Patent Application
20200075836
This application claims the priority benefits of Japanese Patent Application No. 2018-164986, filed on Sep. 4, 2018. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.
This disclosure relates to a cap made of metal that seals a piezoelectric element, and also relates to a piezoelectric device including the cap.
Piezoelectric devices, such as a piezoelectric filter, a piezoelectric resonator, a piezoelectric vibrating piece, a piezoelectric oscillator, and an acceleration sensor, using a piezoelectric material such as crystal are used in fields in an extremely wide range. One type of such piezoelectric devices is disclosed in, for example, Japanese Unexamined Patent Application Publication No. 2000-134055. This piezoelectric device includes a plate-shaped base plate and a metal cap. The base plate includes a bonding metal film formed of a metal film on a peripheral area. The metal cap has a dome shape where a peripheral area is bent downward, and a flange surface is formed on the peripheral area. The bonding metal film and the flange surface are sealed.
However, when an external pressure and the like is applied due to an insufficient sealing strength of the piezoelectric device, leakage possibly occurs between an inside of the piezoelectric device and external air. While enlarging the bonding metal film and the flange surface enhances a bonding strength of the base plate and the metal cap, this causes increase in size of the piezoelectric device.
A need thus exists for a cap and a piezoelectric device which are not susceptible to the drawback mentioned above.
According to an aspect of this disclosure, there is provided a cap made of metal for bonding to a base plate to which a piezoelectric element is installed with a eutectic alloy. The cap includes a first surface, a second surface, and a third surface. The first surface includes an outer ceiling surface, an outer sidewall surface, and a flange outer peripheral end surface. The outer ceiling surface has four sides and a rectangular shape. The outer sidewall surface is bent from the four sides of the outer ceiling surface. The flange outer peripheral end surface is formed outside the outer sidewall surface. The second surface includes an inner ceiling surface parallel to the outer ceiling surface and an inner sidewall surface parallel to the outer sidewall surface. The second surface is a side facing the base plate. The third surface connects the flange outer peripheral end surface to the inner sidewall surface. The third surface is bonded to the base plate with the eutectic alloy. The third surface includes a first curved surface having a first curvature from one end of the third surface to the flange outer peripheral end surface and a second curved surface having a second curvature from another end of the third surface to the inner sidewall surface.
The foregoing and additional features and characteristics of this disclosure will become more apparent from the following detailed description considered with reference to the accompanying drawings.
The following describes an embodiment of the disclosure with reference to the drawings. Each drawing used in the descriptions is merely illustrated schematically for understanding the embodiment, and a size, an angle, a thickness or similar factor is exaggeratedly illustrated. In each drawing used in the descriptions, like reference numerals designate corresponding or identical elements, and therefore such elements will not be further elaborated in some cases. Shapes, dimensions, materials, and similar factor described in the following embodiment are merely preferable examples within the scope of the disclosure.
[Configuration of Piezoelectric Device 100]
In the piezoelectric device 100, the piezoelectric vibrating piece 130 is placed on a surface of a +Y-axis side of the ceramic base plate 120. Further, the cap 110 made of metal is placed on the surface of the +Y-axis side of the ceramic base plate 120 so as to seal the piezoelectric vibrating piece 130. The ceramic base plate 120 and the cap 110 made of metal are bonded via a eutectic alloy EA as a bonding agent. The piezoelectric device 100 is a surface mount type piezoelectric device mounted to a printed circuit board and the like. While
The cap 110 made of metal is pressed with a mold (not illustrated) to be formed in a box shape having a depressed portion 111 depressed in a +Y-axis direction. The cap 110 made of metal has four wall plates 112 that surround the depressed portion 111, a top board 113 bonded to sides on the +Y-axis sides of the respective wall plates 112, and a flange portion 114 formed in a ring shape on sides on −Y-axis sides of the respective wall plates 112 so as to be bent outward from the wall plates 112.
