1. Field of the Invention
This invention generally relates to a cable connector assembly, and more particularly, to a cable connector assembly with a wire management member for a PCB and wires thereof.
2. Description of the Prior Art
U.S. Pat. No. 6,685,501 B1 discloses a high speed cable connector including a cover, a base and a cable assembly mounted between the cover and the base. The cable assembly includes a cable consisting of a plurality of lines. Each line has a signal pair and a ground conductor. The signal pair includes a pair of upper and lower signal conductors. The ground conductors are soldered to shielding plates. The shielding plates are soldered to top and bottom faces of a rear end of a printed circuit board (PCB). The upper and lower signal conductors of each signal pair are soldered to the top and bottom faces of the rear end of the PCB, respectively, and located between two neighboring shielding plates, whereby cross-talk and interference between two neighboring signal pairs can be effectively suppressed and reduced. The PCB has a front end electrically connecting with contacts for electrically engaging with a complementary connector. However, it is very complicated to solder so many shielding plates onto the PCB.
Hence, an improved cable connector assembly is desired to overcome the above problems.
It is an object of the present invention to provide a cable connector assembly with a wire management member for a PCB.
In order to attain the object above, a cable connector assembly according to the present invention comprises an insulator, a PCB and a wire management member. The insulator comprises a front side, a rear side, a plurality of terminal passages between the front side and the rear side, and a plurality of terminals respectively mounted in the terminal passages, each of the terminals has a tail extended out of the rear side of the insulator. The PCB is located behind the insulator and comprises a plurality of first conductive pads which connect with the corresponding terminals and a plurality of second conductive pads which is soldered to a plurality of wires, the first conductive pads electrically connect with the corresponding second conductive pads. The wire management member is held by the insulator, and defines a plurality of wire management grooves above the PCB and adjacent to the second conductive pads, the wire management grooves receives the corresponding wires for enabling the wires to be respectively soldered to the second conductive pads.
In order to attain the object above, a cable connector assembly according to the present invention comprises an insulator, a PCB and a wire management member. The insulator comprises a front side, a rear side, a plurality of terminal passages between the front side and the rear side, a cavity opening rearwards, and a plurality of terminals respectively mounted in the terminal passages, each of the terminals has a tail extended out of said rear side of the insulator. The PCB is located behind the insulator and comprises a top surface and a bottom surface, the top surface has a plurality of first conductive pads which are soldered to the corresponding terminals, the bottom surface has a plurality of second conductive pads which is soldered to a plurality of wires, the first conductive pads electrically connects with the corresponding second conductive pads. The wire management member comprises a projection and a plurality of wire management grooves extending rearwards from the projection, the projection is received in the cavity to hold the wire management member on the insulator, the wire management grooves are located on the bottom surface of the PCB and adjacent to the second conductive pads, the wire management grooves receives the corresponding wires for enabling the wires to be respectively soldered to the second conductive pads.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description of the present embodiment when taken in conjunction with the accompanying drawings.
The features of this invention which are believed to be novel are set forth with particularity in the appended claims. The invention, together with its objects and the advantages thereof, may be best understood by reference to the following description taken in conjunction with the accompanying drawings, in which like reference numerals identify like elements in the figures and in which:
Reference will now be made in detail to the preferred embodiment of the present invention.
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The wire management board 42 is generally in the same surface, and has a rectangular base and defines in the rear portion thereof a plurality of wire management grooves 421 to align and accommodate front ends of the wires. Each wire management groove 421 is rectangular, and runs through the top and bottom surfaces in the vertical direction to communicate with the PCB 2 and outside, and opens back in the front-to-rear direction to insert the wires into the wire management grooves 421 from the rear-to-front direction. The second conductive pads 52 are respective under the corresponding wire management grooves 421 so that conductive cores 64 of the wires which are received in the wire management grooves 421 stand on and electrically connect with the corresponding second conductive pads 52. The wire management board 42 with wire management grooves 421 can effectively reduce the difficulty of wires array, reduce production time and cost. Moreover, even if the conductive cores 64 received in the wire management grooves 421 may still swing, it can prevent solder bridge by the wire management board 42.
A protruding tab 44 extends backwards from the baffle board 41 and connects with the upper surface of the wire management board 42. In assembly, the rectangular cave 54 of the PCB 5 receives the protruding tab 44 to prevent the PCB from mis-engaging.
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The wires comprise a plurality of power wires (not shown in the Figures) with a large size for power transmission, and a plurality of signal wires 6 with small size for signal transmission. Each power wire is composed of an outer jacket at the outmost thereof, and a conductive core at the innermost thereof. Each signal wire 6 is composed of an outer jacket 61 at the outmost thereof, a grounding layer 62 formed below the outer jacket 61, a pair of inner insulative layers 63 formed below the grounding layer 62, and a pair of conductive cores 64 at the innermost thereof. The grounding layer is a metal braid layer. The outer jacket 61 of each signal wire 6 is stripped off at a front end thereof to expose the grounding layer 62 as being a grounding segment of the wire 6. The grounding segment of each signal wire 40b is then respectively soldered with the third conductive pad 53 of the PCB 5. Each signal wire 6 in part is further stripped off to expose the conductive cores 64 as being a signal segment which extends into the wire-receiving passageways 421 for electrically connecting corresponding second conductive pad 52. Finally, an insulative casing 7 (shown in
It is to be understood, however, that even though numerous, characteristics and advantages of the present invention have been set fourth in the foregoing description, together with details of the structure and function of the invention, the disclosed is illustrative only, and changes may be made in detail, especially in matters of number, shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
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Number | Date | Country | |
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20080171476 A1 | Jul 2008 | US |