All of the material in this patent document is subject to copyright protection under the copyright laws of the United States and other countries. The copyright owner has no objection to the facsimile reproduction by anyone of the patent document or the patent disclosure, as it appears in official governmental records but, otherwise, all other copyright rights whatsoever are reserved.
The present invention relates generally to electronic equipment cabinet structures and enclosures, and, in particular, to top panel for providing cable pass-through in electronic equipment cabinet structures and enclosures.
Equipment enclosures, such as frames, cabinets and the like for supporting computer and other electronic equipment, are very well known. Such equipment enclosures are often partially or fully enclosed, either directly through the use of doors and panels mounted directly thereon. The panel situated at the top of the equipment enclosure is often removed or modified in some manner to accommodate changes in the type or quantity of cables passing into or out of the enclosure.
In many known equipment enclosures, the top panel is installed on the equipment enclosure with the aid of tools. A typical installation process involves the use of a drill or similar tools to secure screws or other fasteners in at least the top four corners of the enclosure frame. In other cases, the top panel fits loosely atop the equipment enclosure and is secured with “push pins” placed to extend through openings in the top panel and engage with the top of the equipment enclosure. A risk associated with such a construction may arise if an installer forgets to engage or otherwise implement such push pins, thereby leaving the enclosure in a condition where the top panel may become inadvertently detached from the enclosure, such as by moving the enclosure. In still other cases, the top panel is permanently affixed to the top of the equipment enclosure through a welding process. As such, a need exists for improvement in the top panel installation process such that a top panel can be installed in an equipment enclosure in a non-permanent manner without the need for tools.
In order to accommodate larger connectors passing through the top panel of known equipment enclosures, portions of the top panel are often physically deformed during the installation process, which can often lead to undesirable results by damaging the integrity of the panel material. As an example, secondary operations—such as the removal of metal material from the top panel—may be necessary to accommodate such larger connectors in known equipment enclosures. As such, a need exists for improvement in top panel construction and design such that the top panel can readily accommodate pass-through of larger connectors without damaging or otherwise affecting the integrity of the top panel.
Accordingly, a need exists for improvement in top panel construction and installation for electronic equipment enclosures. These, and other needs, are addressed by one or more aspects of the present invention.
The present invention includes many aspects and features. Moreover, while many aspects and features relate to, and are described in, the context of enclosures for electronic equipment, the present invention is not limited to use only in enclosures for electronic equipment, as will become apparent from the following summaries and detailed descriptions of aspects, features, and one or more embodiments of the present invention.
Broadly defined, the present invention according to a first aspect includes an electronic equipment enclosure having a frame structure and a top panel tool-lessly secured to an upper portion of the frame structure.
In features of this aspect, the top panel may include one or more panel knockouts configured to be removable from the top panel to provide a pass-through opening for a cable; the one or more panel knockouts may include curved lateral edges; and the one or more panel knockouts may be laser-cut into the top panel.
In further features of this aspect, the top panel may include one or more panel sub-knockouts configured to be removable from the top panel to provide a pass-through opening for a cable; and the one or more panel sub-knockouts may be laser-cut into the top panel.
In still further features of this aspect, the top panel may further include a split brush assembly seated in place of one of the one or more panel knockouts; and the split brush assembly may be snap-fit to the top panel.
In still further features of this aspect, the top panel may include one or more stiffening flanges at an underside thereof; one of the one or more stiffening flanges may include at least one spring pin opening therethrough that corresponds with a spring pin mounted to the frame structure; and a portion of the spring pin may extend through the spring pin opening to tool-lessly secure the top panel to the frame structure.
In still further features of this aspect, the top panel may be securable to the frame structure in either of a front-to-rear orientation or a rear-to-front orientation; and the top panel may include an offset edge at an end thereof for positioning underneath an upper cross member of the frame structure.
Broadly defined, the present invention according to a second aspect includes an electronic equipment enclosure substantially as shown and described.
Broadly defined, the present invention according to a third aspect includes a top panel for securement atop an electronic equipment enclosure. The top panel includes a generally flat sheet composed of a metal-based material and one or more panel knockouts configured to be removable from the top panel to provide a pass-through opening for a cable.
In features of this aspect, the one or more panel knockouts may include curved lateral edges; the one or more panel knockouts may be laser-cut; the top panel may further include one or more panel sub-knockouts configured to be removable from the top panel to provide a pass-through opening for a cable; and the one or more panel sub-knockouts may be laser-cut.
In further features of this aspect, the top panel may further include a split brush assembly seated in place of one of the one or more panel knockouts; and the split brush assembly may be attachable by snap fitting.
In still further features of this aspect, the top panel may further include one or more stiffening flanges at an underside thereof, at least one of which includes at least one spring pin opening; and the top panel may further include an offset edge at an end thereof.
Broadly defined, the present invention according to a fourth aspect includes a top panel for securement atop an electronic equipment enclosure substantially as shown and described.
Broadly defined, the present invention according to a fifth aspect includes a method for tool-lessly installing a top panel atop an electronic equipment enclosure. The method includes providing a top panel having an offset edge at an end thereof and a stiffening flange at an underside thereof with at least one spring pin opening extending therethrough; positioning the top panel relative to a frame structure of an electronic equipment enclosure such that the offset edge slides underneath an upper cross member of the frame structure; engaging the stiffening flange against one or more spring pins mounted to the frame structure to deflect the spring pins; and lowering the top panel onto the frame structure to permit the one or more spring pins to spring back and extend through the one or more spring pin openings of the stiffening flange.
In features of this aspect, the top panel may include one or more panel knockouts configured to be removable from the top panel to provide a pass-through opening for a cable; the one or more panel knockouts may be laser-cut into the top panel; the top panel may include one or more panel sub-knockouts configured to be removable from the top panel to provide a pass-through opening for a cable; the one or more panel sub-knockouts may be laser-cut into the top panel; and the method may further include removing one of the one or more panel knockouts from the top panel and attaching a split brush assembly to the top panel in place of the removed panel knockout.
In a further feature of this aspect, the method may further include unsecuring the top panel from the frame structure and resecuring the top panel in an opposite orientation.
Broadly defined, the present invention according to a sixth aspect includes a method for tool-lessly installing a top panel atop an electronic equipment enclosure substantially as shown and described.
In addition to the aforementioned aspects and features of the present invention, it should be noted that the present invention further encompasses the various possible combinations and subcombinations of such aspects and features. Thus, for example, any aspect may be combined with an aforementioned feature in accordance with the present invention without requiring any other aspect or feature.
Broadly defined, the present invention according to a seventh aspect includes a panel for securement to an electronic equipment enclosure. The panel includes a generally flat sheet composed of a metal-based material and one or more panel knockouts arranged in the generally flat sheet and each configured to be removable therefrom to provide a pass-through opening for a cable.
In features of this aspect, at least one of the one or more panel knockouts may include a central portion having curved lateral edges; at least one of the one or more panel knockouts may include a central portion having stair-stepped lateral edges; at least one of the one or more panel knockouts may include a central portion having chamfered lateral edges; at least one of the one or more panel knockouts includes a vent; and the one or more panel knockouts may be laser-cut.
In further features of this aspect, the panel may further include one or more panel sub-knockouts arranged in the generally flat sheet and configured to be removable therefrom to provide a pass-through opening for a cable; and the one or more panel sub-knockouts may be laser-cut.
