |
65074 |
May 1993 |
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Parent |
397334 |
Aug 1989 |
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Parent |
109121 |
Oct 1987 |
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