BOARD CONNECTOR

FIELD

The present disclosure relates to a board connector installed in an electronic device for electrical connection between boards.

BACKGROUND

Connectors are provided for various electronic devices for electrical connection. For example, the connectors may be installed in an electronic device such as a mobile phone, a computer, a tablet computer, and the like to electrically connect various components installed in the electronic device.

In general, a radio frequency (RF) connector and a board-to-board connector (hereinafter referred to as a “board connector”) are provided inside a wireless communication device such as a smart phone or a tablet PC among electronic devices. An RF connector delivers RF signals. The board connector processes digital signals of cameras or the like.

The RF connector and the board connector are mounted on a printed circuit board (PCB). Conventionally, several board connectors and RF connectors are mounted together with a large number of components in a limited PCB space, and thus there is a problem in that the PCB mounting area becomes larger. Accordingly, following the trend of miniaturization of smartphones, there is a need for a technology that integrates an RF connector and a board connector and optimizes the connectors within a small PCB mounting area.

FIG. 1 is a schematic perspective view of a board connector according to the related art.

Referring to FIG. 1, a board connector 100 according to the related art includes a first connector 110 and a second connector 120.

The first connector 110 is to be coupled to a first board (not shown). The first connector 110 may be electrically connected to the second connector 120 through a plurality of first contacts 111.

The second connector 120 is to be coupled to a second board (not shown). The second connector 120 may be electrically connected to the first connector 110 through a plurality of second contacts 121.

The board connector 100 according to the related art may electrically connect the first board and the second board as the first contacts 111 and the second contacts 121 are interconnected. Also, when some contacts among the first contacts 111 and the second contacts 121 are used as RF contacts for transmitting RF signals, the board connector 100 according to the related art may be implemented such that RF signals are transmitted between the first board and the second board through the RF contacts.

Here, the board connector 100 according to the related art has the following problems.

First, the board connector 100 according to the related art cannot achieve smooth signal transmission due to RF signal inference between the RF contacts 111′, 111″, 121′, and 121″ when relatively closely spaced contacts among the contacts 111 and 121 are used as the RF contacts.

Second, the board connector 100 according to the related art has an RF signal shielding unit 112 on the outermost part of the connector and thus can shield the radiation of RF signals to the outside but cannot achieve shielding between RF signals.

Third, the board connector 100 according to the related art includes RF contacts 111′, 111″, 121′, and 121″ including mounting parts 111a′, 111a″, 121a′, and 121a″ mounted on a board, and the mounting parts 111a′, 111a″, 121a′, and 121a″ are exposed to the outside. Accordingly, the board connector 100 according to the related art cannot shield the mounting parts 111a′, 111a″, 121a′, and 121a″.

SUMMARY

The present disclosure has been devised to solve the above problems and is directed to providing a board connector capable of reducing the possibility of RF signal interference between RF contacts.

In order to solve the above problems, the present disclosure may include the following configuration.

A board connector according to the present disclosure may include a plurality of radio frequency (RF) contacts for transmitting RF signals; an insulating part that supports the RF contacts; a plurality of transmission contacts coupled to the insulating part and between a first RF contact and a second RF contact, among the RF contacts, such that the first RF contact and the second RF contact are spaced apart from each other in a first axial direction; and a grounding housing to which the insulating part is coupled. The grounding housing may include an inner grounding wall facing the insulating part, an outer grounding wall spaced apart from the inner grounding wall, and a grounding connection wall coupled to each of the inner grounding wall and the outer grounding wall. The inner grounding wall and the outer grounding wall are double-shielding walls that surround the side of an inner space. The first RF contact and the second RF contact may be placed in the inner space surrounded by the double-shielding walls.

A board connector according to the present disclosure may include a plurality of radio frequency (RF) contacts for transmitting RF signals; an insulating part that supports the RF contacts; a plurality of transmission contacts coupled to the insulating part and between a first RF contact and a second RF contact, among the RF contacts, such that the first RF contact and the second RF contact are spaced apart from each other in a first axial direction; and a grounding housing to which the insulating part is coupled. The grounding housing may include an inner grounding wall surrounding the side of an inner space, an upper grounding wall protruding from the top of the side grounding wall to the inner space, and a lower grounding wall protruding from the bottom of the side grounding wall to the opposite side to the inner space. The first RF contact and the second RF contact may be placed in an inner space surrounded by the side grounding wall, the upper grounding wall, and the lower grounding wall.

According to the present disclosure, the following effects can be achieved.

The present disclosure can implement a shielding function of signals, electromagnetic waves, etc. for RF contacts by using a grounding housing. Thus, the present disclosure can prevent electromagnetic waves generated from RF contacts from interfering with signals of circuit components placed in the vicinity of an electronic device and can prevent electromagnetic waves generated from circuit components placed in the vicinity of an electronic device from interfering with RF signals transmitted by RF contacts. Accordingly, the present disclosure can contribute to improving electromagnetic interference (EMI) shielding performance and electromagnetic compatibility (EMC) performance by using the grounding housing.

The present disclosure may be implemented such that all RF contacts including portions mounted on a board are placed on the inner side of the grounding housing. Accordingly, the present disclosure can realize complete shielding by reinforcing a shielding function for RF contacts by using the grounding housing.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic perspective view of a board connector according to the related art;

FIG. 2 is a schematic perspective view of a receptacle connector and a plug connector in a board connector according to the present disclosure;

FIG. 3 is a schematic perspective view of a board connector according to a first embodiment;

FIG. 4 is a schematic exploded perspective view of the board connector according to the first embodiment;

FIG. 5 is a schematic plan view of the board connector according to the first embodiment;

FIG. 6 is a schematic perspective view of a grounding housing of the board connector according to the first embodiment;

FIG. 7 is a schematic side-sectional view taken along line I-I of FIG. 2;

FIGS. 8 to 12 are schematic side-sectional views showing an enlarged portion A of FIG. 7 in an aspect in which the board connector according to the first embodiment and a board connector according to a second embodiment are coupled;

FIG. 13 is a schematic side-sectional view that is taken along line II-II of FIG. 6 and that shows a coupling relationship between a grounding housing of the board connector according to the first embodiment and a grounding housing of the board connector according to the second embodiment;

FIG. 14 is a schematic plan view illustrating a grounding loop in the board connector according to the first embodiment;

FIGS. 15 and 16 are schematic side-sectional views showing the enlarged portion A of FIG. 7 to illustrate a coupling relationship between an insulating part and the grounding housing of the board connector according to the first embodiment;

FIG. 17 is a schematic side-sectional view showing an enlarged portion B of FIG. 7 to illustrate a coupling relationship between the insulating part and the grounding housing of the board connector according to the first embodiment;

FIGS. 18 and 19 are schematic side-sectional views showing the enlarged portion A of FIG. 7 to illustrate a coupling relationship between the insulating part and the grounding housing of the board connector according to the first embodiment;

FIG. 20 is a schematic exploded side view of the insulating part and the grounding housing of the board connector according to the first embodiment;

FIG. 21 is a schematic perspective view of the board connector according to the second embodiment;

FIG. 22 is a schematic exploded perspective view of the board connector according to the second embodiment;

FIG. 23 is a schematic plan view of the board connector according to the second embodiment;

FIG. 24 is a schematic perspective view of the grounding housing of the board connector according to the second embodiment;

FIG. 25 is a schematic side-sectional view taken along line of FIG. 21;

FIG. 26 is a schematic side-sectional view showing the enlarged portion A of FIG. 7 in an aspect in which the board connector according to the first embodiment and the board connector according to the second embodiment are coupled; and

FIG. 27 is a schematic plan view illustrating a grounding loop in the board connector according to the second embodiment.

DETAILED DESCRIPTION

Hereinafter, embodiments of a board connector according to the present disclosure will be described in detail with reference to the accompanying drawings.

Referring to FIG. 2, a board connector 1 according to the present disclosure may be installed in an electronic device (not shown) such as a mobile phone, a computer, and a tablet computer. The board connector 1 according to the present disclosure may be used to electrically connect a plurality of boards (not shown). The boards may be printed circuit boards (PCBs). For example, when a first board and a second board are electrically connected, a receptacle connector mounted on the first board and a plug connector mounted on the second board may be connected to each other. Thus, the first board and the second board may be electrically connected to each other through the receptacle connector and the plug connector.

