Patent Application
20200304693
The subject matter herein generally relates to image-capturing devices.
A lens module may include lenses, a lens holder, a carrier, a filter, a photosensitive chip, and a circuit board. The lens modules are required to be reduced in size because the electronic devices that applying the lens modules are becoming thinner. Although the lens modules fabricated under the traditional COB (Chip On Board) packaging process are stable, the lens modules are large, and miniaturization is problematic.
Thus, there is room for improvement within the art.
Implementations of the present technology will now be described, by way of embodiments, with reference to the attached figures.
The present disclosure is made in conjunction with the accompanying drawings. Specific embodiments of the present disclosure are described.
In the following description, when an element is described as being “fixed to” another element, the element can be fixed to the another element with or without intermediate elements. When an element is described as “connecting” or “connecting to” another element, the element can be connected to the other element with or without intermediate elements.
Without a definition otherwise, all terms given below are of the same meaning as commonly understood by those skilled in the art. The term “and/or” means including any and all combinations of one or more of associated listed items.
Referring to
The circuit board 10 can be a ceramic substrate, a soft board, a hard board, or a board combining soft and hard. In the embodiment, the circuit board 10 is a soft and hard board, and includes a first hard board portion 11, a second hard board portion 12, and a soft board portion 13 connected between portions 11 and 12. An electrical connection element 20 is mounted on the second hard board portion 12. When the lens module 100 is installed in an electronic device (not shown), the electrical connection element 20 transmits signals between the lens module 100 and other components of the electronic device. In the embodiment, the electrical connection element 20 can be an edge connector or a gold finger.
One surface of the first hard board portion 11 carries a photosensitive chip 21 and a plurality of metal wires 23. The photosensitive chip 21, the metal wires 23 and the electrical connection element 20 are located on a same side of the circuit board 10. The photosensitive chip 21 is electrically connected to the first hard board portion 11 through the metal wires 23. In the embodiment, the photosensitive chip 21 is rectangular in shape. An opposite surface of the first hard board portion 11 carries at least one electronic component 22 electrically connected to the first hard board portion 11. The electronic component 22 can be a passive component such as a resistor, a capacitor, a diode, a transistor, a relay, or an electrically erasable programmable read only memory (EEPROM).
Referring to
The second plastic layer 31 is located on the surface of the first hard board portion 11 where the electronic component 22 is located. In the embodiment, the second plastic layer 31 is substantially rectangular in shape. The second plastic layer 31 defines a groove (not shown) for receiving and covering the electronic component 22, the electronic component 22 is thereby packaged on the first hard board portion 11. In the embodiment, the first plastic layer 30 and the second plastic layer 31 are both injection molded elements.
In a conventional lens module, for the electronic component, the photosensitive chip and the metal wires are located on a same surface of a circuit board, and lateral gaps exist between the photosensitive chip and the metal wires. In the embodiment, lateral gaps are avoided and a lateral dimension of the lens module 100 is reduced where the electronic component 22 is located on a surface of the circuit board 10 and the photosensitive chip 21 is located on opposite surface of the circuit board 10. Thus, the lens module 100 is miniaturized. Furthermore, the first plastic layer 30 and the second plastic layer 31 effectively prevent external contaminants reaching the photosensitive chip 21 and the electronic component 22, thereby improving the imaging quality of the lens module 100. The first plastic layer 30 covers the metal wires 23 and prevents reflections therefrom and flashing and ghost imaging on the photosensitive chip 20 are reduced. The second plastic layer 31 effectively shields against light leaking from the circuit board 10, and improves the imaging quality of the lens module 100 further. The electronic component 22 is disposed on a surface of the circuit board 10 away from the photosensitive chip 21, preventing reflections of light from the electronic component 22 and reducing flashing and ghost imaging on the photosensitive chip 20, thereby improving the imaging quality of the lens module 100.
In the embodiment, the carrier 40 is mounted on the first plastic layer 30 through a first adhesive layer 50. The carrier 40 is substantially a hollow rectangular structure and defines a second through hole 41. The second through hole 41 is aligned with the photosensitive area of the photosensitive chip 21 and exposes the photosensitive area of the photosensitive chip 21. The carrier 40 defines a second recess 42 and an air venting hole 43. The second recess 42 recesses inwardly from a surface of the carrier 40 away from the circuit board 10 and surrounds the second through hole 41. The air venting hole 43 runs through the carrier 40 and has a central axis substantially parallel to a central axis of the second through hole 41. The carrier 40 can be made of metal or plastic. In this embodiment, the carrier 40 is made of plastic.
The filter 60 is mounted in the second recess 42 of the carrier 40 through a second adhesive layer 51. In the present embodiment, the filter 60 has a rectangular shape.
The lens holder 70 is mounted on the surface of the carrier 40 away from the circuit board 10 through a third adhesive layer 52. The lens holder 70 is substantially a rectangular parallelepiped structure. A receiving hole 71 is defined in the lens holder 70. The lens holder 70 is made of metal or plastic. In this embodiment, the lens holder 70 is made of an aluminum alloy.
The lens unit 80 is received in the receiving hole 71 of the lens holder 70. The lens unit 80 and the lens holder 70 are assembled together or integrally formed. In the embodiment, the lens unit 80 and the lens holder 70 are integrally formed by an injection molding process. The lens unit 80 includes a first lens 81, a second lens 82, and a third lens 83. The second lens 82 is located between the first lens 81 and the third lens 83. The first lens 81, the second lens 82, and the third lens 83 are sequentially decreased in diameter. The lens unit 80 is integrally formed or can be assembled by assembling the first lens 81, the second lens 82, and the third lens 83 together. In the embodiment, the first lens 81, the second lens 82, and the third lens 83 are integrally formed to form the lens unit 80.
Referring to
The lens module 100 provided by the present disclosure has the following beneficial effects. The electronic component 22 is located on a surface of the circuit board 10 which is not the surface on which the photosensitive chip 21 and the metal wire 23 are located, thereby avoiding lateral gaps between the electronic component 22 and the photosensitive chip 21 and the metal wire 23, and thereby reducing a lateral dimension of the lens module 100, and achieving better miniaturization of the lens module 100. The embodiments shown and described above are only examples. Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes can be made in the detail, including in matters of shape, size, and arrangement of the parts within the principles of the present disclosure, up to and including the full extent established by the broad general meaning of the terms used in the claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201910204841.7 | Mar 2019 | CN | national |
