An electrical connector may provide signal connections between electronic devices using signal contacts. The electrical connector may include a leadframe assembly that has a dielectric leadframe housing and a plurality of electrical contacts extending therethrough. Typically, the electrical contacts within a leadframe assembly are arranged into a linear array that extends along a direction along which the leadframe housing is elongated. The contacts may be arranged edge-to-edge along the direction along which the linear array extends. The electrical contacts in one or more leadframe assemblies may form differential signal pairs. A differential signal pair may consist of two contacts that carry a differential signal. The value, or amplitude, of the differential signal may be the difference between the individual voltages on each contact. The contacts that form the pair may be broadside-coupled (i.e., arranged such that the broadside of one contact faces the broadside of the other contact with which it forms the pair). Broadside or microstrip coupling is often desirable as a mechanism to control (e.g., minimize or eliminate) skew between the contacts that form the differential signal pair.
When designing a printed circuit board (PCB), circuit designers typically establish a desired differential impedance for the traces on the PCB that form differential signal pairs. Thus, it is usually desirable to maintain the same desired impedance between the differential signal contacts in the electrical connector, and to maintain a constant differential impedance profile along the lengths of the differential signal contacts from their mating ends to their mounting ends. It may further be desirable to minimize or eliminate insertion loss (i.e., a decrease in signal amplitude resulting from the insertion of the electrical connector into the signal's path). Insertion loss may be a function of the electrical connector's operating frequency. That is, insertion loss may be a greater at higher operating frequencies.
Therefore, a need exists for a high-speed electrical connector that minimizes insertion loss at higher operating frequencies while maintaining a desired differential impedance between differential signal contacts.
The disclosed embodiments include an electrical connector having at least four electrical contacts that form two pairs of differential signal contacts. The first and second electrical contacts may be arranged edge-to-edge along a first direction. The third electrical contact may be adjacent to, and arranged broadside-to-broadside with, the first electrical contact along a second direction substantially transverse to the first direction. The first and third electrical contacts may define one of the pairs of differential signal contacts. The fourth electrical contact may be adjacent to, and arranged broadside-to-broadside with, the second electrical contact along the second direction. The second and fourth electrical contacts may define the other pair of differential signal contacts. The two pairs of differential signal contacts may be offset from one another along the second direction.
The electrical connector may include one or more non-air dielectrics, such as a first non-air dielectric disposed between the first and third electrical contacts that form the one pair of differential signal contacts, and a second non-air dielectric disposed between the second and fourth electrical contacts that form the other pair of differential signal contacts.
The electrical connector may further include one or more ground contacts. For example, the electrical connector may include a first ground contact adjacent to, and arranged edge-to-edge with, the first electrical contact along the first direction. The electrical connector may also include second ground contact adjacent to, and arranged edge-to-edge with, the third electrical contact along the first direction.
The plug connector 102 may include a connector housing, a base 110, leadframe assemblies 126, and electrical contacts 114. The connector housing of the plug connector 102 may include an interface portion 105 that defines one or more grooves 107. As will be further discussed below, the grooves 107 may receive a portion of the receptacle connector 104 and, therefore, may help provide mechanical rigidity and support to the connector system 100.
Each of the leadframe assemblies 126 of the plug connector 102 may include a first leadframe housing 128 and a second leadframe housing 130. The first leadframe housing 128 and the second leadframe housing 130 may be made of a dielectric material, such as plastic, for example. The leadframe assemblies 126 may be insert molded leadframe assemblies (IMLAs) and may house a linear array of electrical contacts 114. For example, as will be further discussed below, the array of electrical contacts 114 may be arranged edge-to-edge in each lead frame assembly 126, i.e., the edges of adjacent electrical contacts 114 may face one another.
