Patent Application
20210292692
The present disclosure relates to a bubble ejection method, a power supply device, and a bubble ejecting apparatus. In particular, the present disclosure relates to a bubble ejection method that can continuously eject bubbles into a conductor in accordance with a novel bubble ejection principle, a power supply device used for performing the bubble ejection method, and a bubble ejecting apparatus.
Due to progress of biotechnology in recent years, there is a growing demand for local processing of a cell or the like, such as processing to perforate a membrane or a wall of a cell and remove a nucleus from the cell or introduce a nucleic acid substance such as DNA to the cell. As a local processing technology (hereafter, also referred to as “local ablation method”), methods using a contact processing technology using a probe such as an electrical scalpel, a contactless ablation technology using laser or the like, or the like are widely known.
Further, as a local physical injection technology for introducing a nucleic acid substance or the like to a cell or the like (hereafter, also referred to as “local injection method”), an electroporation, a sonoporation technology using ultrasonic waves, a particle gun method, and the like are widely known.
Furthermore, not only local physical injection technologies for introducing a nucleic acid substance or the like to a cell or the like, such as a contact processing technology using a probe such as an electrical scalpel, a contactless ablation technology using laser or the like, an electroporation as described above but also a local ablation method using a bubble ejection member and a local ablation method and a local injection method using a vapor-liquid ejection member are known (see Patent Literature 1).
A bubble ejection member disclosed in Patent Literature 1 described above includes: (1) a core formed of a conductive material; (2) a shell portion formed of an insulating material, covering the core, and including a portion extending from the tip of the core; (3) a space formed between the extending portion of the shell portion and the tip of the core; and (4) a bubble ejection port formed at the tip of the extending portion (on the opposite side of the core in the space). Further, it is disclosed that, when ejecting a bubble by using the bubble ejection member, (5) first, by immersing at least the bubble ejection port of the bubble ejection member and a counter electrode in a solution, (6) next, by applying a high frequency voltage to the core of the bubble ejection member and the counter electrode, resulting in that (7) a bubble occurs in the space, and the bubble occurring in the space is then discharged so as to be pulled and cut from the bubble ejection port, and (8) by continuously emitting the discharged bubbles to a processing target, it is possible to cut (perform local ablation on) the processing target.
Further, Patent Literature 1 discloses that (9) by providing an outer shell portion outside the shell portion of the bubble ejection member so as to have a space with the shell portion, (10) by introducing, to the space, a solution in which an injection substance is dissolved and/or dispersed and thereby enabling generation of bubbles on which the solution in which an injection substance is dissolved and/or dispersed is absorbed to the interface, and (11) by continuously emitting the bubbles to the processing target, it is possible to cut the processing target and inject the injection substance contained in the solution covering the bubbles to the processing target.
As a technology similar to the above disclosure of Patent Literature 1, a bubble ejection chip in which a bubble ejection portion is formed such that a bubble ejection port is opened above a substrate is known (see Patent Literature 2). The bubble ejection chip disclosed in Patent Literature 2 includes (1) at least a substrate, a current conduction portion, and a bubble ejection portion, and it is disclosed (2) that the current conduction portion is formed above the substrate, (3) that the bubble ejection portion includes an electrode formed of a conductive material, a shell portion formed of an insulating photosensitive resin, and an extending portion extending from the shell portion, the shell portion covers the periphery of the electrode, and the extending portion extends from the tip of the electrode, and furthermore, the bubble ejection portion includes a space formed between the extending portion and the tip of the electrode, and (4) that the electrode of the bubble ejection portion is formed above the current conduction portion.
As described above, in both of the bubble ejection member disclosed in Patent Literature 1 and the bubble ejection portion disclosed in Patent Literature 2, the periphery of the core (electrode) formed of a conductive material is covered with the shell portion formed of an insulating material, and furthermore, a space is provided by using the extending portion extending from the shell portion and the core (electrode). Further, since a bubble is first generated in the space and then ejected from the bubble ejection port, the bubble ejection member and the bubble ejection portion have the extending portion extending from the shell portion as an essential component.
However, it is required to heat and cut off an insulating material such as glass to form the extending portion disclosed in Patent Literature 1. Further, it is required to form the extending portion disclosed in Patent Literature 2 with a photosensitive resin by using a photolithography technology. Thus, there is a problem of increased complexity of the manufacturing process of the bubble ejection member and the bubble ejection chip including the bubble ejection portion.