In further features of this aspect, the panel may further include a split brush assembly seated in place of a removed one of the one or more panel knockouts; the split brush assembly may be seated by snap fitting to the generally flat sheet; the split brush assembly may include alignment pins inserted within apertures in the generally flat sheet; the split brush assembly may be attached to the generally flat sheet with fasteners; the split brush assembly may include at least two separate frame members, each separately attached to the generally flat sheet; and the split brush assembly may include a unitary structure attached to the generally flat sheet.
In still further features of this aspect, the panel may further include one or more stiffening flanges at an underside thereof, at least one of which includes at least one spring pin opening; the panel may further include an offset edge at an end thereof; the panel may be adapted for securement atop an electronic equipment enclosure; the panel may be adapted for securement to a side of an electronic equipment enclosure; and the panel may be adapted for securement to a bottom of an electronic equipment enclosure.
Broadly defined, the present invention according to an eighth aspect includes an electronic equipment enclosure that includes a frame structure and at least one panel secured to the frame structure. The at least one panel includes one or more panel knockouts arranged therein. Each panel knockout is configured to be removable from the at least one panel to provide a pass-through opening for a cable. The at least one panel further includes a split brush assembly seated in place of a removed one of the one or more panel knockouts.
In features of this aspect, at least one of the one or more panel knockouts may include a central portion having curved lateral edge; at least one of the one or more panel knockouts may include a central portion having stair-stepped lateral edges; at least one of the one or more panel knockouts may include a central portion having chamfered lateral edges; at least one of the one or more panel knockouts includes a vent; and the one or more panel knockouts may be laser-cut into the at least one panel.
In further features of this aspect, the at least one panel may further include one or more panel sub-knockouts arranged in the at least one panel and configured to be removable therefrom to provide a pass-through opening for a cable; and the one or more panel sub-knockouts may be laser-cut into the at least one panel.
In further features of this aspect, the split brush assembly may be seated by snap fitting to the at least one panel; the split brush assembly may include alignment pins inserted within apertures in the at least one panel; the split brush assembly may be attached to the at least one panel with fasteners; the split brush assembly may include at least a pair of frame members, each separately attached to the at least one panel; and the split brush assembly may include a unitary structure attached to the at least one panel.
In still further features of this aspect, the at least one panel may further include one or more stiffening flanges at an underside thereof, at least one of which includes at least one spring pin opening; the at least one panel may further include an offset edge at an end thereof; the at least one panel may include a top panel; the at least one panel may include a side panel; and the at least one panel may include a bottom panel.
Broadly defined, the present invention according to a ninth aspect includes an electronic equipment enclosure that includes a frame structure including at least one spring pin attached thereto, the at least one spring pin having an anchor end attached to the frame structure and a free flex end, and a panel having a flange at an interior-facing side thereof, the flange including at least one spring pin opening. The panel is adapted for tool-less securement to the frame structure by positioning of the at least one spring pin opening against the flex end of the at least one spring pin such that the flex end of the at least one spring pin extends through the at least one spring pin opening.
In features of this aspect, the panel may include one or more panel knockouts configured to be removable from the panel to provide a pass-through opening for a cable; at least one of the one or more panel knockouts may include a central portion having curved lateral edges; at least one of the one or more panel knockouts may include a central portion having stair-stepped lateral edges; at least one of the one or more panel knockouts may include a central portion having chamfered lateral edges; at least one of the one or more panel knockouts includes a vent; the one or more panel knockouts may be laser-cut into the panel; the panel may include one or more panel sub-knockouts configured to be removable from the panel to provide a pass-through opening for a cable; the one or more panel sub-knockouts may be laser-cut into the panel; the panel may further include a split brush assembly seated in place of a removed one of the one or more panel knockouts; the split brush assembly may be snap-fit to the panel; the split brush assembly may include alignment pins inserted within apertures in the panel; the split brush assembly may be attached to the panel with fasteners; the split brush assembly may include at least a pair of frame members, each separately attached to the panel; and the split brush assembly may include a unitary structure attached to the panel.
In further features of this aspect, the panel may be adapted for securement atop the electronic equipment enclosure; the panel may be adapted for securement to a side of the electronic equipment enclosure; the panel may be adapted for securement to a bottom of the electronic equipment enclosure; the panel may be securable to the frame structure in either of a front-to-rear orientation or a rear-to-front orientation; and the panel may include an offset edge at an end thereof for positioning underneath an upper cross member of the frame structure.
Broadly defined, the present invention according to a tenth aspect includes a method for installing a panel in an electronic equipment enclosure. The method includes providing a panel having an offset edge at an end thereof and a stiffening flange at an underside thereof with at least one spring pin opening extending therethrough; positioning the panel relative to a frame structure of an electronic equipment enclosure such that the offset edge slides underneath or inside a member of the frame structure; engaging the stiffening flange against one or more spring pins mounted to the frame structure, thereby deflecting the one or more spring pins; and maneuvering the panel onto the frame structure to permit the one or more spring pins to spring back and extend through the one or more spring pin openings of the stiffening flange.
In features of this aspect, the panel may include one or more panel knockouts configured to be removable from the panel to provide a pass-through opening for a cable; the one or more panel knockouts may be laser-cut into the panel; the panel may include one or more panel sub-knockouts configured to be removable from the panel to provide a pass-through opening for a cable; the one or more panel sub-knockouts may be laser-cut into the panel; the method may further include removing one of the one or more panel sub-knockouts from the panel; the method may further include replacing the removed panel sub-knockout with a vent; the method may further include removing one of the one or more panel knockouts from the panel; the method may further include replacing the removed panel knockout with a split brush assembly; replacing the removed panel knockout with a split brush assembly may include snap-fitting the split brush assembly to the panel; and replacing the removed panel knockout with a split brush assembly may include attaching the split brush assembly to the panel with fasteners.
In further features of this aspect, the method may further include reconfiguring the previously-installed panel by unsecuring the panel from the frame structure and resecuring the panel in an opposite orientation; the panel may be installed atop the electronic equipment enclosure; the panel may be installed at a side of the electronic equipment enclosure; and the panel may be installed at a bottom of the electronic equipment enclosure.
Further areas of applicability of the present invention will become apparent from the detailed description provided hereinafter. It should be understood that the detailed description and specific examples, while indicating the preferred embodiment of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Further features, embodiments, and advantages of the present invention will become apparent from the following detailed description with reference to the drawings, wherein:
As a preliminary matter, it will readily be understood by one having ordinary skill in the relevant art (“Ordinary Artisan”) that the present invention has broad utility and application. Furthermore, any embodiment discussed and identified as being “preferred” is considered to be part of a best mode contemplated for carrying out the present invention. Other embodiments also may be discussed for additional illustrative purposes in providing a full and enabling disclosure of the present invention. Moreover, many embodiments, such as adaptations, variations, modifications, and equivalent arrangements, will be implicitly disclosed by the embodiments described herein and fall within the scope of the present invention.
Accordingly, while the present invention is described herein in detail in relation to one or more embodiments, it is to be understood that this disclosure is illustrative and exemplary of the present invention, and is made merely for the purposes of providing a full and enabling disclosure of the present invention. The detailed disclosure herein of one or more embodiments is not intended, nor is to be construed, to limit the scope of patent protection afforded the present invention, which scope is to be defined by the claims and the equivalents thereof. It is not intended that the scope of patent protection afforded the present invention be defined by reading into any claim a limitation found herein that does not explicitly appear in the claim itself.
