1. Field of the Invention
The present invention relates to a touch panel and more particularly to a capacitive touch panel.
2. Description of the Related Art
To keep abreast with the technological development of touch panels, portable electronic devices, such as smart phones, tablet personal computers (PC), media players (MP5) and the like, all adopt touch panels to replace conventional mechanical keyboards, which are more room-consuming, nowadays.
Current touch panels that are oftentimes used in portable electronic devices mostly pertain to capacitive touch panels. With reference to
An objective of the present invention is to provide a capacitive touch panel having an ink layer directly mounted on the touch panel and getting rid of a bonding layer and a protection layer required in downstream manufacturing.
To achieve the foregoing objective, the capacitive touch panel has a transparent substrate and an ink layer.
The transparent substrate has a top surface, a bottom surface, an indium tin oxide (ITO) layer, a lead wire region and multiple lead wires.
The ITO layer is mounted on the bottom surface and has multiple electrodes mounted thereon.
The lead wire region is formed on a bordering portion of the bottom surface.
The lead wires are mounted on the lead wire region and electrically connected to the respective electrodes on the ITO layer.
The ink layer corresponds to the lead wire region and is mounted on the top surface of the transparent substrate.
Alternatively, the capacitive touch panel has a transparent substrate and a first ink layer.
The transparent substrate has a top surface, a bottom surface, an ITO layer and a lead wire region.
The ITO layer is mounted on the bottom surface and has multiple electrodes mounted thereon.
The lead wire region is formed on a bordering portion of the bottom surface.
The first ink layer is mounted on the lead wire region of the transparent substrate and has multiple lead wires electrically connected to the respective electrodes on the ITO layer.
When viewed from the top surface of the transparent substrate of the capacitive touch panel, the non-transparent first ink layer therefore blocks the lead wires on the lead wire region of the bottom surface of the transparent substrate. When downstream manufacturers manufacture electronic devices, the bonding layer and the protection layer are not necessary to be additionally mounted on the touch panel. Not only can the production process and material cost for manufacturing electronic device be reduced, but also the overall thickness of electronic devices can be thinner.
Other objectives, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
With reference to
The transparent substrate 10 has a top surface and a bottom surface, an ITO layer 11, a lead wire region 12 and multiple lead wires 13. The ITO layer 11 is mounted on the bottom surface of the transparent substrate 10 and has multiple electrodes mounted thereon. The lead wire region 12 is formed on a bordering portion of the bottom surface of the transparent substrate 10. The lead wires 13 are mounted on the lead wire segment 12 and electrically connected to the respective electrodes on the ITO layer 11. In the present embodiment, given a projected capacitive touch panel as an example, the ITO layer 11 has an X-axis sensing area 111 and a Y-axis sensing area 112. The X-axis sensing area 111 has multiple X-axis electrodes 14, and each X-axis electrode 14 is electrically connected to a corresponding lead wire 13. The Y-axis sensing area 112 has multiple Y-axis electrodes 14′, and each Y-axis electrode 14′ is electrically connected to a corresponding lead wire 13. With reference to
The ink layer 20 corresponds to the lead wire region 12 of the transparent substrate 10 and is mounted on the top surface of the transparent substrate 10.
The transparent paint layer 30 is fully mounted on the top surface of the transparent substrate 10 and the ink layer 20 to level up a surface of the touch panel and to embellish the touch panel.
With reference to
When viewed from the top surface of the transparent substrate 10 of the capacitive touch panel, the non-transparent ink layer 20 therefore blocks the lead wires on the lead wire region 11 of the bottom surface of the transparent substrate 10. When downstream manufacturers manufacture electronic devices, the bonding layer and the protection layer are not necessary to be additionally mounted on the touch panel. Not only can the production process and material cost for manufacturing electronic device be reduced, but also the overall thickness of electronic devices can be thinner. Accordingly, the light, thin and compact requirement of portable electronic devices can be met.
Even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only. Changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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100212733 | Jul 2011 | TW | national |