Claims
- 1. A built-in resistor for cathode-ray tube which comprises;
an insulating substrate; a resistance layer formed on one main surface of the insulating substrate; a plurality of terminal electrodes mounted on the resistance layer; and a plurality of terminals connected respectively with said terminal electrodes; wherein said plurality of terminals are individually constituted by a base body comprising a non-magnetic alloy, and by a surface layer which is formed on the surface of the base body and comprising an oxide of said non-magnetic alloy; said plurality of terminals have a relative permeability of not more than 1.005; and said surface layer of each of the terminals is partially provided with an insulating covering layer.
- 2. The built-in resistor for cathode-ray tube according to claim 1, wherein said surface layer is formed through an oxidation treatment of the surfaces of said terminals.
- 3. The built-in resistor for cathode-ray tube according to claim 1, wherein said terminals are respectively provided with a caulking portion which is engaged with and fixed to a through-hole formed in the insulating substrate, and said insulating covering layer is formed on the other main surface of said insulating substrate to cover said caulking portion.
- 4. The built-in resistor for cathode-ray tube according to claim 1, wherein said non-magnetic alloy is a Ni—Cr-based alloy.
- 5. The built-in resistor for cathode-ray tube according to claim 4, wherein said surface layer is formed through an oxidation treatment under a condition where the formation of NiO can be suppressed.
- 6. The built-in resistor for cathode-ray tube according to claim 4, wherein said surface layer comprises, as a main component, Cr2O3 and NiCr2O4.
- 7. The built-in resistor for cathode-ray tube according to claim 5, wherein said surface layer is formed of a material containing Cr2O3 and NiCr2O4 at a ratio of 60% by weight or more.
- 8. The built-in resistor for cathode-ray tube according to claim 1, wherein said surface layer is formed on a surface where said terminals are contacted with said terminal electrodes.
- 9. The built-in resistor for cathode-ray tube according to claim 1, wherein said surface layer has a thickness ranging from 0.5 to 2 μm.
- 10. A cathode-ray tube comprising;
an envelope constituted by a panel portion having a fluorescent screen formed on an inner surface thereof and by a funnel portion having a neck portion; and an electron gun disposed inside the neck portion and comprising a cathode body, a plurality of grid electrodes, and a resistor for loading a divided partial voltage to said plurality of grid electrodes; which is featured in that; said resistor comprises an insulating substrate, a resistance layer formed on one main surface of the insulating substrate, a plurality of terminal electrodes mounted on the resistance layer, and a plurality of terminals connected respectively with said terminal electrodes; wherein said plurality of terminals are individually constituted by a base body comprising a non-magnetic alloy, and by a surface layer which is formed on the surface of the base body and comprising an oxide of said non-magnetic alloy; said plurality of terminals have a relative permeability of not more than 1.005; and said surface layer of each of the terminals is partially provided with an insulating covering layer.
- 11. The cathode-ray tube according to claim 10, wherein said surface layer is formed through an oxidation treatment of the surfaces of said terminals.
- 12. The cathode-ray tube according to claim 10, wherein said terminals are respectively provided with a caulking portion which is engaged with and fixed to a through-hole formed in the insulating substrate, and said insulating covering layer is formed on the other main surface of said insulating substrate to cover said caulking portion.
- 13. The cathode-ray tube according to claim 10, wherein said non-magnetic alloy is a Ni—Cr-based alloy.
- 14. The cathode-ray tube according to claim 13, wherein said surface layer is formed through an oxidation treatment under a condition where the formation of NiO can be suppressed.
- 15. The cathode-ray tube according to claim 13, wherein said surface layer comprises, as a main component, Cr2O3 and NiCr2O4.
- 16. The cathode-ray tube according to claim 15, wherein said surface layer is formed of a material containing Cr2O3 and NiCr2O4 at a ratio of 60% by weight or more.
- 17. The cathode-ray tube according to claim 10, wherein said surface layer is formed on a surface where said terminals are contacted with said terminal electrodes.
- 18. The cathode-ray tube according to claim 10, wherein said surface layer has a thickness ranging from 0.5 to 2 μm.
Priority Claims (1)
Number |
Date |
Country |
Kind |
11-171894 |
Jun 1999 |
JP |
|
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This is a Continuation Application of PCT Application No. PCT/JP00/03827, filed Jun. 13, 2000, which was not published under PCT Article 21(2) in English.
[0002] This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 11-171894, filed Jun. 18, 1999, the entire contents of which are incorporated herein by reference.
Continuations (1)
|
Number |
Date |
Country |
Parent |
PCT/JP00/03827 |
Jun 2000 |
US |
Child |
09783972 |
Feb 2001 |
US |