Thus, for example, any sequence(s) and/or temporal order of steps of various processes or methods that are described herein are illustrative and not restrictive. Accordingly, it should be understood that, although steps of various processes or methods may be shown and described as being in a sequence or temporal order, the steps of any such processes or methods are not limited to being carried out in any particular sequence or order, absent an indication otherwise. Indeed, the steps in such processes or methods generally may be carried out in various different sequences and orders while still falling within the scope of the present invention. Accordingly, it is intended that the scope of patent protection afforded the present invention is to be defined by the appended claims rather than the description set forth herein.
Additionally, it is important to note that each term used herein refers to that which the Ordinary Artisan would understand such term to mean based on the contextual use of such term herein. To the extent that the meaning of a term used herein—as understood by the Ordinary Artisan based on the contextual use of such term—differs in any way from any particular dictionary definition of such term, it is intended that the meaning of the term as understood by the Ordinary Artisan should prevail.
Furthermore, it is important to note that, as used herein, “a” and “an” each generally denotes “at least one,” but does not exclude a plurality unless the contextual use dictates otherwise. Thus, reference to “a picnic basket having an apple” describes “a picnic basket having at least one apple” as well as “a picnic basket having apples.” In contrast, reference to “a picnic basket having a single apple” describes “a picnic basket having only one apple.”
When used herein to join a list of items, “or” denotes “at least one of the items,” but does not exclude a plurality of items of the list. Thus, reference to “a picnic basket having cheese or crackers” describes “a picnic basket having cheese without crackers,” “a picnic basket having crackers without cheese,” and “a picnic basket having both cheese and crackers.” Finally, when used herein to join a list of items, “and” denotes “all of the items of the list.” Thus, reference to “a picnic basket having cheese and crackers” describes “a picnic basket having cheese, wherein the picnic basket further has crackers,” as well as describes “a picnic basket having crackers, wherein the picnic basket further has cheese.”
Referring now to the drawings, in which like numerals represent like components throughout the several views, the preferred embodiments of the present invention are next described. The following description of one or more preferred embodiment(s) is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses.
Although the particular frame structure 12 described and illustrated herein may include various novel aspects, it will be apparent to the Ordinary Artisan that various aspects of the present invention are likewise applicable to frame structures of generally conventional design and construction. Furthermore, various different connection means may be used to join the various members together. One novel connection means is illustrated in
Still further, it will be evident to the Ordinary Artisan that in at least some embodiments, other structural arrangements may be used to form a frame structure on which panels may be mounted to form an enclosure. For example, in at least one embodiment (not illustrated), a frame structure may be formed from only two support posts.
Referring to
The enclosure further includes a generally flat top panel 30 sized and shaped to fit an opening 28 defined by the four vertical support posts 16 in connection with the upper front cross member 17, the upper rear cross member 19, and the upper side cross members 21. When installed, the top panel 30 covers the opening 28. In a contemplated embodiment, the top panel 30 is manufactured from sheet metal or other metal-based material.
As further shown in
As can be appreciated by the Ordinary Artisan, the top panel 30 can be customized to accommodate different sizes and different quantities of cables and connectors passing therethrough. For smaller cables and lesser quantities of cables, the top panel 30 can be customized by knocking out one or more panel sub-knockouts 38, thereby providing smaller openings 42 to accommodate cables passing therethrough. Likewise, the top panel 30 can be customized to provide larger openings 34 by knocking out one or more panel knockouts 32 so as to accommodate larger cables or higher quantities of cables passing therethrough. In each situation, the top panel 30 can be customized in a manner such that no more of the top panel 30 is removed than is necessary to accommodate the desired size or quantity of cables or connectors. Furthermore, because the panel knockouts 32 and panel sub-knockouts 38 are laser-cut into the top panel 30, they can be removed from the top panel 30 with relative ease during an installation process without the aid of tools. In a contemplated embodiment, the top panel 30 has eight potential panel sub-knockouts 38 for low cable capacity and four panel knockouts 32 for high cable capacity.
As shown in
Spring pins 56 of the type shown in
As shown in
In a contemplated embodiment, depicted in
Based on the foregoing information, it will be readily understood by those persons skilled in the art that the present invention is susceptible of broad utility and application. Many embodiments and adaptations of the present invention other than those specifically described herein, as well as many variations, modifications, and equivalent arrangements, will be apparent from or reasonably suggested by the present invention and the foregoing descriptions thereof, without departing from the substance or scope of the present invention.
