The present disclosure relates to a Bulk Acoustic Wave (BAW) resonator, which uses multilayer transduction materials, with tunable electromechanical coupling.
Due to their small size, high Q values, and very low insertion losses at microwave frequencies, particularly those above 1.5 Gigahertz (GHz), Bulk Acoustic Wave (BAW) filters have been widely used in many modern wireless applications. For instance, the BAW filters incorporating BAW resonators are the filter of choice for many 3rd Generation (3G) and 4th Generation (4G) wireless devices, and are destined to dominate filter applications for 5th Generation (5G) wireless devices.
One example of a conventional BAW resonator 10 is illustrated in
As an existing solution to this challenge, the BAW resonator with a voltage tunable Ke2 was proposed based on a barium strontium titanate transduction layer being used in its “paraelectric” phase instead of the conventional piezoelectric transduction layer. A drawback of using a transduction material in its paraelectric phase is the necessity of a continuous direct current (DC) bias voltage applied across the electrodes of the device in an “on state” operation (“on state”: when the device acts as a resonator; “off state”: when no DC bias voltage is applied and the device acts as a simple capacitor). The continuous DC bias voltage across the resonator will cause a continuous leakage current through the resonator, and thus a continuous electric power loss.
Accordingly, there remains a need for improved BAW resonator designs to achieve tunable electromechanical coupling coefficients Ke2 without suffering continuous electric power loss and a bulk volume of the final product. Further, there is also a need to keep the final product easy to implement and cost effective.
The present disclosure relates to a Bulk Acoustic Wave (BAW) resonator with tunable electromechanical coupling. The disclosed BAW resonator includes a bottom electrode, a top electrode, and a multilayer transduction structure sandwiched therebetween. Herein, the multilayer transduction structure is composed of multiple transduction layers, and at least one of the transduction layers is formed of a first ferroelectric material, whose polarization will vary with an electric field across the first ferroelectric material. Upon adjusting a direct current (DC) bias voltage between the bottom electrode and the top electrode, an overall polarization of the multilayer transduction structure and an overall electromechanical coupling coefficient of the multilayer transduction structure are capable of being changed. Once the change of the overall electromechanical coupling coefficient of the multilayer transduction structure is completed, the overall electromechanical coupling coefficient of the multilayer transduction structure will remain unchanged after removing the DC bias voltage.
In one embodiment of the disclosed BAW resonator, the first ferroelectric material used to form the at least one of the transduction layers has a box-shaped polarization-electric field (P-E) curve.
In one embodiment of the disclosed BAW resonator, the first ferroelectric material is scandium aluminum nitride (ScxAl1-xN) and the P-E curve of ScxAl1-xN is dependent on a scandium concentration x.
In one embodiment of the disclosed BAW resonator, at least one of the plurality of transduction layers is formed of a second ferroelectric material, which has a different P-E curve compared to the first ferroelectric material. In addition, at least one of the transduction layers is formed of a piezoelectric material, whose polarization does not vary with an electric field across the piezoelectric material.
In one embodiment of the disclosed BAW resonator, each of the transduction layers is formed of a different ferroelectric material.
In one embodiment of the disclosed BAW resonator, at least one of the transduction layers is formed of a piezoelectric material, whose polarization does not vary with an electric field across the piezoelectric material.
In one embodiment of the disclosed BAW resonator, each of the transduction layers has a different thickness.
In one embodiment of the disclosed BAW resonator, each of the transduction layers has a same thickness.
According to one embodiment, the disclosed BAW resonator further includes a bottom Brag reflector formed underneath the bottom electrode and a top Brag reflector formed over the top electrode.
In one embodiment of the disclosed BAW resonator, the multilayer transduction structure further includes a number of internal electrodes, which are alternated with the transduction layers. In addition, each transduction layer is formed of a different ferroelectric material.
According to an exemplary process of forming a BAW resonator with tunable electromechanical coupling, the process includes forming a bottom electrode, forming a multilayer transduction structure over the bottom electrode, and forming a top electrode over the multilayer transduction structure. As such, the multilayer transduction structure is sandwiched between the bottom electrode and the top electrode. Herein, the multilayer transduction structure is composed of multiple transduction layers, and at least one of the transduction layers is formed of a ferroelectric material, whose polarization will vary with an electric field across the ferroelectric material. Upon adjusting a DC bias voltage between the bottom electrode and the top electrode, an overall polarization of the multilayer transduction structure and an overall electromechanical coupling coefficient of the multilayer transduction structure are capable of being changed.