The ceramic base plate 120 has a rectangular shape in plan view, and includes a flat plate 126 that has upper and lower principal surfaces. The ceramic flat plate 126 includes a pair of connection pads 121 on a surface of a +Y-axis side. The connection pads 121 are each electrically connected to the piezoelectric vibrating piece 130 via a conductive adhesive CA (see
A frame-shaped bonding metal film 125 is formed on an outer peripheral side on the surface of the +Y-axis side of the flat plate 126 so as to surround the whole electrodes formed on the surface of the +Y-axis side of the ceramic base plate 120. This frame-shaped bonding metal film 125 faces the flange portion 114, and the bonding metal film 125 is bonded to the flange portion 114 with the eutectic alloy EA. The frame-shaped bonding metal film 125 is formed from a position of an outer peripheral end 126e of the flat plate 126 having a width W22. The frame-shaped bonding metal film 125 has an outer peripheral end at a position matching the position of the outer peripheral end 126e of the flat plate 126. The connection pads 121, the wiring electrode 122, and the frame-shaped bonding metal film 125 are formed by screen-printing and the like. The bonded bonding metal film 125 has a thickness (Y-axis direction) of about 10 μm. While a description is given using the ceramic base plate in the first embodiment, the base plate may be formed of glass or crystal.
The piezoelectric vibrating piece 130 includes excitation electrodes 131 on the surfaces of the +Y-axis side and the −Y-axis side, and extraction electrodes 132 are extracted from the respective excitation electrodes 131. The extraction electrode 132 is extracted from the excitation electrode 131 formed on the surface of the +Y-axis side of the piezoelectric vibrating piece 130 to the −X-axis side, and the extraction electrode 132 is further extracted to the surface of the −Y-axis side via a side surface of a −Z-axis side of the piezoelectric vibrating piece 130. The extraction electrode 132 extracted from the excitation electrode 131 formed on the surface of the −Y-axis side of the piezoelectric vibrating piece 130 extends from the excitation electrode 131 to the −X-axis side, and is further extracted to the surface of the +Y-axis side via a side surface of the +Z-axis side of the piezoelectric vibrating piece 130.
The cap 110 made of metal is made of an alloy, for example, containing at least any of iron, nickel, or cobalt, and integratedly formed. The cap 110 made of metal airtightly seals the depressed portion 111 in a vacuum state or the depressed portion 111 where nitrogen gas or the like is filled. The top board 113 has a rectangular flat plate shape in plan view, and has a principal surface larger than the principal surface of the rectangular-shaped piezoelectric vibrating piece 130 and smaller than the top surface of the base plate 120 in size. The top board 113 has a lower side on which the depressed portion 111 surrounded by the top board 113 and the four wall plates 112 is formed.
The wall plates 112 form the depressed portion 111 on the lower surface of the cap 110 made of metal, and are disposed along an outer edge of the top board 113. In the depressed portion 111, the piezoelectric vibrating piece 130 mounted on the base plate 120 is housed. The flange portion 114 ensures an area for bonding the cap 110 made of metal and the base plate 120 to enhance a bonding strength. The flange portion 114 extends along outer peripheral surfaces of the wall plates 112 in an annular shape and from lower ends toward outer peripheral sides of the wall plates 112.
A dimension of the completed cap 110 made of metal, especially, a dimension of the periphery of the flange portion 114 will be described with reference to the enlarged figure of
A part from the wall plate 112 to the flange portion 114 is bent outward at a right angle. At its corner, an inner bent surface 117 (second curved surface 117) and an outer bent surface 118 are formed on an inside and an outside. The inner bent surface 117 is a curved surface continuous from the inner sidewall surface 112i and preferred to have a large curvature such that a fillet of the eutectic alloy EA is easily formed as described later. The bent surface 118 is a curved surface from the outer sidewall surface 112o to an outer peripheral end surface 114e of the flange portion 114, and formed not to have long lengths in the Z-axis direction and the Y-axis direction of the cap 110 made of metal. That is, on the upper side (+Y-axis side) of the flange portion 114, there is almost no plane area (XZ-plane) preferably.