Accordingly, while the present invention has been described herein in detail in relation to one or more preferred embodiments, it is to be understood that this disclosure is only illustrative and exemplary of the present invention and is made merely for the purpose of providing a full and enabling disclosure of the invention. The foregoing disclosure is not intended to be construed to limit the present invention or otherwise exclude any such other embodiments, adaptations, variations, modifications or equivalent arrangements; the present invention being limited only by the claims appended hereto and the equivalents thereof.
The present application is a continuation patent application of, and claims priority under 35 U.S.C. § 120 to, U.S. nonprovisional patent application Ser. No. 17/945,000, filed Sep. 14, 2022, which '000 application published on Jan. 19, 2023 as U.S. Patent Application Publication No. US 2023/0013890 A1 and issued on Oct. 17, 2023 as U.S. Pat. No. 11,792,948, which '000 application, its publication, and the patent issuing therefrom are each incorporated by reference herein in their entirety, and which '000 application is a continuation patent application of, and claims priority under 35 U.S.C. § 120 to, U.S. nonprovisional patent application Ser. No. 16/871,879, filed May 11, 2020, which '879 application published on Aug. 27, 2020 as U.S. Patent Application Publication No. US 2020/0275569 A1 and issued on Oct. 4, 2022 as U.S. Pat. No. 11,464,123, which '879 application, its publication, and the patent issuing therefrom are each incorporated by reference herein in their entirety, and which '879 application is a continuation patent application of, and claims priority under 35 U.S.C. § 120 to, U.S. nonprovisional patent application Ser. No. 15/721,811, filed Sep. 30, 2017, which '811 application published on Jan. 25, 2018 as U.S. Patent Application Publication No. US 2018/0027677 A1 and issued on May 12, 2020 as U.S. Pat. No. 10,653,025, which '811 application, its publication, and the patent issuing therefrom are each incorporated by reference herein in their entirety, and which '811 application is a continuation patent application of, and claims priority under 35 U.S.C. § 120 to, U.S. nonprovisional patent application Ser. No. 14/711,211, filed May 13, 2015, which '211 application published on Sep. 3, 2015 as U.S. Patent Application Publication No. US 2015/0250071 A1 and issued on Oct. 3, 2017 as U.S. Pat. No. 9,781,852, which '211 application, its publication, and the patent issuing therefrom are each incorporated by reference herein in their entirety, and which '211 application is a continuation patent application of, and claims priority under 35 U.S.C. § 120 to, U.S. nonprovisional patent application Ser. No. 14/157,349, filed Jan. 16, 2014, which '349 application published on May 15, 2014 as U.S. Patent Application Publication No. US 2014/0132134 A1 and issued on Jun. 9, 2015 as U.S. Pat. No. 9,055,677, which '349 application, its publication, and the patent issuing therefrom are each incorporated by reference herein in their entirety, and which '349 application is a divisional patent application of, and claims priority under 35 U.S.C. § 120 to, U.S. nonprovisional patent application Ser. No. 13/229,705, filed Sep. 10, 2011, which '705 application published on Mar. 15, 2012 as U.S. Patent Application Publication No. US 2012/0062086 A1, which '705 application and its publication are each incorporated by reference herein in their entirety, and which '705 application is a U.S. nonprovisional patent application of, and claims priority under 35 U.S.C. § 119(e) to, U.S. provisional patent application Ser. No. 61/381,905, filed Sep. 10, 2010, which '905 application is incorporated by reference herein in its entirety. Additionally, each of the following U.S. patent applications, and any application publication thereof, is expressly incorporated by reference herein in its entirety: (a) U.S. provisional patent application Ser. No. 61/381,904, filed Sep. 10, 2010, and entitled, “ELECTRONIC EQUIPMENT CABINET STRUCTURE;” (b) U.S. provisional patent application Ser. No. 61/381,909, filed Sep. 10, 2010, and entitled, “RAIL SEAL FOR ELECTRONIC EQUIPMENT ENCLOSURE;” (c) U.S. provisional patent application Ser. No. 61/381,912, filed Sep. 10, 2010, and entitled, “RAIL MOUNTING CLAMP FOR ELECTRONIC EQUIPMENT ENCLOSURE;” (d) U.S. provisional patent application Ser. No. 61/381,918, filed Sep. 10, 2010, and entitled, “VERTICAL MOUNTING RAIL WITH CABLE MANAGEMENT FEATURES;” (e) U.S. nonprovisional patent application Ser. No. 13/229,704, filed Sep. 10, 2011, published on Mar. 15, 2012 as U.S. Patent Application Publication No. US 2012/0062084 A1, entitled, “ELECTRONIC EQUIPMENT CABINET STRUCTURE,” and issued on Dec. 2, 2014 as U.S. Pat. No. 8,901,438; (f) U.S. nonprovisional patent application Ser. No. 13/229,706, filed Sep. 10, 2011, published on Mar. 15, 2012 as U.S. Patent Application Publication_No. US 2012/0063099 A1, and entitled, “RAIL SEAL FOR ELECTRONIC EQUIPMENT ENCLOSURE;” (g) U.S. nonprovisional patent application Ser. No. 13/229,707, filed Sep. 10, 2011, published on Mar. 15, 2012 as U.S. Patent Application Publication No. US 2012/0062083 A1, entitled, “RAIL MOUNTING CLAMP FOR ELECTRONIC EQUIPMENT ENCLOSURE,” and issued on Jul. 22, 2014 as U.S. Pat. No. 8,787,023; and (h) U.S. nonprovisional patent application Ser. No. 13/229,708, filed Sep. 10, 2011, published on Mar. 15, 2012 as U.S. Patent Application Publication No. US 2012/0062091 A1, and entitled, “VERTICAL MOUNTING RAIL WITH CABLE MANAGEMENT FEATURES.”
Number | Name | Date | Kind |
---|---|---|---|
