Patent Application
20190126665
Caps or hats are often decorated with one or more emblems (for example, a team emblem or mascot, or other insignia). To reduce manufacturing costs, and to provide flexibility to the consumer, the emblems are usually applied to a plain or generic cap or hat rather than being sown directly into the structure of the cap or hat during fabrication. Generic caps or hats can be produced in larger volumes at lower costs, and can be shipped to distributors or vendors where emblems can be applied based on market demand.
The post-manufacture decoration of caps or hats typically utilizes heat seal products that are applied to the surface of the cap or hat using a heat press machine. However due to the uneven shape of many cap or hat designs, the heat press can produce residual marks or indentations when applying the decoration under compression, and the final product is often rejected by the consumer. Thus, there is a need to provide an improved molding process that enhances final product quality, and retains the cost and flexible design advantages provide by post-manufacture decoration.
A cap or hat decoration method comprising providing a press including a lower platen and upper platen, and coupling a pad to the lower platen, where the pad is dimensioned based on one or more dimensions of the cap or hat. Some embodiments include positioning the cap or hat onto at least a portion of the pad, and positioning at least one decoration onto at least a portion of the cap or hat, the at least one decoration including a heat-activated adhesive. Some embodiments include heating and compressing the decoration onto the cap or hat by compressing the cap or hat and decoration between the lower platen and upper platen.
In some embodiments, the pad comprises a flexible or compressible polymer. In some embodiments, the pad comprises a silicone polymer. In some embodiments of the invention, the cap or hat comprises at least one concave inner surface and at least one convex outer surface. In some embodiments, the method of compressing of the decoration onto the cap or hat comprises a compression time of between about 10 seconds and 45 seconds. In some embodiments, the lower platen and/or the upper platen are heated to a temperature that enables the decoration to reach a temperature of between 230° F. and 360° F., and/or between 380° F. and 430° F., and/or between 340° F. and 365° F.
In some embodiments, the compressing of the decoration onto the cap or hat uses a compression force of between 20 lbs., and 80 lbs. In some embodiments, the pad includes an inner edge positioned between a first and second portion of the pad. In some embodiments, the pad includes an extension extending from one end of the pad, the extension configured and arranged to position a sweat band of the cap or hat. In some embodiments, the lower platen is convex, and the upper platen is concave. In some embodiments, the decoration comprises a label, decal, insignia, mark, and/or marker.
Some embodiments include a good processing method comprising determining one or more dimensions of a good, preparing a mold model using the one or more good dimensions, and preparing a mold based on the mold model. Some embodiments include preparing at least a first pad using the mold, where the first pad is dimensioned based on one or more dimensions of the good transferred by the mold. Some embodiments include providing a press including a lower platen and upper platen, and positioning at least the first pad over the lower or upper platen. Some embodiments include positioning the good onto at least a portion of the first pad, and positioning at least one decoration onto at least a portion of the good, where the at least one decoration includes a heat-activated adhesive. Some embodiments include heating and compressing the decoration onto the good by compressing the good and decoration between the lower platen and upper platen, wherein at least one of the lower or upper platen is heated.
Some embodiments of the method include forming at least a second pad using the mold, where the second pad is dimensioned based on one or more dimensions of the good transferred by the mold, and positioning the second pad over the lower or upper platen. In some embodiments of this method, the lower platen is convex, and the upper platen is concave, and the pad comprises at least one concave inner surface and at least one convex outer surface. In some further embodiments of the method, the pad comprises a flexible or compressible polymer.
In some embodiments, the pad includes an inner edge positioned between a first and second portion of the pad, and further includes an extension extending from one end of the pad, the extension configured and arranged to position a sweat band of the good. In some embodiments of this method, at least one of the lower platen and upper platen are heated to a temperature of a range selected from ranges 230° F. to 360° F., and 380° F. to 430° F., and 340° F. to 365° F. In some other embodiments of this method, the compressing of the decoration onto the good comprises a compression time of between about 10 seconds and 45 seconds.
Before any embodiments of the invention are explained in detail, it is to be understood that the invention is not limited in its application to the details of construction and the arrangement of components set forth in the following description or illustrated in the following drawings. The invention is capable of other embodiments and of being practiced or of being carried out in various ways. Also, it is to be understood that the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. The use of “including,” “comprising,” or “having” and variations thereof herein is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. Unless specified or limited otherwise, the terms “mounted,” “connected,” “supported,” and “coupled” and variations thereof are used broadly and encompass both direct and indirect mountings, connections, supports, and couplings. Further, “connected” and “coupled” are not restricted to physical or mechanical connections or couplings.
