The invention relates to body armor having one or more electronics modules disposed therein.
Body armor plates that provide protection against high-speed, ballistic projectiles are known. Generally, these plates do not provide any functionality beyond impact protection for the individual wearing them. While the protection that they provide tends to be superior to flexible, lighter materials, they increase the bulk and weight of the load of the wearer.
One aspect of the invention relates to a body armor plate configured to provide ballistics protection to a wearer of the plate. For example, the plate may be configured to protect the upper torso of the wearer from high-speed, ballistic projectiles like bullets, shrapnel, and/or other projectiles. In some implementations, the plate may include one or more electronic modules formed integrally therewith. Formation of the electronic modules integrally with the plate may enhance the functionality of the plate, may enhance the convenience (e.g., the form factor, the weight, the portability, etc.) of the electronics modules, robustness of the electronics modules, and/or other aspects of the electronics modules. The combination of the plate and the electronics modules may specifically provide various enhancements to, for example, military or law enforcement personnel that rely on the plate for ballistics protection.
In some implementations, the plate may include a strike face, a backing surface, and a power charging and storage module. The strike face may be formed on an exterior of the plate, and may provide a surface on which ballistics projected at the wearer of the plate impact the plate. The backing surface may be provided on a side of the plate opposite the strike face such that the backing surface faces toward the wearer of the plate during use. The power charging and storage module may be disposed within the plate between the strike face and the backing surface, and may include a power source capable of providing power to electronic components.
The electronic components powered by the power source may include one or more electronic components disposed within the plate (e.g., between the strike plate and the backing surface). The electronic components powered by the power source may include one or more electronic components that are external to the plate. For example, the plate may include an external power interface that enables a hardwired connection between the power source within the plate and one or more electronic components external to the plate over which power can be delivered.
The power source of the power charging and storage module may include, for example, one or both of a super capacitor and/or a battery. The power source may be rechargeable. In some implementations, the power charging and storage module may be configured to recharge the power source wirelessly. Wireless charging of power sources may be relatively inefficient with respect to wired charging solutions. As such, wireless charging may enhance the functionality of the plate in certain implementations. For example, within the context of military or law enforcement use, wireless charging may provided benefits that outweigh the inefficiency of wireless charging. Since at times military or law enforcement personnel must quickly transition between down times and dealing with active threats, reducing the steps that must be taken to make this transition (e.g., unplugging the plate when it is being recharged) may enhance the safety of the wearer of the plate. By way of non-limiting example, wireless recharging of the power source of the power charging and storage module may facilitate power recharging during transport, meal times, downtime storage, and/or other instances of military or law enforcement use in which a threat may arise suddenly.
In some implementations, the plate may include a wireless transmission/reception module disposed between the strike face and the backing surface. The wireless transmission/reception module may be configured to transmit and receive information wirelessly to and from electronic components external to the plate. As such, the wireless transmission/reception module may include one or more antennae and one or more modulator/demodulators that cooperate to transmit and/or receive information wirelessly.
In some implementations, the plate may include an identification module disposed between the strike face and the backing surface. The identification module may be configured to identify the plate to an electronic component external to the plate by a wireless transmission of identification information. The identification module may identify the plate to the external electronic component by transmitting an identifier (e.g., via a wired external interface, via a wireless transmission/reception module within the plate, etc.) to the external electronic component. The transmission of the identifier may include further information related to the plate (e.g., geo-location information, power level information, etc.). The identifier may identify the wearer assigned to the plate. By way of non-limiting example, the identification module may form, in conjunction with a wireless transmission/reception module within the plate, an RFID device that transmits the identifier to an RF reader. In the context of military use, the identification of the plate and/or its wearer may facilitate the monitoring of troops, the monitoring of equipment, and/or other functionalities.
In some implementations, the plate may include one or more sensors. The sensors may include, for example, a geo-location sensor, an impact sensor, a power level sensor, and/or other sensors.
In some implementations, the plate may be deployed with the wearer by placing the plate into a pouch in a piece of protective apparel that holds the plate in place next to, for example, the upper torso of the wearer. The protective garment may itself include some sort of protection against ballistics that is significantly enhanced by the plate in the areas covered by the plate.