According to one embodiment, the process further includes applying a DC bias voltage across the bottom electrode and the top electrode to change the overall polarization of the multilayer transduction structure and the overall electromechanical coupling coefficient of the multilayer transduction structure. Herein, once the change of the overall electromechanical coupling coefficient of the multilayer transduction structure is completed, the overall electromechanical coupling coefficient of the multilayer transduction structure will remain unchanged after removing the DC bias voltage.
In one embodiment of the process, the first ferroelectric material used to form the at least one of the transduction layers has a box-shaped P-E curve.
In one embodiment of the process, the first ferroelectric material is ScxAl1-xN and the P-E curve of ScxAl1-xN is dependent on a scandium concentration x.
In one embodiment of the process, at least one of the transduction layers is formed of a second ferroelectric material, which has a different P-E curve compared to the first ferroelectric material.
In one embodiment of the process, each transduction layer is formed of a different ferroelectric material.
In one embodiment of the process, at least one of the transduction layers is formed of a piezoelectric material, whose polarization does not vary with an electric field across the piezoelectric material.
According to an exemplary system with at least one BAW resonator with tunable electromechanical coupling, the system includes a radio-frequency (RF) input circuitry, a RF output circuitry, and a filter circuitry that includes the at least one BAW resonator. Herein, the filter circuitry is connected between the RF input circuitry and the RF output circuitry. The at least one BAW resonator includes a bottom electrode, a top electrode, and a multilayer transduction structure sandwiched between the bottom electrode and the top electrode. The multilayer transduction structure is composed of multiple transduction layers, and at least one of the transduction layers is formed of a ferroelectric material, whose polarization will vary with an electric field across the ferroelectric material. Upon adjusting a DC bias voltage between the bottom electrode and the top electrode, an overall polarization of the multilayer transduction structure and an overall electromechanical coupling coefficient of the multilayer transduction structure are capable of being changed.
In another aspect, any of the foregoing aspects individually or together, and/or various separate aspects and features as described herein, may be combined for additional advantage. Any of the various features and elements as disclosed herein may be combined with one or more other disclosed features and elements unless indicated to the contrary herein.
Those skilled in the art will appreciate the scope of the present disclosure and realize additional aspects thereof after reading the following detailed description of the preferred embodiments in association with the accompanying drawing figures.
The accompanying drawing figures incorporated in and forming a part of this specification illustrate several aspects of the disclosure, and together with the description serve to explain the principles of the disclosure.
It will be understood that for clear illustrations,
The embodiments set forth below represent the necessary information to enable those skilled in the art to practice the embodiments and illustrate the best mode of practicing the embodiments. Upon reading the following description in light of the accompanying drawing figures, those skilled in the art will understand the concepts of the disclosure and will recognize applications of these concepts not particularly addressed herein. It should be understood that these concepts and applications fall within the scope of the disclosure and the accompanying claims.
It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present disclosure. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
It will be understood that when an element such as a layer, region, or substrate is referred to as being “on” or extending “onto” another element, it can be directly on or extend directly onto the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly on” or extending “directly onto” another element, there are no intervening elements present. Likewise, it will be understood that when an element such as a layer, region, or substrate is referred to as being “over” or extending “over” another element, it can be directly over or extend directly over the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly over” or extending “directly over” another element, there are no intervening elements present. It will also be understood that when an element is referred to as being “connected” or “coupled” to another element, it can be directly connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being “directly connected” or “directly coupled” to another element, there are no intervening elements present.
Relative terms such as “below” or “above” or “upper” or “lower” or “horizontal” or “vertical” may be used herein to describe a relationship of one element, layer, or region to another element, layer, or region as illustrated in the Figures. It will be understood that these terms and those discussed above are intended to encompass different orientations of the device in addition to the orientation depicted in the Figures.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises,” “comprising,” “includes,” and/or “including” when used herein specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms used herein should be interpreted as having a meaning that is consistent with their meaning in the context of this specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Embodiments are described herein with reference to schematic illustrations of embodiments of the disclosure. As such, the actual dimensions of the layers and elements can be different, and variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are expected. For example, a region illustrated or described as square or rectangular can have rounded or curved features, and regions shown as straight lines may have some irregularity. Thus, the regions illustrated in the figures are schematic and their shapes are not intended to illustrate the precise shape of a region of a device and are not intended to limit the scope of the disclosure. Additionally, sizes of structures or regions may be exaggerated relative to other structures or regions for illustrative purposes and, thus, are provided to illustrate the general structures of the present subject matter and may or may not be drawn to scale. Common elements between figures may be shown herein with common element numbers and may not be subsequently re-described.
