The technical field relates to a bus connection wire, and more particularly relates to a bus connection wire forward soldering structure that adopts forward soldering (or welding) to avoid the issues of signal degradation and impedance mismatch.
Peripheral Component Interconnect Express (PCIe) bus connection wire is used extensively in the connector industry, and it mainly includes a flat cable, and a circuit board and a connector which are installed at two ends of the flat cable respectively. Since the flat cable itself with high flexibility is bendable and foldable, the bus connection wire is adaptable to different user's environments and able to be flexibly installed and set in the way of forward insertion or reverse insertion, and thus deriving the demand for the reverse wiring of the flat cable.
Specifically, a normal wiring of the flat cable is to connect a wire with the circuit board (at the installed position of the connector) in an opposite extending direction, such that a solder terminal of the flat cable is engaged with the circuit board, and this is called forward soldering. The reverse wiring of the flat cable is to connect the wire with the circuit board in the same extending direction, and thus most designs adopt reverse soldering, that is, the solder terminal of the flat cable is configured toward the opposite connecting direction of the circuit board and allows the cable to extend in the same connection direction toward the circuit board.
However, the reverse soldering of the flat cable to the circuit board may cause the signals to travel extra paths during transmission and produce a stub effect, leading to the problems of signal attenuation and impedance mismatch. This situation may be even more serious when the current industry changes PCIe 3.0 to the faster PCIe Gen5. Therefore, how to design a bus connection wire capable of realizing the demand for reverse wiring and avoiding the negative effects of the reverse soldering demands immediate attentions and feasible solutions.
In view of the aforementioned drawbacks, the present discloser conducted extensive research, applied related principles and theories, and provided a solution to overcome the drawbacks of the related art.
It is a primary objective of this disclosure to overcome the problems of signal attenuation and impedance mismatch caused by a stub effect produced when the bus connection wire requires a reverse wiring of the flat cable and the need for the signals to travel extra paths during transmission.
To achieve the aforementioned objective, the present disclosure provides a bus connection wire forward soldering structure including a circuit board, a flat cable, and a fixing member. The circuit board has a first surface and a second surface opposite to each other, and the circuit board has a solder area, a docking area and an outgoing line direction defined thereon. The solder area is disposed on the first surface, and the docking area is disposed on one of the first surface and the second surface. The outgoing line direction runs from the solder area toward the docking area. The flat cable includes a solder terminal, a first attaching section, a folding section, a second attaching section and a main body section which are sequentially connected to one another. The solder terminal faces the docking area along the outgoing line direction and is electrically connected to the solder area. The first attaching section is substantially attached to the first surface, and the second attaching section is substantially attached to the second surface. The folding section is bent and connected between the first attaching section and the second attaching section. The main body section extends along the outgoing line direction, and the fixing member covers the solder terminal, the first attaching section, the folding section and the second attaching section. The fixing member has a notch defined corresponding to the second surface and disposed at the junction of the second attaching section and the main body section.
In an embodiment of the present disclosure, the fixing member is integrally formed (or formed in one piece) on a side of circuit board away from the docking area, the fixing member has a first fixing portion and a second fixing portion, the first fixing portion is attached to the first surface and covers the solder terminal, the first attaching section and a part of the folding section, the second fixing portion is attached to the second surface and covers the second attaching section and another part of the folding section.
In an embodiment of the present disclosure, the circuit board has a plurality of through holes, each through hole penetrates the circuit board from the first surface to the second surface, the fixing member has a plurality of positioning pillars, and each positioning pillar is accommodated in each through hole and connected between the first fixing portion and the second fixing portion.
In an embodiment of the present disclosure, the notch is disposed on a side of the second fixing portion facing the docking area, and the cross-sectional length of the first fixing portion along the outgoing line direction is greater than the cross-sectional length of the second fixing portion along the outgoing line direction.
In an embodiment of the present disclosure, the fixing member includes a first casing and a second casing, a side of the first casing facing the circuit board has a first slot, a side of the second casing facing the circuit board has a second slot, the first casing and the second casing jointly clamp the circuit board, and the solder terminal, the first attaching section, the folding section and the second attaching section are accommodated in the first slot and the second slot.
In an embodiment of the present disclosure further includes a bolt and a nut, the bolt sequentially passes through the first casing, the circuit board and at least one part of the second casing and is locked to the nut.
In an embodiment of the present disclosure, the first casing has a column, the second casing has a groove, and the column is inserted into the groove.