The board connector 1 according to the present disclosure may be implemented as the receptacle connector. The board connector 1 according to the present disclosure may be implemented as the plug connector. The board connector 1 according to the present disclosure may be implemented to include both the receptacle connector and the plug connector. Hereinafter, an embodiment in which the board connector 1 according to the present disclosure is implemented as the receptacle connector is defined as a board connector 200 according to a first embodiment, and an embodiment in which the board connector 1 according to the present disclosure is implemented as the plug connector is defined as a board connector 300 according to a second embodiment, which will be described in detail with reference to the accompanying drawings. It will be apparent to those skilled in the art to derive an embodiment in which the board connector 1 according to the present disclosure includes both the receptacle connector and the plug connector.

Board Connector 200 According to First Embodiment

Referring to FIGS. 2 to 4, the board connector 200 according to the first embodiment may include a plurality of RF contacts 210, a plurality of transmission contacts 220, a grounding housing 230, and an insulating part 240.

The RF contacts 210 are for transmitting radio frequency (RF) signals. The RF contacts 210 may transmit ultra-high frequency RF signals. The RF contacts 210 may be supported by the insulating part 240. The RF contacts 210 may be coupled to the insulating part 240 through an assembly process. The RF contacts 210 may be integrally molded with the insulating part 240 through injection molding.

The RF contacts 210 may be spaced apart from one another. The RF contacts 210 may be electrically connected to the first board by being mounted on the first board. The RF contacts 210 may be electrically connected to the second board on which the plug connector is mounted, by being connected to the RF contacts of the plug connector. Thus, the first board and the second board may be electrically connected to each other.

A first RF contact 211 among the RF contacts 210 and a second RF contact 212 among the RF contacts 210 may be spaced apart from each other in a first axial direction (x-axis direction). The first RF contact 211 and the second RF contact 212 may be supported by the insulating part 240 at positions spaced apart from each other in the first axial direction (x-axis direction). In FIG. 4, it is shown that the board connector 200 according to the first embodiment includes two RF contacts 210. However, the present disclosure is not limited thereto, and the board connector 200 according to the first embodiment may include three or more RF contacts 210. Meanwhile, the board connector 200 according to the first embodiment will be described herein as including two RF contacts 210.

The first RF contact 211 may include a first RF mounting member 2111. The first RF mounting member 2111 may be mounted on the first board. Thus, the first RF contact 211 may be electrically connected to the first board through the first RF mounting member 2111. The first RF contact 211 may be formed of an electrically conductive material. For example, the first RF contact 211 may be formed of metal. The first RF contact 211 may be connected to one of the RF contacts of the plug connector.

The second RF contact 212 may include a second RF mounting member 2121. The second RF mounting member 2121 may be mounted on the first board. Thus, the second RF contact 212 may be electrically connected to the first board through the second RF mounting member 2121. The second RF contact 212 may be formed of an electrically conductive material. For example, the second RF contact 212 may be formed of metal. The second RF contact 212 may be connected to one of the RF contacts of the plug connector.

Referring to FIGS. 2 to 4, the transmission contacts 220 may be coupled to the insulating part 240. The transmission contacts 220 may be in charge of transmitting signals, data, etc. The transmission contacts 220 may be coupled to the insulating part 240 through an assembly process. The transmission contacts 220 may be integrally molded with the insulating part 240 through injection molding.

The transmission contacts 220 may be disposed between the first RF contact 211 and the second RF contact 212 in the first axial direction (x-axis direction). Thus, in order to reduce RF signal interference between the first RF contact 211 and the second RF contact 212, the transmission contacts 220 may be disposed in a space between the first RF contact 211 and the second RF contact 212. Accordingly, the board connector 200 according to the first embodiment can reduce RF signal interference by increasing the spacing between the first RF contact 211 and the second RF contact 212 and also can improve the space utilization of the insulating part 240 by arranging the transmission contacts 220 in the space.

The transmission contacts 220 may be spaced apart from each other. The transmission contacts 220 may be electrically connected to the first board by being mounted on the first board. In this case, a transmission mounting member 2201 of each of the transmission contacts 220 may be mounted on the first board. The transmission contacts 220 may be formed of an electrically conductive material. For example, the transmission contacts 220 may be formed of metal. The transmission contacts 220 may be electrically connected to the second board on which the plug connector is mounted, by being connected to transmission contacts of the plug connector. Thus, the first board and the second board may be electrically connected to each other.

Meanwhile, FIG. 4 shows that the board connector 200 according to the first embodiment includes four transmission contacts 220. However, the present disclosure is not limited thereto, and the board connector 200 according to the first embodiment may include five or more transmission contacts 220. The transmission contacts 220 may be spaced apart from each other in the first axial direction (x-axis direction) and a second axial direction (y-axis direction). The first axial direction (x-axis direction) and the second axial direction (y-axis direction) are perpendicular to each other.

Referring to FIGS. 2 to 6, the insulating part 240 is coupled to the grounding housing 230. The grounding housing 230 may be grounded by being mounted on the first board. Thus, the grounding housing 230 may implement a shielding function of signals, electromagnetic waves, etc. for the RF contacts 210. In this case, the grounding housing 230 can prevent electromagnetic waves generated from the RF contacts 210 from interfering with signals of circuit components placed in the vicinity of the electronic device and can prevent electromagnetic waves generated from circuit components placed in the vicinity of the electronic device from interfering with RF signals transmitted by the RF contacts 210. Thus, the board connector 200 according to the first embodiment can contribute to improving EMI shielding performance and EMC performance by using the grounding housing 230. The grounding housing 230 may be formed of an electrically conductive material. For example, the grounding housing 230 may be formed of metal.

The grounding housing 230 may be disposed to surround the lateral sides of an inner space 230a. A portion of the insulating part 240 may be placed in the inner space 230a. The first RF contact 211, the second RF contact 212, and the transmission contacts 220 may all be placed in the inner space 230a. In this case, the first RF mounting member 2111, the second RF mounting member 2121, and the transmission mounting members 2201 may all be placed in the inner space 230a. Accordingly, by implementing shielding walls for the first RF contact 211 and the second RF contact 212, the grounding housing 230 can strengthen the shielding function for the first RF contact 211 and the second RF contact 212 to realize complete shielding. The plug connector may be inserted into the inner space 230a.

The grounding housing 230 may be disposed to surround all the sides of the inner space 230a. The inner space 230a may be disposed on an inner side of the grounding housing 230. When the grounding housing 230 is formed in a rectangular ring shape as a whole, the inner space 230a may be formed in a rectangular parallelepiped shape. In this case, the grounding housing 230 may be disposed to surround four sides of the inner space 230a.

Referring to FIGS. 2 to 7, the grounding housing 230 may be implemented to have double-shielding walls. To this end, the grounding housing 230 may include an inner grounding wall 231, an outer grounding wall 232, and a grounding connection wall 233.

The inner grounding wall 231 may be toward the insulating part 240. The inner grounding wall 231 may be disposed toward the inner space 230a. The inner grounding wall 231 may be disposed to surround all the sides of the inner space 230a. When the plug connector is inserted into the inner space 230a, the inner grounding wall 231 may be connected to the grounding housing of the plug connector.

The outer grounding wall 232 may be spaced apart from the inner grounding wall 231. The outer grounding wall 232 may be disposed outside the inner grounding wall 231. The outer grounding wall 232 may be disposed to surround all the sides of the inner grounding wall 231.

The outer grounding wall 232 and the inner grounding wall 231 may be implemented as double-shielding walls that surround the side of the inner space 230a. The first RF contact 211 and the second RF contact 212 may be placed in the inner space 230a surrounded by the double-shielding walls. Thus, the grounding housing 230 can strengthen the shielding function for the RF contacts 210 using the double-shielding walls. Thus, the board connector 200 according to the first embodiment can contribute to further improving EMI shielding performance and EMC performance by using the double-shielding walls.