An electromechanical coupling coefficient Ke2 of a Bulk Acoustic Wave (BAW) resonator, such as a thin film bulk acoustic resonator (FBAR) or a solidly mounted resonator (SMR), is a function of a piezoelectric coefficient d of a transduction layer of the BAW resonator, and the piezoelectric coefficient d is proportional to a polarization P of the transduction layer of the BAW resonator. Therefore, once the polarization P of the transduction layer varies, the piezoelectric coefficient d will change accordingly, and consequently, the electromechanical coupling coefficient Ke2 of the BAW resonator will change as well.
Notice that, once the polarization P of the ferroelectric material achieves a desired value (i.e., the electromechanical coupling coefficient Ke2 achieves a desired value), there is no need to retain the DC bias voltage applied to the ferroelectric material. After removing the DC bias voltage, the polarization P of the ferroelectric material (i.e., the electromechanical coupling coefficient Ke2 of the ferroelectric material) will remain at that desired value, until another DC bias voltage is applied to the ferroelectric material.
Scandium aluminum nitride (ScxAl1-xN) is an exemplary ferroelectric material.
With a same electric field E (applying a same DC bias voltage), the polarization P of ScxAl1-xN may have different values and/or different directions due to the scandium concentration x. For instance, when the electric filed E is −1.5 MV/cm, the polarization P of Sc0.27Al0.73N is 105 μC/cm2, while the polarization P of Sc0.43Al0.57N is 70 μC/cm2. As such, the electromechanical coupling coefficient Ke2 of the ferroelectric material, which is dependent on the polarization P of ferroelectric material, may also have different values due to the scandium concentration x.
In detail, the bottom electrode 32 may be composed of one or more electrode layers (not shown) and includes at least one metal or alloy, such as Tungsten, Aluminum Copper, and the like. The top electrode 34 may be composed of one or more electrode layers (not shown) and includes at least one metal or alloy, such as Tungsten, Aluminum Copper, and the like. The bottom electrode 32 and the top electrode 34 each has a thickness depending on the main resonant frequency of the exemplary BAW resonator 30. In some applications, the BAW resonator 30 may further include a recessed and/or raised border ring around the periphery of the top electrode 34 to confine the energy inside the exemplary BAW resonator 30 and to prevent laterally propagating standing waves (not shown).
The multilayer transduction structure 36 includes multiple transduction layers 38 (e.g., as shown in
Each transduction layer 38 may have a same or different thickness. At least one of the transduction layers 38 is formed of a ferroelectric material, whose polarization will vary with an electric field across the ferroelectric material. For instance, the ferroelectric material used for the at least one of the transduction layers 38 has a box-shaped P-E curve (e.g., as shown in
In one embodiment, some of the transduction layers 38 may be formed of a piezoelectric material (e.g., Aluminum nitride (AlN), Lithium niobate (LiNbO3), or Zinc oxide (ZnO)), whose polarization will not vary with an electric field across the piezoelectric material; while the remaining transduction layers 38 may be formed of a ferroelectric material (e.g., ScAlN, PZT, PTO, BTO, or HfO2), whose polarization will vary with an electric field across the ferroelectric material. Herein, by adjusting the electric field across the multilayer transduction structure 36, the polarization of the transduction layers 38 formed of the ferroelectric material may be converted to an opposite direction compared to the polarization of the transduction layers 38 formed of the piezoelectric material, or may be converted to a zero polarization. As such, an overall polarization of the multilayer transduction structure 36 may change, and consequently, the overall electromechanical coupling coefficient Ke2 of the entire multilayer transduction structure 36 may change. In one embodiment, the transduction layers 38 formed of the piezoelectric material (e.g., the first transduction layer 38_1 . . . , and the (N−1)th transduction layer 38_N−1) may be alternated with the transduction layers 38 formed of the ferroelectric material (e.g., the second transduction layer 38_2 . . . , and the Nth transduction layer 38_N). In one embodiment, the transduction layers 38 formed of the piezoelectric material may be located in a top region of the multilayer transduction structure 36 (e.g., the Nth transduction layer 38_N and the (N−1)th transduction layer 38_N−1) and the transduction layers 38 formed of the ferroelectric material may be located in a bottom region of the multilayer transduction structure 36 (e.g., the first transduction layer 38_1 and the second transduction layer 38_2). In one embodiment, the transduction layers 38 formed of the piezoelectric material may be located in the bottom region of the multilayer transduction structure 36 (e.g., the first transduction layer 38_1 and the second transduction layer 38_2) and the transduction layers 38 formed of the ferroelectric material may be located in the top region of the multilayer transduction structure 36 (e.g., the Nth transduction layer 38_N and the (N−1)th transduction layer 38_N−1). In one embodiment, the transduction layers 38 formed of the piezoelectric material and the transduction layers 38 formed of the ferroelectric material may be positioned arbitrarily within the multilayer transduction structure 36. The number of the transduction layers 38 formed of the piezoelectric material and the number of the transduction layers 38 formed of the ferroelectric material may be different or the same.
