BUILDING INTEGRABLE INTERCONNECTION STRUCTURES HAVING FIELD-CONFIGURABLE SHAPES

BACKGROUND

Photovoltaic cells are widely used for electricity generation, with one or more photovoltaic cells typically sealed within in a module. Multiple modules may be arranged into photovoltaic arrays used to convert solar energy into electricity by the photovoltaic effect. Arrays can be installed on building rooftops and are used to provide electricity to the buildings and to the general electrical grid.

SUMMARY

Provided are novel building integrable interconnection structures having field-configurable shapes and methods of installing thereof An interconnection structure may be cut or otherwise modified in the field during installation to form one or more openings. These openings can then be positioned around various obstacles that are frequently present in building installation areas. Some examples of such obstacles include chimneys, vents, and skylights. In some embodiments, the interconnection structures can be provided as part of a set or configured to be installed in an array with building integrable photovoltaic (BIPV) modules of the same size. This installation configuration allows preserving an offset between adjacent rows of the array. Furthermore, in some embodiments, the interconnection structures can have the same perimeter features as the BIPV modules, such as electrical connectors and moisture flaps. These features provide electrical continuity and sealing characteristics in an array of BIPV modules despite the presence of obstacles on building structures. In some embodiments, interconnection structures include photovoltaic areas.

In certain embodiments, a building integrable interconnection structure for installation on a building structure in a row with one or more BIPV modules and for electrically connecting to these modules includes a base portion having a first edge and a. second edge, a first electrical connector positioned along the first edge, and a second electrical connector positioned along the second edge. The first edge is opposite to the second edge. The second electrical connector is electrically connected to the first electrical connector or, more specifically, electrical terminals of the two connectors can be interconnected. The base portion of the building integrable interconnection structure is configured to form one or more openings during installation while maintaining the electrical connection between the first electrical connector and the second electrical connector. Furthermore, the building integrable interconnection structure and the BIPV modules may have substantially same size, which preserves an offset between rows in the installed array.

In certain embodiments, at least about 80% of a surface of the base portion is configured to form the one or more openings. One or more edges of the base portion may be configured to overlap with these openings. For example, an obstacle protruding from the building structure may overlap with two building integrable interconnection structures.

The two connectors may be electrically connected by an electrical wire provided adjacent to a back side of the base portion. The electrical wire may be flexible and may be configured to be rerouted in between the one or more openings depending on location and size of the one or more openings determined during installation. In certain embodiments, the back side includes multiple interlocking features for supporting the electrical wire in different positions. The electrical wire may be sufficiently long for routing beyond boundaries of the base portion. The electrical wire may include at least two insulated conductors.

In certain embodiments, a building integrable interconnection structure includes a moisture flap portion attached to a third edge of the base portion and extending substantially parallel to the first edge and the second edge. The building integrable interconnection structure may include multiple mechanical fastener sleeves attached to a back side of the base portion, the multiple mechanical fastener sleeves configured for receiving and retaining mechanical fasteners protruding through the base portion. In these embodiments, the front side of the base portion may include multiple markings corresponding to the multiple mechanical fastener sleeves. The mechanical fastener sleeves may for form channels that, in certain embodiments, may be used for routing an electrical wire between the two connectors. The channels may include interlocking features for supporting the electrical wire within the channels.

In certain embodiments, a building integrable interconnection structure includes one or more photovoltaic cells positioned on a front side of the base portion and in electrical communication with the first electrical connector and the second electrical connector. In these embodiments, the first electrical connector may include two electrical terminals, one of which is not electrically connected to the one or more photovoltaic cells. The photovoltaic cells may occupy between about 25% and 75% of the front side and leave a remaining part of the base portion for forming the one or more openings. In certain embodiments, a voltage output rating of these photovoltaic cells is substantially the same as for the one or more building integrable photovoltaic modules. In other embodiments, the size of each these photovoltaic cells may be substantially the same as in the one or more building integrable photovoltaic modules.

Provided also a building integrable interconnection structure for installing on a building structure in a row with one or more BIPV modules and for electrically connecting to these modules. The building integrable interconnection structure includes a base portion having a first edge and a second edge opposite of each other, a first electrical connector positioned along the first edge, and a second electrical connector positioned along the second edge. The second electrical connector is electrically connected to the first electrical connector. A larger area of the base portion of this building integrable interconnection structure is free from wiring and photovoltaic cells and may be modifiable in the field during installation of the module. In certain embodiments, at least about 75% of the base portion of this building integrable interconnection structure is free from wiring and photovoltaic cells. The building integrable interconnection structure and the one or more building integrable photovoltaic modules have substantially same size.

Provided also a method of installing a photovoltaic array. The method involves installing a first BIPV on a building structure adjacent to an obstacle, determining size and location of the obstacle with respect to that BIPV module, providing a building integrable interconnection structure, forming an opening in the base portion of the building integrable interconnection structure, and installing the building integrable interconnection structure onto the building structure. The building integrable interconnection structure includes a base portion, a first structure connector positioned along one edge of the base portion, and a second structure connector positioned along an opposite edge of the base portion. The first structure connector electrically is connected to the second structure connector. When the opening is formed in the base portion of the building integrable interconnection structure, the first structure connector remains electrically connected to the second structure connector. Furthermore, when the building integrable interconnection structure is installed on the building structure the obstacle is protruding through the opening and establishing an electrical connection between the first structure connector and the first module connector. The first building integratable photovoltaic module and the building integrable interconnection structure forming a row.

In certain embodiments, the method also involves providing a second BIPV module comprising a second module connector and installing the second BIPV module on the building structure in the row and establishing an electrical connection between the second structure connector and the second module connector. In the same or other embodiments, the method may involve selecting the building integrable interconnection structure from a set of building integrable interconnection structures based on size and location of photovoltaic sections on the building integrable interconnection structures in the set. The method may involve positioning a sealing sleeve around the obstacle and in contact with the building integrable interconnection structure and securing the sealing sleeve to the building integrable interconnection structure using one or more mechanical fasteners protruding into corresponding multiple mechanical fastener sleeves of the base portion of the building integrable interconnection structure.

These and other embodiments are described further below with reference to the figures.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic cross-sectional side view of a BIPV module, in accordance with certain embodiments.

FIG. 2 is a schematic top view of a BIPV module, in accordance with certain embodiments.

FIG. 3 illustrates a subset of a photovoltaic array that includes six BIPV modules, in accordance with certain embodiments.

FIG. 4 is a schematic illustration of a photovoltaic array installed on a rooftop of a building structure, in accordance with certain embodiments.

FIG. 5 is a schematic representation of a photovoltaic module having electrically interconnected photovoltaic cells, in accordance with certain embodiments.

FIG. 6 is a schematic electrical diagram of a photovoltaic array having three BIPV modules interconnected in series, in accordance with certain embodiments.

FIG. 7 is a schematic electrical diagram of a photovoltaic array having three BIPV modules interconnected in parallel, in accordance with other embodiments.

