This application claims the priority benefit of Taiwan application serial no. 96120071, filed on Jun. 5, 2007. The entirety the above-mentioned patent application is hereby incorporated by reference herein and made a part of specification.
1. Field of the Invention
The present invention generally relates to a boss structure, in particular, to a boss structure covered by a metal layer, disposed on an inner surface of a casing of an electronic device, and capable of preventing electro-magnetic interference (EMI) and electro-static discharge (ESD).
2. Description of Related Art
In order to prevent EMI and ESD, usually a metal layer is coated on an inner surface of a plastic casing of an electronic device, and is electrically connected to a grounding point of the electronic device. For example, after the plastic casing is fabricated in an injection molding manner, a metal layer is coated on the inner surface of the plastic casing by sputtering process or evaporation process, and then the metal layer is electrically connected to the grounding point of a circuit board of the electronic device.
Accordingly, the present invention is directed to a boss structure adapted to be disposed on an inner surface of a casing of an electronic device, and a circuit board is able to be locked thereon through bolts.
The present invention is directed to a casing of an electronic device, and a circuit board is able to be locked on boss structures thereof through screws.
The present invention provides a boss structure, which includes a boss and a metal layer The boss has a flat surface located on a top end of the boss and a chamfer connected to the flat surface, and the metal layer wholly covers an exposed surface of the boss.
According to an embodiment of the present invention, the boss further has a hole and a female thread. One end of the hole is connected to the flat surface, and the female thread is formed on an inner surface of the hole.
According to an embodiment of the present invention, the chamfer is a bevel.
According to an embodiment of the present invention, the chamfer is a fillet.
According to an embodiment of the present invention, the boss has a burr formed between the chamfer and an outer surface of the boss and covered by the metal layer.
According to an embodiment of the present invention, the boss further has a shoulder away from the flat surface and connected to the flat surface through the chamfer.
According to an embodiment of the present invention, the boss has a burr formed between the shoulder and an outer surface of the boss and covered by the metal layer.
According to an embodiment of the present invention, the material of the boss is plastic.
The present invention further provides a casing of an electronic device, which includes a wall body, a boss, and a metal layer The boss is connected to the wall body and has a flat surface located on a top end of the boss and a chamfer connected to the flat surface, and the metal layer wholly covers an exposed surface of the boss.
According to an embodiment of the present invention, the boss further has a hole and a female thread. One end of the hole is connected to the flat surface, and the female thread is formed on an inner surface of the hole.
According to an embodiment of the present invention, the chamfer is a bevel.
According to an embodiment of the present invention, the chamfer is a fillet.
According to an embodiment of the present invention, the boss has a burr formed between the chamfer and an outer surface of the boss and covered by the metal layer.
According to an embodiment of the present invention, the boss further has a shoulder away from the flat surface and connected to the flat surface through the chamfer.
According to an embodiment of the present invention, the boss has a burr formed between the shoulder and an outer surface of the boss and covered by the metal layer.
According to an embodiment of the present invention, the boss is made of plastic.
In the present invention, a chamfer exists between the flat surface on the top end of the boss and the outer surface of the boss, so when a burr is formed on outer edge of the flat surface after injection molding fabrication, the burr is located below the flat surface. Therefore, the burr is not damaged when the circuit board is locked on the boss structure through the bolts and the completeness of the metal layer of the boss structure is kept.
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
Reference will now be made in detail to the present embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
Referring to
In the first embodiment, the chamfer 224 is for example a bevel, the materials of the wall body 210 and the boss 220a are, for example, plastic, and the wall body 210 and the boss 220a are fabricated in a manner of injection molding. Further, the boss 220a further has a burr 226 formed between the chamfer 224 and an outer surface 222b of the boss 220a, as shown in
In addition, the boss 220a can further have a hole 228 (as shown in
It should be noted that in the first embodiment, the boss 220a has the chamfer 224, such that a height of the burr 226 is below the flat surface 222a of the top end of the boss 220a. Therefore, when the circuit board (not shown) is assembled to the flat surface 222a of the boss 220a through the bolt, the burr 226 is not likely to be pressed. Therefore, the completeness of the metal layer 230 can be kept. However, the present invention is not limited to the embodiment. A plurality of embodiments on shape of the boss structure is illustrated herein below.
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To sum up, in the present invention, the chamfer exists between the flat surface on the top end of the boss and the outer surface of the boss, so when the burr is formed on the outer edge of the boss, the burr is located below the flat surface. Therefore, the burr is not damaged when the circuit board or another electronic element is locked on the boss structure and the completeness of the metal layer of the boss structure is kept.
It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.
Number | Date | Country | Kind |
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96120071 | Jun 2007 | TW | national |