The present disclosure belongs to the technical field of mobile terminals, and specifically relates to a buckle assembly, a pressing and cutting jig, and a method and an apparatus for manufacturing a package structure.
With the rapid development of intelligent terminals, users have higher requirements on the aesthetic appearance of products. The current optimization methods such as paint spraying, film coating and the like on the surfaces of the products cannot satisfy the requirements of users on the appealing aesthetic appearance of products. In the current market, glass and ceramic begin to be selected as the materials for rear covers of electronic products, which, compared with plastic and metals, have thick and heavy texture and can enable better user experience. However, limited by the properties of glass and ceramic, i.e., fragility, the manufacturing of a rear cover for an electronic product is a great challenge.
To solve at least one of the technical problems in the existing art, the present disclosure provides a buckle assembly, a pressing and cutting jig, and a method and an apparatus for manufacturing a package structure.
In a first aspect, a technical solution adopted to solve the technical problem of the present disclosure is a buckle assembly, including a plurality of buckle structures, one plastic frame structure, and one support; wherein an outer contour of the plastic frame structure is matched with an outer contour of a housing of an electronic product; the plastic frame structure is provided with a plurality of openings, and each buckle structure is embedded into one of the openings;
In some embodiments, each branch includes a branch end part at the second end, and a branch body part integrally formed with the branch end part;
In some embodiments, the buckle body part has a first thickness in a direction toward the branch end part connected to the buckle body part; a connection position between the branch end part and the buckle body part has a second thickness in the first direction; and the second thickness is less than or equal to half of the first thickness.
In some embodiments, the branch body part includes a fourth surface connected to the second surface;
In some embodiments, each of the branches has the same path length from the first end to the second end.
In some embodiments, the plastic frame structure includes a multi-segment bridge structure, wherein the multi-segment bridge structure includes two bridge end parts and a bridge body part sandwiched between the two bridge end parts;
In some embodiments, the bridge body part has a third thickness in the first direction; a connection position between the bridge end part and the buckle body part has a fourth thickness in the first direction; and the fourth thickness is less than or equal to half of the third thickness.
In some embodiments, the bridge body part includes an eleventh surface and a twelfth surface disposed opposite to each other in the first direction;
In some embodiments, the plurality of buckle structures are centrosymmetric about a center of the plastic frame structure.
In some embodiments, the buckle assembly further includes a support which is centrosymmetric about a center of the plastic frame structure.
In a second aspect, an embodiment of the present disclosure further provides a method for manufacturing a package structure, including:
In some embodiments, connecting the buckle assembly with the housing and removing the plastic frame structure and the support from the buckle assembly includes:
In some embodiments, the buckle assembly further includes a support; and
In a third aspect, an embodiment of the present disclosure further provides a pressing and cutting jig, including a male jig core, a female jig core, a plurality of sets of cutting needles, a cutting needle plate, a cutting needle baffle and a guide post; wherein the cutting needle plate is disposed on the cutting needle baffle; the male jig core has a guide post through hole; the guide post is fixed on the cutting needle plate and passes through the guide post through hole to be movably connected to the male jig core; the plurality of sets of cutting needles are disposed between the cutting needle baffle and the male jig core, and each set of cutting needles passes through stepped through holes in the cutting needle plate to be fixed by the cutting needle baffle; the female jig core is positioned on a side of the male jig core away from the cutting needle plate, and detachably connected to the male jig core;
In some embodiments, the buckle assembly further includes a support; and each set of cutting needles is further configured to cut at a connection position between one of the buckle structures and the support.
In some embodiments, the pressing and cutting jig further includes a spring; wherein the spring is nested on the guide post and configured to reset the pressing of the female jig core to the male jig core.
In some embodiments, the pressing and cutting jig further includes a stopper; wherein the stopper is disposed between the cutting needle plate and the male jig core, and fixed onto a surface of the male jig core close to the cutting needle plate; and
In some embodiments, the pressing and cutting jig further includes a counter fixed onto the cutting needle plate and configured to record the number of cuts.