The following discussion is presented to enable a person skilled in the art to make and use embodiments of the invention. Various modifications to the illustrated embodiments will be readily apparent to those skilled in the art, and the generic principles herein can be applied to other embodiments and applications without departing from embodiments of the invention. Thus, embodiments of the invention are not intended to be limited to embodiments shown, but are to be accorded the widest scope consistent with the principles and features disclosed herein. The following detailed description is to be read with reference to the figures, in which like elements in different figures have like reference numerals. The figures, which are not necessarily to scale, depict selected embodiments and are not intended to limit the scope of embodiments of the invention. Skilled artisans will recognize the examples provided herein have many useful alternatives and fall within the scope of embodiments of the invention.
Some embodiments of the invention include a hat mold preparation process or method. Some include a hat decoration method that uses one or more conformation pads that are produced and based upon the hat molds produced by the hat mold preparation process. In some embodiments, the decoration can be a label, decal, insignia, and any added mark or marker.
Some embodiments include the decoration of hats or caps (hereinafter referred to as “hats”) using one or more heat seal products. In some embodiments, the heat seal products are applied using heat press machines using specific pressures or ranges of pressures, specific temperatures or ranges or temperatures, and specific process times or ranges of process times.
Some embodiments of the invention can utilize a conventional heat press that can include a bottom and/or top platen. In some embodiments, the bottom platen of the heat press can be selected with a specific size to fit different sizes of hats. Some of these platens are interchangeable. In some embodiments, the heat platen can be the lower platen, the upper platen, or both platens can be heated platens. In some embodiments, the time, pressure and temperature can be varied depending on the product to be applied and/or the type of hat or cap. For example, if the product is thick as embroidery emblems, then more time will be required. If the glue used in the product is industrial level, then more heat will be needed.
In some embodiments of the invention, including any of the methods described herein, an emblem heat seal glue can be activated from about 230° F. to about 360° F., or lower temperature. Some embodiments can utilize an industrial grade heat seal glue activated at a higher temperature (e.g., from about 380° F. to about 430° F., and maybe higher). In some embodiments, “low melt” temperatures of about 340° F. to about 365° F. can be used for the platen temperature. In some embodiments of the invention, the application time can be 10 seconds to 45 seconds (depending on the thickness of the product). In some embodiments of the invention, the platen pressure can be between 20 lbs., and 60 lbs. In some other embodiments of the invention, the platen pressure can be between 20 lbs., and 80 lbs.
Some other embodiments can use a temperature of between about 380° F. and about 425° F., with a process time of 10 seconds to 45 seconds (depending on the thickness of the product), and pressures of between 20 lbs., and 60 lbs, or between 20 lbs., and 80 lbs. In some embodiments, these temperatures can be reached with a top heated press only. Other embodiments can use bottom heated platens.
In some embodiments, one or more conformable pads can be used in an assembly of a heat press to aid in the decoration process. In some embodiments, one or more conformable pads can be placed on one or both platens during pressing of a decoration into a surface of a hat. In some embodiments, heat can be applied to the lower platen, the upper platen, or to both the upper and lower platens. In some embodiments, the upper and/or the lower platen can be curved. For example, in some embodiments, the lower platen can be convex and the upper platen can be concave. In other embodiments, the lower platen can be concave and the upper platen can be convex.