The electrical contacts 114 of the plug connector 102 may each have a cross-section that defines two opposing edges and two opposing broadsides. Each electrical contact 114 may also define at least three portions along its length. For example, as shown in
The base 110 of the plug connector 102 may be made of a dielectric material, such as plastic, for example. The base 110 may define a plane having a connector face 120 and the substrate face 122. The plane defined by the base 110 may be generally parallel to a plane defined by the printed circuit board 106. As shown in
The receptacle connector 104 may include a connector housing, a base 112, leadframe assemblies 132, and electrical contacts 136. The connector housing of the receptacle connector 104 may include an interface portion 109 that defines one or more ridges 111. Upon mating the plug connector 102 and the receptacle connector 104, the ridges 111 on the connector housing of the receptacle connector 104 may engage with the grooves 107 on the connector housing of the plug connector 102. Thus, as noted above, the grooves 107 and the ridges 111 may provide mechanical rigidity and support to the connector system 100.
Each of the leadframe assemblies 132 of the receptacle connector 104 may include a leadframe housing 133. The leadframe housing 133 may be made of a dielectric material, such as plastic, for example. Each of the leadframe assemblies 132 may be an insert molded leadframe assembly (IMLAs) and may house a linear array of electrical contacts 136. For example, the array of electrical contacts 136 may be arranged edge-to-edge in the leadframe assembly 132, i.e., the edges of adjacent electrical contacts 136 may face one another.
Like the electrical contacts 114, the electrical contacts 136 of the receptacle connector 104 may have a cross-section that defines two opposing edges and two opposing broadsides. Each electrical contact 136 may define at least three portions along its length. For example, as shown in
The terminal end 146 of the electrical contact 136 may be “compliant” and, therefore, may be press-fit into an aperture (not shown) of the base 112. The terminal end 146 may electrically connect with a ball grid array (BGA) 142 on a substrate face 140 of the base 112. The lead portion 144 of each electrical contact 136 may extend from the terminal end 146 to the mating end 141.
The base 112 of the receptacle connector 104 may be made of a dielectric material, such as plastic, for example. The base 112 may define a plane having a connector face 138 and the substrate face 140. The plane defined by the base 112 may be generally parallel to a plane defined by the printed circuit board 108. The connector face 138 may define apertures (not shown) for receiving the terminal ends 146 of electrical contacts 136. Although the apertures of the base 112 are not shown in
As noted above, each of the electrical contacts 114 may have a cross-section that defines two opposing edges and two opposing broadsides. The electrical contacts 114 may be arranged edge-to-edge along each of the columns 160, 162, 164, 166. In addition, the electrical contacts 114 may be arranged broadside-to-broadside along each of the rows 150, 152, 154, 156, 158. As shown in
The electrical contacts 114 in the plug connector 102 may include ground contacts G and signal contacts S. As shown in
The plug connector 202 may include the base 110, leadframe assemblies 126, and electrical contacts 114. As shown in
As noted above with respect to
The electrical contacts 114 in the plug connector 202 may also include ground contacts G and signal contacts S. The rows 150, 154, 158 of the plug connector 202 may include all ground contacts G, and the rows 152, 156 may include both ground contacts G and signal contacts S. For example, the electrical contacts 114 in the rows 152, 156 may be arranged in a G-S-S-G pattern. The electrical contacts 114 may be arranged broadside-to-broadside along each of the rows 150, 152, 154, 156, 158. Accordingly, adjacent signal contacts S in rows 152, 156 may form broadside coupled differential signal pairs 174.
As shown in
As further shown in
The plug connector 302 may include the base 110, leadframe assemblies 126, and electrical contacts 114. As shown in
More specifically, the plate portion 180 of the commoned ground plate 178 may be housed within the leadframe assembly 126, and may extend from the terminal ends 182 to the mating interfaces 184. As shown in
The commoned ground plate 178 may also include mating interfaces 184 extending from the plate portion 180, and extending above the first leadframe housing 128 of the lead frame assembly 126. The mating interfaces 184 may be blade-shaped, and may be received by the respective mating ends 141 of the electrical contacts 136.