In a fourth aspect, an embodiment of the present disclosure further provides an apparatus for manufacturing a package structure, including a pressing and cutting jig as described in any of the above embodiments.
In some embodiments, the apparatus further includes a workbench and a manipulator;
Reference Signs: 000. package structure (glass rear cover or ceramic rear cover); 100. buckle assembly; 200. housing (glass sheet or ceramic sheet); 101. buckle structure; 102. plastic frame structure; 103. support; 11. buckle body part; 12. buckle connection part; 2. bridge structure; 21. bridge end part; 22. bridge body part; O. first end of a branch; 31. branch end part; 32. branch body part; 03. third surface; 05. fifth surface; 07. seventh surface; 010. tenth surface; 012. twelfth surface; α. first dihedral angle; β. second dihedral angle; γ. third dihedral angle; H1. first thickness; H2. second thickness; H3. third thickness; H4. fourth thickness; 300. pressing and cutting jig; 41. male jig core; 42. female jig core; 421. handle; 43. cutting needle; 44. cutting needle plate; 45. cutting needle baffle; 46. guide post; 47. spring; 48. stopper; 49. counter; 410-1. screw for fixing a handle; 410-2. screw for fixing a stopper; 410-3. screw for fixing a counter; 410-4. screw for locking a cutting needle plate; 410-5. screw for fixing a cutting needle baffle; 411. positioning block; 400. electronic product body; 500. workbench; 600. manipulator; and 601. suction disk.
To make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions according to the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings of the embodiments of the present disclosure. Apparently, the described embodiments are merely some, but not all, of the embodiments of the present disclosure. The components of the embodiments of the present disclosure, as generally described and illustrated in the figures herein, could be arranged and designed in a wide variety of different configurations. Therefore, the following detailed description of the embodiments of the present disclosure, provided in the accompanying drawings, is not intended to limit the scope of the present disclosure as claimed, but is merely representative of selected embodiments of the present disclosure. All other embodiments, which can be derived by those skilled in the art from the embodiments of the present disclosure without making any creative effort, shall fall within the protection scope of the present disclosure.
Unless otherwise defined, technical or scientific terms used in the present disclosure are intended to have general meanings as understood by those of ordinary skill in the art to which the present disclosure belongs. The words “first”, “second” and similar terms used in the present disclosure do not denote any order, quantity, or importance, but are used merely for distinguishing different components from each other. The word “comprise” or “include” or the like means that the element or item preceding the word contains elements or items that appear after the word or equivalents thereof, but does not exclude other elements or items. The words “upper”, “lower”, “left”, “right”, or the like are merely used to indicate a relative positional relationship, and when an absolute position of the described object is changed, the relative positional relationship may be changed accordingly.
Reference to “a plurality of or several” in the present disclosure means two or more. The term “and/or” describes an association relationship of associated objects, which may include three relationships; for example, A and/or B may refer to: A alone, A and B, or B alone. The character “/” generally indicates that the former and latter associated objects are in an “or” relationship.
It should be noted that the glass or ceramic rear cover can reflect light, giving people a transparent aesthetic feeling, which is not possessed by metal or plastic materials. In addition, the glass or ceramic rear cover is not likely to block electric waves, and thus is more suitable for near field communication (NFC) and wireless charging. For example, since the glass or ceramic is not likely to block electric waves, when an NFC function, for example, swiping a traffic card, swiping a door guard, payment, data transmission or the like, is used, the response can be more sensitive, thereby improving the user experience. For another example, since the glass or ceramic has little resistance to the received electric waves, an electronic product using a glass or ceramic rear cover is more suitable for wireless charging.