The outer grounding wall 232 may be grounded by being mounted on the first board. In this case, the grounding housing 230 may be grounded through the outer grounding wall 232. The bottom of the outer grounding wall 232 may be mounted on the first board. In this case, the outer grounding wall 232 may be formed as a greater height than the inner grounding wall 231.

The grounding connection wall 233 is coupled to the inner grounding wall 231 and the outer grounding wall 232. The grounding connection wall 233 may be disposed between the inner grounding wall 231 and the outer grounding wall 232. The inner grounding wall 231 and the outer grounding wall 232 may be electrically connected to each other through the grounding connection wall 233. Thus, when the outer grounding wall 232 is grounded by being mounted on the first board, the grounding connection wall 233 and the inner grounding wall 231 may also be grounded to implement the shielding function. When the plug connector is inserted into the inner space 230a, the grounding connection wall 233 may be connected to the grounding housing of the plug connector.

The grounding connection wall 233 may be coupled to the top of the outer grounding wall 232 and the top of the inner grounding wall 231. The grounding connection wall 233 may be formed in a horizontally disposed plate shape, and the outer grounding wall 232 and the inner grounding wall 231 may be formed in a vertically disposed plate shape. The grounding connection wall 233, the outer grounding wall 232, and the inner grounding wall 231 may be integrally formed.

The grounding housing 230 may include a grounding floor 234.

The grounding floor 234 may protrude from the inner grounding wall 231 to the inner space 230a. The grounding floor 234 may protrude from the bottom of the inner grounding wall 231 to the inner space 230a. Thus, the board connector 200 according to the first embodiment can further strengthen the shielding function for the first RF contact 211 and the second RF contact 212 by implementing a shielding function for the floor of the grounding housing 230 using the grounding floor 234. When the plug connector is inserted into the inner space 230a, the grounding floor 234 may be connected to the grounding housing of the plug connector. Thus, the board connector 200 according to the first embodiment can further strengthen the shielding function by increasing a contact area through the connection between the grounding floor 234 and the grounding housing of the plug connector. Also, by increasing the contact area between the grounding housing 230 and the grounding housing of the plug connector, the board connector 200 according to the first embodiment may reduce electrical adverse effects such as crosstalk that may be caused by mutual capacitance or inductance between adjacent terminals. In this case, the board connector 200 according to the first embodiment can further strengthen the EMI shielding performance because the board connector 200 can secure a path through which electromagnetic waves are introduced to the grounding of at least one of the first board and the second board. The grounding floor 234 may be formed in a horizontally disposed plate shape.

A connection portion between the grounding floor 234 and the outer grounding wall 232 may be formed in a rounded shape as shown in FIG. 11. Thus, the connection portion between the grounding floor 234 and the outer grounding wall 232 may serve as a guide for the plug connector when the plug connector is inserted into the inner space 230a. In this case, a portion toward the inner space 230a in the connection portion between the grounding floor 234 and the outer grounding wall 232 may be formed in a rounded shape to form a curved surface.

The grounding floor 234, the grounding connection wall 233, the outer grounding wall 232, and the inner grounding wall 231 may be integrally formed. In this case, the grounding housing 230 may be integrally formed without seams. The grounding housing 230 may be integrally formed without seams by a metal injection process such as metal die casting and metal injection molding (MIM). The grounding housing 230 may be integrally formed without seams through computer numerical control (CNC) processing, machining center tool (MCT) processing, or the like.

Referring to FIGS. 2 to 12, the grounding housing 230 may include the following configuration to further strengthen the shielding function by improving the contact between the inner grounding wall 231 and the grounding housing of the plug connector.

First, as shown in FIG. 8, the grounding housing 230 may include a connection groove 235. The connection groove 235 may be formed on an inner surface of the inner grounding wall 231. The inner surface of the inner grounding wall 231 is a surface that is toward the inner space 230a. The connection groove 235 may be implemented as a groove formed on the inner surface of the inner grounding wall 231 to a predetermined depth. A grounding housing 330 of the plug connector may be inserted into the connection groove 235. In this case, a connection protrusion 335 of the grounding housing 330 of the plug connector may be inserted into the connection groove 235. Thus, the board connector 200 according to the first embodiment can further strengthen the shielding function for the first RF contact 211 and the second RF contact 212 by using the connection groove 235 to improve the contact between the grounding housing 230 and the grounding housing 330 of the plug connector. In FIG. 8, it is shown that the connection groove 235 is formed to be a greater length in the vertical direction than the connection protrusion 335. However, the present disclosure is not limited thereto, and the connection groove 235 and the connection protrusion 335 may be formed to be substantially the same length. Meanwhile, the inner grounding wall 231 may prevent the connection protrusion 335 from falling out of the connection groove 235 by supporting the connection protrusion 335 inserted into the connection groove 235. The grounding housing 230 may include a plurality of connection grooves 235. In this case, the connection grooves 235 may be spaced apart from one another on the inner surface of the inner grounding wall 231.

Next, as shown in FIG. 9, the grounding housing 230 may include a connection protrusion 236. The connection protrusion 236 may be formed on the inner surface of the inner grounding wall 231. The connection protrusion 236 may protrude from the inner surface of the inner grounding wall 231. The connection protrusion 236 may be inserted into the grounding housing 330 of the plug connector. In this case, the connection protrusion 236 may be inserted into the connection groove 334 of the grounding housing 330 of the plug connector. Thus, the board connector 200 according to the first embodiment can further strengthen the shielding function for the first RF contact 211 and the second RF contact 212 by using the connection protrusion 236 to improve the contact between the grounding housing 230 and the grounding housing 330 of the plug connector. In FIG. 9, it is shown that the connection protrusion 236 is formed to be a lesser length in the vertical direction than the connection groove 334. However, the present disclosure is not limited thereto, and the connection protrusion 236 and the connection groove 334 may be formed to be substantially the same length. Meanwhile, since the connection protrusion 236 is inserted into the connection groove 334 and supported by the grounding housing 330, the connection protrusion 236 can be prevented from falling out of the connection groove 334. The grounding housing 230 may include a plurality of connection protrusions 236. In this case, the connection protrusions 236 may be spaced apart from one another on the inner surface of the inner grounding wall 231.

Next, as shown in FIG. 10, when the grounding housing 230 includes the connection protrusion 236, the connection protrusion 236 may support the connection protrusion 335 of the grounding housing 330 of the plug connector. Thus, the board connector 200 according to the first embodiment can further strengthen the shielding function for the first RF contact 211 and the second RF contact 212 by using the connection protrusion 236 to improve the contact between the grounding housing 230 and the grounding housing 330 of the plug connector. Meanwhile, the connection protrusion 236 may be disposed above the connection protrusion 335 to support the connection protrusion 335, thereby preventing the connection protrusion 335 from falling out.

Next, as shown in FIG. 11, the grounding housing 230 may be brought into contact with the grounding housing 330 of the plug connector through the surface contact between the inner surface of the inner grounding wall 231 and the grounding housing 330 of the plug connector. In this case, a gap may occur between the inner surface of the inner grounding wall 231 and the grounding housing 330 of the plug connector. In order to compensate for the gap, as shown in FIG. 12, the grounding housing 230 may include a conductive member 237. The conductive member 237 may be coupled to the inner surface of the inner grounding wall 231. The conductive member 237 may be formed in a closed ring shape that extends on the inner surface of the inner grounding wall 231 including a corner portion 231a (see FIG. 6) of the inner surface of the inner grounding wall 231. Thus, the board connector 200 according to the first embodiment can further strengthen the shielding function for the first RF contact 211 and the second RF contact 212 by using the conductive member 237 to improve the contact between the grounding housing 230 and the grounding housing 330 of the plug connector. Also, implementation is difficult in the corner portion 231a of the inner surface of the inner grounding wall 231 in the embodiment using the connection protrusion 236 and the connection groove 235. On the other hand, it is possible to improve the easiness of the implementation in the corner portion 231a of the inner surface of the inner grounding wall 231 in the embodiment using the conductive member 237. The conductive member 237 may be formed of an electrically conductive material to electrically connect the inner grounding wall 231 and the grounding housing 330 of the plug connector, For example, the conductive member 237 may be formed of metal. The conductive member 237 may be separately produced and then coupled to the inner grounding wall 231 through mounting, attachment, and fastening to the inner surface of the inner grounding wall 231. The conductive member 237 may be coupled to the inner grounding wall 231 by applying a conductive shielding material to the inner surface of the inner grounding wall 231.