The commoned ground plates 178a, 178b may be positioned adjacent to the contact columns 162, 164, respectively. Thus, as shown in
The electrical contacts 114 in the plug connector 302 may include ground contacts G and signal contacts S. The rows 150, 154, 158 of the plug connector 302 may include all ground contacts G, and the rows 152, 156 may include both ground contacts G and signal contacts S. For example, the commoned ground plates 178a, 178b and the electrical contacts 114 in the rows 152, 156 may be arranged in a G-S-S-G pattern. The electrical contacts 114 may be arranged broadside-to-broadside along each of the rows 150, 152, 154, 156, 158. Accordingly, adjacent signal contacts S in rows 152, 156 may form broadside coupled differential signal pairs 174.
The commoned ground plates 178a, 178b may each have a cross-section that is generally rectangular in shape. As shown in
As further shown in
It has also been found that the foregoing embodiments break up the coupling wave that moves up the connector causing a dB “suck out” about the 4 GHz region. An object of the plastic is to change the impedance slightly between signal and ground to minimize the coupling wave. The ground plane is to minimize the signal pair coupling to the ground individual pin edge and to provide a continuous ground plane.
The connector 500 may include a connector housing (not shown), one or more leadframe assemblies (not shown), and electrical contacts 502. Each leadframe assembly may be an IMLA and may house a linear array of the electrical contacts 502. For example, the electrical contacts 502 in each linear array may be arranged edge-to-edge, i.e., the edges of adjacent electrical contacts 502 may face one another.
Each electrical contact 502 may define at least three portions along its length. For example, each electrical contact 502 may define a mating end 544, a lead portion 546, and a terminal end 548. As shown in
The connector 500 may further include a non-air dielectric, such as a dielectric material 508, positioned between adjacent leadframe assemblies. In particular, the dielectric material 508 may be positioned between adjacent signal contacts S housed by respective adjacent leadframe assemblies. The dielectric material 508 may be made from any suitable material, such as plastic, for example. The dielectric material 508 may be molded as part of the leadframe assemblies, or may be molded independent of the leadframe assemblies and subsequently inserted therebetween.
The electrical contacts 502 may be arranged edge-to-edge along each of the columns 526, 528, 530, 532, 534, 536, 538, 540, 542. In addition, the electrical contacts 502 may be arranged broadside-to-broadside along each of the rows 516, 518, 520, 522, 524. Adjacent signal contacts S in each of the rows 516, 518, 520, 522, 524 may form a pair of differential signal contacts 504. A ground contact G may be disposed between each pair of differential signal contacts 504 in the rows 516, 518, 520, 522, 524. In addition, the dielectric material 508 may be disposed between the signal contacts S of each pair of differential signal contacts 504. The dielectric material 508 may be used to increase field strength within the pair of differential signal contacts 504 while not increasing pair-to-pair coupling, crosstalk, and/or noise. Moreover, the ground contacts G and the signal contacts S may be surrounded on all sides by a dielectric 506, which may be air.
Referring back to
Each of the contact columns 526, 528, 530, 532, 534, 536, 538, 540, 542 may define a contact pattern, i.e., an arrangement of ground contacts G and signal contacts S. For example, the electrical contacts 502 in the column 526 may be arranged (moving from top to bottom) in a G-S-S-G-S pattern. The electrical contacts 502 in the column 528 may be arranged in a S-G-S-S-G pattern, though it will be appreciated that the contact pattern in the column 528 may be the same as the contact pattern in the column 526 when viewed from bottom to top. The electrical contacts 502 in the column 530 may be arranged in a S-S-G-S-S pattern, which may be different from the respective contact patterns in the columns 526, 528.