In an embodiment of the present disclosure, the notch is disposed on a side of the second casing facing the circuit board, the notch is disposed on a side of the second casing facing the docking area, and the notch communicates with the second slot.
In an embodiment of the present disclosure, the bus connection wire forward soldering structure further includes a connector installed on a side of the circuit board corresponding to the outgoing line direction and electrically connected to the docking area.
In an embodiment of the present disclosure, the main body section includes a slope section and a level section, the slope section is slantingly connected between the second attaching section and the level section to make the level section bypass the outer periphery of the connector.
The bus connection wire forward soldering structure of the present disclosure adopts the forward soldering method to electrically connect the solder terminal of flat cable to the solder area of the first surface, so that the first attaching section of the flat cable is flatly attached to the first surface, and the flat cable is reversely folded and bent from the first surface of the circuit board to let the second attaching section be attached to the second surface. In this way, the main body section may extend along the outgoing line direction and face toward the same direction as the solder terminal, so as to achieve the reverse wiring effect, while avoiding the direct reverse soldering of the flat cable, which may cause extra paths for signals to travel during transmission and produce a stub effect leading to the problems of signal attenuation and impedance mismatch.
In the description of the present disclosure, it is to be understood that the terms “front side”, “rear side”, “left side”, “right side”, “front end”, “rear end”, “end”, “vertical”, “horizontal”, “top”, “bottom”, etc. indicate an orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are provided for the purposes of describing the present disclosure and simplifying the description only, but not intended for indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the present disclosure.
As used herein, terms such as “first”, “second”, “third”, “fourth” and “fifth” are used to describe elements, components, regions, layers and/or parts, but the elements, components, regions, layers and/or parts should not be restricted by these terms. These terms are only used to distinguish an element, component, region, layer or part from another, and the use of these terms including “first”, “second”, “third”, “fourth” and “fifth” in this specification does not imply their order or sequence unless the context clearly indicates otherwise.
The features and technical contents of the present disclosure will become apparent from the following detailed description taken with the accompanying drawing. It is intended that the embodiments and drawing disclosed herein are to be considered illustrative rather than restrictive.
The present disclosure provides a bus connection wire forward soldering structure. With reference to
In
In
It is noteworthy that “the first attaching section 22 is substantially attached to the first surface 11” refers to the arranging manner of the first attaching section 22, that is, there is still a possibility of having a very small gap between the first attaching section 22 and the first surface 11, instead of the configuration of first attaching section 22 being completely attached and fixed to the first surface 11. The same applies to the second attaching section 24 that is substantially attached to the second surface 12, and here is omitted for brevity. In
In
In this embodiment, the main body section 25 includes a slope section 251 and a level section 252, but the present disclosure is not limited to such arrangement only. The slope section 251 is slantingly connected between the second attaching section 24 and the level section 252, so that the level section 252 bypasses the outer edge of the connector 40 without producing interference. The notch 31 allows the fixing member 30 to have a clearance space, so that the second attaching section 24 and the slope section 251 of the flat cable 20 have enough space to bend and tilt, thus avoiding the flat cable 20 from being damaged, excessively deformed, or failed due to signal obstruction at the bending position between the second attaching section 24 and the slope section 251. It is noteworthy that in other embodiments not shown in the figures, if the connector 40 is directly installed on the first surface 11, the main body section 25 may no longer need the slope section 251, and the level section 252 may be straightly attached to the second surface 12 and extended outward along the outgoing line direction D.
In the bus connection wire forward soldering structure of the present disclosure, the forward soldering method is adopted to electrically connect the plurality of solder terminals 21 of the flat cable 20 to the solder area 13 on the first surface 11 of the circuit board 10, so that the first attaching section 22 of the flat cable 20 is flatly attached to the first surface 11, and the flat cable 20 is reversely folded and bent from the first surface 11 of the circuit board 10 to allow the second attaching section 24 to be flatly attached to the second surface 12, and let the main body section 25 extend along the outgoing line direction D and in the same facing direction of each solder terminal 21, so as to achieve the reverse wiring effect, and avoid the problems of signal attenuation and impedance mismatch caused by a stub effect produced when the bus connection wire requires a reverse wiring of the flat cable 20 and the need for the signals to travel extra paths during transmission.
