The present invention relates to an electrical connector utilizing capacitive coupling and suitable for use with camera modules and other similar electronic devices.
Conventionally, a connector has been used for electrically connecting electronic devices including a circuit board with another circuit board or electrically connecting electronic components on the circuit board. For example, Japanese Patent Document No. JP 2006-310026 discloses a socket-style connector for receiving a camera module that has a built-in image sensor and the like and connecting the camera module to substrate such as a circuit board. In such conventional electronic devices, signal and power are transmitted by galvanic contact between two conductive terminals.
In recent years, the use of higher frequency signals in the electronic devices has prevailed, and in this context, connectors utilizing capacitive coupling are of interest. That is, a connector which is connected to two electronic devices and which has two conductors sandwiching a dielectric therebetween. In such a connector, it is necessary for the conductors and the dielectric to be held in close contact with each other in order to maintain proper transmission characteristics.
In the capacitive coupling connector, the conductors are not in contact with each other. However, in the case of providing the connector utilizing capacitive coupling in addition to the connector which has the contact terminals for transmitting power or the like, it is necessary to newly provide the connector utilizing capacitive coupling with a mechanism for ensuring close contact between the conductor and the dielectric. As a result, the number of components is increased.
The present invention is directed to a connector that overcomes the aforementioned problems.
It is therefore an object to provide an electrical connector which is capable of performing a transmission of signals and power with a reduced number of connector components.
In order to solve the above-mentioned problem, one embodiment of a connector connects two electronic devices with each other while being interposed between them and includes: a first connector member formed so that an electronic device is disposed on an upper surface side thereof and having first contact conductors provided in at least two positions and separated from each other on a lower surface side thereof; and a second connector member disposed on another electronic device and facing the lower surface of the first connecting member, and having second contact conductors which are in contact with the first contact conductors. The first connector member includes a capacitive coupling conductor positioned between the first contact conductors and it is positioned in opposition to a conductor provided on the other electronic device while having a dielectric interposed therebetween.
Furthermore, the first and second contact conductors have shapes which correspond to each other, and the first and second contact conductors reliably engage each other while the dielectric is sandwiched between the capacitive coupling conductor and the conductor on the other electronic device.
While the transmission of the power or the like can be performed through galvanic contact between the first and second contact conductors, the transmission of certain signals can be performed by way of a intermediation of the capacitive coupling conductor. Further, in the embodiment, the first and second contact conductors engage each other and retains the two connector members in place, while the dielectric is sandwiched between the capacitive coupling conductor and the conductor provided on the other electronic device. As a result, it is possible to reduce the number of components of the connector, while ensuring close contact between the conductor and the dielectric.
The capacitive coupling conductor provided in the first connector member is disposed so as to contact the dielectric, and the signals are directly transmitted from the capacitive coupling conductor is the conductor provided on the other electronic device. The dielectric may be disposed between the capacitive coupling conductor of the first coupling member and the conductor on the other electronic device. The dielectric may also be positioned between the conductor of the second coupling member and the conductor of the other electronic device. That is, both the conductor of the second connector member and the dielectric may be positioned between the conductor on the other electronic device and the capacitive coupling conductor. Yet further, the dielectric may be formed on the capacitive coupling conductor, or may be formed on the conductor of the other electronic device. In the case where the another conductor such as the conductor of the second connector member is disposed between the capacitive coupling conductor of the first connector member and the conductor on the other electronic device, the dielectric may be formed on the another conductor.