The contact patterns in the columns 526, 528, 530 may be repeated in the remaining columns, i.e., the column 532 may have the same contact pattern as the column 526, the column 534 may have the same contact pattern as the column 528, the column 536 may have the same contact pattern as the column 530, and so on. Thus, each pair of differential signal contacts 504 in the row 518 may be offset (along the row-direction) by one full column pitch from the nearest pair of differential signal contacts 504 in the row 516. Similarly, each pair of differential signal contacts 504 in the row 520 may be offset (along the row-direction) by one full column pitch from the nearest pair of differential signal contacts 504 in the row 518. It will be appreciated that some of the signal contacts S may be neutral contacts, or “extra pins,” and may not be needed for the formation of a pair of differential signal contacts 504.
As shown in
It will be appreciated that the imaginary lines 550, 552 may extend from any suitable point on the same sides of the signal contact S and the ground contacts G, respectively. It will be further appreciated that the imaginary lines 550, 552 may each define an oblique angle with respect to the direction of the columns 526, 528, 530, 532, 534, 536, 538, 540, 542. The oblique angles defined by the lines 550, 552 may be substantially the same or may differ from one another. As shown in
The offset of the ground contacts G from row-to-row may be none, less than a column pitch, equal to a column pitch, or more than a column pitch. Similarly, the offset of the pairs of differential signal contacts 504 from row-to-row may be none, less than a column pitch, equal to a column pitch, or more than a column pitch. A row-to-row centerline spacing A may be about 1.4 mm to 2.5 mm, with approximately 2 mm the preferred spacing. A column-to-column centerline spacing B may be about 1.3 mm to 2.5 mm, with approximately 1.8 mm the preferred spacing. A ground-to-ground spacing C in each column may be about 3.9 mm to 6 mm, with approximately 5.4 mm the preferred spacing. A signal-to-signal spacing D in each column may be about 1.2 mm, but can be in a range of about 0.3 mm to 2 mm. A material thickness E of the ground contacts G and/or the signal contacts S may be in a range of 0.2 mm to 0.4 mm, with approximately 0.35 mm the preferred thickness. A height F of each ground contact G is preferably about 2.4 mm, but the height F may range from about 1 mm to 2.9 mm. A spacing J between a ground contact G and an adjacent signal contact S in a column may be about 0.4 mm, but can be in a range of 0.2 mm to 0.7 mm. A gap distance H between signal contacts S that define a pair of differential signal contacts 504 is about 0.2 mm to 2.5 mm, with a gap distance of about 1.8 mm preferred with the dielectric material 508 disposed between the signal contacts S that form the pair. However, the signal contacts S in a column may be offset from the array centerline spacing by a material stock thickness or more, with a approximate 0.2 mm to 0.3 mm offset in opposite directions preferred.
In an embodiment, the column 528 may include a first signal contact S and a second signal contact S arranged edge-to-edge along the column 528. The column 526 may include a third signal contact S adjacent to the first signal contact S in the column 528. The column 530 may include a fourth signal contact S adjacent to the second signal contact S in the column 528. As shown in
The connector 900 generally may include the same features and/or elements as the connector 500, such as one or more leadframe assemblies (not shown) for housing linear arrays of the electrical contacts 502 and a dielectric material 508 disposed between adjacent signal contacts S. As shown in
As shown in
The connector 1300 generally may include the same features and/or elements as the connector 500, such as one or more leadframe assemblies (not shown) for housing linear arrays of the electrical contacts 502. Each linear array may include the ground contacts G and the signal contacts S. In addition, the connector 1300 may have the same or similar contact and contact spacing dimensions as the connector 500 as well as the same or similar contact arrangements.
As shown in
In one or more of the foregoing embodiments, at least a portion of the electrical contacts may be insert molded in plastic. Moreover, the electrical connectors may be configured for flat rock PCB press-fit insertion. For example, one or more linear arrays of electrical contacts may be laminated. Each laminated linear array may then be combined together to form a solid body or a collection of individual wafers. Alternatively, a four, five, or six sided box may be created around the electrical contacts. The interior of the box may then be filled with air, plastic, PCB material, or any combination thereof. The electrical connector may be mounted to a printed circuit board via solder balls, fusible elements, solder fillets, and the like.
