1. Field of the Invention
The present invention relates to a cable connecting structure for connecting a cable to a substrate.
2. Description of the Related Art
A well-known coaxial cable connecting structure includes a printed substrate having a slit formed on an upper surface thereof and connection patterns formed on both sides of the slit for connecting an external conductor (see Japanese Patent Application Laid-open No. 2001-68175). The technology of Japanese Patent Application Laid-open No. 2001-68175 enables placing the external conductor of the coaxial cable in the slit formed on the printed substrate and connecting the external conductor to the connection patterns on both sides of the slit; therefore, the height necessary for attaching the coaxial cable is reduced by the depth of the slit.
A cable connecting structure according to one aspect of the present invention includes: a cable that includes a conductive film formed on a surface of a core line exposed at a distal end surface; and a substrate that includes an electrode formed on a predetermined connection side surface for connecting the cable. The distal end surface of the cable and the connection side surface of the substrate are arranged so as to face each other. The conductive film formed on the surface of the core line and the electrode are connected by a conductive material.
A cable connecting structure according to another aspect of the present invention includes: a cable that includes a core line exposed at a distal end surface; and a substrate that includes an electrode formed on a predetermined connection side surface for connecting the cable. The distal end surface of the cable and the connection side surface of the substrate are connected by a conductive material.
The above and other features, advantages and technical and industrial significance of this invention will be better understood by reading the following detailed description of presently preferred embodiments of the invention, when considered in connection with the accompanying drawings.
Preferred embodiments of a cable connecting structure according to the present invention will be explained below with reference to the accompanying drawings. It should be noted that the present invention is not limited to the following embodiments. The same components illustrated in the drawings are denoted with the same reference numerals.
The coaxial cable 1 includes an external conductor 14 that is formed around the outer circumference of a center conductor 12 with an inner insulator 13 therebetween. The external conductor 14 is a shielded line and the center conductor is a core line. The coaxial cable 1 further includes an external insulator 15 around the outer circumference of the external conductor 14. A conductive film 21 is formed on a part of the center conductor 12 exposed at the distal end surface 11 of the coaxial cable 1 to flatten the exposed part (the distal end) of the center conductor 12. Moreover, a conductive film 23 is concentrically formed along a part of the external conductor 14 that is exposed to flatten the exposed part (the distal end) of the external conductor 14. The conductive films 21 and 23 are metallic films formed by electrolytic plating, non-electrolytic plating, or spattering. The conductive films 21 and 23 can be either single layered or multilayered. An Au→Ni multilayered film, in which the Au layer is outermost, is preferable because the strength of the joint with the connection side surface 31 of the substrate 3 is increased. If a Ni—Au multilayered film is used, connection to the connection side surface 31 of the substrate 3 can be made in various manners that include not only a later-described connection using an anisotropic conductive material, such as ACF and ACP, but also a solder bump connection and an Au bump connection and the variety of connection manners is increased.
As illustrated in
The distal end surface 11 of the coaxial cable 1 is electrically and physically connected to the connection side surface 31 of the substrate 3 by an anisotropic conductive material (not shown), such as ACF and ACP. That is, in order to connect them, the distal end surface 11 and the connection side surface 31 are first arranged so as to face each other with an anisotropic conductive material therebetween; the conductive film 21 faces the center conductor connecting electrode 311; and the conductive film 23 faces the external conductor connecting electrode 313. After that, heat and pressure are applied to the anisotropic conductive material, with which the conductive film 21 is connected to the center conductor connecting electrode 311 and the conductive film 23 is connected to the external conductor connecting electrode 313; thus, the distal end surface 11 is joined to the connection side surface 31. Solder bumps and Au bumps can be used to connect the conductive film 21 to the center conductor connecting electrode 311 or to connect the conductive film 23 to the external conductor connecting electrode 313.
As described above, according to the first embodiment, the conductive film 21 is formed on a part of the center conductor 12 that is exposed at the distal end surface 11 of the coaxial cable 1 to flatten the center conductor 12 and the conductive film 23 is formed on a part of the external conductor 14 that is exposed at the distal end surface 11 to flatten the external conductor 14, while the center conductor connecting electrode 311 and the external conductor connecting electrode 313 are formed on the connection side surface 31 of the substrate 3. Then, the distal end surface 11 is joined to the connection side surface 31 with, for example, an anisotropic conductive material between them. With this configuration, the height of the attaching portion of the coaxial cable 1 to the substrate 3 decreases to a value equal to or less than the thickness of the substrate 3 or the outer diameter of the coaxial cable 1. With the example of
The distal end surface 11 of the coaxial cable 1 is electrically and physically connected to the connection side surface 31b of the substrate 3b by an anisotropic conductive material (not shown), such as ACF, in a manner similar to the first embodiment. That is, in order to connect them, the distal end surface 11 and the connection side surface 31b are first arranged so as to face each other with an anisotropic conductive material therebetween; the conductive film 21 faces the center conductor connecting electrode 311; and the conductive film 23 faces the external conductor connecting electrode 313. After that, heat and pressure are applied to the anisotropic conductive material, with which, the conductive film 21 is connected to the center conductor connecting electrode 311 and the conductive film 23 is connected to the external conductor connecting electrode 313; thus, the distal end surface 11 is joined to the connection side surface 31b.
In the second embodiment, after the distal end surface 11 is joined to the connection side surface 31b as described above, the coaxial cable 1 is bent at a distal end nearby T that is encircled by the dotted line of
As described above, the second embodiment has the same effect of the first embodiment. Moreover, because the connection side surface 31b of the substrate 3b is an inclined surface, it is possible to form the electrodes 331 and 333 on the main surface 33 and the center conductor connecting electrode 311 and the external conductor connecting electrode 313 on the connection side surface 31b at the same time during the same process, which reduces the manufacture costs.