Referring to FIGS. 2 to 13, the grounding housing 230 may include a grounding arm 238 (see FIG. 13).

The grounding arm 238 may protrude from the grounding floor 234 toward the inner space 230a. The grounding arm 238 may be inclined to increase in height as the grounding arm 238 protrudes toward the inner space 230a. Accordingly, when the plug connector is inserted into the inner space 230a, the grounding arm 238 may be pressed against the grounding housing 330 of the plug connector and thus can rotate and move downward from a point connected to the grounding floor 234. Thus, the grounding arm 238 places pressure on the grounding housing 330 using a restoring force and thus comes into strong contact with the grounding housing 330. Accordingly, the board connector 200 according to the first embodiment can further strengthen the shielding function for the first RF contact 211 and the second RF contact 212 by using the grounding arm 238 to improve the contact between the grounding housing 230 and the grounding housing 330 of the plug connector. The grounding housing 230 may include a plurality of grounding arms 238. In this case, the grounding arms 238 may be spaced apart from one another along the grounding floor 234.

Referring to FIGS. 2 to 13, the grounding housing 230 may include a soldering inspection window 239 (see FIGS. 5 and 6).

The soldering inspection window 239 may be formed through the grounding housing 230. The soldering inspection window 239 may be used to inspect a state in which the first RF mounting member 2111 is mounted on the first board. In this case, the first RF contact 211 may be coupled to the insulating part 240 such that the first RF mounting member 2111 is placed at a position corresponding to the soldering inspection window 239. Thus, the first RF mounting member 2111 is not covered by the grounding housing 230. Accordingly, while the board connector 200 according to the first embodiment is mounted on the first board, it is possible for a worker to inspect a state in which the first RF mounting member 2111 is mounted on the first board through the soldering inspection window 239. Thus, the board connector 200 according to the first embodiment can improve the accuracy of a mounting operation for mounting the first RF contact 211 on the first board even if the entirety of the first RF contact 211 including the first RF mounting member 2111 is placed on the inner side of the grounding housing 230. The soldering inspection window 239 may be implemented as a groove formed on the grounding floor 234 to a certain depth.

The grounding housing 230 may include a plurality of soldering inspection windows 239. In this case, the second RF mounting member 2121 and the transmission mounting members 2201 may be placed at positions corresponding to the soldering inspection windows 239. Accordingly, while the board connector 200 according to the first embodiment is mounted on the first board, it is possible for a worker to inspect a state in which the first RF mounting member 2111, the second RF mounting member 2121, and the transmission mounting members 2201 are mounted on the first board through the soldering inspection windows 239. Thus, the board connector 200 according to the first embodiment can improve the accuracy of the operation of mounting the first RF contact 211, the second RF contact 212, and the transmission contacts 220 on the first board.

Referring to FIGS. 2 to 12, the insulating part 240 may support the RF contacts 210. The RF contacts 210 and the transmission contacts 220 may be coupled to the insulating part 240. The insulating part 240 may be formed of an insulating material. The insulating part 240 may be coupled to the grounding housing 230 so that the RF contacts 210 are placed in the inner space 230a.

The insulating part 240 may include an insulating member 241.

The insulating member 241 supports the RF contacts 210 and the transmission contacts 220. The insulating member 241 may be placed in the inner space 230a. The insulating member 241 may be placed on an inner side of the grounding floor 234. In this case, the grounding floor 234 may be placed between the inner grounding wall 231 and the insulating member 241. The grounding floor 234 may be disposed to surrounding an outer surface of the insulating member 241.

The insulating part 240 may include an insertion member 242 and a connection member 243.

The insertion member 242 may be inserted between the inner grounding wall 231 and the outer grounding wall 232. Since the insertion member 242 is inserted between the inner grounding wall 231 and the outer grounding wall 232, the insulating part 240 may be coupled to the grounding housing 230. The insertion member 242 may be inserted between the inner grounding wall 231 and the outer grounding wall 232 by using interference fitting. The insertion member 242 may be disposed on an outer side of the insulating member 241. The insertion member 242 may be disposed to surround the outer side of the insulating member 241.

The connection member 243 may be coupled to the insertion member 242 and the insulating member 241. The insertion member 242 and the insulating member 241 may be connected to each other through the connection member 243. The connection member 243 may be formed to a vertically less height than the insertion member 242 and the insulating member 241. Thus, a space is provided between the insertion member 242 and the insulating member 241, and the plug connector may be inserted into the corresponding space. The connection member 243 may be disposed under the grounding floor 234. In this case, the grounding floor 234 may be disposed to cover the connection member 243. The connection member 243, the insertion member 242, and the insulating member 241 may be integrally formed.

Referring to FIGS. 2 to 7, the insulating part 240 may include a soldering inspection window 244 (see FIG. 5).

The soldering inspection window 244 may be formed through the insulating part 240. The soldering inspection window 244 may be used to inspect a state in which the first RF mounting member 2111 is mounted on the first board. In this case, the first RF contact 211 may be coupled to the insulating part 240 such that the first RF mounting member 2111 is placed at the soldering inspection window 244. Thus, the first RF mounting member 2111 is not covered by the insulating part 240. Accordingly, while the board connector 200 according to the first embodiment is mounted on the first board, it is possible for a worker to inspect a state in which the first RF mounting member 2111 is mounted on the first board through the soldering inspection window 244. Thus, the board connector 200 according to the first embodiment can improve the accuracy of a mounting operation for mounting the first RF contact 211 on the first board even if the entirety of the first RF contact 211 including the first RF mounting member 2111 is placed on the inner side of the grounding housing 230. The soldering inspection window 244 may be formed through the insulating member 241.

The insulating part 240 may include a plurality of soldering inspection windows 244. In this case, the second RF mounting member 2121 and the transmission mounting members 2201 may be placed at the soldering inspection windows 244. Accordingly, while the board connector 200 according to the first embodiment is mounted on the first board, it is possible for a worker to inspect a state in which the first RF mounting member 2111, the second RF mounting member 2121, and the transmission mounting members 2201 are mounted on the first board through the soldering inspection windows 244. Thus, the board connector 200 according to the first embodiment can improve the accuracy of the operation of mounting the first RF contact 211, the second RF contact 212, and the transmission contacts 220 on the first board.

Referring to FIGS. 2, 7, and 14, the board connector 200 according to the first embodiment may include a first grounding contact 250.

The first grounding contact 250 is coupled to the insulating part 240. The first grounding contact 250 may be grounded by being mounted on the first board. The first grounding contact 250 may be coupled to the insulating part 240 through an assembly process. The first grounding contact 250 may be integrally molded with the insulating part 240 through injection molding.

The first grounding contact 250 may implement the shielding function for the first RF contact 211 together with the grounding housing 230. In this case, as shown in FIG. 5, the grounding housing 230 may include a first double-shielding wall 230b, a second double-shielding wall 230c, a third double-shielding wall 230d, and a fourth double-shielding wall 230e. The first double-shielding wall 230b, the second double-shielding wall 230c, the third double-shielding wall 230d, and the fourth double-shielding wall 230e may be implemented along the inner grounding wall 231, the outer grounding wall 232, and the grounding connection wall 233. The first double-shielding wall 230b and the second double-shielding wall 230c may be disposed to face each other in the first axial direction (x-axis direction). The first RF contact 211 may be placed between the first double-shielding wall 230b and the second double-shielding wall 230c in the first axial direction (x-axis direction). The first RF contact 211 may be placed at a position where the spacing from the first double-shielding wall 230b is shorter than the spacing from the second double-shielding wall 230c in the first axial direction (X-axis direction). The third double-shielding wall 230d and the fourth double-shielding wall 230e may be disposed to face each other in the second axial direction (y-axis direction). The first RF contact 211 may be placed between the third double-shielding wall 230d and the fourth double-shielding wall 230e in the second axial direction (y-axis direction). The first RF contact 211 may be spaced an approximately equal distance from each of the third double-shielding wall 230d and the fourth double-shielding wall 230e in the second axial direction (y-axis direction).

