The present invention relates in general to electrical capacitors. The invention relates in particular to electrical capacitors having high-strength dielectric spacers.
A new dielectric material based on glass-ceramics for high-voltage (HV) capacitors has recently been developed. This material is sold under a trade name POWERAMICâ„¢, by Schott AG of Mainz, Germany. The material is produced in a process of melting amorphous glass then subjecting the molten glass to a time-temperature profile which causes nano-sized crystal to grow in the glass. As a result, a highly homogenous and pore-free glass-ceramic is obtained.
This glass ceramic offers an extraordinarily high energy storage density and dielectric strength even at high temperatures which allows building very thin HV capacitors. By way of example a standard 2 nanofarad (nF) capacitor using a strontium titanate or barium titanate dielectric spacer, has a spacer-thickness of about 15 mm. Substituting the new glass-ceramic for the spacer would allow the dielectric thickness to be reduced to about 3 mm. Such a thin capacitor would be particularly advantageous in certain applications, for example, in the design of electric pulse generators for creating super-atmospheric discharges in excimer laser tubes.
A standard technique for assembling a two-terminal capacitor is to metallize surfaces of a thick dielectric spacer then solder bond metal electrodes to opposite sides of dielectric spacer. Soldering is not compatible with the above-discussed electric pulse generators. An alternative assembly technique preferably not requiring metallization would be more suitable.
In one aspect, an electrical capacitor in accordance with the present invention comprises a dielectric spacer having first and second opposite surfaces. First and second metal electrodes are in contact with respectively the first and second surfaces of the dielectric spacer. The metal electrodes are held in contact with the first and second surfaces of the dielectric spacer by magnetic force.
The accompanying drawings, which are incorporated in and constitute a part of the specification, schematically illustrate a preferred embodiment of the present invention, and together with the general description given above and the detailed description of the preferred embodiment given below, serve to explain principles of the present invention.
Turning now to the drawings, wherein like features are designated by like reference numerals,
Magnets 26 and 28 are polarized with opposite poles thereof (N and S) facing each other such that a magnetic attraction force (schematically indicated) urges the magnets toward holding the magnets in contact with surfaces 22 and 24 of the spacer sheet without mechanical or adhesive assistance. In spacer sheet 20 between magnets 26 and 28, magnetic lines-of-force (designated by bold dashed lines 30) are perpendicular to surfaces 22 and 24 of the spacer sheet. Optionally surfaces 22 and 24 of spacer-sheet 20 can be metallized to improve electrical contact between the spacer sheet and the magnets, but if mating surfaces of the spacer sheet and the magnets are substantially free of defects metallization should not be necessary. Indeed it can be preferable to avoid metallization of the spacer sheet of the present invention, not only to avoid the cost of the two-step (vacuum deposition followed by electroplating) metallization process, but because any stress inequality in the metallized surfaces could distort the spacer sheet to a point where the spacer sheet could not be reliably used in the inventive magnetic assembly.
In the above described embodiments of the inventive capacitor magnets used to prove magnetic force for holding the capacitors together are permanent magnets. In theory at least, electromagnets could be used to provide such magnetic force. This however is unlikely to be practical or cost effective.
Further any of the embodiments could be enclosed in a ceramic or glass envelope for protecting the capacitor from corrosion, nearby surface arcing, atmospheric ionization, and the like. Such protective envelopes for capacitors are well known in the art, and a description thereof is not necessary for understanding principles of the present invention. Accordingly such a description is not presented herein.
In summary, the present invention is described above in terms of preferred embodiments. The invention is not limited, however, by the embodiments described and depicted herein. Rather, the invention is limited only by the claims appended hereto.
This application claims priority to U.S. Provisional Patent Application Ser. No. 62/086,144, filed Dec. 1, 2014, the entire disclosure of which is incorporated herein by reference.
Number | Date | Country | |
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62086144 | Dec 2014 | US |