Camera module

Abstract

A camera module includes a mount for holding a lens directly or indirectly, a cover plate glass with transparency fixed to the mount. A solid-state imaging device is mounted on the cover plate glass. The cover plate contacts a plurality of ribs formed in the mount, and the mount and the cover plate are positioned.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic perspective view showing a camera module according to the present invention;

FIG. 2 is a schematic exploded perspective view showing the camera module according to the present invention;

FIG. 3 is a schematic cross-sectional diagram showing the camera module according to the present invention;

FIG. 4 is a schematic partially enlarged cross-sectional diagram showing the camera module according to the present invention;

FIG. 5 is a schematic perspective view showing a mount of the camera module according to the present invention;

FIG. 6 is a schematic perspective view showing the mount of the camera module with an optical filter mounted thereto according to the present invention;

FIG. 7 is a schematic cross-sectional diagram showing the camera module according to the present invention;

FIGS. 8A to 8C are schematic views explaining another manufacturing method of the camera module according to the present invention;

FIG. 9 is a schematic cross-sectional view showing a camera module used in evaluation tests of examples 1 to 3;

FIG. 10 is a schematic cross-sectional view showing a camera module used in evaluation tests of examples 5 to 7;

FIG. 11 is a schematic perspective view showing the mount of the camera module according to the present invention;

FIG. 12 is a schematic perspective view showing the mount of the camera module according to the present invention;

FIG. 13 is a schematic perspective view showing the mount and a substrate of the camera module according to the present invention;

FIG. 14 is a schematic perspective view showing the mount of the camera module according to the present invention; and

FIG. 15 is a schematic perspective view showing the mount of the camera module according to the present invention.

Claims

1. A camera module comprising: an imaging device that converts light made incident on imaging area into electric signals;a cover plate that has a first plane to which the imaging device is fixed and a second plane that is opposite to the first plane, and transmits an incident light from the second plane to the imaging area of the imaging device;a lens that collects the incident light to the imaging area;a mount that holds a lens directly or indirectly and houses the cover plate; anda substrate that supports the cover plate and to which electrical signals output from the imaging device are inputted;whereinthe second plane of the cover plate is abutted on an inner surface of the mount and then the positioning between the lens and the imaging device is set.

2. The camera module according to claim 1, wherein the second plane of the cover plate is abutted on the inner surface of the mount through a plurality of projecting portions formed on the inner surface of the mount.

3. The camera module according to claim 2, wherein the imaging device is connected to the cover plate through a plurality of solder bumps.

4. The camera module according to claim 2, wherein the projecting portions are provided on three or more places of the mount.

5. The camera module according to claim 1, wherein the mount includes a first surface where the cover plate is mounted on and a second surface where an optical filter is mounted on.

6. The camera module according to claim 5, wherein a level of the first surface is different from a level of the second surface, and a recessed portion is provided between the first surface and the second surface.

7. The camera module according to claim 1, wherein the mount is fixed to the substrate via an adhesive between a lower end of an outer peripheral wall of the mount and the substrate, and a plurality of grooves are provided on the lower end of the outer peripheral wall, the plurality of grooves extend along a direction, which crosses an extending direction of the lower end of the outer peripheral wall.

8. The camera module according to claim 1, wherein the cover plate is a plate of cover glass.

9. The camera module according to claim 1, wherein a lower end of an outer peripheral wall of the mount is placed apart from the substrate when the cover plate is abutted on the inner surface of the mount.

10. The camera module according to claim 9, wherein an adhesive is provided between the lower end of an outer peripheral wall of the mount and the substrate.

11. The camera module according to claim 1, wherein an extended portion that extends towards a center of the mount is provided inside the mount, and the inner surface where the cover plate is abutted on is provided on the extended portion.

12. The camera module according to claim 1, further comprising a lens holder that holds the lens and includes the mount integrated thereto or provided separately.

13. The camera module according to claim 12, wherein the lens and the lens holder are formed of a resin material having a heat-resistant temperature higher than a heating temperature in a mounting process of electric components.

14. The camera module according to claim 12, wherein the lens and the lens holder are formed of a resin material having a heat-resistant temperature of 200° C. or more.