In the existing art, most glass or ceramic rear covers of the current electronic products on the market are manufactured by a bonding process, where the battery cannot be removed, which has the advantages of compact and thin machine body, and good waterproof performance. However, the disadvantages are also obvious. For example, since the battery is not removable, the electronic product has to be replaced by a new one when the lifetime of the battery carried therein expires, thereby shortening the product replacement period. In addition, once the electronic product with the non-detachable rear cover has problems, the user has to seek help from a professional person, and cannot disassemble the electronic product by himself/herself.
A main composition of glass or ceramic is silicon dioxide, which is an amorphous material having a molecular structure typically lacking stability. In simple terms, the silicon dioxide material is fragile. While the glass or ceramic rear cover is manufactured by a bonding process, bonding is relatively difficult limited by the fragility of the material.
In view of this, an embodiment of the present disclosure provides a buckle assembly configured to manufacture a package structure of an electronic product, so that the package structure has buckle structures in the buckle assembly, and the package structure of the electronic product is detachable.
The following provides a detailed description of a specific structure of a buckle assembly according to an embodiment of the present disclosure.
The outer contour of the housing 200 is matched with the outer contour of the plastic frame structure 102, so that the buckle structures 101 embedded into the plastic frame structure 102 are also matched with the outer contour of the housing 200. Meanwhile, the plurality of buckle structures 101 and the plastic frame structure 102 form an integral structure by injection molding, so that relative positions of the buckle structures 101 are relatively accurate, and position deviation of the buckle structures 101 when aligned with the housing 200 is avoided. In addition, the plurality of buckle structures 101 and the plastic frame structure 102 form an integral structure by injection molding, so that in the manufacturing process, this integral structure is connected to the housing 200 to prevent a concentrated stress on the housing 200 when the buckle structures 101 are installed individually. In other words, the buckle assembly 101 in the embodiment of the present disclosure is formed as an integral structure by injection molding, and the plurality of buckle structures 101 are installed with the housing 200 at the same time to disperse a stress on the housing 200, so that the risk of breakage of a local portion of the housing 200 due to pressure during the dwell process is reduced, the quality of the package structure 000 is guaranteed, and the yield of the electronic product is improved.
The buckle structure 101 in the embodiment of the present disclosure is a structure capable of cooperating with another part to implement integral locking, and the buckle structure 101 is typically made of a plastic material with certain flexibility. Apparently, the material of the buckle structure 101 in the embodiment of the present disclosure is not limited to plastic, and may be any other material with certain flexibility. The buckle structure 101 may be cooperated with a body of the electronic product to implement locking.
The number of buckle structures 101 is the same as the number of openings in the plastic frame structure 102. The plurality of buckle structures 101 and the plastic frame structure 102 form an integral structure by injection molding, where the integral structure formed by injection molding is a closed frame structure, wherein the frame structure is relatively stable, and the buckle assembly 100 has an accurate relative position on the frame structure, so as to facilitate subsequent assembling with the glass sheet 200 (or ceramic sheet 200) and implement accurate alignment.
Here, the housing of the electronic product may be understood as a housing of a package structure of the electronic product. The housing may be made of a material including, but not limited to, a relatively thin and fragile material such as glass, ceramic, or the like. Exemplarily, the housing 200 of the electronic product may be selected as a glass sheet or ceramic sheet that is aesthetically pleasing and not likely to block electric waves, which may be specifically a glass sheet or a ceramic sheet on a rear cover of a mobile phone.
The present disclosure will be described by taking the housing 200 being a glass sheet as an example. Bonding is relatively difficult limited by the fragility of the glass. In view of this, the present disclosure provides a buckle assembly 100, which includes a combination of any one or more of the following embodiments with the buckle assembly 100 described above, so as to assist the assembly between the buckle structures 101 and the glass sheet 200, and implement accurate positioning, while reducing the risk of breakage of a local portion of the glass sheet 200 due to pressure during the dwell process, ensuring the quality of the resulting package structure 000, and improving the yield of the electronic product.