1129040 | McClure | Feb 1915 | A |
1919166 | Lavarack | Jul 1933 | A |
2039886 | Cohn | May 1936 | A |
2424217 | Bales | Jul 1947 | A |
2459953 | Mills | Jan 1949 | A |
2616142 | Tinnerman | Nov 1952 | A |
2667368 | Ferguson | Jan 1954 | A |
2676680 | Kindorf | Apr 1954 | A |
2756369 | Gorrie | Jul 1956 | A |
2778000 | Mills | Jan 1957 | A |
2880379 | Stoddart et al. | Mar 1959 | A |
2999190 | Armandroff et al. | Sep 1961 | A |
3034844 | Anderson et al. | May 1962 | A |
3143195 | Schroeder | Aug 1964 | A |
3192306 | Skonnord | Jun 1965 | A |
3265419 | Durnbaugh et al. | Aug 1966 | A |
3355695 | Overesch | Nov 1967 | A |
3404931 | Fall et al. | Oct 1968 | A |
3431590 | Anderson | Mar 1969 | A |
3563627 | Whipps | Feb 1971 | A |
3585333 | Valle et al. | Jun 1971 | A |
3655254 | Mayer et al. | Apr 1972 | A |
3675955 | Hajduk | Jul 1972 | A |
3857625 | Crane et al. | Dec 1974 | A |
4040694 | Lascarrou | Aug 1977 | A |
4101233 | McConnell | Jul 1978 | A |
4148453 | Brantly | Apr 1979 | A |
4495234 | Tominaga et al. | Jan 1985 | A |
4497411 | DeBortoli | Feb 1985 | A |
4551577 | Byrne | Nov 1985 | A |
4553674 | Yoshikawa et al. | Nov 1985 | A |
4592602 | Kuster et al. | Jun 1986 | A |
4643319 | Debus et al. | Feb 1987 | A |
4715502 | Salmon | Dec 1987 | A |
4796541 | Halstrick | Jan 1989 | A |
4814942 | Robirds et al. | Mar 1989 | A |
4825339 | Boudon | Apr 1989 | A |
4869380 | Metcalfe et al. | Sep 1989 | A |
4941717 | Beaulieu | Jul 1990 | A |
4944082 | Jones et al. | Jul 1990 | A |
4962443 | Cole | Oct 1990 | A |
4964020 | Savage et al. | Oct 1990 | A |
4988008 | Blum et al. | Jan 1991 | A |
5004107 | Sevier et al. | Apr 1991 | A |
5009383 | Chapman | Apr 1991 | A |
5020866 | McIlwraith | Jun 1991 | A |
5052565 | Zachrei | Oct 1991 | A |
5149026 | Allen | Sep 1992 | A |
5165770 | Hahn | Nov 1992 | A |
5212907 | Van Sandt | May 1993 | A |
5250752 | Cutright | Oct 1993 | A |
5263252 | Bruggink | Nov 1993 | A |
5275296 | Zachrai | Jan 1994 | A |
5284254 | Rinderer | Feb 1994 | A |
5294748 | Schwenk et al. | Mar 1994 | A |
5310255 | Ranallo | May 1994 | A |
5323916 | Salmon | Jun 1994 | A |
5333950 | Zachrai | Aug 1994 | A |
5372262 | Benson et al. | Dec 1994 | A |
5380083 | Jones et al. | Jan 1995 | A |
5380803 | Coutant et al. | Jan 1995 | A |
5460441 | Hastings et al. | Oct 1995 | A |
5463966 | Nilsson | Nov 1995 | A |
5488543 | Mazura et al. | Jan 1996 | A |
5497444 | Wheeler | Mar 1996 | A |
5498073 | Charbonneau et al. | Mar 1996 | A |
5536079 | Kostic | Jul 1996 | A |
5540339 | Lerman | Jul 1996 | A |
5542549 | Siemon et al. | Aug 1996 | A |
5566836 | Lerman | Oct 1996 | A |
5586012 | Lerman | Dec 1996 | A |
5639150 | Anderson et al. | Jun 1997 | A |
5640482 | Barry et al. | Jun 1997 | A |
5695263 | Simon et al. | Dec 1997 | A |
5713651 | Essig et al. | Feb 1998 | A |
5728973 | Jorgensen | Mar 1998 | A |
5758002 | Walters | May 1998 | A |
5791498 | Mills | Aug 1998 | A |
5798485 | Rohde et al. | Aug 1998 | A |
5806945 | Anderson et al. | Sep 1998 | A |
5806946 | Benner et al. | Sep 1998 | A |
5819956 | Rinderer | Oct 1998 | A |
5833084 | Chang | Nov 1998 | A |
5933563 | Schaffer et al. | Aug 1999 | A |
5938302 | Anderson et al. | Aug 1999 | A |
5954525 | Siegal et al. | Sep 1999 | A |
5961081 | Rinderer | Oct 1999 | A |
5975315 | Jordan | Nov 1999 | A |
5992808 | Morrow | Nov 1999 | A |
5997117 | Krietzman | Dec 1999 | A |
6008621 | Madison et al. | Dec 1999 | A |
6011221 | Lecinski et al. | Jan 2000 | A |
6019446 | Laboch et al. | Feb 2000 | A |
6036290 | Jancsek et al. | Mar 2000 | A |
6039420 | Besserer et al. | Mar 2000 | A |
6044193 | Szetesi et al. | Mar 2000 | A |
6047838 | Rindoks et al. | Apr 2000 | A |
6065612 | Rinderer | May 2000 | A |
6067233 | English et al. | May 2000 | A |
6083010 | Daoud | Jul 2000 | A |
6095345 | Gibbons | Aug 2000 | A |
6103973 | Sharp | Aug 2000 | A |
6118073 | Lau et al. | Sep 2000 | A |
6123203 | Gibbons | Sep 2000 | A |
6123400 | Nicolai et al. | Sep 2000 | A |
6135583 | Simon et al. | Oct 2000 | A |
6155658 | Woodward et al. | Dec 2000 | A |
6179398 | Martin | Jan 2001 | B1 |
6181549 | Mills et al. | Jan 2001 | B1 |
6185098 | Benavides | Feb 2001 | B1 |
6201919 | Puetz et al. | Mar 2001 | B1 |
D440210 | Larsen et al. | Apr 2001 | S |
6223908 | Kurtsman | May 2001 | B1 |
6231142 | Pochet | May 2001 | B1 |
6238029 | Marzec et al. | May 2001 | B1 |
6245998 | Curry et al. | Jun 2001 | B1 |
6254207 | Leneutre | Jul 2001 | B1 |
6282854 | Vos et al. | Sep 2001 | B1 |
6293637 | Anderson et al. | Sep 2001 | B1 |
6299268 | Carle et al. | Oct 2001 | B1 |
6313405 | Rinderer | Nov 2001 | B1 |
6315132 | Hartel et al. | Nov 2001 | B1 |
6321917 | Mendoza | Nov 2001 | B1 |
6327150 | Levy et al. | Dec 2001 | B1 |
6340141 | Rinderer | Jan 2002 | B1 |
6347714 | Fournier et al. | Feb 2002 | B1 |
6349837 | Serban | Feb 2002 | B1 |
6401940 | Hartel et al. | Jun 2002 | B1 |
6410844 | Bruner et al. | Jun 2002 | B1 |
6422399 | Castillo et al. | Jul 2002 | B1 |
6425488 | Notohardjono et al. | Jul 2002 | B1 |
6425648 | Notohardjono et al. | Jul 2002 | B1 |
6481582 | Rinderer | Nov 2002 | B1 |
6489565 | Krietzman et al. | Dec 2002 | B1 |
6502702 | Hsue et al. | Jan 2003 | B1 |
6504100 | Lawrence et al. | Jan 2003 | B2 |
6510589 | Schrage | Jan 2003 | B2 |
6513770 | Franz et al. | Feb 2003 | B1 |
6517174 | Sevier | Feb 2003 | B2 |
6527351 | Sevier et al. | Mar 2003 | B1 |
6541705 | McGrath | Apr 2003 | B1 |
6554697 | Koplin | Apr 2003 | B1 |
6561602 | Sevier et al. | May 2003 | B1 |
6565166 | Bulk et al. | May 2003 | B1 |
6570754 | Foley et al. | May 2003 | B2 |
6601932 | Helgenberg et al. | Aug 2003 | B1 |
6605777 | Anderson et al. | Aug 2003 | B1 |
6605782 | Krietzman et al. | Aug 2003 | B1 |
6629505 | Cronk et al. | Oct 2003 | B1 |
6632999 | Sempliner et al. | Oct 2003 | B2 |