These and other objects, features, and characteristics of the present invention, as well as the methods of operation and functions of the related elements of structure and the combination of parts and economies of manufacture, will become more apparent upon consideration of the following description and the appended claims with reference to the accompanying drawings, all of which form a part of this specification, wherein like reference numerals designate corresponding parts in the various figures. It is to be expressly understood, however, that the drawings are for the purpose of illustration and description only and are not intended as a definition of the limits of the invention. As used in the specification and in the claims, the singular form of “a”, “an”, and “the” include plural referents unless the context clearly dictates otherwise.
In some implementations, plate 10 includes one or more of a cover layer 12, an electronics layer 14, a primary ballistics protection layer 16, a support layer 18, a backing layer 20, and/or other layers. It should be appreciated that the order in which layers 12, 14, 16, 18, and 20 are arranged in
According to various implementations, cover layer 12 provides a strike face 22 of plate 10 on an external surface. Strike face 22 provides a surface on which ballistics projected at the wearer of plate 10 impact plate 10. Cover layer 12 may be formed from a material that is durable to the typical wear and tear experienced during use by the wearer. This wear and tear may include friction, collisions, and/or other forces experienced by plate 10 not including impacts from ballistic projectiles, in addition to the impacts from ballistic projectiles. Cover layer 12 may be formed from a material that reduces incidents of spalling caused by projectile impacts on plate 10. By way of non-limiting example, cover layer 12 may be formed from one or more of woven or non woven textile materials, polyurethane coatings, energy absorbing foams, and/or other materials.
In some implementations, electronics layer 14 is disposed between strike face 22 and backing layer 20. Electronics layer 14 may carry one or more electronics modules. The one or more electronics modules may include one or more electronic circuits that provide the functionality of the one or more electronic modules. The one or more electronic circuits may include one or more electrically conductive materials (e.g., semiconductor material of various kinds, gold, silver, copper, aluminum, tin, and zinc formed on a non-conductive substrate. The non-conductive substrate may be formed from one or more of flexible layers including polyimide, adhesive, and polyester, and/or other materials. Electronics module may include an external interface 24 that is accessible to the wearer when plate 10 is assembled. External interface 24 may provide a physical connection over which information and/or power may be communicated between one or more of the modules carried by electronics layer 14 and one or more components that are external to plate 10.
Primary ballistics protection layer 16 may provide the primary source of ballistic protection afforded the wearer of plate 10. As the primary source of protection from high-speed ballistics, primary ballistic protection layer 16 provides the main source of structural integrity in plate 10 that prevents such ballistics from penetrating plate 10. This does not mean that other components of plate 10 do not provide any protection from high-speed ballistics, or that other components do not play a roll in absorbing the energy imparted on plate 10 by high-speed ballistics. In some implementations, primary ballistics protection layer 16 may be formed from a ceramic such as, for example, alumina, boron carbide, titanium di-boride, silicon carbide, and/or other materials. As is shown in
Support layer 18 may be disposed between primary ballistics protection layer 16 and backing layer 20. Support layer 18 may be formed to absorb energy imparted to plate 10 generally, and to primary ballistics protection layer 16 in particular, by an impact of a projectile on strike face 22. In some implementations, support layer 18 may be ridged, as this structure may enable support layer to deform in response to an impact on strike face 22, thereby absorbing some of the energy from the impact in the deformation. Support layer 18 may be formed from one or more of fiber glass, carbon fiber, kevlar, and/or other materials.
Backing layer 20 may provide a backing surface 28 on a side of plate 10 opposite from strike face 22. During use, backing surface 28 may face toward the wearer. Backing layer 20 may be formed to provide durability through wear and tear, energy absorption, user comfort, ballistic protection from projectiles that pass through layers 16 and 18, and/or other functionality to plate 10. Backing layer 20 may be formed from one or more of polyurethane, polyethylene, ultra-high molecular weight polyethylene, aramid, rigid-rod polymer poly{diimidazo pyridinylene(dihydroxy)phenylene}, and/or other materials.
As was mentioned above, electronics layer 14 may carry one or more electronic modules.
