1. Field of the Invention
This invention generally relates to a cable connector assembly with plural rows of wires, and more particularly, to a cable connector assembly having a wire management member with a low profile.
2. Description of the Prior Art
Developed by Sony, Hitachi, Thomson (RCA), Philips, Matsushita (Panasonic), Toshiba and Silicon Image, the High-Definition Multimedia Interface (HDMI) has emerged as the connection standard for HDTV and the consumer electronics market. HDMI is the first and only digital interface to combine uncompressed high-definition video, multi-channel audio and intelligent format and command data in a single digital interface.
According to the connection standard of HDMI, an HDMI cable assembly generally comprises an insulative housing having a plurality of passages, a plurality of contacts disposed in the housing, a shielding shell surrounding the housing, a cable having a plurality of conductors terminated to the contacts and an insulated protecting cover molded over joint portions of the cable and the contacts. In addition, a spacer is provided to seal up rear openings of the passages during molding of the protecting cover. Generally, the spacer defines a plurality of though holes permitting tail portions of the contacts passing through to solder with the conductors of the cable. For achieving desired soldering effect, the tail portions and the conductors are supported by a rearwardly extending supporting plate.
It is an object of the present invention to provide a cable connector assembly having a wire management member with a low profile.
In order to attain the object above, a cable connector assembly according to the present invention comprises two rows of conductive terminals held in an insulative housing, a plurality of wires electrically connecting with the corresponding conductive terminals, and upper and lower spacers behind the insulative housing to arrange the wires in order. A plurality of first partitions protrude upwards from top surface of the upper spacer to form a plurality of first slots for receiving a group of the wires, and a plurality of second partitions protrude downwards from bottom surface of the lower spacer to form a plurality of second slots for receiving another group of the wires.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description of the present embodiment when taken in conjunction with the accompanying drawings.
The features of this invention which are believed to be novel are set forth with particularity in the appended claims. The invention, together with its objects and the advantages thereof, may be best understood by reference to the following description taken in conjunction with the accompanying drawings, in which like reference numerals identify like elements in the figures and in which:
Reference will now be made in detail to the preferred embodiment of the present invention.
Please referring to
The housing 1 comprises a trapezoid space 11 formed by four walls in the front for receiving a complementary connector (not shown), and a rectangular space 12 at the rear end for receiving the PCB 3 therein. Two rows of terminal passages 13 are formed in upper and bottom walls of the housing 1, and communicate with the trapezoid space 11 and the rectangular space 12.
The terminals 2 are inserted into the terminal passages 13 from the rectangular space 12, with elastic contact portions 21 in the front of the terminals 2 inserted into the trapezoid space 11, and tail portions 22 in the rear to connect with the PCB 3. A plurality of barbs 23 are formed with the middle of each of the terminals 2 to hold the terminal 2 in the housing 1.
The PCB 3 defines upper and lower surfaces, each of the upper and lower surfaces forming a plurality of first conductive traces 31 at the front, a plurality of second conductive traces 32 at the rear, and a plurality of circuit lines 33 to connect the corresponding first and second conductive traces. The space between adjacent first conductive traces 31 is equal to that of adjacent conductive terminals 2 so as to facilitate to solder the terminals 2 to the first conductive traces 31. The space between adjacent second conductive traces 32 is larger so that it is easy to solder the wires 60 to the second conductive traces 32.
In this preferred embodiment, this built-in PCB 3 not only provide general signal transmission, but also is installed some function components, chips on to meet the needs of manufacturers or designers.
The wire management member is composed of upper and lower spacers 41, 42. From top surface of the upper spacer 41 a plurality of convex bars 411 protrude upwards along the wires 60 to form a plurality of slots 410, so as to accept and manage the wires 60. Similarly, a plurality of convex bars 421 protrude downwards along the wires 60 from bottom surface of the lower spacer 42 to form a plurality of slots 420, so as to accept and manage the wires 60.
A pair of locking arms 412 protrude downwards from both sides of bottom surface of the upper spacer 41, and each has an expansion 413 in the front. A pair of grooves 422 are formed at both sides of the lower spacer 42 to interferentially receive the locking arms 412, and each forms a narrow neck 423 to prevent the expansion 413 from withdrawing from the groove 422, so as to fix the upper and lower spacers 41, 42 together. Guide portions 413, 423 are formed to lead the expansions 413 through the narrow necks 423.
In assembly, firstly, arrange the wires 60 in the corresponding slots 410, 420 of the upper and lower spacers 41, 42, with the front end of the wires 60 exposed in front of the slots 410, 420 to facilitate removal of outer insulators 61 of the wires 60. Secondly, Put a dab of glue in each slots 410, 420 to fix the wires 60 in the upper and lower spacers 41, 42. Thirdly, remove the outer insulator 61 of the front end of the wires 60 by Laser Machining to expose inner conductors 62 outside. Fourthly, assemble the upper and lower spacers 41, 42 together, and solder the inner conductors 62 onto the PCB 3. 100221 The metal shell 5 is stamped by a metal sheet and has an elongate base plate 51 with a through hole 510. A box portion 52 enclosed by several sidewalls is formed in the front of the metal shell 5 to receive the insulative housing 1. A pair of side walls 53 extend upwards from both sides of the rear of the base plate 51, and forms a pair of retention portion 531 to engage with a cover shell (not shown) which is used to cover the rear of the metal shell 5. Finally, a casing (not shown) is molded over the rear end of the metal shell 5, the cover shell and the cable 6. In this preferred embodiment, the detail of the cover shell and the casing is not shown, but is similar to corresponding parts of Chinese Patent No. 200420028550.
Note that the slots 410, 420 are formed in outer surfaces of the wire management member, and it is useful to reduce the height of the wire management member. As the wires 60 received in the slots 410, 420 are needed to be soldered to corresponding terminals 2 or conductive traces 32, the space between upper and lower rows of slots 410, 420 is almost changeless, equal to that of adjacent rows of terminals or traces. Therefore, to reduce the height of the wire management member, it is necessary to reduce other dimensions that exclude the space between upper and lower rows of slots 410, 420. It is obvious that the height of the wire management member is minimum, almost equal to the space between upper and lower rows of slots 410, 420, in condition that the slots 410, 420 are formed in outer surfaces of the wire management member. On the other hand, it is easy and convenient to have the upper spacer 41 and the lower spacer 42 respectively assembled with the corresponding upper row wires and lower row wires and successively assembled to each other as the final assembly. It is noted that according to
It is to be understood, however, that even though numerous, characteristics and advantages of the present invention have been set fourth in the foregoing description, together with details of the structure and function of the invention, the disclosed is illustrative only, and changes may be made in detail, especially in matters of number, shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
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