The disclosure in the present specification has been made in order to solve the problems described above, and according to a thorough study, it has been newly found that (1) by applying a negative voltage to a bubble generating electrode formed of a conductive material, (2) it is possible to eject a bubble into a conductor from the tip part of the bubble generating electrode with a state where the conductive material is exposed, in other words, without forming the extending portion and the space disclosed in Patent Literatures 1 and 2 in the tip part of the bubble generating electrode.
That is, the objective of the present disclosure is to provide a bubble ejection method based on a novel principle, a power supply device for performing the bubble ejection method, and a bubble ejecting apparatus.
The present disclosure relates to a bubble ejection method, a power supply device, and a bubble ejecting apparatus illustrated below.
(1) A bubble ejection method into a conductor, the bubble ejection method comprising steps of:
contacting a bubble generating electrode to the conductor;
contacting a counter electrode to the conductor or a processing target; and
applying a negative voltage to the bubble generating electrode,
wherein a conductive material is exposed on at least a tip part of the bubble generating electrode.
(2) The bubble ejection method according to (1) above, wherein the step of applying the negative voltage to the bubble generating electrode
applies a pulsed voltage, and
starts application to the bubble generating electrode from a negative voltage.
(3) The bubble ejection method according to (2) above further comprising a step of:
applying a positive voltage continuously to the step of applying the negative voltage to the bubble generating electrode.
(4) The bubble ejection method according to (1) above,
wherein the step of applying the negative voltage to the bubble generating electrode applies an alternating voltage, and
wherein the alternating voltage has an amplitude on a negative voltage side.
(5) The bubble ejection method according to any one of (1) to (4) above, wherein a part other than the tip part, on which the conductive material is exposed, of the bubble generating electrode is covered with an insulating material.
(6) The bubble ejection method according to any one of (1) to (5) above, wherein a surface area of the bubble generating electrode in contact with the conductor is smaller than a surface area of the counter electrode in contact with the conductor or a processing target.
(7) The bubble ejection method according to any one of (1) to (6) above, wherein the tip part of the bubble generating electrode has a sharp-pointed shape.
(8) A power supply device comprising a control unit used for controlling a voltage to be applied,
wherein the control unit performs control so as to start application from a negative pulsed voltage.
(9) A power supply device comprising a control unit used for controlling a voltage to be applied, wherein the control unit performs control so as to apply an alternating voltage having an amplitude on a negative voltage side.
(10) A bubble ejecting apparatus comprising at least a bubble generating electrode and the power supply device according to (8) or (9) above.
The bubble ejection method disclosed in the present specification can eject a bubble into a conductor by using the bubble generating electrode on which a conductive material is exposed. It is therefore possible to provide a bubble ejection method with a novel principle. Further, the power supply device can be suitably used for the bubble ejection method with the novel principle. Furthermore, by combining the power supply device and the bubble generating electrode, it is possible to provide a bubble ejecting apparatus with the novel principle.
A bubble ejection method, a power supply device, and a bubble ejecting apparatus will be described below in detail with reference to the drawings.
The bubble generating electrode 2 is formed of a conductive material, and the conductive material is exposed on a tip part 21. The conductive material is not particularly limited as long as it conducts electricity and can be used as an electrode, and the conductive material is preferably a metal, which may be, for example, gold, silver, copper, iron, aluminum, platinum, tungsten, or the like or an alloy in which tin, magnesium, chromium, nickel, zirconium, silicon, iridium, or the like is added to the above metal, for example, stainless or the like. Further, carbon or the like may be used other than a metal.
The conductive material is exposed on at least the tip part of the bubble generating electrode 2. In other words, the bubble generating electrode 2 may be entirely formed of the conductive material, or a portion other than the tip part 21 may be covered with an insulating material. Note that, in the present specification, “tip part” means the end of the bubble generating electrode 2 on the side in contact with a conductor L. The bubble ejection method disclosed in the present specification is to concentrate a negative electric field on the tip of the bubble generating electrode 2 to eject a bubble. It is therefore preferable that the tip part 21 be significantly small in order to facilitate concentration of an electric field. If the tip part 21 is covered with an insulating material, the conductive material of the tip part 21 can be exposed by, for example, after producing an electrode body with a conductive material, first, immersing the electrode body in an insulating material, applying an insulating material to the electrode body, or depositing an insulating material on the electrode body to cover the periphery of the electrode body, and then removing the insulating material on the tip part 21 of the electrode body. Further, the electrode may be fitted into a tube formed of an insulating material so that the tip part 21 is exposed.