As depicted in
In some embodiments of the invention, a conformable pad comprising a shape of the inner part of the hat and matched with the curve of the platens of the heat press can be used to decorate the hat without inducing unwanted creases, marks, or other imperfections. For example, some embodiments include a pad 240 that can be placed on lower platen 260 below the top platen 220 of the press 200. In the non-limiting embodiment, the lower platen 260 is convex. In some embodiments, the specific dimensions of a mold used to create the conformable pad 240 can be obtained from measurements of the hat (depicted in
In some embodiments, these measurements can be used to prepare 3D models of molds for the conformable pad. For example,
In some further embodiments, the second portion 420 can comprise an inner edge 450. In some embodiments, the inner edge 450 can be positioned at an interface between the first and second portions 410, 415. In some embodiments, the inner edge 450 can extend between two sides of the mold 400. In some embodiments, the diameter of the inner edge 450 can vary from one side of the mold 400 to the other. In some embodiments, the inner edge 450 can comprise a diameter that is greater at the center of the mold 400, while reducing in diameter towards the edges. In some embodiments, the reduction in diameter is equal on both sides of the mold 400 so that the mold 400 comprises a symmetrical shape about the center. In some embodiments, at least a portion of the diameter of the first portion 415 can vary from one side of the mold 400 to the other. In some embodiments, the first portion 415 can comprise a thickness that is greater at the center of the mold 400, while reducing in diameter towards the edges. In some embodiments, the reduction in diameter is equal on both sides of the mold 400 so that the mold 400 comprises a symmetrical shape about the center. In some further embodiments, at least a portion of the diameter of the second portion 420 can vary from one side of the mold 400 to the other. In some embodiments, the second portion 420 can comprise a diameter that is greater at the center of the mold 400, while reducing in diameter towards the edges. In some embodiments, the reduction in diameter is equal on both sides of the mold 400 so that the mold 400 comprises a symmetrical shape about the center.
In some embodiments of the invention, using the measurements, a mold can be created using fiber glass resin or other conventional molding material (such as any moldable polymer or polymer composite material, or any mold material such as plaster). For example,
In some embodiments, the pad 600 can comprise rubber, silicone, or other flexible polymer. In some embodiments, the polymer used can have different durometers to adapt its shape and properties for use with almost any hat. Further, in some embodiments, the polymer used can be heat resistant, and can be used multiple times without any deformation. In some embodiments, the polymer can be a durometer of 35A. Other durometers can be 60A; 50A; 45A, and 25A.
In some embodiments of the invention, the conformable pad 600 can be shaped rubber silicone that can fit in a hat heat press machine and be used as a decoration tool for hats. In some embodiments, the pad 600 can be positioned inside the hat to provide support and avoid hat damage when applying a decoration using a heat press. For example,
In some embodiments, during use, the pad 600 can be placed on a platen (e.g., such as a lower platen 260) so that the inner surface 630 of the first portion 615 can be placed against an edge of the lower platen 260, and the second portion 620 can extend beyond the lower platen 260, extending below the edge of the lower platen 260. This can allow portions of a mounted or coupled cap or hat to extend away from the lower platen 260.
In some embodiments, the systems and methods described herein can be used to apply emblems to other regions of a hat or cap. For example,
In some embodiments, other conformable pads can be placed at other locations between the platens to prevent the introduction of any artifacts from any portions of the platens and to provide additional support to the hat as desired. In some embodiments, the upper platen 220 can then be lowered and the press heated and/or pressure applied. In some embodiments, the upper platen 220 is concave. The preparation of the hat mold, the preparation of the conformation pad, and the use of a pad in preparing a decorated hat is summarized in
As shown earlier at least in
In this non-limiting embodiment, the mold insert 1250 can comprise a body 1260 extending between a first end 1251 and a second end 1252. In some embodiments, the body 1260 can comprise a first portion 1265 extending from the first end 125 towards the second end 1252. In some embodiments, the first portion 1251 can be coupled to or integrated with a second portion 1267 that extends from the second end 1252 towards the first end 1251. In some embodiments, the first portion 1265 can comprise a concave inner surface, and the second portion 1267 can comprise a concave inner surface, and the outer surfaces of the first and second portions 1265, 1267 can be convex or curved. In some embodiments, the insert 1250 can comprise a band support extension 1270 extending from the body 1260. The use of the insert 1250 is shown in
In some alternative embodiments, any of the pads disclosed herein can comprise one or more shaped or conformable gel pads. In some embodiments, some dimensions of the gel pads can be prepared as described above for the conformable pads. In some embodiments, a gel pad can be used in place of a conformable pad on the lower platen as described above and shown in the process 1100 of
It will be appreciated by those skilled in the art that while the invention has been described above in connection with particular embodiments and examples, the invention is not necessarily so limited, and that numerous other embodiments, examples, uses, modifications and departures from the embodiments, examples and uses are intended to be encompassed by the description and figures, and claims attached hereto. Various features and advantages of the invention are set forth in the following claims.
This application claims priority to U.S. provisional application Ser. No. 62/579,586 filed on Oct. 31, 2017, the entire contents of which are incorporated herein by reference.
| Number | Date | Country | |
|---|---|---|---|
| 62579586 | Oct 2017 | US |