On the lower side (−Y-axis side) of the flange portion 114, a flange plane (XZ-plane) 115 having a width W11 is formed. A first curved surface 116 having a first curvature is formed from one end of the flange plane 115 to the outer peripheral end surface 114e of the flange portion 114. The flange plane 115 has the other end connected to the inner bent surface 117. In this embodiment, an outer side surface, which contacts external air, of the cap 110 made of metal includes the outer ceiling surface 113o, the outer sidewall surface 112o, the outer bent surface 118, and the outer peripheral end surface 114e of the flange portion 114. On the outer side surface, at least the outer ceiling surface 113o and the outer sidewall surface 112o configures a first surface. The cap 110 made of metal has an inner side surface (second surface) on which the piezoelectric vibrating piece 130 is disposed. The inner side surface includes the inner ceiling surface 113i and the inner sidewall surface 112i. The cap 110 made of metal has a third surface that is bonded to the base plate 120 with the eutectic alloy EA. The third surface includes the flange plane 115, the first curved surface 116, and the inner bent surface 117 (second curved surface 117).
Provisionally, when the base plate 120 has the length in the X-axis direction of 0.80 mm and the length in the Z-axis direction of 0.60 mm, the flange plane 115 has the width W11 of 0.03 mm (30 μm) to 0.07 mm (70 μm), preferably about 0.05 mm. The first curved surface 116 has a curvature radius R6 of 0.005 mm (5 μm) to 0.020 mm (20 μm), and preferably about 0.012 mm (12 μm). The inner bent surface 117 has a curvature radius R7 of 0.015 mm (15 μm) to 0.035 mm (35 μm), approximately ½ of the width W11 of the flange plane 115, and preferably about 0.025 mm (25 μm). Therefore, a width W15 from the outer peripheral end surface 114e of the flange portion 114 to the inner sidewall surface 112i of the wall plate 112 is preferably 0.050 mm (50 μm) to 0.125 mm (125 μm).
Here, a method for manufacturing the cap 110 made of metal will be described. The cap 110 made of metal is manufactured by, for example, performing a plastic work on a flat plate by a presswork using a mold. The top board 113, the wall plates 112, and the flange portion 114 are formed by sandwiching and applying pressure to a flat plate with a pair of molds having a protruding part and a depressed part in a shape identical to that of the depressed portion 111 of the cap 110 made of metal. Afterwards, sand-blasting or the like is performed to increase a curvature of bending especially at the periphery of the flange portion 114, and Burrs caused in the presswork are removed. The sand-blasting or the like finishes the first curved surface 116 having the curvature radius R6 of 5 μm to 20 μm. Bending by the presswork and the sand-blasting or the like finish the second curved surface 117 having the curvature radius R7 of 15 μm to 35 μm.
A length of the cap 110 made of metal, that is, a length from one outer peripheral end surface 114e of the flange portion 114 to the other outer peripheral end surface 114e is shorter than a length from one outer peripheral end 126e of the flat plate 126 to the other outer peripheral end 126e. In the X-axis direction illustrated in
As described above, the flange plane 115 of the cap 110 has the width W11 of 0.03 mm (30 μm) to 0.07 mm (70 μm), preferably about 0.05 mm (50 μm). Meanwhile, the frame-shaped bonding metal film 125 has the width W22 of 0.06 mm (60 μm) to 0.08 mm (80 μm). That is, the width W22 of the frame-shaped bonding metal film 125 is preferred to be greater than the width W11 of the flange plane 115. This is for easily forming the fillet (shape spreading toward the end formed by the molten bonding agent) of the eutectic alloy EA on the flange portion 114 of the cap 110.
Here, a description will be given of a positional relation between an inner end of the flange plane 115 of the cap 110 and an inner end of the frame-shaped bonding metal film 125. The flange plane 115 has an inner end 115i arranged on a position approximately identical to that of the inner end 125i of the frame-shaped bonding metal film 125. Alternatively, the inner end 125i of the frame-shaped bonding metal film 125 is preferred to be arranged outside the inner end 115i of the flange plane 115. This is also for easily forming the fillet of the eutectic alloy EA on the flange portion 114 of the cap 110, and for easily forming the fillet of the eutectic alloy EA on the inner end 125i of the frame-shaped bonding metal film 125. For such a positional relation, the width W15 from the inner sidewall surface 112i of the cap 110 to the outer peripheral end surface 114e is preferred to be greater than the width W22 of the bonding metal film 125.
