1. Technical Field
The disclosure generally relates to cooling systems, particularly to a cabinet including a cooling system for dissipating heat generated by servers in the cabinet.
2. Description of Related Art
Many electronic components in a server generate heat when operating. In designing a cabinet for containing multiple servers, a number of fans are positioned in the servers for dissipating heat generated by the servers.
However, all the fans are usually the same air output, but each server might produce different amounts of heat. When heat generation is low the same amount of power is used to operate the fans as when there is a lot of heat generated. Therefore, power will be wasted.
Therefore, there is room for improvement within the art.
Many aspects of the embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the exemplary cabinet with cooling system. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views. Wherever possible, the same reference numbers are used throughout the drawings to refer to the same or like elements of an embodiment.
Referring to
The chassis 10 includes a first side 11 (e.g. front side) and a second side 12 (e.g. back side) opposite to the first side 11. The chassis 10 defines a receiving chamber 13 communicating with the first side 11 and the second side 12. A number of slidable guides (not shown) are positioned in inner walls of the receiving chamber 13.
The first cooling module 20 is mounted on the second side 12 for dissipating heat generated by the server module 30. The first cooling module 20 includes a frame 21 and a number of first fans 22. The frame 21 is used for holding the first fans 22. The frame 21 is positioned on the second side 12, and is adjacent to the server module 30 in the chassis 10. The first fans 22 are mounted on the frame 21 for dissipating heat. In this exemplary embodiment, the first fans 22 each have the same power consumption and air output, and are arranged in a five by three matrix.
The server module 30 is received in the chassis 10 from the first side 11. In this exemplary embodiment, the server module 30 includes four servers 32. Conventional slidable guides (not shown) allow each server 32 to be easily slid in and out of the module 30. The first fans 22 operate together to dissipate heat generated by the servers 32.
The second cooling modules 40 are used for assisting to dissipate heat in the servers 32. Several second cooling modules 40 are assembled inside each server 32. The number of cooling modules 40 depends on the quantity of heat generating components 33 in the server 32. For example, a cooling module 40 can be installed for each CPU and each power supply in each server 32. Each second cooling module 40 includes a second fan 41 and a temperature sensor 42. The temperature sensor 42 is electronically connected to a control processor of the second fan 41. The temperature sensor 42 can detect a temperature of the corresponding component 33, and transmit a signal to the control processor of the second fan 41 for activating/deactivating the second fan 41.
In use, when the servers 32 are operating, the first cooling module 20 also operates. The first fans 22 of the first cooling module 20 direct air flow to each server 32 for dissipating heat. If temperature sensors 42 detect temperatures of the components 33 are lower than a predetermined temperature value, only the first cooling module 20 will operate and the second cooling modules 40 will remain off. If the temperature sensors 42 detect that the temperatures of the components 33 are at or above the predetermined temperature, the detecting temperature sensor/s 42 will transmit a signal to the corresponding control processor's of the second fans 41 for starting the second fan 41. Thus, the second fans 41 assist to dissipate heat for the overheating electronic components. With two levels of heat dissipation, power will not be wasted because the second modules 40 will only be brought online as needed for excess heat generation by components 33.
It is to be understood, however, that even through numerous characteristics and advantages of the disclosure have been set forth in the foregoing description, together with details of the system and function of the disclosure, the disclosure is illustrative only, and changes may be made in detail, especially in the matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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201110432403.X | Dec 2011 | CN | national |