6655534 | Williams et al. | Dec 2003 | B2 |
6695149 | Cote et al. | Feb 2004 | B1 |
6760531 | Solheid et al. | Jul 2004 | B1 |
6769551 | Rafferty et al. | Aug 2004 | B2 |
6785459 | Schmidt et al. | Aug 2004 | B2 |
6788535 | Dodgen et al. | Sep 2004 | B2 |
6791841 | Tirrell et al. | Sep 2004 | B1 |
6796437 | Krampotich et al. | Sep 2004 | B2 |
6796438 | Mendoza | Sep 2004 | B2 |
6796623 | Fontana et al. | Sep 2004 | B1 |
6808240 | Altena | Oct 2004 | B2 |
6814417 | Hartel et al. | Nov 2004 | B2 |
6831225 | Chandler | Dec 2004 | B2 |
6863188 | Besserer et al. | Mar 2005 | B2 |
6866154 | Hartman et al. | Mar 2005 | B2 |
6884942 | McGrath et al. | Apr 2005 | B2 |
6902069 | Hartman et al. | Jun 2005 | B2 |
6920038 | Gehlbach | Jul 2005 | B2 |
6930886 | Velez et al. | Aug 2005 | B2 |
6945616 | Webster et al. | Sep 2005 | B2 |
6992247 | Rasmussen et al. | Jan 2006 | B2 |
7000784 | Canty et al. | Feb 2006 | B2 |
7086707 | Wyatt et al. | Aug 2006 | B2 |
7093725 | Hartman et al. | Aug 2006 | B2 |
7141891 | McNally et al. | Nov 2006 | B2 |
7144320 | Turek et al. | Dec 2006 | B2 |
7168576 | Williams | Jan 2007 | B2 |
7178679 | Canty et al. | Feb 2007 | B2 |
7188735 | Nakagawa et al. | Mar 2007 | B2 |
7204371 | Woolsey et al. | Apr 2007 | B2 |
7255409 | Hu et al. | Aug 2007 | B2 |
7255640 | Aldag et al. | Aug 2007 | B2 |
7285027 | McGrath et al. | Oct 2007 | B2 |
7293666 | Mattlin et al. | Nov 2007 | B2 |
7312980 | Ewing et al. | Dec 2007 | B2 |
7316461 | Wyatt et al. | Jan 2008 | B2 |
7355115 | Liang | Apr 2008 | B2 |
7362941 | Rinderer et al. | Apr 2008 | B2 |
7364243 | Wyatt et al. | Apr 2008 | B2 |
7378046 | Canty et al. | May 2008 | B2 |
7406242 | Braga | Jul 2008 | B1 |
7425678 | Adducci et al. | Sep 2008 | B2 |
7427713 | Adducci et al. | Sep 2008 | B2 |
7438638 | Lewis, II et al. | Oct 2008 | B2 |
7458859 | McGrath et al. | Dec 2008 | B2 |
D584251 | Lewis, II et al. | Jan 2009 | S |
D584252 | Lewis, II et al. | Jan 2009 | S |
7472970 | Bergesch et al. | Jan 2009 | B2 |
7476804 | Adducci et al. | Jan 2009 | B2 |
7485803 | Adducci et al. | Feb 2009 | B2 |
7490872 | Yamamoto et al. | Feb 2009 | B2 |
7495169 | Adducci et al. | Feb 2009 | B2 |
D588081 | Lewis, II et al. | Mar 2009 | S |
7498512 | Adducci et al. | Mar 2009 | B2 |
7504581 | Adducci et al. | Mar 2009 | B2 |
7507912 | Sempliner et al. | Mar 2009 | B1 |
D592618 | Lewis, II et al. | May 2009 | S |
7542287 | Lewis, II et al. | Jun 2009 | B2 |
D596928 | Lawrence et al. | Jul 2009 | S |
7592541 | Adducci et al. | Sep 2009 | B2 |
7608779 | Adducci et al. | Oct 2009 | B2 |
7637771 | Laursen | Dec 2009 | B2 |
7643291 | Mallia et al. | Jan 2010 | B2 |
7667135 | Adducci et al. | Feb 2010 | B2 |
D611326 | Alaniz et al. | Mar 2010 | S |
7697285 | Donowho et al. | Apr 2010 | B2 |
7718889 | Rasmussen et al. | May 2010 | B2 |
7718891 | Adducci et al. | May 2010 | B2 |
7719835 | Schluter | May 2010 | B1 |
7746637 | Donowho et al. | Jun 2010 | B2 |
7772489 | Adducci et al. | Aug 2010 | B2 |
7778513 | Rinderer et al. | Aug 2010 | B2 |
7781675 | Adducci et al. | Aug 2010 | B2 |
7795532 | Walker | Sep 2010 | B2 |
7804685 | Krietzman | Sep 2010 | B2 |
7815246 | Nakamura et al. | Oct 2010 | B2 |
7823846 | Williams, III | Nov 2010 | B2 |
7839635 | Donowho et al. | Nov 2010 | B2 |
7874433 | Levesque et al. | Jan 2011 | B2 |
7878888 | Rasmussen et al. | Feb 2011 | B2 |
7880084 | Adducci et al. | Feb 2011 | B2 |
7893356 | Garza et al. | Feb 2011 | B2 |
7894190 | Davis et al. | Feb 2011 | B2 |
7896177 | Toma | Mar 2011 | B1 |
7939763 | Jones et al. | May 2011 | B2 |
7952869 | Lewis, II et al. | May 2011 | B2 |
7957139 | Davis et al. | Jun 2011 | B2 |
7973242 | Jones et al. | Jul 2011 | B2 |
7974105 | Dean, Jr. et al. | Jul 2011 | B2 |
7999183 | Garza et al. | Aug 2011 | B2 |
8003890 | Donowho et al. | Aug 2011 | B2 |
8035965 | Adducci et al. | Oct 2011 | B2 |
8040673 | Krietzman | Oct 2011 | B2 |
8049109 | Sempliner et al. | Nov 2011 | B2 |
8087979 | Rasmussen | Jan 2012 | B2 |
8107238 | Krietzman et al. | Jan 2012 | B2 |
8138419 | Garza et al. | Mar 2012 | B2 |
8141885 | Fan et al. | Mar 2012 | B2 |
8220110 | Chen | Jul 2012 | B1 |
8235349 | Conklin et al. | Aug 2012 | B1 |
8237052 | Adducci et al. | Aug 2012 | B2 |
8281940 | Fan | Oct 2012 | B2 |
8330043 | Alaniz et al. | Dec 2012 | B2 |
8385850 | Thompson et al. | Feb 2013 | B1 |
8395046 | Nicewicz et al. | Mar 2013 | B2 |
8403736 | Rasmussen et al. | Mar 2013 | B2 |
8405982 | Grantham et al. | Mar 2013 | B2 |
8405984 | Donowho et al. | Mar 2013 | B2 |
8411465 | Dean, Jr. et al. | Apr 2013 | B2 |
8437147 | Dean, Jr. et al. | May 2013 | B2 |
8443987 | Peng et al. | May 2013 | B2 |
8459756 | Linhares et al. | Jun 2013 | B2 |
8628158 | Caveney | Jan 2014 | B2 |
8653363 | Behrens et al. | Feb 2014 | B2 |
8683762 | Rodriquez et al. | Apr 2014 | B2 |
8730665 | Lewis, II et al. | May 2014 | B2 |
8768169 | Yuan | Jul 2014 | B2 |
8787023 | Lewis, II et al. | Jul 2014 | B2 |
8901438 | Lewis, II et al. | Dec 2014 | B2 |
8973951 | Nicewicz | Mar 2015 | B2 |
9055677 | Garza, Jr. et al. | Jun 2015 | B2 |
9066450 | Bednarcik et al. | Jun 2015 | B2 |
9185824 | Nordin et al. | Nov 2015 | B2 |
9210833 | Caveney et al. | Dec 2015 | B2 |
9313927 | Krietzman | Apr 2016 | B2 |
9351427 | Lewis, II et al. | May 2016 | B2 |
9408326 | Lewis, II et al. | Aug 2016 | B2 |
9420727 | Lewis, II et al. | Aug 2016 | B2 |
9452638 | Linn et al. | Sep 2016 | B1 |
9549487 | Lewis, II et al. | Jan 2017 | B2 |
9585266 | Krietzman et al. | Feb 2017 | B2 |
9642270 | Lewis, II et al. | May 2017 | B2 |
9714529 | Conklin et al. | Jul 2017 | B1 |
9781852 | Garza, Jr. et al. | Oct 2017 | B2 |
9814159 | Lewis, II et al. | Nov 2017 | B2 |
9943003 | Segroves et al. | Apr 2018 | B2 |
9949406 | Lewis, II et al. | Apr 2018 | B2 |