The substrate 3b is not limited to a silicon substrate. It can also be, for example, a ceramic substrate, etc. If the substrate 3b is a ceramic substrate, a ceramic layer that has an electrode layer formed at an edge part thereof can be formed as an electrode that is formed on a connection side surface (inclined surface) to which the coaxial cable 1 is connected.
A conductive film 21c is formed on a part of the center conductor 12 that is exposed at the distal end surface 11c of the coaxial cable 1c to flatten the exposed part (the distal end) of the center conductor 12 at the angle of the connection side surface 31b. Moreover, a conductive film 23c is concentrically formed along a part of the external conductor 14 that is exposed to flatten the exposed part (the distal end) of the external conductor 14 at the angle of the connection side surface 31b.
Because the distal end surface 11c of the coaxial cable 1c is an inclined surface and the conductive films 21c and 23c are formed at the angle of the distal end surface 11c, i.e., the angle of the connection side surface 31b of the substrate 3c, the areas of the conductive films 21c and 23c are larger than those of the conductive films 21 and 23 of the first and second embodiments. In the third embodiment, electrodes 311c and 313c that are formed on the connection side surface 31b have larger areas than those of the electrodes of the first and second embodiments in accordance with the areas of the conductive films 21c and 23c.
The distal end surface 11c of the coaxial cable 1c is electrically and physically connected to the connection side surface 31b of the substrate 3c by an anisotropic conductive material (not shown), such as ACF, in a manner similar to the first embodiment. That is, in order to connect them, the distal end surface 11c and the connection side surface 31b are first arranged so as to face each other with an anisotropic conductive material therebetween; the conductive film 21c faces the center conductor connecting electrode 311c; and the conductive film 23c faces the external conductor connecting electrode 313c. After that, heat and pressure are applied to the anisotropic conductive material, with which the conductive film 21c is connected to the center conductor connecting electrode 311c and the conductive film 23c is connected to the external conductor connecting electrode 313c; thus, the distal end surface 11c is joined to the connection side surface 31b.
As described above, the third embodiment has the same effects of the first and second embodiments. Moreover, because the distal end surface 11c of the coaxial cable 1c is an inclined surface that has an angle substantially equal to the angle of the connection side surface 31b of the substrate 3c, it is possible to increase the areas of the conductive films 21c and 23c to be larger than those of the conductive films of the first and second embodiments. Moreover, it is possible to increase, in accordance with the areas of the conductive films 21c and 23c, the areas of the center conductor connecting electrode 311c and the external conductor connecting electrode 313c on the connection side surface 31b to be larger than those of the electrodes of the first and second embodiments. With this configuration, the area where the conductive film 21c is connected to the center conductor connecting electrode 311c and the area where the conductive film 23c is connected to the external conductor connecting electrode 313c are increased and the connection strength is increased.
In the first to third embodiments, examples are described that a single coaxial cable is connected to a substrate. In contrast, the present invention can be applied to an example that two or more coaxial cables are connected to a substrate.
As illustrated in
As illustrated in
The pitch between the center conductor connecting electrode 311d and the external conductor connecting electrode 313d is set in accordance with the connection pitch of the coaxial cables 1d. As illustrated in
The external conductor connecting electrodes 313d are formed at positions opposed to the conductive films 23 formed on the exposed parts of the external conductors 14, respectively. More particularly, the width of each of the external conductor connecting electrodes 313d is set depending on the width of the external conductors 14 in a radial direction so as to face the external conductors 14 of adjacent coaxial cables 1d, so that the external conductors 14 of adjacent coaxial cables 1d face the same external conductor connecting electrode 313d. The size of each of the external conductor connecting electrodes 313d is set in accordance with, for example, the diameter of the center conductor 12 and the diameter of the external conductor 14. For example, each of the external conductor connecting electrodes 313d is formed such that the length of each side is less than the width between the outer circumference of the center conductor 12 and the outer circumference of the external conductor 14 in the radial direction. With this configuration, a short circuit cannot occur caused by a contact of the external conductor connecting electrodes 313d to the center conductors 12.
Moreover, an insulator layer 4 is formed on the connection side surface 31d of the substrate 3d in a section upward of the center conductor connecting electrodes 311d and the external conductor connecting electrodes 313d to cover the wiring patterns 351d and 353d. As illustrated in
The distal end surface 11 of each of the coaxial cables 1d is electrically and physically connected to the connection side surface 31d of the substrate 3d by an anisotropic conductive material (not shown), such as ACF, in a manner similar to the first embodiment. That is, in order to connect them, the distal end surface 11 and the connection side surface 31d are arranged so as to face each other with an anisotropic conductive material therebetween. Then, as illustrated in
As described above, according to the fourth embodiment, it is possible to connect the coaxial cables 1d to the substrate 3d without increasing the height of the attaching portion of the coaxial cables 1d.
Although examples are described in the above embodiments that a coaxial cable(s) is connected to a substrate, the present invention is not limited thereto. It is also applicable to any type of cables other than coaxial cables.
Additional advantages and modifications will readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details and representative embodiments shown and described herein. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.
Number | Date | Country | Kind |
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2009-293444 | Dec 2009 | JP | national |
This application is a continuation of PCT international application Ser. No. PCT/JP2010/072017 filed on Dec. 8, 2010 which designates the United States, incorporated herein by reference, and which claims the benefit of priority from Japanese Patent Application No. 2009-293444, filed on Dec. 24, 2009, incorporated herein by reference.
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Number | Date | Country | |
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Parent | PCT/JP2010/072017 | Dec 2010 | US |
Child | 13525410 | US |