FIGS. 8A-8C are schematic cross-sectional views of two connectors configured for interconnection with each other, in accordance with certain embodiments.

FIG. 9A is a schematic perspective view of a building integrable interconnection structure, in accordance with certain embodiments.

FIG. 9B is a schematic illustration of a photovoltaic array positioned on a rooftop of a building having different size obstacles, in accordance with certain embodiments.

FIG. 10 is a schematic illustration of a photovoltaic array portion having a building integrable interconnection structure positioned around a small obstacle and interconnecting adjacent building integrable photovoltaic modules, in accordance with certain embodiments.

FIG. 11 is a schematic illustration of a photovoltaic array portion having three building integrable interconnection structures positioned around a large obstacle and interconnecting various building integrable photovoltaic modules, in accordance with certain embodiments.

FIG. 12A is a schematic bottom view of a building integrable interconnection structure showing multiple mechanical fastener sleeves and a wire routed around these sleeves, in accordance with certain embodiments.

FIG. 12B is a schematic cross-sectional view of a portion of a building integrable interconnection structure showing two mechanical fastener sleeves and a wire routing channel formed by the two sleeves, in accordance with certain embodiments.

FIG. 13A is a schematic front view of a building integrable interconnection structure having photovoltaic cells integrated in a left portion of the structure, in accordance with certain embodiments.

FIG. 13B is a schematic front view of a different building integrable interconnection structure having photovoltaic cells integrated into a top portion of the structure, in accordance with certain embodiments.

FIG. 14 is a flowchart corresponding to a process of installing a photovoltaic array having one or more building integrable interconnection structures, in accordance with certain embodiments.

DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the presented concepts. The presented concepts may be practiced without some or all of these specific details. In other instances, well known process operations have not been described in detail so as to not unnecessarily obscure the described concepts. While some concepts will be described in conjunction with the specific embodiments, it will be understood that these embodiments are not intended to be limiting.

Introduction

Building integrated photovoltaic (BIPV) modules are used for electricity generation and the environmental protection of building structures supporting these modules. BIPV modules may partially or completely replace traditional roofing materials, such as asphalt shingles. However, building structures often have various objects interfering with the installation of BIPV modules. Some examples of these objects include chimneys, vents, and skylights. These objects are typically referred to as obstacles because of their interference with photovoltaic array installation. Unlike traditional roofing materials, BIPV modules cannot be cut or otherwise modified to avoid direct interference with these objects. As such, areas of the building structures containing the objects cannot be covered with BIPV modules resulting in mechanical and electrical discontinuity in the array.

A photovoltaic array typically includes multiple BIPV modules arranged on the same surface of the building structure. All or a subset of modules may be electrically interconnected in series, forming a string. Allocating modules into different strings allows maintaining voltage levels in the array below a predetermined safety threshold (e.g., 600V in the US based on the National Electric Code). Each string is then independently connected to an inverter. In examples described herein, a string has an integrated return pathway that includes multiple bus bars extending through BIPV modules of the string. The bus bars are not directly connected to any cells in these modules. The integrated bus bars can eliminate a need for a separate “return” wire, which needs to be independently connected and routed. A string typically includes a jumper that loops the electrical current from all modules in the string through an integrated return pathway and back to the inverter.

Each string may be designed to have the same operating voltage at an inverter's end, which can mean that each string has the same number of BIPV modules. Electrical connections between BIPV modules in each string form a continuous loop between the inverter's ends. Furthermore, the underlying building structure is protected from the environment, while the array has a complete and continuous aesthetic appearance. When a photovoltaic array is installed on a typical building structure surface containing multiple obstacles, various configurations of BIPV modules can be employed. For example, two adjacent BIPV modules positioned on opposite sides of an obstacle may be electrically connected, with an area in between these two modules sealed. This area has an interface not only with these two BIPV modules but also with BIPV modules in two adjacent rows and with the obstacle. Complex configurations can add to installation costs and may result in a photovoltaic array susceptible to leaks and having poor visual appearance.

Building integrable interconnection structures described herein can facilitate easy and low cost BIPV installation. In some embodiments, an interconnection structure may be used to establish one or more electrical connections between two adjacent BIPV modules positioned in a row with the interconnection structure. Alternatively, an interconnection structure may be an end component in a string and provide one or more electrical connections between a BIPV module and a jumper or an inverter. Furthermore, an interconnection structure can have the same size and/or sealing edge features as corresponding BIPV modules and provides a sealed interface with all adjacent BIPV modules and other components in a manner similar to the BIPV modules. In certain embodiments, an interconnection structure has the same perimeter geometry, interlocking features, construction materials, and/or electrical connectors as corresponding BIPV modules.

At the same time, an interconnection structure may be cut or otherwise modified and reconfigured in the field during installation of the photovoltaic array. During this operation, one or more openings are formed in the structure and are used for protruding obstacles or positioning the structure around obstacles. The positions of these openings are often not known prior to installation of the array. Generally, these positions are identified only after the array is configured and, in certain embodiments, some BIPV modules are installed. As such, openings often have to be made in the field. Since the interconnection structure is positioned around the obstacle, the areas in between adjacent modules in a row, and in between rows, are covered by the structure. Furthermore, the interconnection structure is designed in such a way that forming one or more openings does not interfere with its electrical interconnection characteristics.

Uniform sizing of the building integrable interconnection structures and BIPV modules may allow a predetermined pitch and row spacing in the photovoltaic array to be maintained. This can be important for aesthetic reasons and integrating array components with a building structure's components, such as asphalt shingles. Furthermore, a consistent roof-covering pattern can be important for sealing and environmental protection purposes and overall ease of installation. For example, even pitch and row spacing allow for using electrical routing structures for interconnecting end BIPV modules (or two interconnection structures or one BIPV module and one interconnection structure) at the ends of the two adjacent rows.

To provide a better understanding of various features of BIPV modules and methods of integrating connectors with photovoltaic inserts during module fabrication, some examples of BIPV modules will now be briefly described. FIG. 1 is a schematic cross-sectional end view (line 1---1 in FIG. 2 indicates the position of this cross-section) of a BIPV module 100, in accordance with certain embodiments. BIPV module 100 may have one or more photovoltaic cells 102 that are electrically interconnected. Photovoltaic cells 102 may be interconnected in parallel, in series, or in various combinations of these. Examples of photovoltaic cells include copper indium gallium selenide (CIGS) cells, cadmium-telluride (Cd—Te) cells, amorphous silicon (a-Si) cells, micro-crystalline silicon cells, crystalline silicon (c-Si) cells, gallium arsenide multi junction cells, light adsorbing dye cells, organic polymer cells, and other types of photovoltaic cells.