In some embodiments,
The support 103 is a molded structure of an injection molding raw material in branch channels of the mold during the injection molding process of the buckle structures 101. As shown in
Exemplarily, at least some of the plurality of branches share at least some structures. As shown in
In some embodiments, as shown in
It should be noted that for the process of assembling the buckle assembly 100 with the glass sheet 200 to form the package structure 000, the support 103 and the plastic frame structure 102 are cut out from the buckle assembly 100, while only the buckle structures 101 are reserved and connected to the glass sheet 200. In this embodiment, however, by forming the first dihedral angle α, so that a certain gap is formed between the connection position between the branch end part 31 and the buckle body part 11 and the sixth surface of the buckle body part 11. The sixth surface is a surface to be connected to the glass sheet 200. As a result, by providing the gap, the influence of cutting needles 43 on the glass sheet 200 in the subsequent cutting process can be avoided, and the risk of damaging the glass sheet 200 by the cutting needles 43 is reduced.
Further, in combination with the above embodiments, as shown in
Here, by forming the second dihedral angle β, the branch end part 31 is substantially thinned, especially that a thickness at the second end of the branch is substantially reduced compared with a thickness of the branch body part 32, so that the connection position between the branch end part 31 and the buckle body part 11 is at a weak point N1, which facilitates the subsequent cutting. In addition, the branch end part 31 in this embodiment has a wedge-shaped structure. A thickness of the branch end part 31 gradually decreases in a direction approaching the buckle body part 11 connected to the branch end part 31, which ensures the strength at the connection position between the branch end part 31 and the branch body part 32, while satisfying the requirement of easy breaking of the connection position between the branch end part 31 and the buckle body part 11.
In some embodiments, as shown in
In some embodiments, as shown in
This embodiment is combined with any one or more of the above embodiments, and the extension plane of the fourth surface is flush with the extension plane of the sixth surface, so that the overall strength of the buckle assembly 100 can be increased, and in the following press-fit process, an overall supporting effect of the glass sheet 200 by the buckle assembly 100 is improved, and the stress on the glass sheet 200 is further dispersed. Therefore, the risk of breakage of a local portion of the glass sheet 200 due to pressure during the dwell process is reduced, the quality of the package structure 000 is guaranteed, and the yield of the electronic product is improved.
In some embodiments, each branch is in a special-shaped structure, and has the same path length from the first end O to the second end. As shown in
In addition, in combination with the above embodiments, in the support 103, the design of at least some of the plurality of branches sharing at least some structures can facilitate the arrangement of branches with the same path length. Meanwhile, the material consumption is reduced, the cost is saved, and the efficiency of the injection molding is improved.
In some embodiments,
It should be noted that for the process of assembling the buckle assembly 100 with the glass sheet 200 to form the package structure 000, the support 103 and the plastic frame structure 102 are cut out from the buckle assembly 100, while only the buckle structures 101 are reserved and connected to the glass sheet 200. In this embodiment, however, by forming the third dihedral angle γ, a certain gap is formed between the connection position between the bridge end part 21 and the buckle body part 11 and the sixth surface of the buckle body part 11. The sixth surface is a surface to be connected to the glass sheet 200. As a result, by providing the gap, the influence of cutting needles 43 on the glass sheet 200 in the subsequent cutting process can be avoided, and the risk of damaging the glass sheet 200 by the cutting needles 43 is reduced.
Further, the bridge body part 22 has a thickness smaller than the buckle body part 11, and the connection position between the bridge end part 21 and the buckle body part 11 has a thickness smaller than the bridge body part 22, so that the connection position between the bridge end part 21 and the buckle body part 11 is at a weak point N2, which facilitates the subsequent cutting.
In addition, in this embodiment, the plastic frame structure 102 includes a multi-segment bridge structure 2. The multi-segment bridge structure 2 connects all the buckle structures 101 into a whole, so that the relative positions of all buckle structures 101 are ensured to be unchanged. Meanwhile, the bridge structure 2 can also effectively prevent deformation or displacement of the buckle structures 101 during injection molding due to an excessive pressure of the injection machine for jetting the injection molding raw material.
