Claims
- 1. A method of forming a bussing block comprising
- (1) providing a plurality of wafers, each of said wafers including a plurality of first apertures, and electrically insulative collars extending from each of said wafers around said first apertures,
- (2) providing a plurality of electrical buss bars, each of said buss bars having a plurality of second apertures therein and spring tabs extending into said second apertures,
- (3) removing selected ones of said collars,
- (4) removing selected ones of said spring tabs,
- (5) assembling said electrical buss bars on said wafers such that those of said second apertures having their spring tabs removed fit around the remaining collars, and
- (6) stacking said wafers with said buss bars one on top of the other such that all of said first and second apertures are aligned.
- 2. A method of forming a bussing block comprising
- (1) providing at least one wafer having a plurality of first apertures, and electrically insulative collars extending from said one wafer around said first apertures,
- (2) providing a plurality of electrical buss bars, each of said buss bars having a plurality of second apertures therein and spring tabs extending into said second apertures,
- (3) removing selected ones of said collars,
- (4) removing selected ones of said spring tabs, and
- (5) assembling said electrical buss bars on said one wafer such that those of said second apertures having their spring tabs removed fit around the remaining collars.
Parent Case Info
This application is a continuation-in-part of application Ser. No. 06,595,684, filed 4-2-84 now abandoned.
US Referenced Citations (4)
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
595684 |
Apr 1984 |
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