Patent Grant
10295123
The present invention relates to a bulb apparatus and a method of manufacturing a lighting apparatus, and particularly to a bulb apparatus for a light emitting diode (LED) and a method of manufacturing the LED lighting apparatus.
With years of technology advances and cost reduction of the LED technology, the LED devices are used in various applications
An LED is usually better than a traditional tungsten light for luminous efficiency. However, heat dissipation is important to LED components.
According to one embodiment of the present invention, a bulb apparatus includes a bulb, a light cap, a light source assembly and a driving component. The light cap has an inner wall and an outer wall. The outer wall is used for connecting to a corresponding shaped receptacle for accessing an external power source. The light source assembly includes a base and the multiple light source components. The base carrying the multiple light source components makes the multiple light source components face an angle with respect to a predetermined position with respect to the bulb. The bottom outer shape of the base is connected with the inner wall of the light cap.
The driving component is disposed in a hole surrounded by the base. The driving component is connected to an external power source through a terminal and converts the external power source into a current suitable for driving multiple light source components for driving the multiple light source components to emit light.
In one of design examples, the multiple light source components and the base may share the same substrate. In other words, the multiple light source components may be constructed of the same substrate as the base. For example, at the time of manufacture, an aluminum substrate or other materials may be used to obtain the desired shape with way of cutting and punching. The multiple LED chips are set in a predetermined region of the substrate. In order to allow the appropriate current to be received between the LED chips, a corresponding conductor or a conductive plate which may increase the heat dissipation may be added directly on the substrate. The LED chips electrically connect in parallel, in series, or in other corresponding connecting ways via a corresponding conductor or a conductive plate.
In order to increase heat dissipation, the material of the same substrate may include aluminum. Besides aluminum, multiple different heat dissipation material may also be selected. The substrate is connected to the light source components, so the whole also be regarded as a radiator. The LED chips or LED module may be directly attached to the substrate, or may be a module, and then fixed to the substrate by means of glue, welding and so on. In addition, a heat dissipation material may be coated between the LED chips and the substrate, for example, the heat dissipation material keeping in a gel state, and the heat dissipation material increases the heat transfer effect between the LED chips and the substrate.
In another type of design, the same substrate material is a heat sink. In addition, for making efficiency, the substrates may be formed by cutting or punching with the same complete material layer or sheet of material. In addition, in different types of design, you may also use multiple pieces of material stitching, pasting or welding, etc. to constitute the substrate. In addition, the substrate may have more than one layer of material. For example, some layers are wire layers, which are responsible for series-connected LED chips. Some layers are connected to a layer of aluminum plates for heat dissipation. Some layers are insulating layers, avoiding short circuits to occur between circuit elements.
In one embodiment, the same substrate may be folded to form a three-dimensional hollow light source assembly. For example, we may cut a substrate into the desired shape. The substrate may have multiple forked strips for placing the LED. Also, the substrate may have a base portion, the multiple forked strips connect to the base portion. The substrate may be formed by folding, for example, the substrate is formed a three-dimensional structure by curling. The substrate may be preliminarily set with a folding groove so that the substrate may accurately and easily fold out the desired corner when folded.
The intermediate portion of the base may have at least one hole to enhance heat dissipation. Through the way of folding the substrate, the bottom of the base area surrounded by circular holes or polygonal holes. The top is extended from the substrate of multiple light source assemblies.
The folded substrate may be placed directly into an injection molding machine to inject a predetermined plastic layer on the inside, outside or both sides of the base area of the substrate. The Plastic layer injected through a plastic injection molding machine may be closely bonded to the substrate base area through the injection molding.
The outside of the plastic layer corresponds to the inner wall of the light cap. In other words, the base of the plastic molding plastic layer may be directly transferred into or embedded in the corresponding light cap. Screw thread may be produced on the plastic layer. With the screw thread, the plastic layer combines with the light cap by rotation. In addition, the plastic layer may also be designed to snap, groove, bump, etc. to connect with the light cap.
A heat dissipating glue may also be added between the bottom of the base and the inner wall of the light cap to further increase heat transfer. In other words, the heat from the LED chips on the substrate may transmit to the base region of the substrate through the substrate and convey to the light cap through the plastic layer.