Photovoltaic cell 102 has a photovoltaic layer that generates a voltage when exposed to sunlight. In certain embodiments, the photovoltaic layer includes a semiconductor junction. The photovoltaic layer may be positioned adjacent to a back conductive layer, which, in certain embodiments, is a thin layer of molybdenum, niobium, copper, and/or silver. Photovoltaic cell 102 may also include a conductive substrate, such as stainless steel foil, titanium foil, copper foil, aluminum foil, or beryllium foil. Another example includes a conductive oxide or metallic deposition over a polymer film, such as polyimide. In certain embodiments, a substrate has a thickness of between about 2 mils and 50 mils (e.g., about 10 mils), with other thicknesses also in the scope. Photovoltaic cell 102 may also include a top conductive layer. This layer typically includes one or more transparent conductive oxides (TCO), such as zinc oxide, aluminum-doped zinc oxide (AZO), indium tin oxide (ITO), and gallium doped zinc oxide. A typical thickness of a top conductive layer is between about 100 nanometers to 1,000 nanometers (for example, between about 200 nanometers and 800 nanometers), with other thicknesses within the scope.

In certain embodiments, photovoltaic cells 102 are interconnected using one or more current collectors (not shown). The current collector may be attached and configured to collect electrical currents from the top conductive layer. The current collector may also provide electrical connections to adjacent cells as further described with reference to of FIG. 5, below. The current collector includes a conductive component (e.g., an electrical trace or wire) that contacts the top conductive layer (e.g., a TCO layer). The current collector may further include a top carrier film and/or a bottom carrier film, which may be made from transparent insulating materials to prevent electrical shorts with other elements of the cell and/or module. In certain embodiments, a bus bar is attached directly to the substrate of a photovoltaic cell. A bus bar may also be attached directly to the conductive component of the current collector. For example, a set of photovoltaic cells may be electrically interconnected in series with multiple current collectors (or other interconnecting wires). One bus bar may be connected to a substrate of a cell at one end of this set, while another bus bar may be connected to a current collector at another end.

Photovoltaic cells 102 may be electrically and environmentally insulated between a front sheet 104 (i.e., the light incident sheet) and a back sheet 106 (i.e., the building structure facing sheet), which may be referred to as sealing sheets. Examples of such sheets include glass, polyethylene, polyethylene terephthalate (PET), polypropylene, polybutylene, polybutylene terephthalate (PBT), polyphenylene oxide (PPO), polyphenylene sulfide (PPS) polystyrene, polycarbonates (PC), ethylene-vinyl acetate (EVA), fluoropolymers (e.g., polyvinyl fluoride (PVF), polyvinylidene fluoride (PVDF), ethylene-terafluoethylene (ETFE), fluorinated ethylene-propylene (FEP), perfluoroalkoxy (PFA) and polychlorotrifluoroethane (PCTFE)), acrylics (e.g., poly(methyl methacrylate)), silicones (e.g., silicone polyesters), and/or polyvinyl chloride (PVC), as well as multilayer laminates and co-extrusions of these materials. A typical thickness of a sealing sheet is between about 5 mils and 100 mils or, more specifically, between about 10 mils and 50 mils. In certain embodiments, a back sheet includes a metallized layer to improve water permeability characteristics of the sheet. For example, a metal foil may be positioned in between two insulating layers to form a composite back sheet. In certain embodiments, a module has an encapsulant layer positioned between one or both sheets 104, 106 and photovoltaic cells 102. Examples of encapsulant layer materials include non-olefin thermoplastic polymers or thermal polymer olefin (TPO), such as polyethylene (e.g., a linear low density polyethylene), polypropylene, polybutylene, polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polystyrene, polycarbonates, fluoropolymers, acrylics, ionomers, silicones, and combinations thereof.

BIPV module 100 may also include an edge seal 105 that surrounds photovoltaic cells 102. Edge seal 105 may be used to secure front sheet 104 to back sheet 106 and/or to prevent moisture from penetrating in between these two sheets. Edge seal 105 may be made from certain organic or inorganic materials that have low inherent water vapor transmission rates (WVTR) (e.g., typically less than 1-2 g/m²/day). In certain embodiments, edge seal 105 is configured to absorb moisture from inside the module in addition to preventing moisture ingression into the module. For example, a butyl-rubber containing moisture getter or desiccant may be added to edge seal 105. In certain embodiments, a portion of edge seal 105 that contacts electrical components (e.g., bus bars) of BIPV module 100 is made from a thermally resistant polymeric material. Various examples of thermally resistant materials and RTI ratings are further described below.

BIPV module 100 may also have a support sheet 108 attached to back sheet 106. The attachment may be provided by a support edge 109, which, in certain embodiments, is a part of support sheet 108, Support sheets may be made, for example, from rigid polymer materials such as polyethylene terephthalate (e.g., RYNITE® available from Du Pont in Wilmington, Del.), polybutylene terephthalate (e.g., CRASTIN® also available from Du Pont), polyphenylene sulfide (e.g., RYTON® available from Chevron Phillips in The Woodlands, Tex.), polyamide (e.g., ZYTEL® available from DuPont), polycarbonate, and polypropylene. In other embodiments, support sheet 108 may be attached to back sheet 106 without a separate support edge 109 or other separate supporting element. For example, support sheet 108 and back sheet 106 may be laminated together, or support sheet 108 may be formed (e.g., by injection molding) over back sheet 106. In other embodiments, back sheet 106 serves as a support sheet 108. In this case, the same element used to seal photovoltaic cells 102 may be positioned over and contact a roof structure (not shown). Support sheet 108 may have one or more ventilation channels 110 to allow for air to flow between BIPV module 100 and a building surface (e.g., a roof-deck or a water resistant underlayment/membrane on top of the roof deck). Ventilation channels 110 may be used for cooling BIPV module 100 during its operation. For example, it has been found that each 1° C. of heating from an optimal operating temperature of a typical Copper indium gallium (di)selenide CIGS cell causes an efficiency loss of about 0.33% to 0.5%.

BIPV module 100 has one or more electrical connectors 112 for electrically connecting BIPV module 100 to other BIPV modules and array components, such as an inverter and/or a battery pack. In certain embodiments, BIPV module 100 has two electrical connectors 112 positioned on opposite sides (e.g., the short or minor sides of a rectangular module) of BIPV module 100, as shown in FIGS. 1 and 2, for example. However, connectors may also be positioned on other sides as well (e.g., the long or major sides of a rectangular module). Connector position may depend on the overall arrangement of the module and/or installation and repair requirements. Each one of two electrical connectors 112 has at least one conductive element electrically connected to photovoltaic cells 102. In certain embodiments, electrical connectors 112 have additional conductive elements, which may or may not be directly connected to photovoltaic cells 102. For example, each of two electrical connectors 112 may have two conductive elements, one of which is electrically connected to photovoltaic cells 102, while the other is electrically connected to a bus bar (not shown) passing through BIPV module 100. This and other examples are described in more detail in the context of FIGS. 6 and 7. In general, regardless of the number of connectors 112 attached to BIPV module 100, at least two conductive elements of these connectors 112 are electrically connected to photovoltaic cells 102.