The insulating material is not particularly limited as long as it insulates electricity and may be, for example, an inorganic-based insulating material such as glass, mica, quartz, silicon nitride, silicon oxide, ceramic, alumina, or the like, a rubber material such as silicone rubber, an ethylene propylene rubber, or the like, or an insulating resin such as an ethylene-vinyl acetate copolymer resin, a silane modified olefin resin, an epoxy resin, a polyester resin, a vinyl chloride-based resin, an acrylic resin, a melamine resin, a phenolic resin, a polyurethane resin, a polystyrene-based resin, a fluorine-based resin, a silicon-based resin, a polysulfide-based resin, a polyamide resin, a polyimide resin, polyethylene, polypropylene, a cellulose-based resin, a UV curing resin, or the like.
As illustrated in Examples and Comparative examples described later, the bubble ejection method disclosed in the present specification can eject a bubble from the tip of the bubble generating electrode 2 by applying a negative voltage to the bubble generating electrode 2. Therefore, the power supply device used for the bubble ejection method is not particularly limited as long as it can be applied with a negative voltage.
As illustrated in Examples and Comparative examples described later, as a voltage applied to the bubble generating electrode 2, it is preferable to initially apply a negative pulsed voltage or apply a voltage having an amplitude on the negative voltage side. However, since current flows from the positive side to the negative side, general commercial power supply devices are designed to apply a voltage from the positive side. Thus, the power supply device 3 disclosed in the present specification is produced so as to be able to initially apply a negative pulsed voltage or apply a voltage having an amplitude on the negative voltage side in accordance with program design. In the power supply device 3 illustrated in
The voltage applied to the bubble generating electrode 2, in other words, the voltage output by the power supply device 3 is not particularly limited as long as it can cause a bubble to be ejected from the bubble generating electrode 2. The voltage to be applied can be suitably set in accordance with the material, the size, or the shape of the tip part in which an electric field concentrates of the bubble generating electrode 2, and the type of the conductor contacted by the bubble generating electrode 2 and the conductor contacted by the counter electrode 4 or the type of a processing target. When the voltage output by the power supply device 3 is a pulsed voltage, the pulse width, the pulse interval when multiple pulses are applied, the output current, or the like are not particularly limited and can be suitably set as long as a bubble can be ejected from the bubble generating electrode 2. Further, when the voltage output by the power supply device 3 is an alternating voltage, the frequency, the output current, or the like are not particularly limited and can be suitably set as long as a bubble can be ejected from the bubble generating electrode 2.
The counter electrode 4 is not particularly limited as long as it conducts electricity, and the same material as that of the bubble generating electrode 2 can be used. The materials of the bubble generating electrode 2 and the counter electrode 4 may be the same or may be different from each other. Further, the counter electrode 4 is not particularly limited in the shape or the like as long as it can contact the exposed conductive material to the conductor or a processing target, and any shape such as a liner shape, a plate-like shape, or the like can be employed. Note that, although it is preferable to reduce the size of the bubble generating electrode 2 so that an electric field concentrates therein, it is not necessary to reduce the size of the counter electrode 4. Therefore, the counter electrode 4 may be larger than the bubble generating electrode 2. In other words, the bubble generating electrode 2 is smaller in comparison between the surface area of the bubble generating electrode in contact with the conductor and the surface area of the counter electrode in contact with the conductor or the processing target.
Next, an embodiment of the bubble ejection method will be described with reference to
The conductor L is not particularly limited as long as the bubble generating electrode 2 and the counter electrode 4 can conduct current therein to eject a bubble and may be a liquid, a viscos liquid having a level of viscosity that does not prevent ejection of a bubble, a mixture of a liquid or a viscos liquid with a solid, or the like. The liquid may be, for example, water, a solution in which a salt such as KCl, NaCl2, or the like is dissolved in water, or a buffer solution, a culture medium, or the like such as PBS used in the field of biology. The viscos liquid may be a viscos liquid in which a thickener is added to the above liquid or a biological component such as blood. The mixture of a liquid or a viscos liquid with a solid may be a biological tissue containing a large amount of a conductive body fluid.