The electrical contacts 1732 may be arranged edge-to-edge along each of the columns 1714, 1716, 1718, 1720, 1722, 1724, 1726, 1728, 1730. In addition, at least a portion of the electrical contacts 1732 may be arranged broadside-to-broadside along each of the rows 1702, 1704, 1706, 1708, 1710, 1712. Adjacent signal contacts S in each of the columns 1714, 1716, 1718, 1720, 1722, 1724, 1726, 1728, 1730 may form a pair of differential signal contacts 1734. A ground contact G may be disposed between each pair of differential signal contacts 1734 in the columns 1714, 1716, 1718, 1720, 1722, 1724, 1726, 1728, 1730. The ground contacts G and the signal contacts S may be surrounded on all sides by the dielectric 506.
Each of the contact columns 1714, 1716, 1718, 1720, 1722, 1724, 1726, 1728, 1730 may define a contact pattern. For example, the electrical contacts 1732 in the column 1714 may be arranged (moving from top to bottom) in a G-S-S-G-S-S pattern. The electrical contacts 1732 in the column 1716 may be arranged in a S-S-G-S-S-G pattern, though it will be appreciated that the contact pattern in the column 1716 may be the same as the contact pattern in the column 1714 when viewed from bottom to top. The electrical contacts 1732 in the column 1718 may be arranged in a S-G-S-S-G-S pattern, which may be different from the respective contact patterns in the columns 1714, 1716.
The contact patterns in the columns 1714, 1716, 1718 may be repeated in the remaining columns, i.e., the column 1720 may have the same contact pattern as the column 1714, the column 1722 may have the same contact pattern as the column 1716, the column 1724 may have the same contact pattern as the column 1718, and so on. It will be appreciated that some of the signal contacts S may be neutral contacts, or “extra pins,” and may not be needed for the formation of a pair of differential signal contacts 1734.
As shown in
This application claims benefit under 35 U.S.C. § 119(e) of provisional U.S. Patent Application No. 60/855,558, filed Oct. 30, 2006, and of provisional U.S. Patent Application No. 60/869,292, filed Dec. 8, 2006, the disclosures of which are incorporated herein by reference in their entirety. This application is related by subject matter to U.S. patent application Ser. No. 11/866,061, filed Oct. 2, 2007 and entitled “Broadside-Coupled Signal Pair Configurations For Electrical Connectors,” the disclosure of which is hereby incorporated by reference in its entirety.
Number | Name | Date | Kind |
---|---|---|---|
3286220 | Marley et al. | Nov 1966 | A |
3390369 | Zavertnik et al. | Jun 1968 | A |
3538486 | Shlesinger, Jr. | Nov 1970 | A |
3587028 | Uberbacher | Jun 1971 | A |
3669054 | Desso et al. | Jun 1972 | A |