In some implementations, power charging and storage module 30 may include a power source capable of providing power to electronic components. The electronic components to which power charging and storage module 30 provides power may include one or more electronic modules within plate 10, and/or electronic components external to plate 10. Power may be delivered to electronic components external to plate 10 via, for example, external interface 24. The power source may include one or both of a battery and/or a super capacitor.
The power source of power charging and storage module 30 may be rechargeable. Power may be delivered to power charging and storage module 30 to charge the power source from an external power supply. The external power may be delivered via a wired connection (e.g., via external interface 24), the external power may be delivered wirelessly, and/or otherwise delivered. Wireless charging of power sources may be relatively inefficient with respect to wired charging solutions. As such, wireless charging may only enhance the functionality of plate 10 in certain implementations. For example, within the context of military use wireless charging may provided benefits that outweigh the inefficiency of wireless charging. Since at times military personnel must quickly transition between down times and dealing with active threats, reducing the steps that must be taken to make this transition (e.g., unplugging plate 10) may enhance the safety of the wearer of plate 10. By way of non-limiting example, wireless recharging of the power source of power charging and storage module 30 may facilitate power recharging during transport, meal times, downtime storage, and/or other instances of military use in which a threat may come up suddenly.
In some implementations, power charging and storage module 30 may include a power level sensor that detects a relative power level of the power source (relative to its maximum level). This information may be conveyed by power charging and storage module 30 to the wearer and/or other entities through wired communication (e.g., via external interface 24), through wireless communication (e.g., through module 32, discussed further below), and/or otherwise conveyed.
In some implementations, wireless transmission/reception module 32 may be configured to transmit and receive information wirelessly to and from electronic components carried by electronics layer 14. Wireless transmission/reception module 32 may transmit and receive information via one or more modulation schemes and/or at one or more frequencies. As such, wireless transmission/reception module 32 may include one or more antennae and one or more modulator/demodulators that cooperate to transmit and/or receive information wirelessly. The wireless transmission and/or reception of information by wireless transmission/reception module 32 may include one or more of short-range RF communications, IR communications, mid-range RF communications, long-range RF communications, satellite communications, microwave, millimeter wave, electromagnetic coupling, and/or other types of communications.
In some implementations, identification module 34 may be configured to identify plate 10 to an electronic component external to plate 10. Identification module 34 may identify plate 10 to the external electronic component by transmitting an identifier (e.g., via external interface 24, via wireless transmission/reception module 32, etc.) to the external electronic component. The transmission of the identifier may include further information related to plate 10 (e.g., geo-location information, power level information, etc.). The identifier may identify the wearer assigned to plate 10. By way of non-limiting example, identification module 34 may form, in conjunction with wireless transmission/reception module 32, an RFID device that transmits the identifier to an RF reader. In the context of military use, the identification of plate 10 and/or its wearer may facilitate the monitoring of troops, the monitoring of equipment, and/or other functionalities.
In some implementations, geo-location module 36 may be configured to determine information related to the geo-location of plate 10 and/or its wearer. For example, geo-location module 36 and wireless transmission/reception module 32 may form a Global Positioning Satellite (“GPS”) sensor that receives communications from one or more satellites, and determines a geo-location of plate 10 from the received communications. In some instance, the information related to the geo-location of plate 10 determined by geo-location module 36 may be communicated to electronic components external to plate 10 (e.g., via external interface 24, via wireless transmission/reception module 32, etc.).
In some implementations, impact detection module 38 may detect impacts to plate 10. As such, impact detection module 38 may include an impact or force sensor that generates an output signal conveying information about impacts on strike face 24. In addition to impact detection armor integrity can be determined through the use of integrity sensors and sensing materials. The information generated by impact detection module 38 may be communicated to electronic components external to plate 10 (e.g., via external interface 24, via wireless transmission/reception module 32, etc.).
Although the invention has been described in detail for the purpose of illustration based on what is currently considered to be the most practical and preferred embodiments, it is to be understood that such detail is solely for that purpose and that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover modifications and equivalent arrangements that are within the spirit and scope of the appended claims. For example, it is to be understood that the present invention contemplates that, to the extent possible, one or more features of any embodiment can be combined with one or more features of any other embodiment.
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