With reference to
In this embodiment, the notch 31 is disposed on a side of the second fixing portion 33 facing the docking area 14. In some embodiments, the notch 31 completely penetrates a side of the second fixing portion 33 facing the docking area 14 in a horizontal direction. In the cross-sectional view of
With reference to
In this embodiment, the fixing member 30 includes a first casing 35 and a second casing 36. The first casing 35 has a first slot 351 formed on a side facing the circuit board 10. The second casing 36 has a second slot 361 formed on a side facing the circuit board 10. The first casing 35 and the second casing 36 jointly clamp the upper and lower sides of the circuit board 10. In this embodiment, the first casing 35 is disposed corresponding to the first surface 11, the second casing 36 is disposed corresponding to the second surface 12, but the present disclosure is not limited to such arrangement. For example, the first casing 35 is disposed corresponding to the second surface 12, and the second casing 36 is disposed corresponding to the first surface 11. The solder terminal 21, first attaching section 22, folding section 23 and second attaching section 24 are contained in the first slot 351 and the second slot 361 and thus protected by the first casing 35 and the second casing 36, and may not be interfered with the first casing 35 and the second casing 36.
This embodiment further includes at least one bolt 50 and at least one nut 60 with the quantity corresponding to that of the bolt 50. The bolt 50 sequentially passes through the first casing 35, the circuit board 10 and at least one part of the second casing 36 and is locked to the nut 60, so as to forcibly press the first casing 35 and second casing 36 to securely clamp the circuit board 10. Specifically, the circuit board 10 has at least one via 16, the first casing 35 and the second casing 36 have at least one counterbore 37 respectively, and the counterbore 37 of the first casing 35 and the counterbore 37 of the second casing 36 are configured to be opposite to each other as shown in
In addition, the first casing 35 has at least one column 352, the second casing 36 has at least one groove 362 with a quantity corresponding to that of the columns 352. The column 352 is inserted into the groove 362 to fix the first casing 35 and the second casing 36 without vertical and horizontal movements. In this embodiment, the quantity of bolts 50, nuts 60, columns 352 and grooves 362 at one of the ends of the flat cable 20 is two, and each bolt 50, each nut 60, each column 352 and each groove 362 are evenly disposed on two sides of the solder area 13, so that each bolt 50 and each nut 60 evenly exert a force onto the first casing 35 and the second casing 36, and each bolt 50, each nut 60, each column 352 and each groove 362 are jointly provided for preventing the first casing 35 and the second casing 36 from rotating moving vertically, or moving horizontally relative to each other. This embodiment of the present disclosure adopts a plurality of bolts 50, nuts 60, columns 352 and grooves 362, but other embodiments having is only one bolt 50, one nut 60, one column 352 and one groove 362 still has the effect of preventing the first casing 35 and the second casing 36 from rotating, moving vertically, and moving horizontally relative to each other.
In
With reference to
In this embodiment, the connector 40 is installed on the first surface 11 of the circuit board 10, and there are two docking areas 14 disposed on the first surface 11. Specifically, the connector 40 has a plurality of connecting terminals 41 extended from two sides of the bottom of the connector 40, such that each connecting terminal 41 is connected to two docking areas 14 to form an electrical connection. In this way, the connector 40 of this embodiment is located on the first surface 11, so that after the flat cable 20 is bent from the first surface 11 to the second surface 12, the main body section 25 of the flat cable 20 does not need to be tilt to bypass the connector 40 as the first embodiment does, but the main body section 25 is directly attached to the second surface 12 of the circuit board 10 and the cable can be pulled out along the outgoing line direction D.
In the bus connection wire forward soldering structure of the present disclosure, the plurality of solder terminals 21 of the flat cable 20 is electrically connected to the solder area 13 on the first surface 11 of the circuit board 10, and the flat cable 20 is folded and bent from the first surface 11 of the circuit board 10, so that the main body section 25 is extended along the outgoing line direction D and in the same direction of each solder terminal 21 faces, so as to achieve the reverse wiring effect and avoid the problems of signal attenuation and impedance mismatch caused by a stub effect produced when the bus connection wire requires a reverse wiring of the flat cable 20 and the need for the signals to travel extra paths during transmission. In addition, the fixing member 30 is provided for covering and fixing the solder terminal 21, the first attaching section 22, the folding section 23 and the second attaching section 24 of the flat cable 20 and preventing them from shaking, and the notch 31 formed on the fixing member 30 of the second surface 12 and disposed at the junction of the second attaching section 24 and the main body section 25 provides a clearance space for the flat cable 20 to bend and tilt.
While this disclosure has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of this disclosure set forth in the claims.
Number | Date | Country | Kind |
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112210754 | Oct 2023 | TW | national |