Number | Date | Country | Kind |
---|---|---|---|
197 50 107 | Nov 1997 | DE |
Filing Document | Filing Date | Country | Kind | 102e Date | 371c Date |
---|---|---|---|---|---|
PCT/DE98/03099 | WO | 00 | 7/9/1999 | 7/9/1999 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO99/24377 | 5/20/1999 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
4205858 | Shimazaki et al. | Jun 1980 | |
5571379 | Derrick | Nov 1996 |
Number | Date | Country |
---|---|---|
21 22 621 | Nov 1972 | DE |
1321033 | Jun 1973 | DE |
63-46287 | Feb 1988 | JP |
Entry |
---|
Database WPI Week 8626, Derwent Publications, Ltd., London, GB; AN 86-167200 XP002095656, “Sealing Resin Composition with High Coefficient of Thermal Conductivity”. |