In addition, in order to get the light to follow the desired path, the light source components may include an aluminum substrate with multiple LED chips. The multiple LED chips are arranged on the aluminum substrate and the aluminum substrate is extended in a predetermined manner so that different LED chips on the same aluminum substrate emit light toward two or more angles. As mentioned above, the substrate may be an aluminum substrate. At this time, the aluminum substrate may be bent by bending and so on, for example, bending into a curve, or multiple paragraphs bent into multiple relative angles. In this way, in different paragraphs, or different areas of the LED chips may have a different light injection angle. By adjusting the relative angle of the aluminum substrate or substrate made by several materials at different positions, the LED chips may emit light in a desired direction so that the light emission of the entire lighting apparatus conforms to the desired light distribution.
In particular, one of the practices includes bending the aluminum substrate at an upper end at an angle such that different LED chips on both sides of the bent position emit light at different angles. In other words, the LED chips above the bent position emits light toward the first angle and the LED chips below the bent position emits light toward the second angle, wherein the first angle and the second angle remain constant big difference, so that light may be fired in different directions. Typically, the main beam angle of the LED chips are about 120 degrees. When designing the substrate, you may create the beam angles of LED chips at different area overlap for general lighting and ambience.
In addition, if it is a common Edison light cap, the center of the light cap is a cylindrical hole. The central axis of the cylindrical hole has a central axis direction. By bending a local region of a substrate such as an aluminum substrate so that at least one or more light emitting direction of the LED chips center is different from the central axis direction by 30 degrees or more.
In addition, as described above, the substrate may be set with multiple intersecting strips for setting the LED chips. The multiple crossings may have a certain gap between them for better heat dissipation. For example, the light source assembly has the multiple aluminum substrates, and the multiple aluminum substrates have a slit so that air flows between the inner space surrounded by the multiple aluminum substrates and other spaces in the bulb to have heat dissipation.
In one embodiment, the sum of the widths of the gaps is between one-third and one-half of the sum of the widths of the multiple aluminum substrates, and the sum of the widths of the gaps is equal to the sum of the widths of the multiple aluminum substrates. The sum of the widths respectively, refer to the sum of the gaps between the multiple aluminum substrates and the sum of the widths of the plurality of aluminum plates, of the three-dimensional structure of the light source assembly during assembly.
In order to introduce a current into the LED chip, the bulb apparatus further includes an electrical connection terminal, and the multiple light source components are connected to the driving component through the electrical connection terminal. The electrical connection terminals may be used to form the desired conductive structure with shrapnel, springs, wires or multiple different configurations.
Of course, in addition to the conventional bulb apparatus, the substrate with three-dimensional structure by bending may be used in different lighting apparatus such as downlights and spotlights, etc. The area in which the light source board is originally set may be changed to multiple light source components having a long strip shape in a part of the region by a substrate. A light source such as a LED chip is set thereon, and then the region of the light source component is bent so that the LED emits light toward the desired place.
According to another embodiment of the present invention, there provides a method of manufacturing an illumination device. The method includes the following steps.
First, multiple light source component regions are formed on one substrate, and multiple LED chips are set in each of the light source component regions, wherein the multiple light source component regions have gaps.
The substrate is folded to form a three-dimensional hollow light source assembly. The multiple light source component regions of the substrate and a corresponding multiple LED chips constitute multiple light source components. The gaps between the multiple light source component regions allow the airflow to dissipate heat.
Bending the light source so that different LED chips on both sides of the light source are bent toward different angles.
The light source assembly is combined with the power supply connector.
In other words, the bulb apparatus may be manufactured by this method. Moreover, such a manufacturing method may bring high-efficiency and low-cost technical effects.
In addition, the method may also include forming a plastic layer by injection molding at the bottom of the light source assembly, the plastic layer corresponding to the shape of the power supply connector.
In addition, the method may also include cutting two substrates on a sheet, the two substrates being disposed backwards, and the two substrates being staggered on the panels in a portion of the panel. In other words, the method may be for a large area of the substrate with the corresponding LED chip set and then cut. Since the gap between the light source components is staggered, it is equal to the gap of the substrate of one lamp, and is the position of the light source board of the substrate of the other light. Through the approach may not waste material, and may achieve more environmentally friendly and reduce the cost of the effect.
The substrate may include an aluminum substrate, and furthermore, the intermediate sidewall of the light source assembly may further be set with holes to increase heat dissipation, such as increasing the flow of gas.
Through the above design method, we may achieve lower manufacturing costs and better cooling efficiency, while maintaining the excellent characteristics of lighting.
Please refer to
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The driving component 43 is disposed in a hole surrounded by the base 102. The driving component 43 is connected to the external power source through a terminal (not shown), and the external power source is converted into a current suitable for driving the multiple light source components 101 for driving the multiple light source components 101 to emit light.
Then, we illustrate the characteristics of each component through a series of graphs.