By contacting the bubble generating electrode 2 to the conductor L, contacting the counter electrode 4 to the conductor L or the processing target, and then applying a negative voltage to the bubble generating electrode 2, it is possible to eject the bubble B from the tip part 21 of the bubble generating electrode 2 into the conductor L.
Further, as disclosed in Patent Literatures 1 and 2, by causing the bubble B ejected from the bubble generating electrode 2 by using the bubble ejection method disclosed in the present specification to collide with a processing target, it is possible to perform local ablation on the processing target. Further, when a liquid is used as the conductor L, it is possible to inject an injection substance to the processing target while performing local ablation on the processing target by dissolving a nucleic acid such as DNA or RNA, a protein, an amino acid, a soluble drug, or a gaseous injection substance such as nitrogen, helium, carbon dioxide, argon, or the like in the liquid in advance.
The processing target is not particularly limited as long as ablation can be performed thereon by using bubbles and may be an animal, a plant such as a leaf or a seed, an organism such as a microorganism, a tissue or a cell separated from such an organism, a protein, or the like. The cell may be a cell such as an animal cell such as a stem cell, a skin cell, a mucosal cell, a hepatocyte, an islet cell, a nerve cell, a chondrocyte, an endothelial cell, an epithelial cell, a bone cell, a muscle cell, an egg cell, or the like isolated from a tissue of a human or a non-human animal, a plant cell, an insect cell, or a microbial cell such as E. coli, a yeast, and a mold, or the like. Further, a resin, a metal, or the like may be used other than an organism.
For example, it is possible to perform ablation by using a liquid as a conductor, arranging a processing target between the bubble generating electrode 2 and the counter electrode 4 that are immersed in the liquid, and applying a negative voltage to the bubble generating electrode 2 to cause the ejected bubble to collide with the processing target. Note that, as described above, when the processing target is conductive, the counter electrode 4 may be in direct contact with the processing target. Further, when the processing target is a conductor (such as a biological tissue containing a large amount of conductive body fluid), it is possible to perform direct ablation on the processing target by contacting the bubble generating electrode 2 and the counter electrode 4 to the processing target and applying a negative voltage to the bubble generating electrode 2.
Although examples will be presented below to specifically describe each embodiment, these examples are provided only for the purpose of reference of a specific aspect thereof. These illustrations are not intended to limit or restrict the scope of the invention.
First, a thin wire was produced from stainless, abrasive machining was performed on the tip part of the thin wire, and thereby a bubble generating electrode having a substantial cone-shaped tip part was produced.
The tip part of the bubble generating electrode and the counter electrode of the produced bubble ejecting apparatus were immersed in phosphate buffered saline (PBS: Wako 163-25265 10×PBS(−) was diluted 10 times). Note that a volume of 5 mm by 5 mm by 0.044 mm of the counter electrode was immersed. Next, a Hi-mode (5 W) and continuous 300 sets with 5-cycle amplitudes being defined as one set were set as the conditions of Hyfrecator 2000 to apply the voltage. The state of the tip part of the bubble generating electrode was photographed in a condition of 1500 fps by using a high-speed camera (HAS-U2, by DITECT Co. Ltd.). The arrow of
Hyfrecator 2000 (ConMed Corp.) was used as the power supply device in the same manner, and the bubble ejecting apparatus was produced in the same procedure as that in Example 1 except that the voltage applied to the bubble generating electrode was changed so that initially a negative voltage was applied but then the amplitude occurred on the positive voltage side.
A bubble ejection method was implemented in the same procedure as that in Example 1 except that the voltage applied to the bubble generating electrode had the amplitude occurring on the positive voltage side. The arrow of
When the voltage having an amplitude on the negative voltage side was applied to the bubble generating electrode as illustrated in
A bubble generating electrode whose tip part has substantially a cone shape that was cut at a small angle was produced in the same procedure as that in Example 1 except that copper instead of stainless was used.
A bubble ejection method was performed in the same procedure as that in Example 1 except that 2 mM of KCl instead of PBS was used, and a pulsed voltage having a voltage of −1000 V, a pulse width of 3 μs, and a pulse interval of 150 μs was applied continuously for 50 times. The arrow of
A bubble ejecting apparatus was produced in the same procedure as that in Example 3 except that the power supply device of Example 3 was altered so as to be able to apply a positive voltage instead of a negative voltage.