15. The camera module according to claim 12, wherein the material of the lens is at least one of a heat resistant optical resin material including a silicon resin, an epoxy resin, and a polysulfone resin, or a resin material added with inorganic particulates to the heat resistant optical resin material, a polycarbonate, a norbornene amorphous polyolefin, an acrylic, or an olefin maleimide resin.

16. The camera module according to claim 12, wherein the material of the lens holder is at least one of a heat resistant optical resin material including a silicon resin, an epoxy resin, and a polysulfone resin, or a resin material added with inorganic particulates to the heat resistant optical resin material, a polycarbonate, a norbornene amorphous polyolefin, an acrylic, or an olefin maleimide resin, or a resin material such as a polyamid, a polyimid, a polyamid-imid, a polyether sulfone, a polyetherimide, a polyarylate, a polyphthalamide, a polyphthalimid, and a liquid crystal polymer.

17. The camera module according to claim 12, wherein a distance H, which is a distance between a lens-side end of the lens holder and a lens-side plane of the cover plate, is set to 3.5 mm or less, and a following formula is satisfied 0.05≦S/(H×H)where S is an area of a connecting portion of the lens and the cover plate, andH is the distance between a lens-side end of the lens holder and a lens-side plane of the cover plate.

18. The camera module according to claim 12, wherein the distance H, which is a distance between a lens-side end of the lens holder and a lens-side plane of the cover plate, is set to 3.5 mm or less, and a following formula is satisfied S/(H×H)≦1wherein S is the area of the connecting portion of the lens and the cover plate, andH is the distance between a lens-side end of the lens holder and a lens-side plane of the cover plate.

19. The camera module according to claim 13, wherein with a coefficient of thermal expansion of a material of the lens to be α1 and a coefficient of thermal expansion of a material of the lens holder to be α2, a relationship of 1<α1/α2≦20 is satisfied.

20. The camera module according to claim 13, wherein with a coefficient of thermal expansion of a material of the lens to be α1 and a coefficient of thermal expansion of a material of the lens holder to be α2, a relationship of 1.5<α1/α2≦20 is satisfied.

21. The camera module according to claim 13, wherein with a coefficient of thermal expansion of a material of the lens to be α1 and a coefficient of thermal expansion of a material of the lens holder to be α2, a relationship of 2<α1/α2≦20 is satisfied.

22. A camera module comprising: a substrate module that includes an imaging device having a pixel where photo-electric conversion is conducted;a lens that is formed of a resin material having a heat-resistance temperature higher than a heating temperature in a mounting process of electric components and transfers an image to the imaging device; anda lens holder that is formed of a resin material having a heat-resistance temperature higher than the heating temperature in a mounting process of electric components and holds the lens and being fixed to the substrate module.

23. The camera module according to claim 22, wherein the lens and the lens holder have a heat-resistance temperature of 250° C. or more.

24. The camera module according to claim 22, wherein the material of the lens is at least one of a heat resistant optical resin material including a silicon resin, an epoxy resin, and a polysulfone resin, or a resin material added with inorganic particulates to the heat resistant optical resin material, a polycarbonate, a norbornene amorphous polyolefin, an acrylic, or an olefin maleimide resin.

25. The camera module according to claim 22, wherein the material of the lens holder is at least one of a heat resistant optical resin material including a silicon resin, an epoxy resin, and a polysulfone resin, or a resin material added with inorganic particulates to the heat resistant optical resin material, a polycarbonate, a norbornene amorphous polyolefin, an acrylic, or an olefin maleimide resin, or a resin material such as a polyamid, a polyimid, a polyamid-imid, a polyether sulfone, a polyetherimide, a polyarylate, a polyphthalamide, a polyphthalimid, and a liquid crystal polymer.

26. The camera module according to claim 22, wherein a distance H, which is a distance between a lens-side end of the lens holder and a lens-side plane of the cover plate, is set to 3.5 mm or less, and a following formula is satisfied 0.05≦S/(H×H)wherein S is an area of a connecting portion of the lens and the cover plate, andH is the distance between a lens-side end of the lens holder and a lens-side plane of the cover plate.

