The present disclosure relates generally to broadband array antennas and, more particularly, broadband array antennas enhanced with spatially engineered dielectrics.
A radome is an enclosure that protects a device, such as a microwave antenna, a radar antenna or a phased array antenna. The radome is constructed of material that minimally attenuates electromagnetic signals. Radomes also serve to protect antenna surfaces from weather or to conceal antenna electronic equipment from view. Radomes can be spherical, geodesic, planar, etc., depending upon the particular application and may be ground or aircraft based.
Phased array antennas, in particular, suffer from impedance degradation when a scanning angle is offset from a boresight angle. As such, the scanning or active reflection coefficient increases from large scan angles and tends to reduce the power transmitted to or received by the array.
According to one embodiment, an antenna array system includes an antenna and a radome. The radome is disposed such that electromagnetic radiation transmitted with respect to the antenna passes through the radome. The radome includes a dielectric layer, first dielectric inclusions distributed in the dielectric layer in a first pattern and second dielectric inclusions spatially and dimensionally varied from the first dielectric inclusions and distributed in the dielectric layer in a second pattern, which is different from the first pattern.
According to another embodiment, a radome is provided and includes one or more dielectric layers, first dielectric inclusions distributed in a first pattern in the one or more dielectric layers, second dielectric inclusions distributed in a second pattern in the one or more dielectric layers and the first and second dielectric inclusions being spatially and dimensionally varied from one another.
According to another embodiment, a broadband array antenna is provided and includes a plurality of feed towers and a radome. Each feed tower includes a support structure and multiple antenna elements. The multiple antenna elements are coupled to the support structure and configured to transmit and receive electromagnetic energy. The radome is disposed about the plurality of feed towers and includes at least two or more dielectric layers. A first one of the dielectric layers has first dielectric inclusions spatially and dimensionally associated with the support structures. A second one of the dielectric layers has second dielectric inclusions spatially and dimensionally associated with the antenna elements.
According to yet another embodiment, a method of assembling a radome is provided and includes forming a first dielectric layer having first dielectric inclusions distributed in a first pattern, forming a second dielectric layer having second dielectric inclusions distributed in a second pattern, the first and second dielectric inclusions being spatially and dimensionally varied from one another and disposing at least the first and second dielectric layers in a layered structure.
For a more complete understanding of this disclosure, reference is now made to the following brief description, taken in connection with the accompanying drawings and detailed description, wherein like reference numerals represent like parts:
Previously, the problem of a scanning or active reflection coefficient increasing from large scan angles and thereby reducing the power transmitted to or received by the array has been addressed by the use of isotropic or anisotropic wide angle impedance matching radomes or superstrates that are non-dispersive or frequency invariant. Other solutions have included the use of single or multiple uniform dielectric layers and/or printed metallic elements, such as split ring resonators or frequency selective surfaces. These options often improve scan angle performance but are generally only useful for narrowband operations. Aspects described herein, by contrast, relate to broadband array antennas and address the problems of reduced power transmission or reception associated with large scan angles by way of spatially engineered dielectrics. That is, in broadband array antennas, radomes having spatially varying materials have increased array bandwidth and scanning performance.
With reference to
With reference to
The first dielectric layer 20 is formed of at least one or multiple dielectric materials 21 and is formed to have at least first dielectric inclusions 22 (∈A) and 23 (∈B) distributed in one or more first patterns. The first dielectric inclusions 22 and 23 may include one dielectric material, similar dielectric materials or multiple different dielectric materials. The second dielectric layer 30 is formed of at least one or multiple dielectric materials 31 and is formed to have at least second dielectric inclusions 32 (∈C) and 33 (∈D) distributed in one or more second patterns. The second dielectric inclusions 32 and 33 may include one dielectric material, similar dielectric materials or multiple different dielectric materials. The third dielectric layer 40 is formed of at least one or multiple dielectric materials 41 and is formed to have at least third dielectric inclusions 42 (∈E) and 43 (∈F) distributed in one or more third patterns. The third dielectric inclusions 42 and 43 may include one dielectric material, similar dielectric materials or multiple different dielectric materials. The fourth dielectric layer 50 is formed of at least one or multiple dielectric materials 51 and is formed to have at least fourth dielectric inclusions 52 (∈G) and 53 (∈H) distributed in one or more fourth patterns. The fourth dielectric inclusions 52 and 53 may include one dielectric material, similar dielectric materials or multiple different dielectric materials.
