Wireless communication technologies have been growing in popularity and use over the past several years. This growth has been fueled by better communications hardware, larger networks, and more reliable protocols. Wireless and Internet service providers are now able to offer their customers with an ever-expanding array of features and services, such as robust cloud-based services.
To better support these enhancements, more powerful consumer facing edge devices (e.g., consumer grade access points, IoT gateways, routers, switches, etc.) are beginning to emerge. These devices include more powerful processors, system-on-chips (SoCs), memories, antennas, power amplifiers, and other resources (e.g., power rails, etc.) that better support high-speed wireless communications and execute complex and power intensive applications facilitating edge computing.
In addition to high performance and functionality, consumers increasingly demand that their devices be affordable, future-proof (e.g., upgradeable, highly versatile, etc.) and small enough to readily placed throughout a home or small office. New and improved cables, connectors and interfaces will be beneficial to consumers and such consumer facing edge devices.
Various embodiments include a connector head assembly for an electrical cable attached to one or more receptacle connectors. The connector head assembly may include an elongate overmold having a longitudinal extent that is longer than a height or width thereof. The elongate overmold may be configured to encase a terminal end of the electrical cable coupled to the one or more receptacle connectors inside the elongate overmold. The connector head assembly may also include a pull tab pivotally attached to the elongate overmold on an upper surface thereof. A pulling force applied to the pull tab may be configured to separate the receptacle connector from a receptacle in which the receptacle connector is configured to be held.
In some embodiments, the elongate overmold and the pull tab may be integrally formed such that the pivotal attachment of the pull tab is formed as a living hinge integrated into an outer surface of the elongate overmold. The elongate overmold and the pull tab may be integrally formed such that the pivotal attachment of the pull tab is formed as a living hinge integrated into an outer surface of the elongate overmold. The pull tab may pivot from an open position, in which the pull tab extends away from an upper surface of the elongate overmold, to a closed position, in which the pull tab extends parallel to the longitudinal extent. At least a portion of the handle may be configured to sit below an upper surface of the elongate overmold when the handle is in the closed position. The pull tab may be formed as a separate part from the elongate overmold and releasably attaches to the elongate overmold.
In some embodiments, an attachment portion of the pull tab may slide onto a mating structure of the elongate overmold, preventing relative movement between the attachment portion and the elongate overmold in a direction perpendicular to the longitudinal extent. The pull tab may include the attachment portion that is configured to remain stationary relative to the elongate overmold, and a pivotal portion that is configured to pivot relative to the elongate overmold. The attachment portion and the pivotal portion may be integrally formed such that the pivotal attachment of the pull tab is formed as a living hinge attaching the attachment portion to the pivotal portion. the pivotal portion is configured to pivot into a closed position in which the pivotal portion covers an upper surface and at least one side surface of the elongate overmold. The pivotal portion may include at least one side wall, wherein the at least one side wall is configured to sit below an upper surface of the elongate overmold when the pivotal portion is in the closed position. The pivotal portion may include two opposed side walls, wherein the two opposed side walls are configured to sit below an upper surface of the elongate overmold when the pivotal portion is in the closed position.
In some embodiments, the elongate overmold may be further configured to receive the electrical cable through an aperture in a first end of the elongate overmold, wherein the electrical cable is configured to extend through the aperture, parallel to the longitudinal extent. The elongate overmold may be further configured to hold the receptacle connector extending from a bottom side of the elongate overmold near a second end thereof that is opposed to the first end. The receptacle connector may be a USB-C power bank connector.
In some embodiments, the elongate overmold may include a longitudinal extent that is longer than a height or width thereof. The elongate overmold may be configured to encase a terminal end of the electrical cable coupled to the one or more receptacle connectors inside the elongate overmold. The terminal end of the one or more receptacle connectors may protrude from a first portion of an underside of the elongate overmold in a direction perpendicular to the longitudinal extent. A second portion of the underside may include a cavity configured to receive a portion of a finger for applying a force in the direction perpendicular to the longitudinal extent.