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The driving component 43 is provided with a current for converting the external power source into a voltage suitable for driving the LED chip 1011. And the current is directed to the LED chip 1011 on the light source assembly 42 with a terminal or a wire.
In the example, the bulb is used as an example of implementing the invention. In other examples, the light source assembly 42 may be connected to a battery. The bulb 41 may also be a variety of transparent or translucent covers or boards or related devices with lenses that are different from this example. For example, the LED chip 1011 may direct light to a light guide plate made of laser light or a refraction plate composed of a plurality of micro lenses to achieve the desired light effect.
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In another embodiment, in order to achieve a different light distribution effect, the beam axis 512 of at least one LED chip 1011 on the light source components 101 and the central axis 510 of the light source assembly 42 form an angle α. The angle α is under 30 degrees. In some cases, the angle α is between 30 degrees and 90 degrees.
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In addition, in this example, the light source component 101 may be set with a relatively dense LED chip, such as the LED chips 71, 72, at a position distant from the light cap to achieve the effect of enhancing the emission of light in a particular area. If the requirements of different light bulbs, you may adjust the different light source density in different locations.
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In another design example, the multiple light source components and the base may share the same substrate. In other words, the multiple light source components may be constructed of the same substrate as the base. For example, at the time of making, an aluminum substrate or other material may be used to obtain the desired shape by cutting or stamping. The multiple LED chips are set in a predetermined region of the substrate. In order to allow the appropriate current to be received between the LED chips, it is also possible to add the corresponding wires or a conductive plate which may increase the heat dissipation directly to the substrate. The LED chips electrically connect in parallel, in series, or in other corresponding connecting ways via a corresponding conductor or a conductive plate.
In order to increase the heat dissipation effect, the material of the same substrate may include aluminum. Besides aluminum, you may use a variety of different heat dissipation materials. This substrate is connected to the light source described above, so the whole may also be regarded as a radiator. The LED chip or LED module may be directly attached to the substrate, or may be a module, and then fixed to the substrate by means of glue, welding or the like. In addition, a heat dissipating material may be coated between the LED chip and the substrate, for example, a gel-type heat dissipating material that never become harder, and increases the heat transfer effect between the LED chip and the substrate.
In one type of design, the same substrate material is a heat sink. In addition, for the sake of fabrication efficiency, the substrates mentioned herein may be formed by cutting or punching with the same complete material layer or sheet of material. In addition, in different designs, you may also use multiple pieces of material stitching, paste or welding, etc. to constitute a substrate. In addition, the substrate may have more than one layer of material. For example, some layers are wire layers, which are responsible for series-connected LED chips. Some layers are connected to a layer of aluminum plates for heat dissipation. Some layers are insulating layers, avoiding short circuits between circuit elements that may not occur.
In one embodiment, the same substrate described above may be folded to form a three-dimensional hollow light source assembly. For example, we may use a substrate cut into the desired shape. The substrate may have multiple forked strips for placing the LED. The substrate may have a base portion, which is commonly connected to the base. The substrate may be formed by folding, for example, by curling a three-dimensional structure. The substrate may be preliminarily set with a folding groove so that the substrate may accurately and easily fold out the desired corner when folded.
The intermediate portion of the base may have at least one hole to enhance the effect of heat dissipation of the substrate. If it is through the way of folding the substrate, then the bottom of the base area surrounded by circular holes or polygonal holes. The top is extended from the substrate of a number of light source assemblies.
The folded substrate may be directly placed into the injection molding machine to inject a predetermined plastic layer on the inside, outside or both sides of the base area of the substrate. The plastic injection molding machine through the injection molding method may be closely bonded to the substrate base area through the injection molding method.
The outside of the plastic layer corresponds to the inner wall of the light cap. In other words, the base of the plastic molding plastic layer may be directly transferred into or embedded in the corresponding light cap. Screw thread may be produced on the plastic layer. With the screw thread, the plastic layer combines with the light cap by rotation. In addition, the plastic layer may also be designed to snap, groove, bump, etc. to connect with the light cap.
A heat dissipating glue may also be added between the bottom of the base and the inner wall of the light cap to further increase heat transfer. In other words, the heat from the LED chip on the substrate may be transmitted through the substrate to the base region of the substrate and transferred to the light cap through the plastic layer.
