Patent Application
20220201168
The subject matter herein generally relates to a camera module and an electronic device having the camera module.
Most camera modules include a lens, a lens holder, a filter, a photosensitive chip, and a circuit board. The lens is installed in the lens holder, the lens holder and the photosensitive chip are installed on the circuit board, and the filter is installed above the photosensitive chip. In order to prevent dust and impurities from entering the lens module and affecting the imaging quality, a closed space must be enclosed between the lens holder, filter, photosensitive chip, and circuit board. Of course, when the lens is installed in the lens holder, dust and impurities are easy to produce. When dust and impurities fall on the filter, the image will be stained, and the dust and impurities will also rise and fall when the camera module is shaken or dropped.
Therefore, there is room for improvement within the art.
Implementations of the present disclosure will now be described, by way of embodiments, with reference to the attached figures.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale, and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.
The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings, in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean “at least one.”
The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series, and the like.
In at least one embodiment, the circuit board 1 may be a flexible circuit board, a rigid circuit board, or a flexible-rigid circuit board. Preferably, the circuit board 1 is a flexible-rigid circuit board. Referring to
In at least one embodiment, the photosensitive chip 2 may have a rectangular shape. Each electronic component 16 may be a passive component such as a resistor, a capacitor, a diode, a triode, a relay, or an electrically erasable programmable read-only memory (EEPROM).
Referring to
Referring to
The lens base 4 may be made of metal or plastic. Preferably, the lens base 4 is made of aluminum alloy.
Referring to
The protrusion 42 extends from the first top wall 400 in a direction away from the first side wall 402. In at least one embodiment, the protrusion 42 may extend along an inscribed circle of the first top wall 400. The protrusion 42 includes a second top wall 420 facing away from the first top wall 400 and a second side wall 421 connected between the second top wall 420 and the first top wall 400. A second through hole 422 penetrates the second top wall 420 and the second side wall 421 and communicates with the first though hole 406. A first thread 423 is formed on an inner surface surrounding to define the second through hole 422. A second thread 512 is formed on an outer surface of the lens 5. The first thread 423 and the second thread 512 are matched to install the lens 5 in the second through hole 422.
The first top wall 400 includes an inner area 408 corresponding the second through hole 422. The first through hole 406 is located in the inner area 408. The dust-absorbing film 409 is formed on a surface of the inner area 408 facing away from the circuit board 1. The dust-absorbing film 409 may be formed by sprayed on the surface of the inner area 408 facing away from the circuit board 1, or may be made into a film and then attached to the surface of the inner area 408 facing away from the circuit board 1.
Referring to
When an external light passes through the lens, the light is continuously refracted inside the lens base, and will eventually be reflected to the photosensitive chip 2 again, causing a light spot. The lens base 4 described in the present disclosure is provided with a dust-absorbing film 409. Since the base layer is made of silicon dioxide or titanium dioxide, it has a good absorption effect on stray light, so it can reduce the light spots and effectively avoid astigmatism, thereby improving the shooting effect of the camera module 100.
In at least one embodiment, the dust-absorbing film 409 may further formed on the inner surface defining the second through hole 422 to absorb dust and impurities, thereby improving the shooting effect of the camera module 100.
Referring to
The second thread 512 is formed on an area of the outer surface of the lens 5 corresponding to the first lens portion 51.
It is to be understood, even though information and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the present embodiments, the disclosure is illustrative only; changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the present embodiments to the full extent indicated by the plain meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202011510340.0 | Dec 2020 | CN | national |