In some embodiments, an arch on the underside of the elongate overmold forms the cavity. The width of the elongate overmold may be wider at the second portion than at the first portion. The connector head assembly may be configured to fit within a channel in a housing base, wherein a lateral side of the elongate overmold includes a key element configured to mate with a matching key element in the channel of the housing base.
The accompanying drawings, which are incorporated herein and constitute part of this specification, illustrate exemplary embodiments of the claims, and together with the general description given above and the detailed description given below, serve to explain the features of the claims.
Various embodiments will be described in detail with reference to the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts. References made to particular examples and embodiments are for illustrative purposes, and are not intended to limit the scope of the claims.
In overview, the embodiments include a modular wireless communications system (e.g., edge device that provides Wi-Fi access points, IoT gateways, etc.) that includes a baseline feature set, and an expandable architecture that allows end users to add specific features or functionality (e.g., digital concierge, home assistant, etc.) to the system as needed. The modular wireless communications system may expose systems buses and resources in a manner that allows the device to be readily expanded. The modular wireless communications system may include an electro-mechanical interface such that system busses and resources may be readily accessed and/or retro-fitted by the end user, after deployment, or in the field. An interface plug may be connected to one of the exposed electro-mechanical interfaces facilitating different connection and interface options.
The various embodiments may include, use, incorporate, implement, provide access to a variety of wired and wireless communication networks, technologies and standards that are currently available or contemplated in the future, including any or all of Bluetooth®, Bluetooth Low Energy, ZigBee, LoRa, Wireless HART, Weightless P, DASH7, RPMA, RFID, NFC, LwM2M, Adaptive Network Topology (ANT), Worldwide Interoperability for Microwave Access (WiMAX), WIFI, WiFi6, WIFI Protected Access I & II (WPA, WPA2), personal area networks (PAN), local area networks (LAN), metropolitan area networks (MAN), wide area networks (WAN), networks that implement the data over cable service interface specification (DOCSIS), networks that utilize asymmetric digital subscriber line (ADSL) technologies, third generation partnership project (3GPP), long term evolution (LTE) systems, LTE-Direct, third generation wireless mobile communication technology (3G), fourth generation wireless mobile communication technology (4G), fifth generation wireless mobile communication technology (5G), global system for mobile communications (GSM), universal mobile telecommunications system (UMTS), high-speed downlink packet access (HSDPA), 3GSM, general packet radio service (GPRS), code division multiple access (CDMA) systems (e.g., cdmaOne, CDMA2000TM), enhanced data rates for GSM evolution (EDGE), advanced mobile phone system (AMPS), digital AMPS (IS-136/TDMA), evolution-data optimized (EV-DO), digital enhanced cordless telecommunications (DECT), etc. Each of these wired and wireless technologies involves, for example, the transmission and reception of data, signaling and/or content messages.
Any references to terminology and/or technical details related to an individual wired or wireless communications standard or technology are for illustrative purposes only, and not intended to limit the scope of the claims to a particular communication system or technology unless specifically recited in the claim language.
The term “computing device” may be used herein to refer to any one or all of quantum computing devices, edge devices, Internet access gateways, modems, routers, network switches, residential gateways, access points, integrated access devices (IAD), mobile convergence products, networking adapters, multiplexers, personal computers, laptop computers, tablet computers, user equipment (UE), smartphones, personal or mobile multi-media players, personal data assistants (PDAs), palm-top computers, wireless electronic mail receivers, multimedia Internet enabled cellular telephones, gaming systems (e.g., PlayStation™, Xbox™, Nintendo Switch™, etc.), wearable devices (e.g., smartwatch, head-mounted display, fitness tracker, etc.), IoT devices (e.g., smart televisions, smart speakers, smart locks, lighting systems, smart switches, smart plugs, smart doorbells, smart doorbell cameras, smart air pollution/quality monitors, smart smoke alarms, security systems, smart thermostats, etc.), media players (e.g., DVD players, ROKU™, AppleTV™, etc.), digital video recorders (DVRs), and other similar devices that include a programmable processor and communications circuitry for providing the functionality described herein.