The first grounding contact 250 may be disposed between the first RF contact 211 and the transmission contacts 220 in the first axial direction (x-axis direction). Accordingly, the first RF contact 211 may be placed between the first double-shielding wall 230b and the first grounding contact 250 in the first axial direction (x-axis direction) and may be placed between the third double-shielding wall 230d and the fourth double-shielding wall 230e in the second axial direction (y-axis direction). Accordingly, the board connector 200 according to the first embodiment can strengthen the shielding function for the first RF contact 211 using the first grounding contact 250, the first double-shielding wall 230b, the third double-shielding wall 230d, and the fourth double-shielding wall 230e.

The first grounding contact 250, the first double-shielding wall 230b, the third double-shielding wall 230d, and the fourth double-shielding wall 230e may be disposed on four sides with respect to the first RF contact 211 to implement shielding against RF signals. In this case, the first grounding contact 250, the first double-shielding wall 230b, the third double-shielding wall 230d, and the fourth double-shielding wall 230e may implement a grounding loop 250a (see FIG. 14) for the first RF contact 211. Accordingly, the board connector 200 according to the first embodiment can realize complete shielding for the first RF contact 211 by further strengthening the shielding function for the first RF contact 211 using the grounding loop 250a.

The first grounding contact 250 may be formed of an electrically conductive material. For example, the first grounding contact 250 may be formed of metal. When the plug connector is inserted into the inner space 230a, the first grounding contact 250 may be connected to the grounding contact of the plug connector.

Referring to FIGS. 2, 7, and 14, the board connector 200 according to the first embodiment may include a second grounding contact 260.

The second grounding contact 260 is coupled to the insulating part 240. The second grounding contact 260 may be grounded by being mounted on the first board. The second grounding contact 260 may be coupled to the insulating part 240 through an assembly process. The second grounding contact 260 may be integrally molded with the insulating part 240 through injection molding.

The second grounding contact 260 may implement the shielding function for the second RF contact 212 together with the grounding housing 230. The second grounding contact 260 may be disposed between the second RF contact 212 and the transmission contacts 220 in the first axial direction (x-axis direction). Accordingly, the second RF contact 212 may be placed between the second double-shielding wall 230c and the second grounding contact 260 in the first axial direction (x-axis direction) and may be placed between the third double-shielding wall 230d and the fourth double-shielding wall 230e in the second axial direction (y-axis direction). Accordingly, the board connector 200 according to the first embodiment can strengthen the shielding function for the second RF contact 212 using the second grounding contact 260, the second double-shielding wall 230c, the third double-shielding wall 230d, and the fourth double-shielding wall 230e.

The second grounding contact 260, the second double-shielding wall 230c, the third double-shielding wall 230d, and the fourth double-shielding wall 230e may be disposed on four sides with respect to the second RF contact 212 to implement shielding against RF signals. In this case, the second grounding contact 260, the second double-shielding wall 230c, the third double-shielding wall 230d, and the fourth double-shielding wall 230e may implement a grounding loop 260a (see FIG. 14) for the second RF contact 212. Accordingly, the board connector 200 according to the first embodiment can realize complete shielding for the second RF contact 212 by further strengthening the shielding function for the second RF contact 212 using the grounding loop 260a.

The second grounding contact 260 may be formed of an electrically conductive material. For example, the second grounding contact 260 may be formed of metal. When the plug connector is inserted into the inner space 230a, the second grounding contact 260 may be connected to the grounding contact of the plug connector.

Referring to FIGS. 15 to 20, the board connector 200 according to the first embodiment may be implemented such that the grounding housing 230 and the insulating part 240 are firmly coupled. This can be specifically described as follows.

First, as shown in FIG. 15, the insulating part 240 may include a protrusion member 245. The protrusion member 245 may protrude from the insertion member 242. The protrusion member 245 may protrude from the inner surface of the insertion member 242, which faces the inner space 230a (see FIG. 2), to the inner space 230a (see FIG. 2). When the grounding housing 230 and the insulating part 240 are coupled, the protrusion member 245 may apply pressure on the inner grounding wall 231. A face of the inner grounding wall 231 facing the insertion member 242 may receive pressure from the protrusion member 245. Since the protrusion member 245 places pressure on the inner grounding wall 231, the grounding housing 230 and the insulating part 240 may be firmly coupled through fitting. The protrusion member 245 and the insertion member 242 may be integrally formed. Although not shown, the insulating part 240 may include a plurality of protrusion members 245. The protrusion members 245 may protrude from the insertion member 242 at positions spaced apart from each other.

Next, as shown in FIG. 16, the insulating part 240 may include the protrusion member 245. The protrusion member 245 may protrude from the insertion member 242. The protrusion member 245 may protrude from the inner surface of the insertion member 242, which faces the inner space 230a (see FIG. 2), to the inner space 230a (see FIG. 2).

The grounding housing 230 may include an inner wall hole 231b. The inner wall hole 231b may be formed through the inner grounding wall 231. When the grounding housing 230 and the insulating part 240 are coupled, the protrusion member 245 may be inserted into the inner wall hole 231b. Thus, the protrusion member 245 supports the inner grounding wall 231, and thus the grounding housing 230 and the insulating part 240 may be firmly coupled. The protrusion member 245 and the insertion member 242 may be integrally formed. Although not shown, the insulating part 240 may include a plurality of protrusion members 245. The protrusion members 245 may protrude from the insertion member 242 at positions spaced apart from each other. In this case, the grounding housing 230 may include a plurality of inner wall holes 231b. The inner wall holes 21b may be formed through the inner grounding wall 231 at positions spaced apart from each other.

Next, as shown in FIG. 17, the insulating part 240 may include the protrusion member 245. The protrusion member 245 may protrude from the insertion member 242. The protrusion member 245 may protrude outward from an outer surface of the insertion member 242. The outer surface of the insertion member 242 may be a face placed opposite to the inner surface of the insertion member 242. The outer side is a side opposite to the side facing the inner space 230a.

The grounding housing 230 may include an outer wall hole 232a. The outer wall hole 232a may be formed through the outer grounding wall 232. When the grounding housing 230 and the insulating part 240 are coupled, the protrusion member 245 may be inserted into the outer wall hole 232a. Thus, the protrusion member 245 supports the outer grounding wall 232, and thus the grounding housing 230 and the insulating part 240 may be firmly coupled. The protrusion member 245 and the insertion member 242 may be integrally formed. Although not shown, the insulating part 240 may include a plurality of protrusion members 245. The protrusion members 245 may protrude from the insertion member 242 at positions spaced apart from each other. In this case, the grounding housing 230 may include a plurality of outer wall holes 232a. The outer wall holes 232a may be formed through the outer grounding wall 232 at positions spaced apart from each other.

Next, as shown in FIG. 18, the insulating part 240 may include a catching groove 241a. The catching groove 241a may be formed in the insulating member 241. The catching groove 241a may be formed on a face of the insulating member 241 facing the insertion member 242. When the grounding housing 230 and the insulating part 240 are coupled, the grounding arm 238 may be inserted into the catching groove 241a. Thus, the insulating member 241 supports the grounding arm 238, and thus the grounding housing 230 and the insulating part 240 may be firmly coupled.

Although not shown, an elastic groove may be formed on the grounding floor 234. The elastic groove may be placed on both sides of the grounding arm 238. Due to the elastic groove, the elastically movable displacement of the grounding arm 238 may increase with respect to the grounding floor 234. The elastic groove may be formed to extend from the grounding floor 234 to the inner grounding wall 231. The grounding housing 230 may include a plurality of grounding arms 238. The grounding arms 238 may be disposed to protrude from the grounding floor 234 at positions spaced apart from each other. In this case, the insulating part 240 may include a plurality of catching grooves 241a. The catching grooves 241a may be formed in the insulating member 241 at positions spaced apart from each other.

Next, as shown in FIG. 19, when the grounding housing 230 and the insulating part 240 are coupled, the grounding arm 238 may receive pressure from the first grounding contact 250. The first grounding contact 250 supports the grounding arm 238 while remaining coupled to the insulating part 240, and thus the grounding housing 230 and the insulating part 240 may be firmly coupled.