9955616 | Krietzman et al. | Apr 2018 | B2 |
9980400 | Lewis, II et al. | May 2018 | B2 |
10133320 | Lewis, II et al. | Nov 2018 | B2 |
10172453 | Redfern et al. | Jan 2019 | B1 |
10178784 | Lewis, II et al. | Jan 2019 | B2 |
10182651 | Jost et al. | Jan 2019 | B2 |
10237994 | Donowho et al. | Mar 2019 | B2 |
10271452 | Hennrich et al. | Apr 2019 | B2 |
10518578 | Spektor et al. | Dec 2019 | B1 |
10588227 | Donowho et al. | Mar 2020 | B2 |
10648615 | Conklin et al. | May 2020 | B1 |
10653025 | Garza, Jr. | May 2020 | B2 |
11039543 | Donowho et al. | Jun 2021 | B2 |
11071227 | Hennrich et al. | Jul 2021 | B2 |
11083108 | Lewis, II et al. | Aug 2021 | B2 |
11162615 | Hennrich et al. | Nov 2021 | B2 |
11166395 | Krietzman | Nov 2021 | B2 |
11268636 | Hennrich et al. | Mar 2022 | B2 |
11444438 | Schindler et al. | Sep 2022 | B2 |
11464123 | Garza, Jr. et al. | Oct 2022 | B2 |
11493151 | Hennrich et al. | Nov 2022 | B2 |
11619328 | Hennrich et al. | Apr 2023 | B2 |
11622458 | Hennrich et al. | Apr 2023 | B1 |
11622469 | Waz et al. | Apr 2023 | B2 |
11627677 | Hennrich et al. | Apr 2023 | B1 |
11644125 | Hennrich | May 2023 | B2 |
11644126 | Hennrich et al. | May 2023 | B2 |
11678456 | Krietzman et al. | Jun 2023 | B1 |
11678458 | Krietzman et al. | Jun 2023 | B1 |
11792948 | Garza, Jr. | Oct 2023 | B2 |
11815042 | Hennrich et al. | Nov 2023 | B2 |
11818860 | Krietzman et al. | Nov 2023 | B1 |
11818861 | Krietzman et al. | Nov 2023 | B1 |
11818862 | Krietzman et al. | Nov 2023 | B1 |
11903156 | Hennrich et al. | Feb 2024 | B1 |
11920392 | Krietzman et al. | Mar 2024 | B1 |
20010015598 | Sevier | Aug 2001 | A1 |
20020046979 | Larsen et al. | Apr 2002 | A1 |
20020074149 | Lawrence et al. | Jun 2002 | A1 |
20020172013 | Chandler | Nov 2002 | A1 |
20020195029 | Walton | Dec 2002 | A1 |
20020197045 | Schmidt et al. | Dec 2002 | A1 |
20030034717 | Yao | Feb 2003 | A1 |
20030037953 | Sarkinen et al. | Feb 2003 | A1 |
20030079897 | Sempliner et al. | May 2003 | A1 |
20030118311 | Thibault et al. | Jun 2003 | A1 |
20030221392 | Furman | Dec 2003 | A1 |
20040007372 | Krietzman et al. | Jan 2004 | A1 |
20040016708 | Rafferty et al. | Jan 2004 | A1 |
20040016713 | Wyatt et al. | Jan 2004 | A1 |
20040020873 | Henderson | Feb 2004 | A1 |
20040050808 | Krampotich et al. | Mar 2004 | A1 |
20040069725 | Adducci et al. | Apr 2004 | A1 |
20040093688 | Lucht | May 2004 | A1 |
20040146266 | Solheid et al. | Jul 2004 | A1 |
20040173545 | Canty et al. | Sep 2004 | A1 |
20040183409 | Rinderer | Sep 2004 | A1 |
20040190270 | Aldag et al. | Sep 2004 | A1 |
20040201335 | Davis | Oct 2004 | A1 |
20040226900 | Canty et al. | Nov 2004 | A1 |
20040231875 | Rasmussen et al. | Nov 2004 | A1 |
20050103734 | Saltzberg et al. | May 2005 | A1 |
20050221683 | McGrath et al. | Oct 2005 | A1 |
20050247650 | Vogel et al. | Nov 2005 | A1 |
20060043031 | Rinderer | Mar 2006 | A1 |
20060087792 | Ng et al. | Apr 2006 | A1 |
20060103270 | Bergesch et al. | May 2006 | A1 |
20060118321 | Herring et al. | Jun 2006 | A1 |
20060141921 | Turek et al. | Jun 2006 | A1 |
20060162948 | Rinderer et al. | Jul 2006 | A1 |
20060213853 | Schluter et al. | Sep 2006 | A1 |
20070064389 | Lewis, II et al. | Mar 2007 | A1 |
20070064391 | Lewis, II et al. | Mar 2007 | A1 |
20070081874 | Kamino et al. | Apr 2007 | A1 |
20070183129 | Lewis, II et al. | Aug 2007 | A1 |
20070210679 | Adducci et al. | Sep 2007 | A1 |
20070210680 | Appino et al. | Sep 2007 | A1 |
20070210681 | Adducci et al. | Sep 2007 | A1 |
20070210683 | Adducci et al. | Sep 2007 | A1 |
20070210686 | Adducci et al. | Sep 2007 | A1 |
20070221393 | Adducci et al. | Sep 2007 | A1 |
20070293138 | Adducci et al. | Dec 2007 | A1 |
20080035810 | Lewis, II | Feb 2008 | A1 |
20080037228 | Lewis, II | Feb 2008 | A1 |
20080062654 | Mattlin et al. | Mar 2008 | A1 |
20080067904 | Adducci et al. | Mar 2008 | A1 |
20080074849 | Adducci et al. | Mar 2008 | A1 |
20080130262 | Rinderer et al. | Jun 2008 | A1 |
20080174217 | Walker | Jul 2008 | A1 |
20080180004 | Martich et al. | Aug 2008 | A1 |
20080266789 | Hruby et al. | Oct 2008 | A1 |
20080289873 | Herring | Nov 2008 | A1 |
20080316702 | Donowho et al. | Dec 2008 | A1 |
20080316703 | Donowho et al. | Dec 2008 | A1 |
20090014614 | Warmoth et al. | Jan 2009 | A1 |
20090059523 | Mallia et al. | Mar 2009 | A1 |
20090061755 | Calder et al. | Mar 2009 | A1 |
20090093169 | McGrath et al. | Apr 2009 | A1 |
20090129013 | Donowho et al. | May 2009 | A1 |
20090151983 | Sempliner et al. | Jun 2009 | A1 |
20090168306 | Sharp et al. | Jul 2009 | A1 |
20090190307 | Krietzman | Jul 2009 | A1 |
20090224110 | Donowho et al. | Sep 2009 | A1 |
20090227197 | Lewis, II et al. | Sep 2009 | A1 |
20090236117 | Garza et al. | Sep 2009 | A1 |
20090239460 | Lucia et al. | Sep 2009 | A1 |
20090239461 | Lewis, II et al. | Sep 2009 | A1 |
20090273915 | Dean, Jr. et al. | Nov 2009 | A1 |
20090283488 | McMillan, III et al. | Nov 2009 | A1 |
20100051308 | Hansen et al. | Mar 2010 | A1 |
20100061059 | Krietzman et al. | Mar 2010 | A1 |
20100084188 | Rajvanshi et al. | Apr 2010 | A1 |
20100096962 | Rajvanshi et al. | Apr 2010 | A1 |
20100101820 | Alaniz et al. | Apr 2010 | A1 |
20100122830 | Garza et al. | May 2010 | A1 |
20100126750 | Garza et al. | May 2010 | A1 |
20100126751 | Garza et al. | May 2010 | A1 |
20100172092 | Davis et al. | Jul 2010 | A1 |
20100172093 | Davis et al. | Jul 2010 | A1 |
20100193241 | Bennett et al. | Aug 2010 | A1 |
20100193754 | Garza et al. | Aug 2010 | A1 |
20100200707 | Garza et al. | Aug 2010 | A1 |
20100243315 | Shumate et al. | Sep 2010 | A1 |
20110001408 | Caveney et al. | Jan 2011 | A1 |
20110019362 | Krietzman | Jan 2011 | A1 |
20110056895 | Tichy | Mar 2011 | A1 |
20110083873 | Hartman et al. | Apr 2011 | A1 |
20110095495 | Fan et al. | Apr 2011 | A1 |
