Bonding and grounding clamp

Information

  • Patent Grant
  • D651569
  • Patent Number
    D651,569
  • Date Filed
    Wednesday, January 6, 2010
    14 years ago
  • Date Issued
    Tuesday, January 3, 2012
    12 years ago
  • US Classifications
    Field of Search
    • US
    • D13 133
    • D13 148
    • D13 149
    • D13 151
    • D13 154
    • D13 184
    • 439 092000
    • 439 142000
    • 439 320000
    • 439 535000
    • 439 557000
    • D08 330
    • D08 331
    • D08 382
    • D08 383
    • D08 394
    • D08 395
    • 248 049000
    • 248 074100
    • 248 062000
    • 248 063000
    • 174 0650R0
    • 174 0650G0
    • 174 068100
    • 174 068300
    • 174 069000
    • 174 0710R0
    • 174 0720C0
  • International Classifications
    • 1303
    • Term of Grant
      14Years
Abstract
Description


FIG. 1 is a perspective view of a bonding and grounding clamp showing my new design;



FIG. 2 is a side elevation view thereof, the opposite side being a mirror image thereto;



FIG. 3 is a front elevation view thereof;



FIG. 4 is a rear elevation view thereof;



FIG. 5 is a top plan view thereof; and,



FIG. 6 is a bottom plan view thereof.


The broken line portion of the figure drawings is included to show unclaimed subject matter only and forms no part of the claimed design.


Claims
  • The ornamental design for a bonding and grounding clamp, as shown and described.
US Referenced Citations (13)
Number Name Date Kind
4526437 Kies Jul 1985 A
D360188 Kiely et al. Jul 1995 S
5494462 Auclair Feb 1996 A
5928006 Franks, Jr. Jul 1999 A
D487062 Foster Feb 2004 S
D577977 Hernandez Oct 2008 S
D585833 Sherman Feb 2009 S
7494157 Kiely Feb 2009 B1
D629364 Smith et al. Dec 2010 S
7901256 Kiely Mar 2011 B1
D635520 Kiely Apr 2011 S
7927157 Kiely Apr 2011 B1
20030040214 Kiely Feb 2003 A1