Although not shown, an elastic groove may be formed on the grounding floor 234. The elastic groove may be placed on both sides of the grounding arm 238. Due to the elastic groove, the elastically movable displacement of the grounding arm 238 may increase with respect to the grounding floor 234. The elastic groove may be formed to extend from the grounding floor 234 to the inner grounding wall 231. The grounding housing 230 may include a plurality of grounding arms 238. The grounding arms 238 may be disposed to protrude from the grounding floor 234 at positions spaced apart from each other. Some of the grounding arms 238 may receive pressure from the first grounding contact 250, and others of the grounding arms 238 may receive pressure from the second grounding contact 260 (see FIG. 14). The others of the grounding arms 238 may receive pressure from the transmission contact 220 (see FIG. 14).

As shown in FIG. 20, the insulating part 240 may include an insertion groove 242a. The insertion groove 242a may be formed in the insertion member 242. The insertion groove 242a may be implemented as a groove formed on the outer surface of the insertion member 242 to a certain depth. A catching surface 242b disposed toward the insertion groove 242a may be formed on the insertion member 242.

The grounding housing 230 may include a catching member 232b. The catching member 232b may be formed on the outer grounding wall 232. In this case, the grounding housing 230 may include a plurality of outer grounding walls 232 spaced apart from each other so that outer grounding wall 232 can be inserted into the insertion groove 242a. The catching member 232b may protrude from opposite sides of the outer grounding walls 232 facing each other. Thus, when the grounding housing 230 and the insulating part 240 are coupled, the catching member 232b may apply pressure on the catching surface 242b. In this case, the catching member 232b may be inserted into the catching surface 242b like a wedge. Accordingly, the grounding housing 230 and the insulating part 240 may be firmly coupled. Although not shown, the insulating part 240 may include a plurality of insertion grooves 242a. The insertion grooves 242a may be formed on the insertion member 242 at positions spaced apart from each other. In this case, the grounding housing 230 may include a plurality of outer grounding walls 232 where the catching member 232b is formed. The outer grounding walls 232 may be disposed at positions spaced apart from each other and inserted into the insertion grooves 242a.

Board Connector 300 According to Second Embodiment

Referring to FIGS. 2 and 21, the board connector 300 according to the second embodiment may include a plurality of RF contacts 310, a plurality of transmission contacts 320, a grounding housing 330, and an insulating part 340.

The RF contacts 310 are for transmitting RF signals. The RF contacts 310 may transmit ultra-high frequency RF signals. The RF contacts 310 may be supported by the insulating part 340. The RF contacts 310 may be coupled to the insulating part 340 through an assembly process. The RF contacts 310 may be integrally molded with the insulating part 340 through injection molding.

The RF contacts 310 may be spaced apart from one another. The RF contacts 310 may be electrically connected to the second board by being mounted on the second board. The RF contacts 310 may be electrically connected to the first board on which the receptacle connector is mounted, by being connected to the RF contacts of the receptacle connectors. Thus, the first board and the second board may be electrically connected to each other. In this case, the receptacle connector may be implemented as the board connector 200 according to the first embodiment. Meanwhile, the plug connector in the board connector 200 according to the first embodiment may be implemented as the board connector 300 according to the second embodiment.

A first RF contact 311 among the RF contacts 310 and a second RF contact 312 among the RF contacts 310 may be spaced apart from each other in the first axial direction (x-axis direction). The first RF contact 311 and the second RF contact 312 may be supported by the insulating part 340 at positions spaced apart from each other in the first axial direction (x-axis direction). FIG. 22 shows that the board connector 300 according to the second embodiment includes two RF contacts 310. However, the present disclosure is not limited thereto, and the board connector 300 according to the second embodiment may include three or more RF contacts 310. Meanwhile, the board connector 300 according to the second embodiment will be described herein as including two RF contacts 310.

The first RF contact 311 may include a first RF mounting member 3111. The first RF mounting member 3111 may be mounted on the second board. Thus, the first RF contact 311 may be electrically connected to the second board through the first RF mounting member 3111. The first RF contact 311 may be formed of an electrically conductive material. For example, the first RF contact 311 may be formed of metal. The first RF contact 311 may be connected to one of the RF contacts of the receptacle connector.

The second RF contact 312 may include a second RF mounting member 3121. The second RF mounting member 3121 may be mounted on the second board. Thus, the second RF contact 312 may be electrically connected to the second board through the second RF mounting member 3121. The second RF contact 312 may be formed of an electrically conductive material. For example, the second RF contact 312 may be formed of metal. The second RF contact 312 may be connected to one of the RF contacts of the receptacle connector.

Referring to FIGS. 2, 21, and 22, the transmission contacts 320 are coupled to the insulating part 340. The transmission contacts 320 may be in charge of transmitting signals, data, etc. The transmission contacts 320 may be coupled to the insulating part 340 through an assembly process. The transmission contacts 320 may be integrally molded with the insulating part 340 through injection molding.

The transmission contacts 320 may be disposed between the first RF contact 311 and the second RF contact 312 in the first axial direction (x-axis direction). Thus, in order to reduce RF signal interference between the first RF contact 311 and the second RF contact 312, the transmission contacts 320 may be disposed in a space between the first RF contact 311 and the second RF contact 312. Accordingly, the board connector 300 according to the second embodiment can reduce RF signal interference by increasing the spacing between the first RF contact 311 and the second RF contact 312 and also can improve the space utilization of the insulating part 340 by arranging the transmission contacts 320 in the space.

The transmission contacts 320 may be spaced apart from each other. The transmission contacts 320 may be electrically connected to the second board by being mounted on the second board. In this case, a transmission mounting member 3201 of each of the transmission contacts 320 may be mounted on the second board. The transmission contacts 320 may be formed of an electrically conductive material. For example, the transmission contacts 320 may be formed of metal. The transmission contacts 320 may be electrically connected to the second board on which the receptacle connector is mounted, by being connected to the transmission contacts of the receptacle connector. Thus, the first board and the second board may be electrically connected to each other.

Meanwhile, in FIG. 22, it is shown that the board connector 300 according to the second embodiment includes four transmission contacts 320. However, the present disclosure is not limited thereto, and the board connector 300 according to the second embodiment may include five or more transmission contacts 320. The transmission contacts 320 may be spaced apart from each other in the first axial direction (x-axis direction) and the second axial direction (y-axis direction).

Referring to FIGS. 21 to 24, the insulating part 340 is coupled to the grounding housing 330. The grounding housing 330 may be grounded by being mounted on the second board. Thus, the grounding housing 330 may implement a shielding function of signals, electromagnetic waves, etc. for the RF contacts 310. In this case, the grounding housing 330 can prevent electromagnetic waves generated from the RF contacts 310 from interfering with signals of circuit components placed in the vicinity of the electronic device and can prevent electromagnetic waves generated from circuit components placed in the vicinity of the electronic device from interfering with RF signals transmitted by the RF contacts 310. Thus, the board connector 300 according to the second embodiment can contribute to improving EMI shielding performance and EMC performance by using the grounding housing 330. The grounding housing 330 may be formed of an electrically conductive material. For example, the grounding housing 330 may be formed of metal.

The grounding housing 330 may be disposed to surround the lateral sides of an inner space 330a. The insulating part 340 may be placed in the inner space 330a. The first RF contact 311, the second RF contact 312, and the transmission contacts 220 may all be placed in the inner space 330a. In this case, the first RF mounting member 3111, the second RF mounting member 3121, and the transmission mounting members 3201 may all be placed in the inner space 330a. Accordingly, by implementing shielding walls for the first RF contact 311 and the second RF contact 312, the grounding housing 330 can strengthen the shielding function for the first RF contact 311 and the second RF contact 312 to realize complete shielding. The receptacle connector may be inserted into the inner space 330a. In this case, a portion of the receptacle connector may be inserted into the inner space 330a, and a portion of the board connector 300 according to the second embodiment may be inserted into the inner space of the receptacle connector.

The grounding housing 330 may be disposed to surround all the sides of the inner space 330a. The inner space 330a may be disposed on an inner side of the grounding housing 330. When the grounding housing 330 is formed in a rectangular ring shape as a whole, the inner space 330a may be formed in a rectangular parallelepiped shape. In this case, the grounding housing 330 may be disposed to surround four sides of the inner space 330a.