The term “quantum computing device” may be used herein to refer to a computing device or edge device, whether it is a standalone device or used in conjunction with current computing processes, that generates or manipulates quantum bits (qubits) or which utilizes quantum memory states. A quantum computing device may enhance edge computing capability by providing solutions that would be challenging to implement via conventional computing systems. This is especially true with value added computing for leveraging a diverse amount of sensor and other input data to arrive at a solution in real time. Through unifying diverse data sources a quantum computing solution at the edge may accelerate machine learning, solve complex problems faster as well as provide the fundamental platform for artificial intelligence nodes at the edge of the network. With the vast array of data delivered by sensors as well state information the quantum computing process may improve the memory allocation though the use of superposition allowing for more information to be simultaneously stored and processed.
The term “edge device” may be used herein to refer to a computing device that includes a programmable processor and communications circuitry for establishing communication links to consumer devices (e.g., smartphones, UEs, IoT devices, etc.) and/or to network components in a service provider, core, cloud, or enterprise network. For example, an edge device may include or implement functionality associated any one or all of an access point, gateway, modem, router, network switch, residential gateway, mobile convergence product, networking adapter, customer premise device, multiplexer and/or other similar devices.
The term “system on chip” (SOC) may be used herein to refer to a single integrated circuit (IC) chip that contains multiple resources and/or processors integrated on a single substrate. A single SOC may contain circuitry for digital, analog, mixed-signal, and radio-frequency functions. A single SOC may also include any number of general purpose and/or specialized processors (digital signal processors, modem processors, video processors, etc.), memory blocks (e.g., ROM, RAM, Flash, etc.), and resources (e.g., timers, voltage regulators, oscillators, etc.). SOCs may also include software for controlling the integrated resources and processors, as well as for controlling peripheral devices.
The term “system in a package” (SIP) may be used herein to refer to a single module or package that contains multiple resources, computational units, cores and/or processors on two or more IC chips, substrates, or SOCs. For example, a SIP may include a single substrate on which multiple IC chips or semiconductor dies are stacked in a vertical configuration. Similarly, the SIP may include one or more multi-chip modules (MCMs) on which multiple ICs or semiconductor dies are packaged into a unifying substrate. A SIP may also include multiple independent SOCs coupled together via high speed communication circuitry and packaged in close proximity, such as on a single backplane, single motherboard or in a single wireless device. The proximity of the SOCs facilitates high speed communications and the sharing of memory and resources.
The term “multicore processor” may be used herein to refer to a single integrated circuit (IC) chip or chip package that contains two or more independent processing cores (e.g., CPU core, IP core, GPU core, etc.) configured to read and execute program instructions. A SOC may include multiple multicore processors, and each processor in an SOC may be referred to as a core. The term “multiprocessor” may be used herein to refer to a system or device that includes two or more processing units configured to read and execute program instructions.
In the example illustrated in
The thermal management unit 222 may be configured to monitor and manage the device's junction temperature, surface/skin temperatures and/or the ongoing consumption of power by the active components that generate thermal energy in the device. The thermal management unit 222 may determine whether to throttle the performance of active processing components (e.g., CPU, GPU, LCD brightness), the processors that should be throttled, the level to which the frequency of the processors should be throttled, when the throttling should occur, etc.
The system components and resources 220 and custom circuitry 218 may manage sensor data, analog-to-digital conversions, wireless data transmissions, and perform other specialized operations, such as decoding data packets and processing video signals. For example, the system components and resources 220 may include power amplifiers, voltage regulators, oscillators, phase-locked loops, peripheral bridges, temperature sensors (e.g., thermally sensitive resistors, negative temperature coefficient (NTC) thermistors, resistance temperature detectors (RTDs), thermocouples, etc.), semiconductor-based sensors, data controllers, memory controllers, system controllers, access ports, timers, and other similar components used to support the processors and software clients running on a device. The custom circuitry 218 may also include circuitry to interface with other computing systems and peripheral devices, such as wireless communication devices, external memory chips, etc.
