Patent Application
20210387423
The subject matter herein generally relates to a bonding device, and more particularly to a bonding device for bonding components of an electronic device.
The temperature during normal operation of camera components of most camera devices (such as mobile phones) is generally higher than the workshop temperature during assembly and testing of the camera components. Therefore, the camera devices may not meet specification requirements in actual use, resulting in low yield.
Implementations of the present disclosure will now be described, by way of embodiments, with reference to the attached figures.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. Additionally, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures and components have not been described in detail so as not to obscure the related relevant feature being described. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features. The description is not to be considered as limiting the scope of the embodiments described herein.
Several definitions that apply throughout this disclosure will now be presented.
The term “coupled” is defined as connected, whether directly or indirectly through intervening components, and is not necessarily limited to physical connections. The connection can be such that the objects are permanently connected or releasably connected. The term “comprising” means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in a so-described combination, group, series, and the like.
Referring to
The body 1 includes a cover plate (not shown) for closing the cavity 2. Products are laminated and assembled in the cavity 2.
As shown in
As shown in
The exhaust device 5 includes an exhaust pipe 51 provided on the body 1 and an exhaust port 52 provided on a wall of the cavity 2. An exhaust device (not shown) is provided on an end of the exhaust pipe 51 away from the exhaust port 52 for exhausting the gas in the cavity 2 through the exhaust port 52 and the exhaust pipe 51.
In one embodiment, the intake device 4 and the exhaust device 5 are respectively arranged on opposite sides of the cavity 2. The direction of gas flow is shown by arrows in
In one embodiment, the gas filled into the cavity 2 is an inert gas, such as nitrogen for preventing the bonding station and the product from being oxidized. In another embodiment, air is filled into the cavity 2.
In one embodiment, both the intake port 42 and the exhaust port 52 are provided with dust-proof nets or waterproof and breathable membranes. The dust-proof net can prevent dust from entering the cavity 2, and the waterproof and breathable membrane can prevent moisture and dust from entering the cavity 2, thereby prolonging the service life of the bonding station.
As shown in
A plurality of temperature sensors can be provided in the cavity 2 for sensing the temperature in different locations in the cavity 2. The controller 7 can control the heating device 3 according to the sensed temperatures in the cavity 2 for making the temperature in the cavity 2 uniform. In one embodiment, the temperature in the cavity 2 is set at 35° C.-42° C. By performing the bonding work under this temperature environment, the yield of the laminated products can be effectively improved.
The bonding device 100 further includes a display 8 electrically connected to the controller 7 and the temperature sensor. The display 8 displays the temperatures sensed by the temperature sensors in the cavity 2.
The bonding device 100 is compared to a bonding device in the related art for bonding a mobile phone camera, and the products obtained by the two devices are tested. The results of testing are shown in Tables 1-3.
It can be seen from the test results in Tables 1-3 that the CPK of the product bonded using the bonding device 100 is better than the CPK of the product bonded using the related art device without a heating function. Thus, a difference between the product used by the end client and the product tested is relatively small, and the product yield of the bonding device 100 is higher.
Compared with the related art, the bonding device 100 has the following beneficial effects:
1. It can effectively control the environmental temperature variables. In the bonding process, the heating device makes the production end bonding environment consistent with the customer use end environment, and the product performance is more stable, which effectively improves the product quality and improves the product yield.
2. The temperature is controlled by injecting gas into the cavity, so that the temperature of the bonding station is more uniform, no local overheating occurs, and the heating effect is improved.
3. Less changes are required on the traditional bonding machine without special equipment, which can effectively reduce equipment costs.
4. It can meet the requirements of the original manufacturing process for equipment accuracy.
The embodiments shown and described above are only examples. Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes may be made in the detail, including in matters of shape, size and arrangement of the parts within the principles of the present disclosure up to, and including, the full extent established by the broad general meaning of the terms used in the claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202010550750.1 | Jun 2020 | CN | national |