The eutectic alloy EA has a melting point higher than a melting point 250° C. to 280° C. of an alloy (for example, lead-free solder) used for connecting the mounting terminal 124 to an external board of external electronic equipment and the like. For the eutectic alloy EA, for example, a zinc-aluminum (ZnAl) alloy, a gold-tin (AuSn) alloy, or a copper-tin (CuSn) alloy having the melting point above 300° C. (melting point above 400° C. after made to be an alloy) is preferable. The disposed eutectic alloy EA has a thickness D11 of, for example, 12 to 15 μm.
In sealing the cap 110 and the base plate 120, the flange portion 114 is placed on the frame-shaped bonding metal film 125, and the cap 110 and the base plate 120 are put into a predetermined sealing device. Then, when the eutectic alloy EA melts, the melted eutectic alloy EA flows in an outer peripheral direction of the bonding metal film 125 to make a thickness D12 of the eutectic alloy EA about 10 μm as illustrated in
As described above, the length from the one outer peripheral end surface 114e of the flange portion 114 to the other outer peripheral end surface 114e is shorter than the length from the one outer peripheral end 126e of the flat plate 126 to the other outer peripheral end 126e by the length double of the width W31. On one side in the X-axis direction or the Z-axis direction, the width W31 is about ½ to ¼ of the width W22 of the frame-shaped bonding metal film 125. In view of this, in other words, the length of the cap 110 made of metal is shorter than the length of the ceramic base plate 120 by a length about one time to ½ of the width W22 of the frame-shaped bonding metal film 125. Provisionally, when the base plate 120 has the length in the X-axis direction of 0.80 mm and the length in the Z-axis direction of 0.60 mm, the width W31 is preferred to be 0.04 mm (40 μm) to 0.01 mm (10 μm), and further, the width W31 is further preferred to be 0.03 mm (30 μm) to 0.02 mm (20 μm). More preferably, the width W31 is about 0.025 mm (25 μm).
Next, a width W33 from the inner end 125i of the frame-shaped bonding metal film 125 to the inner sidewall surface 112i of the cap 110 made of metal will be described. As described above, the inner end 125i of the frame-shaped bonding metal film 125 is preferred to be positioned at a position approximately identical to or outside the position of the inner end 115i of the flange plane 115. In view of this, the width W33 from the inner end 125i of the frame-shaped bonding metal film 125 to the inner sidewall surface 112i of the cap 110 made of metal is longer than the width W31 from the outer peripheral end 126e of the flat plate 126 to the outer peripheral end surface 114e of the flange portion 114.
While the base plate described in this embodiment does not include castellation electrodes on four corners, this embodiment is also applicable to a base plate including a castellation electrode. This embodiment is also applicable to a base plate where an upper ceramic plate and a lower ceramic plate are combined and a through electrode and a castellation electrode are included.
In the above-described aspect of this disclosure, the third surface of the cap may include a third plane parallel to the base plate between the first curved surface and the second curved surface. The second curvature radius may be from 15 μm to 35 μm. The first curvature radius may be from 5 μm to 20 μm.
The cap made of metal according to the embodiment of the disclosure ensures the enhanced bonding strength of the base plate without increase in size.
The principles, preferred embodiment and mode of operation of the present invention have been described in the foregoing specification. However, the invention which is intended to be protected is not to be construed as limited to the particular embodiments disclosed. Further, the embodiments described herein are to be regarded as illustrative rather than restrictive. Variations and changes may be made by others, and equivalents employed, without departing from the spirit of the present invention. Accordingly, it is expressly intended that all such variations, changes and equivalents which fall within the spirit and scope of the present invention as defined in the claims, be embraced thereby.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2018-164986 | Sep 2018 | JP | national |