Each processor 208, 210, 212, 214 may include one or more cores, and each processor/core may perform operations independent of the other processors/cores. For example, the SOC 202 may include a processor that executes a first type of operating system (e.g., FreeBSD, LINUX, OS X, etc.) and a processor that executes a second type of operating system (e.g., MICROSOFT WINDOWS 10). In addition, any or all of the processors 208, 210, 212, 214 may be included as part of a processor cluster architecture (e.g., a synchronous processor cluster architecture, an asynchronous or heterogeneous processor cluster architecture, etc.).
The processors 208, 210, 212, 214 may be interconnected to one another and to the memory 218, system components and resources 220, and custom circuitry 218, and the thermal management unit 222 via the interconnection/bus module 224. The interconnection/bus module 224 may include an array of reconfigurable logic gates and/or implement a bus architecture (e.g., CoreConnect, AMBA, etc.). Communications may be provided by advanced interconnects, such as high-performance networks-on chip (NoCs).
The SOC 202 may further include an input/output module (not illustrated) for communicating with resources external to the SOC, such as the clock 204 and the voltage regulator 206. Resources external to the SOC (e.g., clock 204, etc.) may be shared by two or more of the internal SOC processors/cores.
In addition to the SOC 202 discussed above, the various embodiments may include or may be implemented in a wide variety of computing systems, which may include a single processor, multiple processors, multicore processors, or any combination thereof.
With reference to
The type-C connector 232 and/or stack connector 234 may include interconnection/bus module with various data and control lines for communicating with the SOC 202. The type-C connector 232 and/or stack connector 234 may also expose systems buses and resources of a SOC 202 or computing device 200 in a manner that allows the chip or computing system to attach to an additional unit to include additional features, functions or capabilities, but which preserves the performance and integrity of the original SOC 202 or computing device 200. The type-C connector 232 and/or stack connector 234 may include proprietary or custom connector pin-outs that allow for stacking interfaces and/or for the device to be retrofitted after deployment to expand its capabilities. This allows the device to have a longer life cycle, and for the manufacturer to obtain additional revenues from accessory sales, keep the baseline cost of the product down, and sell in a cheaper market with the option to upsell later with additional add-on features.
The type-C connector 232 and/or stack connector 234 may include or control various system busses and data/control lines, such as serial gigabit media-independent interface (SGMII), universal serial bus (USB), peripheral component interconnect express (PCIe), general-purpose input/output (GPIO), etc. The stack connector 234 may also include links to a dual bidirectional inter-integrated circuit (I2C) bus and SMBus voltage-level translator (e.g., Level Trans 236) and various load switches.
Various embodiments provide a connector head assembly 300 for an electrical cable 10 attached to one or more receptacle connectors 20, 25. The connector head assembly 300 may include an elongate overmold 310 and a pull tab 320. Because the pull tab 320 may pivot relative to the elongate overmold 310, the pull tab 320 may provide better leverage for separating (i.e., by pulling) the connector head assembly 300 from the housing base (e.g., 106). The elongate overmold 310 may have a longitudinal extent that is longer than a height or width thereof. Also, the elongate overmold 310 may be configured to encase a terminal end of the electrical cable 10 coupled to the receptacle connector(s) 20, 25 inside the elongate overmold 310. The terminal end of the electrical cable 10 is situated at one end or extremity of the electrical cable 10.
The elongate overmold 310 and the pull tab 320 may be integrally formed (i.e., formed together as one piece) such that the pivotal attachment 322 of the pull tab 320 is formed as a living hinge integrated into an outer surface of the elongate overmold 320. As used herein, the term “living hinge” refers to a thin flexible hinge integrally formed with and made from the same material as the two more rigid pieces it connects. For example, an inner portion of an otherwise continuous piece of material may be grooved, weakened, or thinned such that two portions of the otherwise continuous piece of material on opposite sides of the inner portion may pivot relative to one another as the inner portion bends. Alternatively, other forms of hinge-type structure may be provided between the elongate overmold 310 and the pull tab 320 to provide a pivotal arrangement.
