The present application is based on, and claims priority from the prior Japanese Patent Application No. 2021-129485, filed on Aug. 6, 2021, the entire contents of which are incorporated herein by reference.
The disclosure relates to a bus bar.
JP 2001-286028 A proposes a bus bar in which a wiring pathway is formed of a single member made from a conductive material. The single member is formed in a shape along the wiring pathway by performing press working on a single flat plate shaped base material. Alternatively, the single member is formed in a shape along the wiring pathway by performing a forming process on a single linear base material.
In a bus bar, plate processing is performed as surface treatment in order to improve the electrical connection reliability of connection portions for electrical input-output. However, in a case where a wiring pathway is formed of a single member like the bus bar described in JP 2001-286028 A, it is necessary to perform plate processing on the entirety of the bus bar, thereby increasing the used amount of a plating material and thus increasing the cost. Although plate processing may be performed in a state where the portion other than the connection portions of the bus bar is masked in order to decrease the used amount of a plating material, it is still necessary to perform masking work, thereby increasing the cost.
The disclosure is directed to a lower cost bus bar.
A bus bar in accordance with some embodiments includes members made from a conductive material and consecutively arranged to form a plate shape defining a wiring pathway. The members adjacent to each other are connected to each other by laser joining. The members include connection members arranged at both ends of the wiring pathway and having connection portions for electrical input-output, and a conductive member arranged between the connection members. In the members, only the connection members are plated.
According to the aforementioned configuration, it is possible to provide a lower cost bus bar.
Various embodiments will be described hereinafter with reference to the accompanying drawings.
A detailed description will be hereinbelow provided for a bus bar 1 according to an embodiment by referring to the drawings. Noted that the proportions of the dimensions of the drawings are exaggerated for illustration purposes and therefore the proportions may be different from actual ones.
As illustrated in
The connection members 11 include a first connection member 15 and a second connection member 17 arranged at both ends of the wiring pathway 7. Connection portions 19 electrically connected to the battery stacks 3 are provided in the first connection member 15 and the second connection member 17, respectively. The connection portions 19 are fastening portions to which non-illustrated fastening members such as bolts are fastened, for example.
The first connection member 15 and the second connection member 17 are made from copper which has excellent electrical connection to the battery stacks 3 and is suitable for fastening of the fastening members, for example. The first connection member 15 and the second connection member 17 may be made from copper alloy composed mainly of copper. The first connection member 15 and the second connection member 17 may be made from 6000 series aluminum alloy composed mainly of aluminum which has excellent electrical connection to the battery stacks 3 and is suitable for fastening of the fastening members, for example. In this way, the material for the connection members 11 may be any materials as long as it has excellent conductivity and excellent stiffness.
The first connection member 15 and the second connection member 17 are respectively formed in a quadrangular plate shape by press working or a forming process. The first connection member 15 and the second connection member 17 are readily processable due to their simple quadrangular shape, thereby reducing the manufacturing cost. In the embodiment, the first connection member 15 and the second connection member 17 have the same plate thickness, the same plate width, and the same plate length. Thus, the first connection member 15 and the second connection member 17 can be formed by the same processing method, thereby reducing the manufacturing cost even more. The first connection member 15 and the second connection member 17 may be made from different materials and have different plate thicknesses, different plate widths, and different plate lengths. The conductive member 13 is arranged between the first connection member 15 and the second connection member 17.
The conductive member 13 is arranged between the first connection member 15 and the second connection member 17 in the wiring pathway 7. The conductive member 13 is made from copper as with the connection members 11. The conductive member 13 may be made from copper alloy composed mainly of copper. When the connection members 11 are made from aluminum alloy composed mainly of aluminum, for example, the conductive member 13 may be made from the same aluminum alloy.
The conductive member 13 is formed in a quadrangular plate shape by press working or a forming process. The conductive member 13 is readily processable due to its simple quadrangular shape, thereby reducing the manufacturing cost. In the embodiment, the conductive member 13 and the connection members 11 have the same plate thickness, the same plate width, and the same plate length. Thus, the conductive member 13 and the connection members 11 can be formed by the same processing method, thereby reducing the manufacturing cost even more. The conductive member 13 and the connection members 11 may have different plate thicknesses, different plate widths, and different plate lengths. For example, the plate width of the conductive member 13 may be larger than the plate width of the respective connection members 11 in order to improve heat dissipation of the conductive member 13 with the increased surface area.
The conductive member 13 may be formed to have the bent portions 5 in the wiring pathway 7. When the conductive member 13 is provided with the bent portions 5, the conductive member 13 may be made from 1000 series aluminum alloy composed mainly of aluminum which is softer than and superior in formability to the connection members 11, for example. The plate thickness of the conductive member 13 may be less than the plate thickness of the connection members 11 in order to reduce the stiffness of the conductive member 13 with increased formability. In this way, the increased formability of the conductive member 13 allows processing for forming the bent portions 5 in the conductive member 13 to be easily carried out, thereby reducing the manufacturing cost.
The members 9 including the conductive member 13 and the connection members 11 described above are arranged along the wiring pathway 7 and the portions in contact with each other are connected to each other by laser joining. An example of the connection of the members 9 in the bus bar 1 is described below. First, a connection surface 23 which is one end surface of the conductive member 13 in the width direction thereof is arranged to be in contact with a connection surface 21 which is one end surface of the first connection member 15 in the length direction thereof. Next, the portions where the connection surface 21 of the first connection member 15 and the connection surface 23 of the conductive member 13 are in contact with each other are connected to each other by laser joining. The connection of the first connection member 15 and the conductive member 13 forms a bent portion 5 in the wiring pathway 7.