Referring to FIGS. 21 to 25, the grounding housing 330 may include a side grounding wall 331, a lower grounding wall 332, and an upper grounding wall 333.

The side grounding wall 331 may be disposed to surround the lateral sides of the inner space 330a. The side grounding wall 331 may be disposed to surround all the sides of the inner space 330a. When the receptacle connector is inserted into the inner space 330a, the side grounding wall 331 may be connected to the grounding housing of the receptacle connector. In this case, the side grounding wall 331 may be connected to the inner grounding wall 231. The side grounding wall 331 may be formed in a vertically disposed plate shape.

The lower grounding wall 332 may protrude from the bottom of the side grounding wall 331 toward the opposite side to the inner space 330a. That is, the lower grounding wall 332 may protrude from the outside of the side grounding wall 331. The lower grounding wall 332 may be formed in a closed ring shape extending along the bottom of the side grounding wall 331. The lower grounding wall 332 may be grounded by being mounted on the second board. Thus, the side grounding wall 331 and the upper grounding wall 333 may be grounded through the lower grounding wall 332. That is, the grounding housing 330 may be grounded through the lower grounding wall 332. When the receptacle connector is inserted into the inner space 330a, the lower grounding wall 332 may be connected to the grounding housing of the receptacle connector. In this case, the lower grounding wall 332 may be connected to the grounding connection wall 233. The lower grounding wall 332 may be formed in a horizontally disposed plate shape.

The upper grounding wall 333 may protrude from the top of the side grounding wall 331 toward the inner space 330a. The upper grounding wall 333 may be formed in a closed ring shape extending along the top of the side grounding wall 331. When the receptacle connector is inserted into the inner space 330a, the upper grounding wall 333 may be connected to the grounding housing of the receptacle connector. In this case, the upper grounding wall 333 may be connected to the grounding floor 234. The upper grounding wall 333 may be formed in a horizontally disposed plate shape.

The upper grounding wall 333, the lower grounding wall 332, and the side grounding wall 331 may be integrally formed. In this case, the grounding housing 330 may be integrally formed without seams. The grounding housing 330 may be integrally formed without seams by a metal injection process such as metal die casting and metal injection molding (MIM). The grounding housing 330 may be integrally formed without seams through computer numerical control (CNC) processing, machining center tool (MCT) processing, or the like.

Referring to FIGS. 8 to 26, the grounding housing 330 may include the following configuration to further strengthen the shielding function by improving the contact between the side grounding wall 331 and the grounding housing of the receptacle connector.

First, as shown in FIG. 8, the grounding housing 330 may include a connection protrusion 335. The connection protrusion 335 may be formed on an outer surface of the side grounding wall 331. The connection protrusion 335 may protrude from the outer surface of the side grounding wall 331. The connection protrusion 335 may be inserted into the grounding housing 230 of the receptacle connector. In this case, the connection protrusion 335 may be inserted into the connection groove 235 of the grounding housing 230 of the receptacle connector. Thus, the board connector 300 according to the second embodiment can further strengthen the shielding function for the first RF contact 311 and the second RF contact 312 by using the connection protrusion 335 to improve the contact between the grounding housing 330 and the grounding housing 230 of the receptacle connector. In FIG. 8, it is shown that the connection protrusion 335 is formed to be a lesser length in the vertical direction than the connection groove 235. However, the present disclosure is not limited thereto, and the connection protrusion 335 and the connection groove 235 may be formed to be substantially the same length. The grounding housing 330 may include a plurality of connection protrusions 335. In this case, the connection protrusion 335 may be spaced apart from one another on the outer surface of the side grounding wall 331.

Next, as shown in FIG. 9, the grounding housing 330 may include a connection groove 334. The connection groove 334 may be formed on an outer surface of the side grounding wall 331. The connection groove 334 may be implemented as a groove formed on the outer surface of the side grounding wall 331 to a predetermined depth. A grounding housing 230 of the receptacle connector may be inserted into the connection groove 334. In this case, a connection protrusion 236 of the grounding housing 230 of the receptacle connector may be inserted into the connection groove 334. Thus, the board connector 300 according to the second embodiment can further strengthen the shielding function for the first RF contact 311 and the second RF contact 312 by using the connection groove 334 to improve the contact between the grounding housing 330 and the grounding housing 230 of the receptacle connector. In FIG. 9, it is shown that the connection groove 334 is formed to be a greater length in the vertical direction than the connection protrusion 236. However, the present disclosure is not limited thereto, and the connection groove 334 and the connection protrusion 236 may be formed to be substantially the same length. Meanwhile, the side grounding wall 331 may prevent the connection protrusion 236 from falling out of the connection groove 334 by supporting the connection protrusion 236 inserted into the connection groove 334. The grounding housing 330 may include a plurality of connection grooves 334. In this case, the connection grooves 334 may be spaced apart from one another on the outer surface of the side grounding wall 331.

Next, as shown in FIG. 10, when the grounding housing 330 includes the connection protrusion 335, the connection protrusion 335 may be supported by the connection protrusion 236 of the grounding housing 230 of the receptacle connector. Thus, the board connector 300 according to the second embodiment can further strengthen the shielding function for the first RF contact 311 and the second RF contact 312 by using the connection protrusion 335 to improve the contact between the grounding housing 330 and the grounding housing 230 of the receptacle connector. Meanwhile, the connection protrusion 335 may be placed on the bottom of the connection protrusion 236 and supported by the connection protrusion 236.

Next, as shown in FIG. 11, the grounding housing 330 may be brought into contact with the grounding housing 230 of the receptacle connector through the surface contact between the outer surface of the side grounding wall 331 and the grounding housing 230 of the receptacle connector. In this case, a gap may occur between the outer surface of the side grounding wall 331 and the grounding housing 230 of the receptacle connector. In order to compensate for the gap, as shown in FIG. 26, the grounding housing 330 may include a conductive member 336. The conductive member 336 may be coupled to the outer surface of the side grounding wall 331. The conductive member 336 may be formed in a closed ring shape that extends on the outer surface of the side grounding wall 331 including a corner portion 3301 (see FIG. 24) of the outer surface of the side grounding wall 331. Thus, the board connector 300 according to the second embodiment can further strengthen the shielding function for the first RF contact 311 and the second RF contact 312 by using the conductive member 336 to improve the contact between the grounding housing 330 and the grounding housing 230 of the receptacle connector. Also, implementation is difficult in the corner portion 3301 of the outer surface of the side grounding wall 331 in the embodiment using the connection protrusion 335 and the connection groove 334. On the other hand, it is possible to improve the easiness of the implementation in the corner portion 3301 of the outer surface of the side grounding wall 331 in the embodiment using the conductive member 336. The conductive member 336 may be formed of an electrically conductive material to electrically connect the side grounding wall 331 and the grounding housing 230 of the receptacle connector. For example, the conductive member 336 may be formed of metal. The conductive member 336 may be separately produced and then coupled to the side grounding wall 331 through mounting, attachment, and fastening to the outer surface of the side grounding wall 331. The conductive member 336 may be coupled to the side grounding wall 331 by applying a conductive shielding material to the outer surface of the side grounding wall 331.

Referring to FIGS. 13 to 26, the grounding housing 330 may include a grounding plate 337 (see FIG. 13).

The grounding plate 337 may protrude from the upper grounding wall 333 to the inner space 330a. When the receptacle connector is inserted into the inner space 330a, the grounding plate 337 may apply pressure on the grounding housing 230 of the receptacle connector. In this case, the grounding plate 337 may rotate and move the grounding arm 238 downward by applying pressure on the grounding arm 238 of the grounding housing 230. Thus, the grounding arm 238 applys pressure to the grounding plate 337 using a restoring force and thus comes into strong contact with the grounding plate 337. Accordingly, the board connector 300 according to the second embodiment can further strengthen the shielding function for the first RF contact 311 and the second RF contact 312 by using the grounding plate 337 to improve the contact between the grounding housing 330 and the grounding housing 230 of the receptacle connector. The grounding housing 330 may include a plurality of grounding plates 337. In this case, the grounding plates 337 may be spaced apart from one another along the upper grounding wall 333.