According to an aspect of the present invention, the other contact conductor may protrude toward the one contact conductor, and the one contact conductor may be formed so as to be capable of receiving the other contact conductor, and may hold the received other contact conductor. According to this aspect, with a simple structure, the one contact conductor is capable of retaining the other contact conductor. In addition, according to this aspect, the one contact conductor may be formed as an elastic member so as to elastically hold the other contact conductor. As described above, in the case where the one contact conductor is formed by an elastic member, the one contact conductor may have a pair of extending portions which extend toward a base portion side of the other contact conductor and catch the other contact conductor, and the pair of extending portions may respectively have contact portions which are pressed to the other contact conductor, and may be curved for reducing a clearance between the contact portions. With this structure, the other contact conductor can be further stably retained by the one contact conductor. In addition, as described above, in the case where the extending portions are curved for reducing the clearance between the contact portions, the other contact conductor may have a forward end portion which is thicker than the base portion of the other contact conductor. With this structure, the relative movement between the one contact conductor and the other contact conductor is further effectively restricted.
Still further, according to another aspect, the second connector member may be formed in a frame shape, and the capacitive coupling conductor may be positioned on an inside of the second connector member. According to this aspect, without the necessity of providing the conductor in the second connector member, both the capacitive coupling conductor and the conductor on the other electronic device can be in contact with the dielectric. Yet according to another aspect, a hole is provided that passes through the second connector member and the capacitive coupling conductor may be positioned on an inside of the hole. According to this aspect also, without the necessity of providing the conductor in the second connector member, both the capacitive coupling conductor and the conductor on the other electronic device can be in contact with the dielectric. According to those aspects, the dielectric may be formed on a surface of the capacitive coupling conductor. In further addition to the above, the first connector member may have a recess which extends downwardly, and the capacitive coupling conductor may be provided in a bottom plate portion which forms a bottom of the recessed portion. In this structure, it is possible to reduce the clearance between the capacitive coupling conductor and the conductor on the other contact conductor.
Yet further, according to another aspect of the present invention, the first connector member has a plurality of the first contact conductors which surround the capacitive coupling conductor on the lower surface of the first coupling member. Accordingly, the other contact conductor can be further stably retained by the one contact conductor.
These and other objects, advantages and features of the invention shall become more evident in a reading of the following detailed description.
Throughout the course of the following detailed description, reference will be made to the following drawings in which like reference numbers identify like parts and in which:
In the following, an embodiment of the present invention is described with reference to the drawings. The electrical connector 1 is for electrically connecting the two electronic devices together while being interposed therebetween. Herein, the application of the electrical connector 1 which connects the circuit board 100 and the camera module 200 with each other while interposed therebetween is explained by way of example and it will be understood that other applications are possible. In particular, the electrical connector 1 is one which enables a transmission of low frequency signals and direct current power through galvanic contact between opposing conductors, or terminals, and which also enables transmission of high frequency signals through capacitive coupling between conductors out of contact with each other.
The electrical connector 1 can be seen to have a plug portion, or first connector member, 10 to which a camera module 200 is attached on an upper surface 10a side thereof. The connector also includes a receptacle portion, or second connector member, 30 which is disposed on the circuit board 100 and disposed in opposition to a lower surface 10b of the plug portion 10, as shown in
The plug portion 10 is a member preferably formed from an insulative material such as a plastic resin, and has a generally quadrangular shape, with a square shape being shown in the preferred embodiment, when taken in a top plan view. As illustrated in
As illustrated in
The electronic components of the camera module 200 are disposed on the inside of this recess 12. In this example, the camera module 200 includes a circuit board 201, an image sensor 202 and multiple integrated circuits (not shown) disposed on the circuit board 201. These electronic components are disposed as one element, within the interior of the recess 12, as shown best in
As illustrated in
The shape of the capacitive coupling conductor 50 is not limited to the plate shapes illustrated in
A circuit board 201 of the camera module 200 is disposed in opposition to the bottom plate portion 12a. An upper surface 50a of the capacitive coupling conductor 50 is attached to the camera module, for example, by soldering it to a conductor 201a provided on the lower surface of the circuit board 201, to thereby effect an electrical connection between the camera module and the connector plug portion.