3748633 | Lundergan | Jul 1973 | A |
4045105 | Lee et al. | Aug 1977 | A |
4076362 | Ichimura | Feb 1978 | A |
4159861 | Anhalt | Jul 1979 | A |
4260212 | Ritchie et al. | Apr 1981 | A |
4288139 | Cobaugh et al. | Sep 1981 | A |
4383724 | Verhoeven | May 1983 | A |
4402563 | Sinclair | Sep 1983 | A |
4482937 | Berg | Nov 1984 | A |
4560222 | Dambach | Dec 1985 | A |
4717360 | Czaja | Jan 1988 | A |
4734060 | Kawawada et al. | Mar 1988 | A |
4776803 | Pretchel et al. | Oct 1988 | A |
4815987 | Kawano et al. | Mar 1989 | A |
4867713 | Ozu et al. | Sep 1989 | A |
4907990 | Bertho et al. | Mar 1990 | A |
4913664 | Dixon | Apr 1990 | A |
4973271 | Ishizuka et al. | Nov 1990 | A |
5066236 | Broeksteeg | Nov 1991 | A |
5077893 | Mosquera et al. | Jan 1992 | A |
5098311 | Roath et al. | Mar 1992 | A |
5163849 | Fogg et al. | Nov 1992 | A |
5167528 | Nishiyama et al. | Dec 1992 | A |
5174770 | Sasaki et al. | Dec 1992 | A |
5192231 | Dolin, Jr. | Mar 1993 | A |
5224867 | Ohtsuki et al. | Jul 1993 | A |
5238414 | Yaegashi et al. | Aug 1993 | A |
5254012 | Wang | Oct 1993 | A |
5274918 | Reed | Jan 1994 | A |
5277624 | Champion et al. | Jan 1994 | A |
5286212 | Broeksteeg | Feb 1994 | A |
5302135 | Lee | Apr 1994 | A |
5342211 | Broekstagg | Aug 1994 | A |
5356300 | Costello et al. | Oct 1994 | A |
5356301 | Champion et al. | Oct 1994 | A |
5357050 | Baran et al. | Oct 1994 | A |
5431578 | Wayne | Jul 1995 | A |
5475922 | Tamura et al. | Dec 1995 | A |
5525067 | Gatti | Jun 1996 | A |
5558542 | O'Sullivan et al. | Sep 1996 | A |
5586914 | Foster, Jr. et al. | Dec 1996 | A |
5590463 | Feldman et al. | Jan 1997 | A |
5609502 | Thumma | Mar 1997 | A |
5713746 | Olson et al. | Feb 1998 | A |
5730609 | Harwath | Mar 1998 | A |
5741144 | Elco et al. | Apr 1998 | A |
5741161 | Cahaly et al. | Apr 1998 | A |
5795191 | Preputnick et al. | Aug 1998 | A |
5817973 | Elco et al. | Oct 1998 | A |
5853797 | Fuchs et al. | Dec 1998 | A |
5908333 | Perino et al. | Jun 1999 | A |
5925274 | McKinney et al. | Jul 1999 | A |
5961355 | Morlion et al. | Oct 1999 | A |
5967844 | Doutrich et al. | Oct 1999 | A |
5971817 | Longueville | Oct 1999 | A |
5980321 | Cohen et al. | Nov 1999 | A |
5993259 | Stokoe et al. | Nov 1999 | A |
6042389 | Lemke et al. | Mar 2000 | A |
6050862 | Ishii | Apr 2000 | A |
6068520 | Winings et al. | May 2000 | A |
6099332 | Troyan | Aug 2000 | A |
6116926 | Ortega et al. | Sep 2000 | A |
6116965 | Arnett et al. | Sep 2000 | A |
6123554 | Ortega et al. | Sep 2000 | A |
6125535 | Chiou et al. | Oct 2000 | A |
6129592 | Mickievicz et al. | Oct 2000 | A |
6139336 | Olson | Oct 2000 | A |
6146157 | Lenoir et al. | Nov 2000 | A |
6146203 | Elco et al. | Nov 2000 | A |
6150729 | Ghahghahi | Nov 2000 | A |