In one embodiment, the transduction layers 38 in the multilayer transduction structure 36 may be formed of two or more ferroelectric materials, which have different P-E curves. When applying a same electric field, a polarization of each different ferroelectric material will have different values and/or directions. Therefore, by changing electric fields, the overall polarization of the multilayer transduction structure 36 may change, and consequently, the overall electromechanical coupling coefficient Ke2 of the entire multilayer transduction structure 36 may change. In a simplified instance, some of the transduction layers 38 may be formed of a first ferroelectric material (e.g., ScxAl1-xN), and some of the transduction layers 38 may be formed of a second ferroelectric material (e.g., ScyAl1-yN, wherein x is different from y and each of x and y is between 0.1 and 0.8). The first ferroelectric material and the second ferroelectric material have different P-E curves. In one embodiment, upon applying a first electric field, the first ferroelectric material may have a polarization with an opposite direction to the polarization of the second ferroelectric material. Upon applying a second electric field, the polarization of the first ferroelectric material and the polarization of the second ferroelectric material have a same direction. As such, the overall polarization of the multilayer transduction structure 36 is different with the first or second electric field, and consequently, the overall electromechanical coupling coefficient Ke2 of the entire multilayer transduction structure 36 is different with the first or second electric field. In one embodiment, the transduction layers 38 formed of different ferroelectric materials may be positioned alternatively. In one embodiment, the transduction layers 38 formed of different ferroelectric materials may be positioned in groups, wherein each group utilizes one ferroelectric material. In one embodiment, the transduction layers 38 formed of formed of different ferroelectric materials may be positioned arbitrarily within the multilayer transduction structure 36. The number of the transduction layers 38 formed of each ferroelectric material may be different or the same.
In one embodiment, some of the transduction layers 38 may be formed of one or more piezoelectric materials (e.g., AlN, LiNbO3, and/or ZnO), while the remaining transduction layers 38 may be formed of two or more ferroelectric materials (e.g., ScAlN, PZT, BTO, HfO2, and/or PTO), wherein each ferroelectric material has a different P-E curve. In a simplified instance, some of the transduction layers 38 may be formed of a piezoelectric material, some of the transduction layers 38 may be formed of a first ferroelectric material, and some of the transduction layers 38 may be formed of a second ferroelectric material. The first ferroelectric material and the second ferroelectric material have different P-E curves. In one embodiment, upon applying a first electric field, the first ferroelectric material may have a polarization with an opposite direction to the polarization of the piezoelectric material, while the second ferroelectric material may have a polarization with a same direction as the polarization of the piezoelectric material or may have a zero polarization. Upon applying a second electric field, the first ferroelectric material and the second ferroelectric material each may have a polarization with an opposite direction to the polarization of the piezoelectric material. As such, the overall polarization of the multilayer transduction structure 36 is different with the different electric field, and consequently, the overall electromechanical coupling coefficient Ke2 of the entire multilayer transduction structure 36 is different with the different electric field. In one embodiment, the transduction layers 38 formed of different materials may be positioned in an alternative configuration, a grouped configuration, or an arbitrary configuration. The number of the transduction layers 38 formed of each material may be different or the same.
