1. Field of the Invention
The present invention generally relates to a cable connector assembly, and more particularly to a cable connector assembly for high-speed signal transmission.
2. Description of Related Art
For high-speed signal transmission electrical connectors, EMI and wire management are two most significant problems to be solved since such electrical connector usually has a large number of wires to transmit signals which need to be managed. Infiniband connector is a kind of high-speed signal transmission connector which comprises an insulative housing, a plurality of signal and ground terminals retained in the insulative housing, a spacer assembled to the housing and the terminals, a plurality of wires each comprising a signal differential pair transmitting positive and negative signals and a grounding conductor. The wires are managed by the spacer with the signal differential pairs and the grounding conductors respectively electrically connecting with the signal and ground terminals. Additionally, for depressing EMI, a grounding plate is adopted to electrically connect with the ground terminals and the grounding conductors.
Such features are disclosed in U.S. Pat. Nos. 6,685,501, 6,726,503, 6,764,342, 6,869,308, and 6,739,904. As for U.S. Pat. Nos. 6,685,501, 6,869,308 and 6,739,904, each spacer disclosed therein is a whole piece or a pair of upper and lower halves defines a plurality of aligning holes to permit the penetration of wires for aligning the wires. Each spacer is assembled with a large number of ground plates each soldered to corresponding grounding conductors of the wires and ground terminal to depress EMI in signal transmission. However, the number of the ground plates is large which is costly and assembling the so many ground plates to the spacer is time consuming and also costly.
U.S. Pat. No. 6,726,503 discloses an Infiniband type connector with a spacer having upper and lower halves assembled together to align wires and engaging with tail portions of ground terminals with grounding conductors electrically connecting with the tail portions of the ground terminals. U.S. Pat. No. 6,764,342 discloses a whole-piece spacer aligning wires and assembled with a pair of ground plates and short arms of ground terminals with the ground plates directly electrically connecting with grounding conductors of the wires and the short arms of the ground terminals to form electrical connection between the ground terminals and the grounding conductors of the wires. However, the ground terminals of these two connectors all directly connect the ground plates or the grounding conductors of the wires. In some circumstances, a printed circuit board is needed to realize the electrical connection between terminals and wires. The spacers and the ground plates are not suitable for above circumstance. Therefore, a cable connector with improved wire organizer and ground plate is desired to be developed to address above problems.
Accordingly, an object of the present invention is to provide a cable connector assembly with improved wire organizer to achieve wire alignment and EMI depression.
In order to achieve the above-mentioned object, a cable connector assembly in accordance with the present invention comprises a printed circuit board having a plurality of signal and ground pads alternatively arranged at opposite front and rear ends thereof, a conductive wire organizer comprising a body portion defining a plurality of through holes and a plurality of ground plates integrally extending forwardly from the body portion to electrically connecting with the ground pads of the printed circuit board, and a plurality of wires protruding through the through holes of the wire organizer. Each wire comprises at least one signal conductor soldered with the signal pad of the printed circuit board, an insulator enclosing the at least one signal conductor and a conductor layer enclosing the insulator and electrically connecting with the wire organizer.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description of the present embodiment when taken in conjunction with the accompanying drawings.
Reference will now be made to the drawing figures to describe the present invention in detail.
Please refer to
The PCB 2 is a flat board and comprises opposite front and rear ends 21, 22 and opposite upper and lower surfaces 23, 24. A plurality of first and second conductive pads 25, 26 are formed at front and rear ends 21, 22 of the upper and lower surfaces 23, 24. The first and second conductive pads 25, 26 are in pairs along front-to-rear direction and each pair 25, 26 connects to each other by a conductive trace 20. Each set of the first and second conductive pads 25, 26 consist of four sets of signal differential pairs 250, 260 and five ground pads 252, 262 alternatively arranged with the signal differential pairs 250, 260 for assuring signal transmission effect.
