Bond pattern for substrate

Information

  • Patent Grant
  • D973200
  • Patent Number
    D973,200
  • Date Filed
    Monday, September 13, 2021
    3 years ago
  • Date Issued
    Tuesday, December 20, 2022
    2 years ago
  • US Classifications
    Field of Search
    • US
    • D24 124
    • D24 125
    • D24 126
    • D24 189
    • D24 190
    • D24 191
    • D24 192
    • CPC
    • A61F13/15
    • A61F13/64
    • A61F13/476
    • A61F13/5611
    • A61F13/4704
  • International Classifications
    • 0201
    • Term of Grant
      15Years
Abstract
Description


FIG. 1 is a perspective view of a bond pattern for a substrate;



FIG. 2 is a view of the front side of the bond pattern for a substrate of FIG. 1;



FIG. 3 is a view of the right side of the bond pattern for a substrate of FIG. 1;



FIG. 4 is a view of the back side of the bond pattern for a substrate of FIG. 1;



FIG. 5 is a view of the left side of the bond pattern for a substrate of FIG. 1;



FIG. 6 is a view of the top side of the bond pattern for a substrate of FIG. 1; and,



FIG. 7 is a view of the bottom side of the bond pattern for a substrate of FIG. 1.


The broken lines are included for the purpose of illustrating environment and form no part of the claimed design.


Claims
  • The ornamental design for the bond pattern for a substrate, as shown and described above.
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Provisional Applications (2)
Number Date Country
62780520 Dec 2018 US
62645483 Mar 2018 US
Continuations (1)
Number Date Country
Parent 16357685 Mar 2019 US
Child 29807499 US