By adjusting the DC bias voltage between the top and bottom electrodes 32 and 34, different electric fields may be achieved across the multilayer transduction structure 36, thereby changing the overall polarization of the multilayer transduction structure 36. Therefore, the electromechanical coupling coefficients Ke2 of the multilayer transduction structure 36, which is a function of the polarization of the multilayer transduction structure 36, is tunable. In different states, the multilayer transduction structure 36 has different values of the electromechanical coupling coefficients Ke2. Notice that, once the polarization of the multilayer transduction structure 36 achieves a desired value (i.e., the electromechanical coupling coefficient Ke2 achieves a desired value), there is no need to retain the DC bias voltage applied to the top and bottom electrodes 32 and 34. After removing the DC bias voltage, the polarization of the multilayer transduction structure 36 (i.e., the electromechanical coupling coefficient Ke2 of the multilayer transduction structure 36) will remain at that desired value, until another DC bias voltage is applied to the multilayer transduction structure 36. As such, no continuous DC bias voltage across the exemplary BAW resonator 30 is needed. A continuous leakage current through the resonator and a continuous electric power loss, which are caused by the continuous DC bias voltage, will not exist in the exemplary BAW resonator 30.
In some applications, a BAW resonator may further include one or two reflectors.
In some applications, in order to adjust the electric field across each transduction layer, internal electrodes may be used. As illustrated in
For the purpose of this illustration, the filter circuitry 904 includes three filters 906A, 906B, and 906C. Herein, one or more of the filters 906A, 906B, and 906C may be BAW filters, which are implemented by one or more BAW resonators 30/30A/30B/30C. In different applications, the filter circuitry 904 may include more or fewer filters. In one embodiment, each of the filters 906A, 906B, and 906C may be a lowpass filter or a bandpass filter, and the filters 906A, 906B, and 906C may be connected in a cascaded arrangement. The filter types that are included in the filter circuitry 904 may be based at least on the rejection requirements of the system 900.
The filter circuitry 904 is connected to an RF output circuitry 908. In certain embodiments, the RF output circuitry 908 includes an antenna. The RF input circuitry 902 and/or the RF output circuitry 908 may include additional or different components in other embodiments.
The baseband processor 1004 processes the digitized received signal to extract the information or data bits conveyed in the received signal. This processing typically comprises demodulation, decoding, and error correction operations, as will be discussed in greater detail below. The baseband processor 1004 is generally implemented in one or more digital signal processors (DSPs) and ASICs.
For transmission, the baseband processor 1004 receives digitized data, which may represent voice, data, or control information, from the control system 1002, which it encodes for transmission. The encoded data is output to the transmit circuitry 1006, where a digital-to-analog converter(s) (DAC) converts the digitally encoded data into an analog signal and a modulator modulates the analog signal onto a carrier signal that is at a desired transmit frequency or frequencies. A power amplifier will amplify the modulated carrier signal to a level appropriate for transmission and deliver the modulated carrier signal to the antennas 1012 through the antenna switching circuitry 1010 to the antennas 1012. The multiple antennas 1012 and the replicated transmit and receive circuitries 1006, 1008 may provide spatial diversity. Modulation and processing details will be understood by those skilled in the art.
It is contemplated that any of the foregoing aspects, and/or various separate aspects and features as described herein, may be combined for additional advantage. Any of the various embodiments as disclosed herein may be combined with one or more other disclosed embodiments unless indicated to the contrary herein.
Those skilled in the art will recognize improvements and modifications to the preferred embodiments of the present disclosure. All such improvements and modifications are considered within the scope of the concepts disclosed herein and the claims that follow.
This application claims the benefit of provisional patent application Ser. No. 63/298,244 filed Jan. 11, 2022, and provisional patent application Ser. No. 63/324,946, filed Mar. 29, 2022, the disclosures of which are hereby incorporated herein by reference in their entireties. The present application is related to concurrently filed U.S. patent application Ser. No. ______, filed on ______, entitled “ACOUSTIC WAVE RESONATOR WITH LOW/ZERO-ELECTROMECHANICAL COUPLING AT BORDER REGION,” and U.S. patent application Ser. No. ______, filed on ______, entitled “ACOUSTIC WAVE RESONATOR USING MULTILAYER TRANSDUCTION MATERIALS WITH LOW/ZERO COUPLING BORDER REGION,” the disclosures of which are hereby incorporated herein by reference in their entireties.
Number | Date | Country | |
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63298244 | Jan 2022 | US | |
63324946 | Mar 2022 | US |