The wire organizer 3 is made from conductive material and comprises a rectangular body portion 30 and an upper and lower rows of ground plates 31 extending forwardly from front surface of the body portion 30. The body portion 30 defines upper and lower rows of elliptic-shape through holes 300 each located between adjacent two ground plates 31. The inner periphery of each through hole 300 is same as outer periphery of each wire 4. The upper row of the ground plates 31 are not aligned with the lower row of the ground plates 31, that is to say, each ground plate 31 of the upper row is located in a middle of two ground plates 31 of the lower row along vertical direction. Of course, the through holes 300 of the upper row are not aligned with the through holes 300 of the lower row. A pair of openings 301 are respectively recessed downwardly and upwardly from upper and lower surfaces of the body portion 30 and respectively communicate with the through holes 300 of the upper row and the through holes 300 of the lower row. Each ground plate 31 is substantially of L-shape and comprises a rear wider stop portion 310 connecting with the body portion 30 and a narrower soldering portion 312 extending from upper/lower part of the ground plate of upper/lower row. A slit 311 extends upwardly/downwardly from the joint location of the stop portion 310 and the soldering portion 312 for receiving excessive solder when soldering the ground plates 31 with the ground pads 262 of the PCB 2.
The wires 4 are divided into upper and lower groups corresponding to the through holes 300 of the wire organizer 3, that is, each wire 4 of the upper group is located in the middle of the two adjacent wires 4 of the lower group viewed from up-to-down direction. Such arrangement helps to reduce cross talk in signal transmission. Each wire 4 comprises a pair of signal conductors 40 respectively transmitting positive and negative signals, a pair of insulators 41 respectively enclosing corresponding signal conductors 40, and a conductive layer 42 enclosing the pair of insulators 41 to serve as ground conductor. The front end of the wire 4 is partially stripped to expose the pair of signal conductors 40, the front ends of the pair of insulators 41 along front-to-back direction.
When assembly, the inner mold 5 is firstly molded with the wires 4 to hold the wires 4 together. Then, the wires 4 respectively protrude through the through holes 300 of the wire organizer 3 to fill up the through holes 300 until the front ends of the signal conductors 40 substantially extends to the front edges of the ground plates 31. Thus, front end of each wire 4 exposed beyond the front surface of the wire organizer 3 is located between adjacent ground plates 31. The conductive layers 42 of the wires 4 contact inner peripheries of the through holes 300 to form electrical connection between the wires 4 and the wire organizer 3, and the middle portions of the wires 4 received in the wire organizer 3 are exposed in the openings 301 of the wire organizer 3. A pair of rectangular blocks 6 (for simple illustration, only one rectangular block 6 is shown) which are conductive blocks are pressed into the openings 301 and soldered with the body portion 30 of the wire organizer 3 to press the exposed portions of the wires 4 for adjusting the configurations of the wires 4 to fit in the through holes 300 well. The pair of rectangular blocks 6 also can be glue made from Epoxy Bong spread into the openings 301 fill the openings 301 and position the wires 4 relative to the wire organizer 3. Then, the wires 4 and the wire organizer 3 are assembled to the PCB 2 together with the stop portions 310 abut against the rear end 22 of the PCB 2. The soldering portions 312 of the ground plates 31 and the signal conductors 40 are respectively soldered to the ground pads 262 and the signal differential pairs 260 of the second conductive pads 26 to form electrical connection therebetween. Thus, signal transmission paths and grounding paths are established. The conductive wire organizer 3 has dual-functions, one is aligning and positioning the wires 4, the other is establishing grounding paths to depress EMI in signal transmission. When mating with a complementary connector, the first conductive pads 25 of the PCB 2 may directly electrically connect with terminals of the complementary connector, or soldered with contacts (not shown) assembled into an insulative housing (not shown) of the cable connector assembly of the present invention.
It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
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5281762 | Long et al. | Jan 1994 | A |
6380485 | Beaman et al. | Apr 2002 | B1 |
6489563 | Zhao et al. | Dec 2002 | B1 |
6685501 | Wu et al. | Feb 2004 | B1 |
6726503 | Waddell et al. | Apr 2004 | B2 |
6739904 | Wu | May 2004 | B2 |
6764342 | Murayama et al. | Jul 2004 | B2 |
6869308 | Wu | Mar 2005 | B2 |
7192301 | Kuroda et al. | Mar 2007 | B2 |