FIG. 2 is a schematic top view of BIPV module 100, in accordance with certain embodiments. Support sheet 108 is shown to have a side skirt 204 and a flap portion 206 extending beyond a photovoltaic portion 202 of BIPV module 100. Side skirt 204 is sometimes referred to as a side flap, while flap portion 206 is sometimes referred to as a top lap or a moisture flap. In certain embodiments, BIPV module 100 does not include side skirt 204. Photovoltaic portion 202 is defined as an area of BIPV module 100 that does not extend under other BIPV modules or similar building materials (e.g., roofing shingles) after installation. Photovoltaic portion 202 includes photovoltaic cells 102. Generally, it is desirable to maximize the ratio of the exposed area of photovoltaic cells 102 to photovoltaic portion 202 in order to maximize the “working area” of BIPV module 100. It should be noted that, after installation, flaps of other BIPV modules typically extend under photovoltaic portion 202. In a similar manner, after installation, side skirt 204 of BIPV module 100 may extend underneath another BIPV module positioned on the left (in the same row) of BIPV module 100, thereby creating an overlap for moisture sealing. Flap portion 206 may extend underneath one or more BIPV modules positioned above BIPV module 100. Arrangements of BIPV modules in an array will now be described in more detail with reference to FIGS. 3 and 4.

FIG. 3 illustrates a photovoltaic array 300 or, more specifically, a portion of a photovoltaic array, which includes six BIPV modules 100a-100f arranged in three different rows extending along horizontal rooflines, in accordance with certain embodiments. Installation of BIPV modules 100a-100f generally starts from a bottom roofline 302 so that the top flaps of BIPV modules 100a-100f can be overlapped with another row of BIPV modules. If a side flap is used, then the position of the side flap (i.e., a left flap or a right flap) determines which bottom corner should be the starting corner for the installation of the array. For example, if a BIPV module has a top flap and a right-side flap, then installation may start from the bottom left corner of the roof or of the photovoltaic array. Another BIPV module installed later in the same row and on the right of the initial BIPV module will overlap the side flap of the initial BIPV module. Furthermore, one or more BIPV modules installed in a row above will overlap the top flap of the initial BIPV module. This overlap of a BIPV module with a flap of another BIPV module creates a moisture barrier.

FIG. 4 is a schematic illustration of a photovoltaic array 400 installed on a rooftop 402 of a building structure 404 for protecting building structure 404 from the environment as well as producing electricity, in accordance with certain embodiments. Multiple BIPV modules 100 are shown to fully cover one side of rooftop 402 (e.g., a south side or the side that receives the most sun). In other embodiments, multiple sides of rooftop 402 are used for a photovoltaic array. Furthermore, some portions of rooftop 402 may be covered with conventional roofing materials (e.g., asphalt shingles). As such, BIPV modules 100 may also be used in combination with other roofing materials (e.g., asphalt shingles) and cover only a portion of rooftop. Generally, BIPV modules 100 may be used on steep sloped to low slope rooftops. For example, the rooftops may have a slope of at least about 2.5-to-12 or, in many embodiments, at least about 3-to-12.

Multiple BIPV modules 100 may be interconnected in series and/or in parallel with each other. For example, photovoltaic array 400 may have sets of BIPV modules 100 interconnected in series with each other (i.e., electrical connections among multiple photovoltaic modules within one set), while these sets are interconnected in parallel with each other (i.e., electrical connections among multiple sets in one array). Photovoltaic array 400 may be used to supply electricity to building structure 404 and/or to an electrical grid. In certain embodiments, photovoltaic array 400 includes an inverter 406 and/or a battery pack 408. Inverter 406 is used for converting a direct current (DC) generated by BIPV modules 100 into an alternating current (AC). Inverter 406 may be also configured to adjust a voltage provided by BIPV modules 100 or sets of BIPV modules 100 to a level that can be utilized by building structure 404 or by a power grid. In certain embodiments, inverter 406 is rated up to 600 volts DC input or even up to 1000 volts DC, and/or up to 10 kW power. Examples of inverters include a photovoltaic static inverter (e.g., BWT10240—Gridtec 10, available from Trace Technologies in Livermore, Calif.) and a string inverter (e.g. Sunny Boy RTM.2500 available from SMA America in Grass Valley, Calif.). In certain embodiments, BIPV modules 100 may include integrated inverters (i.e., “on module” inverters). These inverters may be used in addition to or instead of external inverters. Battery pack 408 is used to balance electric power output and consumption.

FIG. 5 is a schematic representation of a photovoltaic module insert 500 illustrating photovoltaic cells 504 electrically interconnected in series using interconnecting wires 506, in accordance with certain embodiments. Often individual cells 504 do not provide an adequate output voltage. For example, a typical voltage output of an individual CIGS cell is only between 0.4V and 0.7V. To increase voltage output, photovoltaic cells 504 may be electrically interconnected in series (for example, as shown in FIG. 5) and/or include “on module” inverters (not shown). Interconnecting wires 506 may also be used to provide uniform current distribution and collection from one or both contact layers.

As shown in FIG. 5, each pair of photovoltaic cells 504 has one interconnecting wire positioned in between the two cells and extending over a front side of one cell and over a back side of the adjacent cell. For example, a top interconnecting wire 506 in FIG. 5 extends over the front light-incident side of cell 504 and under the back side of the adjacent cell. In the figure, the interconnecting wires 506 also collect current from the TCO layer and provide uniform current distribution, and may be referred to herein as current collectors. In other embodiments, separate components are used for current collection and cell-to-cell interconnection. End cell 513 has a current collector 514 that is positioned over the light incident side of cell 513 but does not connect to another cell. Current collector 514 connects cell 513 to a bus bar 510. Another bus bar 508 may be connected directly to the substrate of the cell 504 (i.e., the back side of cell 504). In another embodiment, a bus bar may be welded to a wire or other component underlying the substrate. In the configuration shown in FIG. 5, a voltage between bus bars 508 and 510 equals a sum of all cell voltages in insert 500. Another bus bar 512 passes through insert 500 without making direct electrical connections to any photovoltaic cells 504. This bus bar 512 may be used for electrically interconnecting this insert in series without other inserts, as further described below with reference to FIG. 6. Similar current collectors/interconnecting wires may be used to interconnect individual cells or set of cells in parallel (not shown).

BIPV modules themselves may be interconnected in series to increase a voltage of a subset of modules or even an entire array. FIG. 6 illustrates a schematic electrical diagram of a photovoltaic array 600 having three BIPV modules 602a-602c interconnected in series using module connectors 605a, 605b, and 606, in accordance with certain embodiments. A voltage output of this three-module array 600 is a sum of the voltage outputs of the three modules 602a-602c. Each module connector 605a and 605b shown in FIG. 6 may be a combination of two module connectors of BIPV modules 602a-602c. These embodiments are further described with reference to FIGS. 8A-8C. In other words, there may be no separate components electrically interconnecting two adjacent BIPV modules, with the connection instead established by engaging two connectors installed on the two respective modules. In other embodiments, separate connector components (i.e., not integrated into or installed on BIPV modules) may be used for connecting module connectors of two adjacent modules.