The pull tab 320 may include a handle 330 at a first end 331 that is remote from an opposed second end 332 where the pull tab 320 pivotally attaches to the elongate overmold 310. Also, the pull tab 320 may pivot from an open position (see
In various embodiments, the elongate overmold 310 may be further configured to receive the electrical cable 10 through an aperture in a first end 331 of the elongate overmold 310. The electrical cable 10 may be configured to extend through the aperture in the first end 331, parallel to the longitudinal extent of the elongate overmold 310. Also, the elongate overmold 310 may be further configured to hold at least one receptacle connector 20, 25 extending from a bottom side of the elongate overmold 310 near a second end 332 thereof that is opposed to the first end 331.
The elongated overmold 310 may also function as a strain relief for cable 10 providing additional structural integrity. In this way, without the elongated overmold 310, the cable 10 would often be forced to form a ninety-degree bend since the cable 10 is generally configured to extend perpendicular to an insertion axis of the receptacle connectors 20, 25. Such bending in the cable 10 may strain and eventually break the outer sheathing Thus, the elongated overmold 310 may prevent such strain and breaking.
In some embodiments, the pull tab 420 may be formed as a separate part from the elongate overmold 410 and releasably attaches to the elongate overmold 410. The elongated overmold 410 also functions as a strain relief for cable 10 providing additional structural integrity. The pull tab 420 may be formed by an attachment portion 424 and a pivotal portion 426 connected by a pivot joint 422. Also, the attachment portion 424 of the pull tab 420 may slide onto a mating structure 412 of the elongate overmold, preventing relative movement between the attachment portion 424 and the elongate overmold 410 in a direction perpendicular to longitudinal extent of the elongate overmold 410. The pull tab 420 may include the attachment portion 424 that is configured to remain stationary relative to the elongate overmold 410, and a pivotal portion 426 that may be configured to pivot relative to the elongate overmold 410. The attachment portion 424 and the pivotal portion 426 may be integrally formed such that the pivotal attachment of the pull tab 420 is formed as a living hinge attaching the attachment portion 424 to the pivotal portion 426. The pivotal portion 426 may be configured to pivot into a closed position (see
In some embodiments, a position of the pivot joint 422 along the longitudinal axis of the elongate overmold 410 may be aligned with a centerline C of the receptacle connector 20. In this way, when the pivotal portion 426 is in the open position, the pull tab 420 will apply a centerline force for more easily removing the connector head assembly 400 from the receptacle (e.g., 114).
In some embodiments, the overmold assembly 510 may include a narrow distal head portion 515 and a wider proximal end portion 520. The narrow distal head portion 515 is configured to fit within the narrow channel (e.g., 118 in
In some embodiments, the connector head assembly 500 may include a key 519, which may prevent inadvertent use with another device. The key 519 may be a slot formed into in a lateral side of the elongate overmold 510, and extending in a direction perpendicular to longitudinal extent of the elongate overmold 510. The narrow channel (e.g., 118 in
The processors discussed in this application may be any programmable microprocessor, microcomputer or multiple processor chip or chips that can be configured by software instructions (applications) to perform a variety of functions, including the functions of the various embodiments described below. In some devices, multiple processors may be provided, such as one processor within an SOC dedicated to wireless communication functions and one processor within an dedicated to running other applications. Software applications may be stored in the device's memory before they are accessed and loaded into the processor. The processors may include internal memory sufficient to store the application software instructions.
As used in this application, the terms “component,” “module,” “system,” and the like are intended to include a computer-related entity, such as, but not limited to, hardware, firmware, a combination of hardware and software, software, or software in execution, which are configured to perform particular operations or functions. For example, a component may be, but is not limited to, a process running on a processor, a processor, an object, an executable, a thread of execution, a program, and/or a computer. By way of illustration, both an application running on a wireless device and the wireless device may be referred to as a component. One or more components may reside within a process and/or thread of execution and a component may be localized on one processor or core and/or distributed between two or more processors or cores. In addition, these components may execute from various non-transitory computer readable media having various instructions and/or data structures stored thereon. Components may communicate by way of local and/or remote processes, function or procedure calls, electronic signals, data packets, memory read/writes, and other known network, computer, processor, and/or process related communication methodologies.