6171115 | Mickievicz et al. | Jan 2001 | B1 |
6171149 | Van Zanten | Jan 2001 | B1 |
6190213 | Reichart et al. | Feb 2001 | B1 |
6212755 | Shimada et al. | Apr 2001 | B1 |
6219913 | Uchiyama | Apr 2001 | B1 |
6220896 | Bertoncini et al. | Apr 2001 | B1 |
6227882 | Ortega et al. | May 2001 | B1 |
6267604 | Mickievicz et al. | Jul 2001 | B1 |
6269539 | Takahashi et al. | Aug 2001 | B1 |
6280209 | Bassler et al. | Aug 2001 | B1 |
6293827 | Stokoe et al. | Sep 2001 | B1 |
6319075 | Clark et al. | Nov 2001 | B1 |
6322379 | Ortega et al. | Nov 2001 | B1 |
6322393 | Doutrich et al. | Nov 2001 | B1 |
6328602 | Yamasaki et al. | Dec 2001 | B1 |
6343955 | Billman et al. | Feb 2002 | B2 |
6347952 | Hasegawa et al. | Feb 2002 | B1 |
6350134 | Fogg et al. | Feb 2002 | B1 |
6354877 | Shuey et al. | Mar 2002 | B1 |
6358061 | Regnier | Mar 2002 | B1 |
6361366 | Shuey et al. | Mar 2002 | B1 |
6363607 | Chen et al. | Apr 2002 | B1 |
6364710 | Billman et al. | Apr 2002 | B1 |
6368121 | Ueno et al. | Apr 2002 | B1 |
6371773 | Crofoot et al. | Apr 2002 | B1 |
6375478 | Kikuchi | Apr 2002 | B1 |
6379188 | Cohen et al. | Apr 2002 | B1 |
6386914 | Collins et al. | May 2002 | B1 |
6409543 | Astbury, Jr. et al. | Jun 2002 | B1 |
6431914 | Billman | Aug 2002 | B1 |
6435913 | Billman | Aug 2002 | B1 |
6435914 | Billman | Aug 2002 | B1 |
6461202 | Kline | Oct 2002 | B2 |
6471548 | Bertoncini et al. | Oct 2002 | B2 |
6482038 | Olson | Nov 2002 | B2 |
6485330 | Doutrich | Nov 2002 | B1 |
6494734 | Shuey et al. | Dec 2002 | B1 |
6503103 | Cohen et al. | Jan 2003 | B1 |
6506081 | Blanchfield et al. | Jan 2003 | B2 |
6520803 | Dunn | Feb 2003 | B1 |
6527587 | Ortega et al. | Mar 2003 | B1 |
6537111 | Brammer et al. | Mar 2003 | B2 |
6540559 | Kemmick et al. | Apr 2003 | B1 |
6547066 | Koch | Apr 2003 | B2 |
6547606 | Johnston et al. | Apr 2003 | B1 |
6554647 | Cohen et al. | Apr 2003 | B1 |
5641141 | Stoddard | Jun 2003 | A1 |
6572410 | Volstorf et al. | Jun 2003 | B1 |
6602095 | Astbury, Jr. et al. | Aug 2003 | B2 |
6609933 | Yamasaki | Aug 2003 | B2 |
6641411 | Stoddard et al. | Nov 2003 | B1 |
6652318 | Winnings et al. | Nov 2003 | B1 |
6652319 | Billman | Nov 2003 | B1 |
6672907 | Azuma | Jan 2004 | B2 |
6692272 | Lemke et al. | Feb 2004 | B2 |
6695627 | Ortega et al. | Feb 2004 | B2 |
6700455 | Tripathi et al. | Mar 2004 | B2 |
6717825 | Volstorf | Apr 2004 | B2 |
6762067 | Quinones et al. | Jul 2004 | B1 |
6764341 | Lappoehn | Jul 2004 | B2 |
6776649 | Pape et al. | Aug 2004 | B2 |
6805278 | Olson et al. | Oct 2004 | B1 |
6808399 | Rothermel et al. | Oct 2004 | B2 |
6824391 | Mickievicz et al. | Nov 2004 | B2 |
6843686 | Ohnishi et al. | Jan 2005 | B2 |
6848944 | Evans | Feb 2005 | B2 |
6851974 | Doutrich | Feb 2005 | B2 |