Module connector 606 may be a special separate connector component that is connected to one module only. It may be used to electrically interconnect two or more conductive elements of the same module connector (e.g., to close an electrical loop in a series of connections).

Sometimes BIPV modules may need to be electrically interconnected in parallel. FIG. 7 illustrates a schematic electrical diagram of a photovoltaic array 700 having three BIPV modules 702a-702c interconnected in parallel using module connectors 705a and 705b, in accordance with certain embodiments. Each module may have two bus bars extending through the module (i.e., a “top” bus bar 711 and a “bottom” bus bar 713, as shown in FIG. 7). Top bus bars 711 of each module are connected to right electrical leads 704a, 704b, and 704c of the modules, while bottom bus bars 713 are connected to left electrical leads 703a, 703b, and 703c. A voltage between the top bus bars 711 and bottom bus bars 713 is therefore the same along the entire row of BIPV modules 702a-702c.

FIG. 8A is a schematic cross-sectional side view of two connectors 800 and 815 configured for interconnection with each other, in accordance with certain embodiments. For simplicity, the two connectors are referred to as a female connector 800 and a male connector 815. Each of the two connectors 800 and 815 is shown attached to its own photovoltaic insert, which includes photovoltaic cells 802 and one or more sheets 804. Connectors 800 and 815 include conductive elements 808b and 818b, respectively, which are shown to be electrically connected to photovoltaic cells 802 using bus bars 806 and 816, respectively.

In certain embodiments, a conductive element of one connector (e.g., conductive element 808b of female connector 800) is shaped like a socket/cavity and configured for receiving and tight fitting a corresponding conductive element of another connector (e.g., conductive element 818b of male connector 815). Specifically, conductive element 808b is shown forming a cavity 809b. This tight fitting and contact in turn establishes an electrical connection between the two conductive elements 808b and 818b. Accordingly, conductive element 818b of male connector 815 may be shaped like a pin (e.g., a round pin or a flat rectangular pin). A socket and/or a pin may have protrusions (not shown) extending towards each other (e.g., spring loaded tabs) to further minimize the electrical contact resistance by increasing the overall contact area. In addition, the contacts may be fluted to increase the likelihood of good electrical contact at multiple points (e.g., the flutes guarantee at least as many hot spot asperities of current flow as there are flutes).

In certain embodiments, connectors do not have a cavity-pin design as shown in FIGS. 8A-8C. Instead, an electrical connection may be established when two substantially flat surfaces contact each other. Conductive elements may be substantially flat or have some topography designed to increase a contact surface over the same projection boundary and/or to increase contact force at least in some areas. Examples of such surface topography features include multiple pin-type or rib-type elevations or recesses.

In certain embodiments, one or more connectors attached to a BIPV module have a “touch free” design, which means that an installer can not accidently touch conductive elements or any other electrical elements of these connectors during handling of the BIPV module. For example, conductive elements may be positioned inside relatively narrow cavities. The openings of these cavities are too small for a finger to accidently come in to contact with the conductive elements inside the cavities. One such example is shown in FIG. 8A where male connector 815 has a cavity 819b formed by connector body 820 around its conductive pin 818b. While cavity 819b may be sufficiently small to ensure a “touch free” designed as explained above, it is still large enough to accommodate a portion of connector body 810 of female connector 800. In certain embodiments, connector bodies 810 and 820 have interlocking features (not shown) that are configured to keep the two connectors 800 and 815 connected and prevent connector body 810 from sliding outs of cavity 819b. Examples of interlocking features include latches, threads, and various recess-protrusion combinations.

FIG. 8B is schematic plan view of female connector 800 and male connector 815, in accordance with certain embodiments. Each of the connectors 800 and 815 is shown with two conductive elements, i.e., conductive elements 808a and 808b formed as sockets in connector 800 and conductive elements 818a and 818b formed as pins in connector 815. One conductive element of each connector is shown to be electrically connected to photovoltaic cells 802. Another conductive element of each of the two connectors 800 and 815 may be connected to bus bars (e.g., bus bars 809 and 819) that do not have an immediate electrical connection to photovoltaic cells 802 of their respective BIPV module (the extended electrical connection may exist by virtue of a complete electrical circuit).

As shown, conductive elements 808a and 808b may have their own designated inner seals 812a and 812b. Inner seals 812a and 812b are designed to provide more immediate protection to conductive elements 808a and 818a after connecting the two connectors 800, 815. As such, inner seals 812a and 812b are positioned near inner cavities of conductive elements 808a and 808b. The profile and dimensions of pins 818a and 818b closely correspond to that of inner seals 812a and 812b. In the same or other embodiments, connectors 800, 815 have external seals 822a and 822b. External seals 822a and 822b may be used in addition to or instead of inner seals 812a and 812b. Various examples of seal materials and fabrication methods are described below in the context of FIG. 9. FIG. 8C is schematic front view of female connector 800 and male connector 815, in accordance with certain embodiments. Connector pins 818a and 818b are shown to have round profiles. However, other profiles (e.g., square, rectangular) may also be used for pins 818a and 818b and conductive elements 808a and 808b.

BIPV Modules Connected with Building Integrable Interconnection Structures

As explained above, building integrable interconnection structures have field-configurable shapes and may be cut during installation. Furthermore, such interconnection structures may provide electrical connections between adjacent BIPV modules and/or other structures positioned in the same row of a photovoltaic array. FIG. 9A is a schematic perspective view of a building integrable interconnection structure 910, in accordance with certain embodiments. Interconnection structure 910 includes a base portion 914 having a first edge 918a and a second edge 918b. As shown in FIG. 9A, first edge 918a is opposite to second edge 918b with respect to the X direction. Interconnection structure 910 includes two electrical connectors electrically interconnected with each other. Specifically, interconnection structure 910 has a first electrical connector 916a positioned along first edge 918a and a second electrical connector 916b positioned along second edge 918b. Connectors 916a and 916b may be positioned within flap portion 912, within base portion 914, or at the interface of the two portions. Interconnection structure 910 may also include a moisture flap portion 912 attached to a third edge 920 of base portion 914. Moisture flap is sometimes referred to as a top lap. Moisture flap portion 912 may extend away from base portion 914 in the Z direction, which is substantially parallel to first edge 918a and second edge 918b of base portion 914. The function of moisture flap portion 912 of interconnection structure 910 is similar to those of BIPV modules described above.

