Bond pattern for substrate

Information

  • Patent Grant
  • D1031026
  • Patent Number
    D1,031,026
  • Date Filed
    Tuesday, November 8, 2022
    2 years ago
  • Date Issued
    Tuesday, June 11, 2024
    5 months ago
Abstract
Description


FIG. 1 is a perspective view of a bond pattern for a substrate;



FIG. 2 is a view of the front side of the bond pattern for a substrate of FIG. 1;



FIG. 3 is a view of the right side of the bond pattern for a substrate of FIG. 1;



FIG. 4 is a view of the back side of the bond pattern for a substrate of FIG. 1;



FIG. 5 is a view of the left side of the bond pattern for a substrate of FIG. 1;



FIG. 6 is a view of the top side of the bond pattern for a substrate of FIG. 1; and,



FIG. 7 is a view of the bottom side of the bond pattern for a substrate of FIG. 1.


The broken lines are included for the purpose of illustrating environment and form no part of the claimed design.


Claims
  • The ornamental design for the bond pattern for a substrate, as shown and described above.
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Divisions (1)
Number Date Country
Parent 29807499 Sep 2021 US
Child 29859142 US
Continuations (1)
Number Date Country
Parent 16357685 Mar 2019 US
Child 29807499 US