As illustrated in
The capacitive coupling conductor 50 and the conductor 101 on the circuit board 100 are formed at positions corresponding to each other, and the capacitive coupling conductor 50 is positioned oppositely to the circuit board conductor 101 while interposing the dielectric 60 therebetween. The receptacle portion 30 is positioned below the plug portion 10 and also has a quadrangular frame shape to match the configuration of the plug portions. The receptacle portion 30 therefore has a quadrangular cavity 30a which extends vertically in the central portion thereof (
Further, as illustrated in
The plug portion 10 may be formed as a MID (Molded Interconnect Device) in which the contacts, or terminals are directly formed in or on the surface of the molded product. As illustrated in FIGS. 1 and 7-9, the upper surface 10a and the lower surface 10b of the plug portion 10 is provided with multiple thin-film conductors 20. The conductors 20 each extend from the inside of the recess 12 to the edges 10c of the plug portion 10 on the upper surface of the upper plate portion 11. After that, the conductors 20 are reversed at their edges 10c to extend from the edges 10c to the protruding portions 13 on the lower surface of the upper plate portion 11. That is, each conductor 20 has an inner conductor 20f formed on the inner surface of the side wall portion 12b and contacts the terminal of the circuit board 201 disposed in the recess 12. Also, each of the conductors 20 has an upper conductor portion 20a formed on the upper surface of the upper plate portion 11, and a lower conductor portion 20b formed on the lower surface thereof.
Further, the conductor 20 is formed also on the outer surface of the protruding portion 13 which protrudes downward, and the conductor 20 has plug side contact conductor 20e which extends downward along the outer edges of the protruding portions 13. The plug side contact conductors 20e are positioned correspondingly to the positions of the receptacle side contact conductors 42 provided to the terminals 40 of the receptacle 30, and protrude downward to the receptacle side contact conductors 42 (refer to
The multiple upper conductors 20a extend toward the same edge 10c and the lower conductor 20b extend from each of the upper conductors 20a in parallel to each other at a preselected spacing. The multiple plug portion side contact conductors 20e are preferably formed parallel to each other, similar to the upper conductors 20a and the lower conductors 20b, and are further arranged in the extending directions of the protruding portions 13 on the outer surface of the protruding portions 13. Thus, the multiple plug portion side contact conductors 20e are arranged also in a frame shape similar to the protruding portions 13 to surround the side wall portion 12b of the recess 12 from four sides. Further, the plug side contact conductors 20e formed in the two protruding portions 13 which face each other (multiple plug side contact conductors 20e formed on one protruding portion 13 and multiple plug side contact conductors 20e formed on the other protruding portion 13) are positioned separately from each other along the bottom plate portion 12a, and the bottom plate portion 12a and the capacitive coupling conductor 50 are positioned between these plug side contact conductors 20e.
The plug side contact conductors 20e are formed with pairs of plug side contact portions 20c, 20d. The plug side contact portions 20c extend from the lower conductors 20b so as to be formed on the outer surfaces of the protruding portions 13 (surfaces on edges 10c side). Further, the plug side contact portions 20d extend from the plug side contact portions 20c so as to be formed on the inner surfaces of the protruding portions 13 (surfaces which face side wall portions 12b).