As used herein, the term dielectric inclusion refers to a dielectric material that is included in a corresponding dielectric layer or is at least associated with a corresponding dielectric layer. Generally, although not necessarily, the dielectric material of the dielectric inclusion will be different from that of the dielectric layer. Also, the shape of the dielectric inclusion may be variable and may be sized to fit within the corresponding dielectric layer or may be permitted to span multiple dielectric layers. That is, in the former case a thickness of the dielectric inclusion should be substantially similar to or less than the thickness of the corresponding dielectric layer whereas, in the latter case, the thickness of the dielectric inclusion could be greater than the thickness of the corresponding dielectric layer. Within a plane of the corresponding dielectric layer, the dielectric inclusion can be any shape or size.
Thus, with reference to the embodiments of
Although the first, second third and fourth distribution patterns of the dielectric inclusions illustrated in
In accordance with embodiments and, with reference to
In addition, the dielectric materials of the various dielectric inclusions may be different from one another. As such, the multiple dielectric materials of the first dielectric inclusions 22 and 23 may be different from the multiple dielectric materials of the second dielectric inclusions 32 and 33. Thus, the first dielectric inclusions 22 and 23 may have different permittivities from the second dielectric inclusions 32 and 33. Moreover, due to the presence of the first and second dielectric inclusions 22 and 23, 32 and 33 in the first and second dielectric layers 20 and 30, the first dielectric layer 20 will thus have a different effective permittivity from the second dielectric layer 30.
As an example, one of the dielectric materials used in one of the dielectric inclusions may include air and one of the dielectric materials used in another one of the dielectric inclusions may include a dielectric material having a relative permittivity of about 6-20.
With reference to
The radome 120 is disposed about the plurality of feed towers 110 and includes first dielectric layer 121, second dielectric layer 122 and third dielectric layer 123. The first dielectric layer 121 faces away from the base 111. The third dielectric layer 123 faces the base 111, and may be substantially uniform and may not include any inclusions. The second dielectric layer 122 is interposed between the first dielectric layer 121 and the third dielectric layer 123.
As shown in
In the embodiment of
A method of assembling the radome 120 of
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one more other features, integers, steps, operations, element components, and/or groups thereof.
The corresponding structures, materials, acts, and equivalents of all means or step plus function elements in the claims below are intended to include any structure, material, or act for performing the function in combination with other claimed elements as specifically claimed. The description of the present disclosure has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the embodiments in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the disclosure. The embodiment was chosen and described in order to best explain the principles of the disclosure and the practical application, and to enable others of ordinary skill in the art to understand the disclosure for various embodiments with various modifications as are suited to the particular use contemplated.
The flow diagram depicted herein is just one example. There may be many variations to this diagram or the steps (or operations) described therein without departing from the spirit of the disclosure. For instance, the steps may be performed in a differing order or steps may be added, deleted or modified. All of these variations are considered a part of the claimed embodiments.
Number | Name | Date | Kind |
---|---|---|---|
2956281 | McMillan | Oct 1960 | A |
3780374 | Shibano et al. | Dec 1973 | A |
4517571 | Mulliner et al. | May 1985 | A |
4725475 | Fiscus et al. | Feb 1988 | A |
5117240 | Anderson et al. | May 1992 | A |
5497168 | Thomas et al. | Mar 1996 | A |
6081239 | Sabet et al. | Jun 2000 | A |
6567048 | McKinzie, III et al. | May 2003 | B2 |
6768471 | Bostwick et al. | Jul 2004 | B2 |
7071879 | Strickland | Jul 2006 | B2 |
7656358 | Haziza | Feb 2010 | B2 |
7656359 | Haziza | Feb 2010 | B2 |
7847749 | Haziza | Dec 2010 | B2 |
8054239 | Wu et al. | Nov 2011 | B2 |
20040239577 | Delgado et al. | Dec 2004 | A1 |
20050001331 | Kojima et al. | Jan 2005 | A1 |
20060044189 | Livingston et al. | Mar 2006 | A1 |
20080136731 | Wu et al. | Jun 2008 | A1 |
20080238782 | Hsu et al. | Oct 2008 | A1 |
20100231433 | Tishin et al. | Sep 2010 | A1 |
20110254739 | Dudley et al. | Oct 2011 | A1 |
Number | Date | Country |
---|---|---|
9962137 | Dec 1999 | WO |
Entry |
---|
HEX WEB HRP Fiberglass/Phenolic Honeycomb Product Data, Hexcel Corporation, Oct. 2006, 4 pages. |
International Search Report issued on Nov. 7, 2013, in PCT/US2013/055125 filing date Aug. 15, 2013; 6 pages. |
Written Opinion issued on Nov. 7, 2013, in PCT/US2013/055125 filing date Aug. 15, 2013; 5 pages. |
European Search Report issued in EP 13172860 on Mar. 31, 2014, 7 pages. |
Number | Date | Country | |
---|---|---|---|
20140055316 A1 | Feb 2014 | US |