Interconnection structure 910 has substantially the same size as BIPV modules in order to allow undisrupted integration of interconnection structure 910 into a photovoltaic array. In certain embodiments, base portion 914 of interconnection structure 910 has substantially the same size as photovoltaic portions of BIPV modules. Likewise, moisture flap portion 912 of interconnection structure 910 may have substantially the same size as moisture flap portions of BIPV modules. In some ways, interconnection structure 910 may be compared to a BIPV module that is missing photovoltaic cells in a part of or its entire photovoltaic portion. When interconnection structure 910 does not have any photovoltaic cells, then corresponding electrical leads of first electrical connector 916a and second electrical connector 916b are interconnected with each other. In some embodiments, interconnection structure 910 may have one or more photovoltaic cells positioned in its base portion 914, while at least some part of base portion 914 remains free from photovoltaic cells, as for example shown in FIGS. 13A and 13B. In these embodiments, the electrical leads of first electrical connector 916a and second electrical connector 916b can be connected to the one or more photovoltaic cells in a manner similar to BIPV modules.

However, unlike BIPV modules, at least a part of base portion 914 of interconnection structure 910 remains free from photovoltaic cells. In certain embodiments, interconnection structure 910 does not have any photovoltaic cells, and the entire base portion 914 is free from photovoltaic cells. Being free from photovoltaic cells, partially or completely, allows modifying base portion 914 in the field, for example, during installation when size and location of obstacles are known. In certain embodiments, moisture flap portion 912 is also modified. In certain embodiments, base portion 914 is configured to form one or more openings during installation of structure 910. These openings may also extend into moisture flap portion 912 and/or overlap with one or more edges of base portion 914. These openings can be used to protrude obstacles through the structure and/or to position the interconnection structure around the obstacles.

Forming these openings does not interfere with electrical connections between first electrical connector 916a and second electrical connector 916b. As such, electrical connections between the connectors are maintained during and after formation of the openings. In certain embodiments, first electrical connector 916a and second electrical connector 916b are connected using a flexible wire that may be rerouted in between the openings during installation of interconnection structure 910 depending on location and size of these openings. Since interconnection structure 910 is used for connecting adjacent BIPV modules and/or other electrical components, a continuous and uniform array may be formed on the building structure despite presence of various obstacles extending from its surface. Furthermore, such an array is formed regardless of location and size of obstacles. Various features of building integrable interconnection structure 910 will now be explained in more detail.

FIG. 9B is a schematic illustration of a photovoltaic array 900 of BIPV modules 902 positioned on a rooftop of a building structure 901, in accordance with certain embodiments. The rooftop has multiple obstacles 904a-904d that may be conceptually divided into obstacles that extend across multiple rows of BIPV modules 902 and obstacles constrained within one row of BIPV modules 902. In many embodiments, larger obstacle (e.g., chimneys or skylights) extends across multiple rows, with smaller obstacles (e.g., vents, wire feeds, or antenna posts) constrained within one row. However, even relatively small objects may be positioned at the interface of two rows and/or interface with two modules in the same row. In certain embodiments, BIPV modules 902 may interface with asphalt shingles (not shown) positioned, for example, along the rooftop edges. These shingles may be prescribed by the fire code and provide walkways with sufficient friction. BIPV modules 902 interface with building integrable interconnection structures 903. Structures 903 are cut to avoid interference with obstacles 904a-904d.

Electrical connections, wire routing, and certain other features of a photovoltaic array can be provided in part by interconnection structures as will now be explained with reference to FIGS. 10 and 11. Specifically, FIG. 10 is a schematic illustration of an array portion 1000 having an interconnection structure 1004 positioned around an obstacle 1006 and interconnecting two adjacent BIPV modules 1002d and 1002e, in accordance with certain embodiments. Two adjacent rows of BIPV modules 1002a-1002c and 1002f-1002h do not interface with any obstacles. These BIPV modules may be directly interconnected using their connectors and, in certain embodiments, connector joiners (not shown). The middle row containing BIPV modules 1002d and 1002e has obstacle 1006, which prevents positioning another BIPV module in this location (i.e., in between modules 1002d and 1002e). To maintain a constant pitch, the space between modules 1002d and 1002e is the same as the spaces between BIPV modules 1002a and 1002c and between modules 1002f and 1002h. Instead of a BIPV module, a building integrable interconnection structure 1004 is positioned in this space. Prior to installation of interconnection structure 1004, a location and size of obstacle 1006 is identified with respect to other BIPV modules (e.g., with respect to module 1002d if this row is installed from left to right). Then a cutout is made in the base portion of interconnection structure 1004 to accommodate obstacle 1006, for example, by allowing obstacle 1006 to protrude through the cutout.

Perimeter features of interconnection structure 1004 may be substantially the same as ones provided on BIPV modules 1002a-1002h. For example, left and right edges of interconnection structure 1004 and BIPV modules 1002a-1002h may have connectors for forming electrical connectors with each other. In some embodiments, for example, each connector may have two electrical leads, for example, leads 1008a and 1010a on the left connector of module 1002a. One lead may be attached to a bus bar, while another lead may be attached to a set of interconnected photovoltaic cells. The bus bar may extend through the BIPV module without making direct electrical connections to the cells. the context of interconnection structure 1004, both leads of a connector may be attached to a wire having two insulated conductors. Another end of the wire is connected to a second electrical connector on the opposite end. Various examples of wires and wire routing are described above.

An interconnection structure can include various sealing features. For example, interconnection structure 1004 may include a moisture flap (not shown) extending under BIPV modules 1002a and 1002b for seating an interface between BIPV modules 1002a and 1002b. The same moisture flap can also seal an interface between BIPV module 1002a and interconnection structure 1004 and an interface between BIPV module 1002b and interconnection structure 1004. Interfaces between interconnection structure 1004 and BIPV modules 1002f and 1002g in an adjacent row may be sealed by the moisture flaps of these modules. Finally, an interface between interconnection structure 1004 and obstacle 1006 may be sealed by using separate seals.

FIG. 11 is a schematic illustration of another array portion 1100 having three building integrable interconnection structures 1104a-1104c positioned around an obstacle 1106, in accordance with certain embodiments. Obstacle 1106 extends over two rows of BIPV modules i.e., the second-from-top row containing module 1102d and the third-from-top row containing modules 1102e and 1102f). Furthermore, the position and size of obstacle 1106 with respect to the second-from-top row is such that it would have interfered with two adjacent BIPV modules in this row. As such, obstacle 1106 is surrounded by three interconnection structures 1104a-1104c. Specifically, a bottom right corner of interconnection structure 1104a is cut to accommodate this obstacle. Similarly, a bottom left corner of interconnection structure 1104b is cut for the same purpose. Wires of these interconnection structures may be routed in their top portions (e.g., around an interface with the moisture flap portion). Furthermore, obstacle 1106 can overlaps with a large part of the base portion and moisture flap portion (the moisture flap portions are not visible in FIG. 11). The wire of interconnection structure 1104b can be routed along its bottom edge. As further explained below, wires of interconnection structures may be rerouted from one area to another area depending on location and size of obstacles.

In some embodiments, interconnection structure 1104a may be an end structure in that row (i.e., there may be no more BIPV modules or interconnection structures to the left of interconnection structure 1104a). This end interconnection structure may be connected to a module in an adjacent row (e.g., module 1102a or 1102b or both), to an inverter, or to a jumper to complete a string as explained below.