Referring to FIGS. 21 to 26, the insulating part 340 may support the RF contacts 310. The RF contacts 310 and the transmission contacts 320 may be coupled to the insulating part 340. The insulating part 340 may be formed of an insulating material. The insulating part 340 may be coupled to the grounding housing 330 so that the RF contacts 310 are placed in the inner space 330a. The insulating part 340 may be coupled to the grounding housing 330 through interference fitting.

The insulating part 340 may include a soldering inspection window 341 (see FIG. 23).

The soldering inspection window 341 may be formed through the insulating part 340. The soldering inspection window 341 may be used to inspect a state in which the first RF mounting member 3111 is mounted on the second board. In this case, the first RF contact 311 may be coupled to the insulating part 340 such that the first RF mounting member 3111 is placed at the soldering inspection window 341. Thus, the first RF mounting member 3111 is not covered by the insulating part 340. Accordingly, while the board connector 300 according to the second embodiment is mounted on the second board, it is possible for a worker to inspect a state in which the first RF mounting member 3111 is mounted on the second board through the soldering inspection window 341. Thus, the board connector 300 according to the second embodiment can improve the accuracy of a mounting operation for mounting the first RF contact 311 on the second board even if the entirety of the first RF contact 311 including the first RF mounting member 3111 is placed on the inner side of the grounding housing 330. The soldering inspection window 341 may be formed through the insulating member 241.

The insulating part 340 may include a plurality of soldering inspection windows 341. In this case, the second RF mounting member 3121 and the transmission mounting members 3201 may be placed at the soldering inspection windows 341. Accordingly, while the board connector 300 according to the second embodiment is mounted on the second board, it is possible for a worker to inspect a state in which the first RF mounting member 3111, the second RF mounting member 3121, and the transmission mounting members 3201 are mounted on the second board through the soldering inspection windows 341. Thus, the board connector 300 according to the second embodiment can improve the accuracy of the operation of mounting the first RF contact 311, the second RF contact 312, and the transmission contacts 320 on the second board.

Referring to FIGS. 21 to 27, the board connector 300 according to the second embodiment may include a first grounding contact 350.

The first grounding contact 350 is coupled to the insulating part 340. The first grounding contact 350 may be grounded by being mounted on the second board. The first grounding contact 350 may be coupled to the insulating part 340 through an assembly process. The first grounding contact 350 may be integrally molded with the insulating part 340 through injection molding.

The first grounding contact 350 may implement the shielding function for the first RF contact 311 together with the grounding housing 330. In this case, as shown in FIGS. 23 and 27, the grounding housing 330 may include a first shielding wall 330b, a second shielding wall 330c, a third shielding wall 330d, and a fourth shielding wall 330e. The first shielding wall 330b, the second shielding wall 330c, the third shielding wall 330d, and the fourth shielding wall 330e may be implemented by the side grounding wall 331, the lower grounding wall 332, and the upper grounding wall 333. The first shielding wall 330b and the second shielding wall 330c may be disposed to face each other in the first axial direction (x-axis direction). The first RF contact 311 may be placed between the first shielding wall 330b and the second shielding wall 330c in the first axial direction (x-axis direction). The first RF contact 311 may be placed at a position where the spacing from the first shielding wall 330b is shorter than the spacing from the second shielding wall 330c in the first axial direction (X-axis direction). The third shielding wall 330d and the fourth shielding wall 330e may be disposed to face each other in the second axial direction (y-axis direction). The first RF contact 311 may be placed between the third shielding wall 330d and the fourth shielding wall 330e in the second axial direction (y-axis direction). The first RF contact 311 may be spaced an approximately equal distance from each of the third shielding wall 330d and the fourth shielding wall 330e in the second axial direction (y-axis direction).

The first grounding contact 350 may be disposed between the first RF contact 311 and the transmission contacts 320 in the first axial direction (x-axis direction). Accordingly, the first RF contact 311 may be placed between the first shielding wall 330b and the first grounding contact 350 in the first axial direction (x-axis direction) and may be placed between the third shielding wall 330d and the fourth shielding wall 330e in the second axial direction (y-axis direction). Accordingly, the board connector 300 according to the second embodiment can strengthen the shielding function for the first RF contact 311 using the first grounding contact 350, the first shielding wall 330b, the third shielding wall 330d, and the fourth shielding wall 330e.

The first grounding contact 350, the first shielding wall 330b, the third shielding wall 330d, and the fourth shielding wall 330e may be disposed at four corners with respect to the first RF contact 311 to implement shielding against RF signals. In this case, the first grounding contact 350, the first shielding wall 330b, the third shielding wall 330d, and the fourth shielding wall 330e may implement a grounding loop 350a (see FIG. 27) for the first RF contact 311. Accordingly, the board connector 300 according to the second embodiment can realize complete shielding for the first RF contact 311 by further strengthening the shielding function for the first RF contact 311 using the grounding loop 350a.

The first grounding contact 350 may be formed of an electrically conductive material. For example, the first grounding contact 350 may be formed of metal. When the receptacle connector is inserted into the inner space 330a, the first grounding contact 350 may be connected to the grounding contact of the receptacle connector.

The board connector 300 according to the second embodiment may include a plurality of first grounding contacts 350. The first grounding contacts 350 may be spaced apart from each other in the second axial direction (y-axis direction). A gap formed by the first grounding contacts 350 being spaced apart from each other may be filled in when the first grounding contact 350 is connected to the grounding contact of the receptacle connector.

Referring to FIGS. 21 to 27, the board connector 300 according to the second embodiment may include a second grounding contact 360.

The second grounding contact 360 is coupled to the insulating part 340. The second grounding contact 360 may be grounded by being mounted on the second board. The second grounding contact 360 may be coupled to the insulating part 340 through an assembly process. The second grounding contact 360 may be integrally molded with the insulating part 340 through injection molding.

The second grounding contact 360 may implement the shielding function for the second RF contact 312 together with the grounding housing 330. The second grounding contact 360 may be disposed between the second RF contact 312 and the transmission contacts 320 in the first axial direction (x-axis direction). Accordingly, the second RF contact 312 may be placed between the second shielding wall 330c and the second grounding contact 360 in the first axial direction (x-axis direction) and may be placed between the third shielding wall 330d and the fourth shielding wall 330e in the second axial direction (y-axis direction). Accordingly, the board connector 300 according to the second embodiment can strengthen the shielding function for the second RF contact 312 using the second grounding contact 360, the second shielding wall 330c, the third shielding wall 330d, and the fourth shielding wall 330e.

The second grounding contact 360, the second shielding wall 330c, the third shielding wall 330d, and the fourth shielding wall 330e may be disposed at four corners with respect to the second RF contact 312 to implement shielding against RF signals. In this case, the second grounding contact 360, the second shielding wall 330c, the third shielding wall 330d, and the fourth shielding wall 330e may implement a grounding loop 360a (see FIG. 27) for the second RF contact 312. Accordingly, the board connector 300 according to the second embodiment can realize complete shielding for the second RF contact 312 by further strengthening the shielding function for the second RF contact 312 using the grounding loop 360a.

The second grounding contact 360 may be formed of an electrically conductive material. For example, the second grounding contact 360 may be formed of metal. When the receptacle connector is inserted into the inner space 330a, the second grounding contact 360 may be connected to the grounding contact of the receptacle connector.

The board connector 300 according to the second embodiment may include a plurality of second grounding contacts 360. The second grounding contacts 360 may be spaced apart from each other in the second axial direction (y-axis direction). A gap formed by the second grounding contacts 360 being spaced apart from each other may be filled in when the second grounding contact 360 is connected to the grounding contact of the receptacle connector.

The present disclosure described above is not limited to the above-described embodiments and the accompanying drawings, and it will be obvious to those skilled in the art that various substitutions, modifications, and changes can be made without departing from the technical spirit of the present disclosure.

Number	Date	Country	Kind
10-2020-0018067	Feb 2020	KR	national
10-2020-0029683	Mar 2020	KR	national
10-2020-0033572	Mar 2020	KR	national
10-2021-0009085	Jan 2021	KR	national

BOARD CONNECTOR

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