As illustrated in
As illustrated in
The terminals 40 are formed using elastic, spring materials. As illustrated in
As described above, the terminals 40 have the receptacle side contact conductors 42 (
The receptacle side contact conductor 42 has a bottom portion 42a which is disposed on a bottom portion 35 of the frame 31, and a pair of extending portions 42b, 42c which extend upward from both end of the bottom portion 42a. As illustrated in
As illustrated in
Further, the terminals 40 have leg portions 41 which extend downward on the outside of the outer frame portion 32 from one upper end 42g of the receptacle side contact conductor 42 beyond the upper edge of the outer frame portion 32. At the lower ends of the leg portions 41, there are provided tail portions 41a to be soldered to conductors on the circuit board 100. On the outer surface of the outer frame portion 32, there are formed the multiple wall portions 32b which extend in the up-and-down direction and are arranged at intervals corresponding to the thickness of the leg portions 41. The leg portions 41 are arranged between the wall portions 32b. In this regard, as illustrated in
As the attachment members 13 of the plug portion 10 enter into the attachment channel 34, the plug side contact conductors 20e formed on the attachment member 13 enter to the inside of the receptacle side contact conductors 42. In this case, the upper ends 42f, 42g are prevented from being collided against the plug side contact conductor 20e at the forward end of the attachment member 13 because the respective upper ends 42f, 42g of the extending portions 42b, 42c are widen. Further, as illustrated in
When the plug side contact conductors 20e are fitted in the receptacle side contact conductors 42, the plug side contact portions 20c are brought into contact with the receptacle side contact portions 42e, and the plug side contact portions 20d are brought into contact with the receptacle side contact portions 42d. As a result, the conductor of the circuit board 100 and the circuit board 201 disposed in the recess 12 are electrically connected with each other through contact of the conductors 20 and the terminals 40. Therefore, the conductors 20 and the terminals 40 having achieved the connection therebetween enable the transmissions of the low frequency signals and the direct current power.
As illustrated in
As described above, the extending portions 42b, 42c are curved toward the inside of the attachment channel 34 so that the clearance between the receptacle side contact portions 42d, 42e becomes small. The clearance between the receptacle side contact portions 42d, 42e is smaller than the thickness (clearance between plug side contact portions 20d, 20c) of the attachment member 13, when the receptacle side contact conductors 42 having elasticity are in a free state (state of free from load). That is, the receptacle side contact portions 42d, 42e are biased to the plug side contact conductors 20e side (inside of attachment channel 34). Thus, in a state in which the plug side contact conductors 20e are positioned on the inside of the receptacle side contact conductors 42, the receptacle side contact portions 42d, 42e are laterally pressed (in a direction orthogonal to entrance direction of attachment members 13) on the plug side contact portions 20d, 20c owing to the elasticity of the terminals 40. With this structure, the receptacle side contact conductors 42 are capable of stably retaining the plug side contact conductors 20e. In addition, when the receptacle side contact conductors 42 retain the plug side contact conductors 20e as described above, the plug portion 10 is restricted from moving in the direction of being separated from the receptacle 30.
Further, as described above, the bottom plate portion 12a is provided with the capacitive coupling conductor 50 which has the lower surface 50b on which the dielectric 60 formed. The board side conductor 101 is positioned on the side opposite to the capacitive coupling conductor 50 with the dielectric 60 being interposed therebetween. Then, in this embodiment, the receptacle side contact conductors 42 retain the plug side contact conductors 20e while the dielectric 60 is sandwiched between the capacitive coupling conductor 50 and the board side conductor 101. With this structure, the dielectric 60 and the board side conductor 101 are brought into close contact with each other, whereby capacitive coupling is achieved between the board side conductor 101 and the capacitive coupling conductor 50. Further, the receptacle side contact conductors 42 and the plug side contact conductors 20e are positioned so as to surround the bottom plate portion 12a and the capacitive coupling conductor 50. Therefore, in the state in which the receptacle side contact conductors 42 retain the plug side contact conductors 20e, a part of the dielectric 60 is prevented from being separated from the board side conductor 101.
In the alternate embodiment shown in phantom in
As illustrated in
Further, the thickness of the forward end portion 13a of the attachment member 13 is larger than those of the base portion and the midway portion of the attachment member 13. The forward end portion 13a bulges in a direction of expanding the clearance between the extending portions 42b, 42c, and has a thickness larger than the clearance between the receptacle side contact portions 42d, 42e. Therefore, after the plug portion 10 is pressed from above and the forward end portion 13a expands the clearance between the receptacle side contact portions 42d, 42e so as to enter the inside of the receptacle side contact conductor 42, the plug portion 10 is effectively prevented from being detached from the receptacle 30 thereafter. As a result, proper capacitive coupling is realized more effectively.