Building Integrable Interconnection Structure Examples

Additional features of building integrable interconnection structures will now be explained with reference to FIGS. 12A and 1213. Specifically, FIG. 12A is a schematic bottom view of a building integrable interconnection structure 1200 showing multiple mechanical fastener sleeves 1204 positioned on a back side of base portion 1202, in accordance with certain embodiments. Mechanical fastener sleeves 1204 may be evenly spaced in both directions (i.e., the Z direction and X direction) and cover an entire back side of building integrable interconnection structure 1200. In some embodiments, for example, mechanical fastener sleeves 1204 may be arranged into rectangular or other uniform patterns. In some embodiments, adjacent rows of fastener sleeves may form channels. As discussed further below with respect to FIG. 12B, the channels may be used for ventilation of the back side and/or for routing an electrical wire 1206 connecting two electrical connectors 1208a and 1208b. When no photovoltaic cells are present in a building integrable interconnection structure, electrical wire 1206 may function as one or more bus bars between two electrical connectors 1208a and 1208b. An array of fastener sleeves covering the entire back side of a base portion (or an entire back side of a portion available for accommodating an obstacle) provide flexibility in wire routing and sealing structure positioning.

Mechanical fastener sleeves 1204 are configured to receive mechanical fasteners, such as nails and screws, for supporting various components positioned over a front surface of building integrable interconnection structure 1200. For example, an interface between an obstacle and building integrable interconnection structure 1200 may he sealed using a mechanical fastener sleeve 1204 that is formed around the obstacle. The mechanical fastener sleeve 1204 can be attached to, and supported with respect to, the front side of building integrable interconnection structure 1200 to maintain the seal.

Electrical connectors 1208a and 1208b may be positioned at any location along the two respective edges 1209a and 1209b of building integrable interconnection structure 1200. In certain embodiments, electrical connectors 1208a and 1208b are positioned at an interface of the base portion and moisture flap portion or positioned within the boundaries of one of these portions. A moisture flap portion is discussed above with reference to FIG. 9A. Electrical connectors 1208a and 1208b may be recessed into boundaries of building integrable interconnection structure 1200 such that they are protected at least from direct ultraviolet exposure by other components of building integrable interconnection structure 1200 (e.g., its base portion).

In some embodiments, an electrical wire 1206 that extends between electrical connectors 1208a and 1208b is sufficiently long to allow different routing schemes. This routing flexibility allows for avoiding interference with the one or more openings that may be formed substantially anywhere in the base and/or moisture flap portions. For example, FIG. 12A illustrates electrical wire 1206 routed along the bottom edge of the base portion 1202. This routing configuration may be suitable if an opening does not extend into this area of the base portion (as, e.g., in interconnection structure 1004 in FIG. 10 or interconnection structure 1104c in FIG. 11). However, when an opening needs to be formed in this area (as, for example, in interconnection structures 1104a and 1104b in FIG. 11), electrical wire 1206 can be moved into other areas of building integrable interconnection structure 1200, such as to the top edge of the base portion 1202.

The length of electrical wire 1206 allows for this routing flexibility. In certain embodiments, the length of the wire is at least about 50% of the perimeter of the base portion or, more specifically, at least about 75% or even at least about 100%. Electrical wire 1206 may be routed both under a base portion and under a moisture flap portion and even under another adjacent structure and/or module. Rerouting electrical wire 1206 may be performed without disconnecting it from electrical connectors 1208a and 1208b. Furthermore, electrical wire 1206 may be supported with respect to the back side and avoid “dangling” when building integrable interconnection structure 1200 is handled and installed using various retaining features. In certain embodiments further described below with reference to FIG. 12B, mechanical fastener sleeves 1204 provide retaining capabilities. However, a back side may include separate retaining features even when mechanical fastener sleeves 1204 are not provided.

FIG. 12B is a schematic cross-sectional view of a portion of building integrable interconnection structure 1210 illustrating two adjacent mechanical fastener sleeves 1212a and 1212b, in accordance with certain embodiments. Mechanical fastener sleeves 1212a and 1212b extend from and may be attached to the back side 1213 of the interconnection structure 1210. The mechanical fastener sleeves 1212a and 1212b extend from back side 1213 in the direction opposite of the Y direction, They have hollow portions 1214a and 1214b for receiving mechanical fasteners. The cross-sectional dimensions of hollow portions 1214a and 1214b (i.e., in the X-Z plane) correspond to the size of the mechanical fasteners. The cross-section of hollow portions 1214a and 1214b may be round or square. Hollow portions 1214a and 1214b prevent excessive mechanical stresses and cracking in interconnection structure 1210 when mechanical fasteners protrude through front side 1211 of interconnection structure 1210.

Hollow portions 1214a and 1214b are enclosed at least at their interface with front side 1211 by providing a “barrier” as shown in FIG. 12B. This barrier prevents moisture from getting into hollow portions 1214a and 1214b unless the barrier is penetrated with a mechanical fastener. A thickness of the barrier may smaller than a thickness of the base portion. This allows mechanical fasteners to easily protrude into hollow portions 1214a and 1214b from the front side 1211 and prevents excessive stresses. Once mechanical fasteners protrude into hollow portions 1214a and 1214b, the seal may be provided by the right fit between mechanical fastener sleeves 1212a and 1212b and mechanical fasteners. Additional sealing features may be positioned over this interface. In certain embodiments, hollow portions 1214a and 1214b are tapered.

To ensure that mechanical fastener sleeves 1212a and 1212b or, more specifically, hollow portions 1214a and 1214b, can be located during installation, front side 1211 may include markings 1220 corresponding to mechanical fastener sleeves 1212a and 1212b Markings 1220 may include some mold features (e.g., indents used for positioning a tip of the fastener during installation), printing features, and other similar features.

As described above, two adjacent rows of mechanical fastener sleeves 1212a and 1212b may be a channel 1216 in between the rows. Such channels may extend in the Z and/or X directions and be used for ventilation and/or routing the electrical wire. The width can be such to ensure adequate fitting of a wire into a channel and to allow turning a wire from one channel into another. As such, these dimensions can depend on the size of the wire and its stiffness. In certain embodiments, a wire includes two insulated conductors, which are sufficiently large to support current generated by the string. The insulation can be rated for photovoltaic application and voltages used in a string.

Channel 1216 may include one or more retaining features 1218 configured for supporting a wire during handling and installation of interconnection structure 1210. Retaining features 1218 may allow for removal of the wire from channel 1216 for rerouting in different channels. In certain embodiments, the wire may be equipped with “mating” features that correspond to retaining features 1218 and may be provided as sleeves around the wire.