The bubble ejection method was performed in the same procedure as that in Example 3 except that the voltage applied to the bubble generating electrode was a positive pulsed voltage. The arrow of
When the negative pulsed voltage was applied to the bubble generating electrode as illustrated in FIG. 6A (1), ejection of bubbles from the tip part of the bubble generating electrode was observed as indicated by the arrow in
Next, a bubble ejecting apparatus was produced and a bubble ejection method was performed in the same procedure as that in Example 3 except that the power supply device was altered so as to apply a positive voltage continuously from a negative pulsed voltage, 0.5×PBS instead of 2 mM of KCl was used, the positive voltage was +600 V, the negative voltage was −600 V, each pulse width of the positive voltage and the negative voltage was 6 μs, the pulse interval (the period of time from the end of application of a positive pulse to application of the next negative pulse) was 100 μs, and 50 sets were continuously applied with application of a negative voltage pulse and then a positive voltage pulse being defined as one set. The arrow of
A bubble ejecting apparatus was produced and a bubble ejection method was performed in the same procedure as that in Example 4 except that the power supply device was altered so as to apply a negative voltage continuously from a positive voltage. The arrow of
In Example 4 in which the negative to positive pulsed voltage was continuously applied to the bubble generating electrode as illustrated in
A bubble ejecting apparatus was produced and a bubble ejection method was performed in the same procedure as that in Example 5 except that tungsten was used as a material of the bubble generating electrode, mM KCl instead of 0.5×PBS was used, the positive voltage was +1000 V, the negative voltage was −1000 V, and each pulse width of the positive voltage and the negative voltage was 2 μs. The arrow of
Even when the positive to negative pulsed voltage was continuously applied to the bubble generating electrode as illustrated in
Next, a bubble ejecting apparatus was produced and a bubble ejection method was performed in the same procedure as that in Example 3 except that the tip of the bubble generating electrode was polished into a planar shape, and the applied voltage was 1200 V. The arrow of
When a negative pulsed voltage was applied to the bubble generating electrode as illustrated in
Next, a bubble ejecting apparatus was produced and a bubble ejection method was performed in the same procedure as that in Example 3 except that the tip of the bubble generating electrode was polished such that the sectional shape was a right triangle, and the applied voltage was 1150 V. The arrow of
A bubble ejecting apparatus was produced and a bubble ejection method was performed in the same procedure as that in Example 8 except that the power supply device was altered so as to apply a positive voltage. The arrow of
When the negative pulsed voltage was applied to the bubble generating electrode as illustrated in
Next, stainless was used for the material of the bubble generating electrode, and the bubble generating electrode in which the tip was polished so as to be sharper than that in Examples 3, 7, and 8 was produced. Then, a bubble ejecting apparatus was produced and a bubble ejection method was performed in the same procedure as that in Example 3 except that the applied voltage was 1200 V. The arrow of
When the bubble generating electrode illustrated in Example 9 was used, it was observed that directional continuous bubbles were ejected from the tip part of the bubble generating electrode as is clear from comparison between
Next, in Example 10, a bubble generating electrode produced by polishing the tip by using stainless was used, and a pulsed voltage was applied in the same procedure as that in Example 3. Note that photographs were taken at 800 fps by the high-speed camera.
Photographs were taken in the same procedure as that in Example 10 except that a voltage of +1000 V was applied to the bubble generating electrode continuously from a pulsed voltage of −1000 V.
Next, the frames of the high-speed camera in Example 10 and Example 11 were analyzed to analyze the positions of bubbles ejected to the farthest after 1.25 ms and 2.5 ms from application of a negative pulsed voltage. The upper part in
First, a thin wire having a diameter of approximately 0.1 mm was produced from a material of an alloy of platinum and iridium (PTIR, platinum:iridium=9:1), and the tip part was polished to produce bubble generating electrode. Next, a bubble ejection method was performed in the same procedure as that in Example 3 except that a pulsed voltage having a voltage of −600 V and a pulse width of 2 μs was applied.
A bubble ejection method was performed in the same procedure as that in Example 12 except that a pulsed voltage of +600 V was applied.
The bubble generating electrode 2 used for a bubble ejection method disclosed in the present specification can be easily produced, because the conductive material thereof is exposed. Therefore, the invention is useful in fields in which a processing target is processed by bubbles, such as a field of livestock, agriculture, forestry, and fisheries.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2018-138069 | Jul 2018 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2019/028396 | 7/19/2019 | WO | 00 |