In the electrical connector 1 described above, the capacitive coupling conductors 50 are provided in addition to the plug side contact conductors 20e and the receptacle side contact conductors 42. Thus, while the transmission of power or the like can be performed through an intermediation of the plug side contact conductors 20e and the receptacle side contact conductors 42, the transmission of the high frequency signals can be performed through an intermediation of the capacitive coupling conductors 50. Further, in the electrical connector 1, the capacitive coupling conductors 50 are disposed between the plug side contact conductors 20e which are positioned separately from each other in the width direction of the bottom plate portion 12a. Therefore, the receptacle side contact conductors 42 which are positioned correspondingly to the plug side contact conductors 20e retain the plug side contact conductors 20e while the dielectric 60 is sandwiched between the capacitive coupling conductors 50 and the board side conductor 101 of the circuit board 100. In the electrical connector 1 as described above, it is possible to suppress the increase of the components for ensuring close contact between the conductor and the dielectric.
Further, in the electrical connector 1, the receptacle 30 is formed in a frame shape, and the capacitive coupling conductors 50 are positioned on the inside of the receptacle 30. With this structure, the capacitive coupling conductors 50 and the board side conductors 101 can be directly brought into contact with the dielectric bodies 60 without providing the conductor with receptacle 30.
Note that, the present invention is not limited to the electrical connector 1 described above, and various modifications can be made thereto. For example, the receptacle 30 is formed in a quadrangular frame shape in the above description. However, the shape of the receptacle 30 is not limited thereto. For example, there may be adopted a shape in which one of the four lines forming the quadrangular shape is omitted.
Further, the plug side contact conductors 20e are provided on the lower surface of the plug portion 10 so as to surround the capacitive coupling conductors 50 from four sides. However, the positions of the plug side contact conductors 20e are not limited thereto. For example, the plug side contact conductors 20e may be provided only at two portions with the capacitive coupling conductors 50 being sandwiched therebetween. For example, it is possible to provide the plug portion 10 with only the two attachment members 13 which are positioned on the sides opposed to each other while sandwiching the recess 12 therebetween, and to form the plug side contact conductors 20e on the two attachment members 13.
Further, in the above description, the dielectric bodies 60 are formed on the lower surface 50b of each of the capacitive coupling conductors 50. However, the dielectric bodies 60 may be formed on the board side conductor 101 of the circuit board 100.
Still further, in the above description, the receptacle 30 is formed in a quadrangular frame shape, and the cavity 30a is formed on the inside thereof. However, the receptacle 30 may have the bottom, and be provided with the conductors at the positions thereof corresponding to the capacitive coupling conductors 50. In addition, the dielectric may be provided on the upper surface or the lower surface of the dielectric which is provided at the bottom of the receptacle 30 in this case.
Yet further, in the above description, the camera module 200 is disposed on the upper surface 10a side of the plug portion 10, and the circuit board 201 on which the image sensor 202 and the like mounted is disposed on the inside of the recess 12. However, the electronic devices disposed on the upper surface 10a side of the plug portion 10 are not limited thereto, and various electronic devices using the high frequency signals may be disposed on the upper surface 10a side of the plug portion 10.
Yet further, in the above description, the receptacle side contact conductors 42 provided in the receptacle 30 retain the plug side contact conductors 20e provided in the plug portion 10. However, the plug side contact conductors and the receptacle side contact conductors may be formed such that the plug side contact conductor retains the receptacle side contact conductor.
Note that, the terms “up” and “down” defined in the above description refer to the directions which represent the positional relationships between the plug portion 10, the receptacle 30, and the like, and do not refer to the absolute directions.
Number | Date | Country | Kind |
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2008-255657 | Sep 2008 | JP | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/US2009/059078 | 9/30/2009 | WO | 00 | 6/10/2011 |
Publishing Document | Publishing Date | Country | Kind |
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WO2010/039867 | 4/8/2010 | WO | A |
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