Building Integrable Interconnection Structures having Photovoltaic Cells

While building integrable interconnection structures are field configurable, and portions of these structures are cut in the field to form one or more openings, the remaining portions are intact. In certain embodiments, these remaining portions may support photovoltaic cells on their front surfaces to provide additional power output from this string. For example, a typical vent used on rooftops is only about 2-3 inches in diameter, while base portions or exposed portions of BIPV modules and interconnection structures are about 36 inches in length and 12 inches in width. Accordingly, a large exposed portion of the interconnection structure may remain unaffected when the structure is positioned around the vent, even taking into account all sealing features that may be provided around the vent. However, exact boundaries of the unaffected portion may be hard or impossible to predict. Boundary locations can depend on a starting point of an array and other considerations, which are often hard to predict or control. In some embodiments, different interconnection structures having photovoltaic cells in different respective locations are provided. Two such examples are presented in FIGS. 13A and 13B. These different interconnection structures provide flexibility in array installation, while allowing efficient use of non-obstructed areas of a building structure.

FIG. 13A is a schematic front view of a building integrable interconnection structure 1300 having photovoltaic cells 1304 integrated into a left portion 1306 of structure 1300, in accordance with certain embodiments. Remaining portion 1308 may still be used for accommodating an obstacle. Likewise, an interconnection structure may be designed with a photovoltaic cells integrated into the right portion, middle portion, two end portions, or the like. FIG. 13B is a schematic front view of a building integrable interconnection structure 1320 having photovoltaic cells 1324 integrated into a top portion 1326 of structure 1320, in accordance with different embodiments. Remaining portion 1328 is usable for accommodating an obstacle. Various positions and sizes of photovoltaic portions along the X and Z directions are possible. In certain embodiments, a photovoltaic portion is movable with respect to the remaining components of interconnection structure 1300 and may be repositioned in the field based on the location and size of obstacles.

Photovoltaic portions of such building integrable interconnection structures can be smaller than that of corresponding BIPV modules in an array to provide at least some portions that can be cut and sealed. In certain embodiments, a photovoltaic portion of an interconnection structure is between about 25% and 75% of the overall exposed front side area (i.e., an area not including various flaps configured for extending under adjacent modules and interconnection structures). In some embodiments, this ratio is less than 50% or even less than 25%.

Because photovoltaic portions of building integrable interconnection structures are smaller, their power output is also smaller. The power output is typically proportional to the photovoltaic surface area. Depending on the configuration of photovoltaic cells, this power loss may be attributed to lower voltage, lower current, or both lower voltage and lower current. Typically, photovoltaic cells may be all interconnected in series in a module or interconnection structure. When interconnection structures are equipped with cells of the same size as in corresponding BIPV modules, the interconnection structures generally produce the same current output but at a lower voltage. This example is based on photovoltaic cells interconnected in series within BIPV modules and interconnection structures. As a result, a string assembled with one such interconnection structure may have a lower voltage output than a similar string that has a BIPV module in place of the interconnection structure. In some embodiments, the voltage disbalance may be compensated by an inverter or by using multiple interconnection structures instead of one BIPV module.

Alternatively, interconnection structures may be equipped with the same number of photovoltaic cells as corresponding BIPV modules, with the size of these cells is proportionally smaller than that in the BIPV modules. Such interconnection structures will produce the same voltage but at proportionally lower currents. However, when BIPV modules and such interconnection structures are connected in series (e.g., in a string), each smaller cell of these structures will have to conduct the same current as the larger cells of the BIPV modules. This may create a higher risk of developing shunts.

Installation Process Examples

FIG. 14 is a flowchart corresponding to a process 1400 for installing a photovoltaic array having one or more building integrable interconnection structures, in accordance with certain embodiments. Process 1400 may start with installing a first BIPV module on a building structure in an optional operation 1402. This BIPV module may be attached to a building structure using nails, screws, staples, or some other mechanical fasteners. During installation, the BIPV module may be electrically connected to one or more BIPV modules or interconnection structures positioned in the same row or other rows (e.g., adjacent rows). Alternatively, the BIPV module may be the first module in an electrical string and be connected to a jumper or inverter. The BIPV module has at least one other connector for connecting to an interconnection structure (provided in a later operation). In certain embodiments, an interconnection structure is a first component installed in a row, a string, or even an entire photovoltaic array and operation 1402 is skipped. In these embodiments, process 1400 starts with operation 1404.

During operation 1404, a size and location of the obstacle with respect to an area to be covered with the interconnection structure is determined. This information will be used for making one or more openings in the interconnection structure to avoid interference with the obstacle. An edge of the previously installed BIPV modules or some other components of the array may be used as a reference.

Process 1400 continues with providing a building integrable interconnection structure in operation 1406. Various examples of such interconnection structures are described above. If interconnection structures are equipped with photovoltaic cells, then this operation may involve selecting a particular structure from a number of different structures such that the obstacles will not interfere with photovoltaic portions. In either case, the provided interconnection structure includes two connectors. One connector will be used for making an electrical connection to the BIPV module installed during operation 1402 or some other electrical component of the array. The other connector will be connected to the second BIPV module installed in a later operation as described below or another interconnection structure.

One or more openings are then formed in the provided interconnection structure during operation 1408 based on information obtained in operation 1404. Forming these openings may involve cutting a portion of the interconnection structure and, in certain embodiments, rerouting the electrical wire in between the two connectors of the wire to overcome interference with the openings.

During operation 1410, the interconnection structure having one or more openings is installed onto the building structure. This installation operation may be similar to the installation of WV modules. That is, one connector of the structure is connected to a BIPV module previously installed in this row or some other electrical components of the array, such as another interconnection structure, a jumper, or an inverter. A portion of the structure may overlap one or more moisture flaps of BIPV modules or other interconnection structures in the adjacent lower row. A moisture flap and/or other parts of the interconnection structure may be nailed or otherwise mechanically fastened to the building structure.

Operation 1410 can also include sealing an interface between the obstacle and structure. For example, a sealing material may be positioned at the interface. In the same or other embodiments, a specially designed sleeve may be slid over the obstacle or formed around the obstacle to create a flap extending over a portion of the interconnection structure near the cutout. The sleeve may be attached to the interconnection structure using one or more mechanical fasteners that extend into mechanical fastener sleeves of the structure. As explained above, the front surface of the structure may have indicators corresponding to the mechanical fastener sleeves to ensure proper positioning of the mechanical fasteners.

If the obstacle is sufficiently large and requires two or more building integrable interconnection structures to interface with it (e.g., as shown in FIG. 11), then operations 1406, 1408, and 1410 may be repeated to form a continuous row of electrically connected structures, with each structure interfacing with the obstacle. Process 1400 may then proceed with installing another BIPV module in operation 1412, which is electrically connected to the interconnected structure.

Conclusion

Although the foregoing concepts have been described in some detail for the purpose of clarity of understanding, it will be apparent that certain changes and modifications may be practiced within the scope of the appended claims. It should be noted that there are many alternative ways of implementing the processes, systems, and apparatuses. Accordingly, the present embodiments are to be considered as illustrative and not restrictive.

BUILDING INTEGRABLE INTERCONNECTION STRUCTURES HAVING FIELD-CONFIGURABLE SHAPES

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