27. The camera module according to claim 22, wherein the distance H, which is a distance between a lens-side end of the lens holder and a lens-side plane of the cover plate, is set to 3.5 mm or less, and a following formula is satisfied S/(H×H)≦1wherein S is the area of the connecting portion of the lens and the cover plate, andH is the distance between a lens-side end of the lens holder and a lens-side plane of the cover plate.

28. The camera module according to claim 22, wherein with a coefficient of thermal expansion of a material of the lens to be α1 and a coefficient of thermal expansion of a material of the lens holder to be α2, a relationship of 1<α1/α2≦20 is satisfied.

29. The camera module according to claim 22, wherein with a coefficient of thermal expansion of a material of the lens to be α1 and a coefficient of thermal expansion of a material of the lens holder to be α2, a relationship of 1.5<α1/α2≦20 is satisfied.

30. The camera module according to claim 22, wherein with a coefficient of thermal expansion of a material of the lens to be +1 and a coefficient of thermal expansion of a material of the lens holder to be α2, a relationship of 2<α1/α2≦20 is satisfied.

31. The camera module according to claim 22, wherein the substrate module further comprises a cover plate having the imaging device being fixed thereto, wherein the cover plate has a transparency and is fixed to the lens holder; andthe imaging device is mounted on a surface opposite to a lens-side surface of the cover plate.

32. A camera module comprising: a substrate module that includes an imaging device having a pixel where photo-electric conversion is conducted;a lens that provides an image to the imaging device; anda lens holder that holds the lens, the lens holder being fixed to the cover plate,whereinthe lens and the lens holder are formed of a resin material having a heat-resistance temperature of 200° C. or more.

33. The camera module according to claim 32, wherein the lens and the lens holder have a heat-resistance temperature of 250° C. or more.

34. The camera module according to claim 32, wherein the material of the lens is at least one of a heat resistant optical resin material including a silicon resin, an epoxy resin, and a polysulfone resin, or a resin material added with inorganic particulates to the heat resistant optical resin material, a polycarbonate, a norbornene amorphous polyolefin, an acrylic, or an olefin maleimide resin.

35. The camera module according to claim 32, wherein the material of the lens holder is at least one of a heat resistant optical resin material including a silicon resin, an epoxy resin, and a polysulfone resin, or a resin material added with inorganic particulates to the heat resistant optical resin material, a polycarbonate, a norbornene amorphous polyolefin, an acrylic, or an olefin maleimide resin, or a resin material such as a polyamid, a polyimid, a polyamid-imid, a polyether sulfone, a polyetherimide, a polyarylate, a polyphthalamide, a polyphthalimid, and a liquid crystal polymer.

36. The camera module according to claim 32, wherein a distance H, which is a distance between a lens-side end of the lens holder and a lens-side plane of the cover plate, is set to 3.5 mm or less, and a following formula is satisfied 0.05≦S/(H×H)wherein S is an area of a connecting portion of the lens and the cover plate, andH is the distance between a lens-side end of the lens holder and a lens-side plane of the cover plate.

37. The camera module according to claim 32, wherein the distance H, which is a distance between a lens-side end of the lens holder and a lens-side plane of the cover plate, is set to 3.5 mm or less, and a following formula is satisfied S/(H×H)≦1wherein S is the area of the connecting portion of the lens and the cover plate, andH is the distance between a lens-side end of the lens holder and a lens-side plane of the cover plate.

38. The camera module according to claim 32, wherein with a coefficient of thermal expansion of a material of the lens to be α1 and a coefficient of thermal expansion of a material of the lens holder to be α2, a relationship of 1<α1/α2≦20 is satisfied.

39. The camera module according to claim 32, wherein with a coefficient of thermal expansion of a material of the lens to be α1 and a coefficient of thermal expansion of a material of the lens holder to be α2, a relationship of 1.5<α1/α2≦20 is satisfied.

40. The camera module according to claim 32, wherein with a coefficient of thermal expansion of a material of the lens to be α1 and a coefficient of thermal expansion of a material of the lens holder to be α2, a relationship of 2<α1/α2≦20 is satisfied.