A number of different cellular and mobile communication services and standards are available or contemplated in the future, all of which may implement and benefit from the various embodiments. Such services and standards include, e.g., third generation partnership project (3GPP), LTE systems, third generation wireless mobile communication technology (3G), fourth generation wireless mobile communication technology (4G), fifth generation wireless mobile communication technology (5G), global system for mobile communications (GSM), universal mobile telecommunications system (UMTS), 3GSM, general Packet Radio service (GPRS), code division multiple access (CDMA) systems (e.g., cdmaOne, CDMA1020™), enhanced data rates for GSM evolution (EDGE), advanced mobile phone system (AMPS), digital AMPS (IS-136/TDMA), evolution-data optimized (EV-DO), digital enhanced cordless telecommunications (DECT), Worldwide Interoperability for Microwave Access (WiMAX), wireless local area network (WLAN), Wi-Fi Protected Access I & II (WPA, WPA2), and integrated digital enhanced network (iDEN). Each of these technologies involves, for example, the transmission and reception of voice, data, signaling, and/or content messages. It should be understood that any references to terminology and/or technical details related to an individual telecommunication standard or technology are for illustrative purposes only, and are not intended to limit the scope of the claims to a particular communication system or technology unless specifically recited in the claim language.
Various embodiments illustrated and described are provided merely as examples to illustrate various features of the claims. However, features shown and described with respect to any given embodiment are not necessarily limited to the associated embodiment and may be used or combined with other embodiments that are shown and described. Further, the claims are not intended to be limited by any one example embodiment.
The foregoing method descriptions and the process flow diagrams are provided merely as illustrative examples and are not intended to require or imply that the operations of various embodiments must be performed in the order presented. As will be appreciated by one of skill in the art the order of operations in the foregoing embodiments may be performed in any order. Words such as “thereafter,” “then,” “next,” etc. are not intended to limit the order of the operations; these words are used to guide the reader through the description of the methods. Further, any reference to claim elements in the singular, for example, using the articles “a,” “an,” or “the” is not to be construed as limiting the element to the singular.
Various illustrative logical blocks, modules, components, circuits, and algorithm operations described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and operations have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such embodiment decisions should not be interpreted as causing a departure from the scope of the claims.
The hardware used to implement various illustrative logics, logical blocks, modules, and circuits described in connection with the embodiments disclosed herein may be implemented or performed with a general purpose processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. A general-purpose processor may be a microprocessor, but, in the alternative, the processor may be any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of receiver smart objects, e.g., a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration. Alternatively, some operations or methods may be performed by circuitry that is specific to a given function.
In one or more embodiments, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software, the functions may be stored as one or more instructions or code on a non-transitory computer-readable storage medium or non-transitory processor-readable storage medium. The operations of a method or algorithm disclosed herein may be embodied in a processor-executable software module or processor-executable instructions, which may reside on a non-transitory computer-readable or processor-readable storage medium. Non-transitory computer-readable or processor-readable storage media may be any storage media that may be accessed by a computer or a processor. By way of example but not limitation, such non-transitory computer-readable or processor-readable storage media may include RAM, ROM, EEPROM, FLASH memory, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage smart objects, or any other medium that may be used to store desired program code in the form of instructions or data structures and that may be accessed by a computer. Disk and disc, as used herein, includes compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk, and Blu-ray disc where disks usually reproduce data magnetically, while discs reproduce data optically with lasers. Combinations of the above are also included within the scope of non-transitory computer-readable and processor-readable media. Additionally, the operations of a method or algorithm may reside as one or any combination or set of codes and/or instructions on a non-transitory processor-readable storage medium and/or computer-readable storage medium, which may be incorporated into a computer program product.
The preceding description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the claims. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the scope of the claims. Thus, the present disclosure is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the following claims and the principles and novel features disclosed herein.
This application claims the benefit of priority to U.S. Provisional Patent Application No. 63/036,241 entitled “Cable Pull Tab” filed Jun. 8, 2020, the entire contents of which is hereby incorporated by reference for all purposes.
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20210384675 A1 | Dec 2021 | US |
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