In addition, in order to allow the beam to follow the desired beam path, the light source may include an aluminum substrate with multiple LED chips. The multiple LED chips are arranged on the aluminum substrate and the aluminum substrate is extended in a predetermined manner so that different LED chips on the same aluminum substrate emit light toward two or more angles. As described above, the substrate may be an aluminum substrate. At this time, the aluminum substrate may be bent by bending or the like, for example, bending into a curve, or multiple paragraphs bent into multiple relative angles. In this way, in different paragraphs, or different areas of the LED chips may have different light injection angles. By adjusting the relative angle of the aluminum substrate or the substrate of the various materials at different positions, the LED chips may emit light in a desired direction so that the light emission of the entire lighting apparatus conforms to the desired light distribution.
In practically, one of the practices includes bending the aluminum substrate at an upper end at an angle such that different LED chips on both sides of the bent position emit light at different angles. In other words, the LED chip above the bent position emits light toward the first angle and the LED chip below the bent position emits light toward the second angle, wherein the first angle and the second angle remain constant big difference, so that light may be fired in different directions. Typically, the main beam angles of the LED chips are about 120 degrees. In the design, you may make different areas of the LED chips' beam angles part of the overlap in order to avoid the emergence of light spots.
In addition, if it is a common Edison light cap, the center of the light cap is a cylindrical hole. The central axis of the cylindrical hole has a central axis direction. By bending a local region of a substrate such as an aluminum substrate so that at least one or more of the LED chips of the light emitting direction is different from the central axis direction by 30 degrees or more.
In addition, as described above, multiple regions may be set on the substrate for setting the LED chips. The area may have a certain gap between for better cooling effect. For example, the light source assembly has the multiple aluminum substrates, and there are gaps between the multiple aluminum substrates so that air flows between the inner space surrounded by the multiple aluminum substrates and other spaces in the bulb heat dissipation.
In one embodiment, the sum of the widths of the gaps is between one-third and one-half of the sum of the widths of the multiple aluminum substrates. The sum of the widths of the gaps refers to the sum of the gaps between the multiple aluminum substrates, while the light source assembly is formed a three-dimensional structure. The sum of the widths of the multiple aluminum substrates refers to the sum of the widths of the multiple aluminum plates, while the light source assembly is formed a three-dimensional structure.
In order to introduce a current into the LED chip, the bulb apparatus further includes an electrical connection terminal, and the multiple light source components are connected to the driving component through the electrical connection terminal. The electrical connection terminals may be used to form the desired conductive structure with shrapnel, springs, wires or multiple different configurations.
Surely, in addition to the conventional bulb apparatus, the substrate with three-dimensional structure by bending may be used in different lighting apparatus such as downlights and spotlights, etc. The area in which the light source plate is originally set may be changed to multiple light sources set with a substrate in a part of the substrate, and a light source such as an LED chip is set thereon, and then the region of the light source component is bent so that the LED chip faces where the desired place glows.
Please refer to
First, multiple light source component regions are formed on one substrate (step 901), and multiple LED chips are set in each of the light source component regions, wherein the multiple light source component regions have gaps.
Folding the substrate into a three-dimensional hollow light source assembly (Step 902), and multiple light source component regions and a corresponding multiple LED chips of the substrate form multiple light source members. The gap between the multiple light source component regions helps the air pass through for heat dissipation.
The light source component is bent (step 903) so that different LED chips on both sides of the light source component emit beams toward different angles.
The light source assembly is connected to the power supply connector (step 904).
In other words, the bulb apparatus may be manufactured by this method. Moreover, such a manufacturing method may bring high-efficiency, low-cost technical effects.
In addition, the method may also include forming a plastic layer by injection molding at the bottom of the light source assembly, the plastic layer corresponding to the shape of the power supply connector.
In addition, the method may also include cutting two of the substrates on a sheet, the two substrates being disposed backwards, and the two substrates being staggered on the panels in a portion of the panel. In other words, the method may be for a large area of the substrate with the corresponding LED chip set, and then cut. Since the gap between the light source members is staggered, it is equal to the gap of the substrate of one light, and is the position of the light source plate of the substrate of the other light. Through the approach may not waste material, and may achieve more environmentally friendly and reduce the cost of the effect.
The substrate may include an aluminum substrate, and furthermore, the intermediate sidewall of the light source assembly may further be set with holes to increase the heat dissipation effect, for example, to increase the flow of the gas.
Through the above design method, we may achieve lower manufacturing costs and better cooling efficiency, while maintaining the excellent characteristics of light lighting.
In addition to the above-described embodiments, the present invention may be devised as other variations as long as they remain within the spirit of the invention set forth herein and may remain within the scope of the present invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2017 1 0492611 | Jun 2017 | CN | national |
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| 20150098223 | Su | Apr 2015 | A1 |
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| Number | Date | Country | |
|---|---|---|---|
| 20180372276 A1 | Dec 2018 | US |