6852567 | Lee et al. | Feb 2005 | B1 |
6863543 | Lang et al. | Mar 2005 | B2 |
6869292 | Johnescu et al. | Mar 2005 | B2 |
6890214 | Brown et al. | May 2005 | B2 |
6905368 | Mashiyama et al. | Jun 2005 | B2 |
6913490 | Whiteman, Jr. et al. | Jul 2005 | B2 |
6932649 | Rothermel et al. | Aug 2005 | B1 |
6945796 | Bassler et al. | Sep 2005 | B2 |
6953351 | Fromm et al. | Oct 2005 | B2 |
6969268 | Brunker | Nov 2005 | B2 |
6969280 | Winings et al. | Nov 2005 | B2 |
6976886 | Winings et al. | Dec 2005 | B2 |
6979226 | Otsu et al. | Dec 2005 | B2 |
6981883 | Raistrick et al. | Jan 2006 | B2 |
6988902 | Winnings et al. | Jan 2006 | B2 |
6994569 | Minich et al. | Feb 2006 | B2 |
7057115 | Clink et al. | Jun 2006 | B2 |
7097506 | Nakada | Aug 2006 | B2 |
7118391 | Minich et al. | Oct 2006 | B2 |
7131870 | Whiteman, Jr. et al. | Nov 2006 | B2 |
7157250 | Gabriel | Jan 2007 | B2 |
7182643 | Winings | Feb 2007 | B2 |
7207807 | Fogg | Apr 2007 | B2 |
7229318 | Winings et al. | Jun 2007 | B2 |
7320621 | Laurx | Jan 2008 | B2 |
7331800 | Winings et al. | Feb 2008 | B2 |
7407413 | Minich | Aug 2008 | B2 |
7422484 | Cohen et al. | Sep 2008 | B2 |
7524209 | Hull | Apr 2009 | B2 |
20020098727 | McNamara et al. | Jul 2002 | A1 |
20020106930 | Pape et al. | Aug 2002 | A1 |
20030143894 | Kline et al. | Jul 2003 | A1 |
20030171010 | Winings et al. | Sep 2003 | A1 |
20030203665 | Ohnishi et al. | Oct 2003 | A1 |
20030220021 | Whiteman, Jr. et al. | Nov 2003 | A1 |
20050009402 | Chien et al. | Jan 2005 | A1 |
20050020109 | Raistrick et al. | Jan 2005 | A1 |
20050118869 | Evans | Jun 2005 | A1 |
20050170700 | Shuey et al. | Aug 2005 | A1 |
20050277221 | Mongold | Dec 2005 | A1 |
20060014433 | Consoli | Jan 2006 | A1 |
20060046526 | Minich | Mar 2006 | A1 |
20060121749 | Fogg | Jun 2006 | A1 |
20060192274 | Lee | Aug 2006 | A1 |
20070099455 | Rothermel et al. | May 2007 | A1 |
20070205774 | Minich | Sep 2007 | A1 |
20070207641 | Minich | Sep 2007 | A1 |
20080085618 | Sercu | Apr 2008 | A1 |
20090011641 | Cohen et al. | Jan 2009 | A1 |
20090191756 | Hull | Jul 2009 | A1 |
Number | Date | Country |
---|---|---|
0273683 | Jul 1988 | EP |
1148587 | Apr 2002 | EP |
0891016 | Oct 2002 | EP |
06-236788 | Aug 1994 | JP |
07-114958 | May 1995 | JP |
11-185886 | Jun 1999 | JP |
2000-003743 | Jan 2000 | JP |
2000-003744 | Jan 2000 | JP |
2000-003745 | Jan 2000 | JP |
2000-003746 | Jan 2000 | JP |
WO 9016093 | Dec 1990 | WO |
WO 0129931 | Apr 2001 | WO |
WO 0139332 | May 2001 | WO |
WO 02101882 | Dec 2002 | WO |
WO2006031296 | Mar 2006 | WO |
Number | Date | Country | |
---|---|---|---|
20080102702 A1 | May 2008 | US |
Number | Date | Country | |
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60869292 | Dec 2006 | US | |
60855558 | Oct 2006 | US |