20110148261 | Donowho et al. | Jun 2011 | A1 |
20110173906 | Reddicliffe | Jul 2011 | A1 |
20110211328 | Dean, Jr. et al. | Sep 2011 | A1 |
20110211329 | Dean, Jr. et al. | Sep 2011 | A1 |
20110278060 | Rajvanshi et al. | Nov 2011 | A1 |
20110287704 | Lewis, II et al. | Nov 2011 | A1 |
20110290553 | Behrens et al. | Dec 2011 | A1 |
20110308179 | Pirner | Dec 2011 | A1 |
20120012543 | Fan | Jan 2012 | A1 |
20120013229 | Krietzman | Jan 2012 | A1 |
20120062083 | Lewis, II et al. | Mar 2012 | A1 |
20120062084 | Lewis, II et al. | Mar 2012 | A1 |
20120062086 | Garza, Jr. et al. | Mar 2012 | A1 |
20120062091 | Donowho et al. | Mar 2012 | A1 |
20120063099 | Alaniz et al. | Mar 2012 | A1 |
20120112612 | Krietzman | May 2012 | A1 |
20120181906 | Caveney | Jul 2012 | A1 |
20120267991 | Adducci et al. | Oct 2012 | A1 |
20120274190 | Qin et al. | Nov 2012 | A1 |
20120279779 | Cottuli et al. | Nov 2012 | A1 |
20120292278 | Schluter et al. | Nov 2012 | A1 |
20120305307 | Korcz et al. | Dec 2012 | A1 |
20130160271 | Krietzman et al. | Jun 2013 | A1 |
20130165035 | Krietzman et al. | Jun 2013 | A1 |
20140034593 | Chen et al. | Feb 2014 | A1 |
20140132134 | Garza, Jr. et al. | May 2014 | A1 |
20150136714 | Franklin | May 2015 | A1 |
20150173253 | Lewis, II et al. | Jun 2015 | A1 |
20150250071 | Garza, Jr. et al. | Sep 2015 | A1 |
20150264839 | Lewis, II et al. | Sep 2015 | A1 |
20150282390 | Lewis, II et al. | Oct 2015 | A1 |
20150366094 | Segroves et al. | Dec 2015 | A1 |
20160249488 | Krietzman | Aug 2016 | A1 |
20160262277 | Lewis, II et al. | Sep 2016 | A1 |
20170042057 | Segroves et al. | Feb 2017 | A1 |
20170127570 | Lewis, II et al. | May 2017 | A1 |
20170150636 | Seagroves et al. | May 2017 | A1 |
20170223864 | Jost et al. | Aug 2017 | A1 |
20170223865 | Lewis, II et al. | Aug 2017 | A1 |
20170254129 | Gompper et al. | Sep 2017 | A1 |
20170290181 | Donowho et al. | Oct 2017 | A1 |
20170332501 | Lewis, II et al. | Nov 2017 | A1 |
20180027677 | Garza, Jr. et al. | Jan 2018 | A1 |
20180110153 | Hennrich et al. | Apr 2018 | A1 |
20180110154 | Mayer et al. | Apr 2018 | A1 |
20180213672 | Eckberg et al. | Jul 2018 | A1 |
20190078321 | Bowron | Mar 2019 | A1 |
20190098791 | Hennrich et al. | Mar 2019 | A1 |
20190098792 | Hennrich et al. | Mar 2019 | A1 |
20190215973 | Donowho et al. | Jul 2019 | A1 |
20190343023 | Lewis, II et al. | Nov 2019 | A1 |
20190350110 | Krietzman | Nov 2019 | A1 |
20200077533 | Lu et al. | Mar 2020 | A1 |
20200196465 | Donowho et al. | Jun 2020 | A1 |
20200275569 | Garza, Jr. et al. | Aug 2020 | A1 |
20200288605 | Lewis, II et al. | Sep 2020 | A1 |
20200367381 | Hennrich et al. | Nov 2020 | A1 |
20200367382 | Hennrich et al. | Nov 2020 | A1 |
20200383230 | Hennrich et al. | Dec 2020 | A1 |
20210219446 | Curlee et al. | Jul 2021 | A1 |
20210307183 | Donowho et al. | Sep 2021 | A1 |
20210329808 | Hennrich et al. | Oct 2021 | A1 |
20210345516 | Waz et al. | Nov 2021 | A1 |
20210385976 | Lewis, II et al. | Dec 2021 | A1 |
20220034430 | Hennrich et al. | Feb 2022 | A1 |
20220053672 | Krietzman | Feb 2022 | A1 |
20220235883 | Hennrich et al. | Jul 2022 | A1 |
20230013890 | Garza, Jr. et al. | Jan 2023 | A1 |
20230065144 | Hennrich et al. | Mar 2023 | A1 |
20230243445 | Hennrich et al. | Aug 2023 | A1 |
Number | Date | Country |
---|---|---|
2008254682 | Nov 2012 | AU |
102177633 | Sep 2011 | CN |
7836374 | Mar 1979 | DE |
29607244 | Aug 1997 | DE |
19615759 | Oct 1997 | DE |
19707594 | Oct 1997 | DE |
20207426 | Sep 2002 | DE |
000663943-0001 | Jul 2007 | EC |
000663943-0002 | Jul 2007 | EC |
000663943-0003 | Jul 2007 | EC |
000663943-0004 | Jul 2007 | EC |
0577433 | Jan 1994 | EP |
2205054 | Jul 2010 | EP |
2429271 | Mar 2012 | EP |
2429272 | Mar 2012 | EP |
2904732 | Feb 2008 | FR |
2366084 | Sep 2002 | GB |
2468823 | Oct 2012 | GB |
535066 | Apr 2012 | SE |
201630514 | Aug 2016 | TW |
2001001533 | Jan 2001 | WO |
2006055506 | May 2006 | WO |
2008022058 | Feb 2008 | WO |
2008022058 | Nov 2008 | WO |
2008144678 | Nov 2008 | WO |
2009089008 | Jul 2009 | WO |
2009089307 | Jul 2009 | WO |
2009103090 | Aug 2009 | WO |
2009103090 | Oct 2009 | WO |
2009143193 | Nov 2009 | WO |
2009089307 | Dec 2009 | WO |
2009143193 | Mar 2010 | WO |
2010028384 | Mar 2010 | WO |
2010028384 | May 2010 | WO |
2010117699 | Oct 2010 | WO |
2011088430 | Jul 2011 | WO |
2011088438 | Jul 2011 | WO |
2018022721 | Feb 2018 | WO |
Entry |
---|
Information Disclosure Statement (IDS) Letter Regarding Common Patent Application(S), dated Feb. 26, 2024. |
Information Disclosure Statement (IDS) Letter Regarding Common Patent Application(S), dated Nov. 29, 2023. |
Chatsworth Products, Inc., “Thermal Management Solutions,” Signature Solutions Brochure, available at Internet Web Page <www.chatsworth.com/passivecooling>, dated Mar. 2008 (6 pages). |
“European Search Report” European Patent Application No. 11275109.4 for Chatsworth Products Inc., dated Sep. 18, 2014 (5 pages). |
Rack Technologies Pty Ltd, Product Catalog, Internet Web Page <http://racktechnologies.com.au/files/rt2005.pdf>, Jun. 16, 2005, retrieved from Internet Archive Wayback Machine <http://web.archive.org/web/20050616212856/http://racktechnologies.com.au/files/rt2005.pdf> as reviewed as of Apr. 29, 2016 (73 pages). |
Hewlett-Packard Development Company, LP, HP 10000 G2 42U Rack Air Duct Installation Guide, dated Aug. 2008 (23 pages). |
Panduit Corporation, Panduit Net-Access Vertical Exhaust Duct (VED) Instructions, dated 2009 (4 pages). |
Panduit Corporation, Panduit Net-Access Vertical Exhaust System (VES) Specification Sheet, dated 2011 (4 pages). |
Chatsworth Products, Inc. “Cabinet Airflow Baffles—Air Dam Kit for CPI Cabinet Systems,” Product Data Sheet, Jun. 2004 (2 pages). |
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