Next, a connection surface 27 which is one end surface of the second connection member 17 in the width direction thereof is arranged to be in contact with a connection surface 25 which is one end surface of the conductive member 13 in the length direction thereof. Then, the portions where the connection surface 25 of the conductive member 13 and the connection surface 27 of the second connection member 17 are in contact with each other are connected to each other by laser joining. The connection of the conductive member 13 and the second connection member 17 forms a bent portion 5 in the wiring pathway 7.
In this way, the wiring pathway 7 having the bent portions 5 can be formed by consecutively connecting the members 9 to each other by laser joining. Thus, there is no need to form a single member in a shape along the wiring pathway 7 by press working or a forming process and it is possible to easily correspond with wiring pathways 7 having various shapes. When the connection members 11 and the conductive member 13 are made from different types of metal such as copper and aluminum, an intermetallic compound may be generated at the connection portions thereof, causing the joint strength to decrease. Thus, when the connection members 11 and the conductive member 13 are made from different types of metal, a clad member including the same types of metal as the connection members 11 and the conductive member 13 may be interposed between the connection members 11 and the conductive member 13.
In the bus bar 1 described above, the members 9 are arranged in the same plane. However, the present invention is not limited to this. For example, as illustrated in
Since the bus bar 1 is a member which electrically connects between the battery stacks 3, it is preferable to perform plate processing as surface treatment in order to improve the electrical connection reliability between the bus bar 1 and the battery stacks 3. However, in a case where the bus bar 1 is formed of a single member, it is necessary to perform plate processing on the entirety of the bus bar 1, thereby increasing the used amount of a plating material and thus increasing the cost. Although plate processing may be performed in a state where the portion other than the connection portions 19 of the bus bar 1 is masked in order to decrease the used amount of a plating material, it is still necessary to perform masking work, thereby increasing the cost. Thus, only the connection members 11 are plated in the bus bar 1 according to the embodiment.
In the bus bar 1, plate processing as surface treatment is performed on the first connection member 15 and the second connection member 17 after the first connection member 15 and the second connection member 17 are formed by press working or a forming process, for example. In contrast, plate processing as surface treatment is not performed on the conductive member 13 after the conductive member 13 is formed by press working or a forming process, for example. Thus, in a state where the first connection member 15, the conductive member 13, and the second connection member 17 are connected to each other, plate processing as surface treatment has been performed on only the first connection member 15 and the second connection member 17. Accordingly, it is possible to achieve a state where plate processing has been performed on the first connection member 15 and the second connection member 17 including the connection portions 19 without requiring masking work, thereby decreasing the cost of the bus bar 1. Additionally, it is possible to decrease the used amount of a plating material and thus decrease the cost.
In this way, the electrical connection reliability between the connection members 11 and the battery stacks 3 can be improved by performing plate processing on the connection members 11. Performing plate processing on the connection members 11 can be also applied to a case such as the bus bar 1 illustrated in
For example, in the bus bar 1 illustrated in
In the bus bar 1 illustrated in
The bus bar 1 described above includes the members 9 which are made from a conductive material and consecutively arranged to form a plate shape defining the wiring pathway 7. The members 9 adjacent to each other are connected to each other by laser joining. The members 9 include the connection members 11 located at both ends of the wiring pathway 7 and having the connection portions 19 for electrical input-output, and the conductive member 13 arranged between the connection members 11. In the members 9, only the connection members 11 are plated.
Thus, unlike a case where the wiring pathway 7 is formed of a single member, it is possible to achieve a state where plate processing has been performed on the connection members 11 including the connection portions 19 without requiring masking work, thereby decreasing the cost. Additionally, it is possible to decrease the used amount of a plating material and thus decrease the cost. Accordingly, it is possible to provide the bus bar 1, with which cost is reduced.
The connection members 11 and the conductive member 13 are connected to each other in a state where the connection surfaces 29, 31 located in the same plane are in contact with each other. Thus, the connection portions are easy to see, improving workability. Additionally, since direct welding can be performed along the connection border of the connection surfaces 29, 31, the welding quality can be improved.
The wiring pathway 7 electrically connects between the different battery stacks 3. Thus, the bus bar 1 plated at low cost can be applied to wiring pathways 7 having various shapes designed to be arranged between the different battery stacks 3.
The bus bar 1 according to the embodiment electrically connects the different battery stacks 3 to each other.
However, the present invention is not limited to this. For example, the bus bar 1 may be arranged between any electric components, for example, between a power source and a device and between a device and a device.
In the bus bar 1 according to the embodiment, the wiring pathway 7 includes the bent portions 5. However, the present invention is not limited to this. The wiring pathway 7 may be linear as long as only the connection members 11 in the members 9 are plated.
In the bus bar 1 according to the embodiment, one conductive member 13 is arranged between the first connection member 15 and the second connection member 17. However, the present invention is not limited to this. Two or more conductive members 13 may be arranged between the first connection member 15 and the second connection member 17.
While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel embodiments described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions.
Number | Date | Country | Kind |
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2021-129485 | Aug 2021 | JP | national |