In some embodiments, as shown in
Further, as shown in
In combination with the above embodiments, the provision of the bridge structure 2 ensures the connection strength with the buckle structures 101, and facilitates subsequent cutting of the bridge structure 2.
In some embodiments, as shown in
This embodiment is combined with any one or more of the above embodiments, and the extension plane of the eleventh surface is flush with the extension plane of the sixth surface, so that the overall strength of the buckle assembly 100 can be increased, and in the following press-fit process, an overall supporting effect of the glass sheet 200 by the buckle assembly 100 is improved, and the stress on the glass sheet 200 is further dispersed. Therefore, the risk of breakage of a local portion of the glass sheet 200 due to pressure during the dwell process is reduced, the quality of the package structure 000 is guaranteed, and the yield of the electronic product is improved.
In some embodiments, as shown in
In some embodiments, as shown in
The above is a complete description of the structure of the buckle assembly 100 provided in the embodiments of the present disclosure.
In addition, the buckle assembly 100 may be formed by an injection molding process. The specifically process may include, for example, adding an injection molding raw material into a hopper of an injection machine, heating and melting the raw material to a flowing state, pushing the material flow, by a screw or piston of the injection machine, into a prepared specific mold cavity (including a main channel, branch channels, forming cavities for the buckle structures 101, and a forming cavity for the plastic frame structure 102) through a nozzle and a pouring system of the mold, and curing and shaping the material in the specific mold cavity, so as to form the buckle assembly 100.
Here, after being put into the injection machine, the raw material may be melted into a molten state by a heating device in the injection machine, for example, by electric heating or heating with a heating oil.
An embodiment of the present disclosure further provides a method for manufacturing a package structure 000, including the following steps S11 to S12.
At S11, providing a buckle assembly 100 and a housing 200.
The buckle assembly 100 may be a buckle assembly 100 as described in any of the above embodiments. For the specific structures in the buckle assembly 100, reference may be made to the above detailed description of the structures in the buckle assembly 100 in the foregoing embodiments, and thus are not repeated in the embodiments of the method for manufacturing the package structure 000. The housing 200 may be understood as a housing of a package structure 000 of the electronic product. Exemplarily, the housing 200 may be a glass sheet 200 as a rear cover for an electronic product.
At S12, connecting the buckle assembly 100 with the housing 200, and removing the plastic frame structure 102 and the support 103 from the buckle assembly 100 to form a package structure 000.
Here, the buckle assembly 100 and the glass sheet 200 may be connected by an adhesive. The bonded structure may be cut manually to remove the plastic frame structure 102 and the support 103 from the buckle assembly 100, so as to form the package structure 000. Alternatively, the bonded structure may be cut by a specific device to remove the plastic frame structure 102 and the support 103 from the buckle assembly 100 at the same time, thereby improving the manufacturing efficiency of the package structure 000.
In some embodiments, in step S12, a pre-prepared pressing and cutting jig 300 may be used to cut the bonded structure, which specifically includes the following steps S121 to S123.
At S121, providing a pressing and cutting jig 300.
The pressing and cutting jig 300 provided in the embodiment of the present disclosure is a jig dedicated for cutting the buckle assembly 100. The pressing and cutting jig 300 includes at least a male jig core 41, a female jig core 42 and a plurality of sets of cutting needles 43. An outer contour of an internal cavity of the male jig core 41 is matched with an outer contour of the buckle assembly 100. The internal cavity of the male jig core 41 is completely obtained by profiling the buckle assembly 100, and is used for accommodating the buckle assembly 100.
At S122, placing the buckle assembly 100 into an internal cavity of the male jig core 41, and bonding the housing 200 onto the buckle assembly 100 by a bonding structure; and assembling the female jig core 42 with the male jig core 41. The internal cavity of the male jig core 41 has the same pattern as the buckle assembly 100.
Specifically, as shown in
At S123, pressing a structure obtained by bonding the buckle assembly 100 and the glass sheet 200 by using the female jig core 42, to enable each set of cutting needles 43 to cut at a connection position between one of the buckle structures 101 and the plastic frame structure 102, thereby forming the package structure 000.
Specifically,
Further, in combination with the above embodiments, the buckle assembly 100 further includes a support 103. The cutting needles 43 may be used to cut at connection positions between the buckle structures 101 and the support 103. As shown in
In combination with the above embodiments, a detachable glass rear cover structure (i.e., the package structure 000 according to the present disclosure) can be manufactured.
An embodiment of the present disclosure further provides a pressing and cutting jig 300 for manufacturing a package structure 000 of an electronic product, such as a removable glass rear cover of a mobile phone.
It should be noted that for the functions of the main structures in the pressing and cutting jig 300, reference may be made to the steps S121 to S123 in the method for manufacturing the package structure 000, and repeated descriptions are omitted here.
In some embodiments, as shown in
Exemplarily, in combination with the above embodiments, one set of cutting needles 43 includes three cutting needles, two of which are used to cut two bridge structures 2 connected to the buckle structure 101, where the specific cutting position is a weak point N2. The remaining cutting needle 43 is used to cut one branch end part 31 connected to the buckle structure 101, where the specific cutting position is a weak point N1.
In some embodiments, as shown in
In some embodiments, as shown in
Here, the first distance is the maximum stroke L of the cutting needle 43. The thickness of the bridge body part 22 is a third thickness H3. The minimum thickness of the branch end part 31 in the first direction Y is a second thickness H2. The minimum thickness of the bridge end part 21 in the first direction Y is a fourth thickness H4. In other words, the maximum stroke L is less than the third thickness H3, and greater than a maximum one of the second thickness H2 and the fourth thickness H4, i.e., max (H2, H4)<L<H3.
In some embodiments, as shown in
As shown in
An embodiment of the present disclosure further provides an apparatus for manufacturing a package structure 000, which can implement automatic or semi-automatic manufacturing of the package structure 000 of an electronic product, for example, implement manufacturing of a detachable glass rear cover of a mobile phone.
In some embodiments, the apparatus for manufacturing a package structure further includes a workbench 500 and a manipulator 600. As shown in
It should be noted that for the specific structure of the pressing and cutting jig 300, reference may be made to the detailed description in the embodiment of the pressing and cutting jig 300, and repeated descriptions are omitted here. For the detailed pressing and cutting process of the pressing and cutting jig 300, reference may be made to the detailed description in the embodiment of the method for manufacturing a package structure, and repeated descriptions are omitted here.
The manipulator 600 may be disposed on the workbench 500 or on the ground. The manipulator 600 is configured to assemble or separate the female jig core 42 and the male jig core 41; and/or, take a finished package structure 000 out of the male jig core 41. Exemplarily, during a bonding and dwell process, the manipulator 600 assemblies the female jig core 42 with the male jig core 41 by a suction disk 601. When the buckle assembly 100 is cut, the manipulator 600 separates the female jig core 42 from the male jig core 41 by the suction disk 601, and takes the finished package structure 000 out of an internal cavity of the male jig core 41, thereby implementing automatic manufacturing of the package structure 000, improving production efficiency and saving the labor cost.
It will be appreciated that the above implementations are merely exemplary implementations for the purpose of illustrating the principle of the present disclosure, and the present disclosure is not limited thereto. It will be apparent to one of ordinary skill in the art that various modifications and variations may be made without departing from the spirit or essence of the present disclosure. Such modifications and variations should also be considered as falling into the protection scope of the present disclosure.
Filing Document | Filing Date | Country | Kind |
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PCT/CN2023/077562 | 2/22/2023 | WO |