The present disclosure relates to capacitor modules and methods for fabricating capacitor modules.
Capacitors using laminate films as exterior covering materials are known. For example, Japanese Patent No. 4354240 describes a surface-mounted capacitor including a capacitor exteriorly-covered with a laminate film.
The surface-mounted capacitor described in Japanese Patent No. 4354240 has room for improvement in terms of insulation and size reduction when the capacitor is modularized.
In view of the foregoing, the exemplary aspects of the present disclosure provide a capacitor module with improved insulation and a reduced size. Moreover, a method for fabricating the capacitor module is also described herein.
In an exemplary aspect, a capacitor module is provided that includes one or more capacitors that each comprise a main-body covered with a laminate film, and a first terminal electrode and a second terminal electrode exposed from the main-body; a case having one or more recesses that are adapted to house the one or more capacitors; a first bus bar integrally incorporated in the case and electrically connected to the first terminal electrodes; and a second bus bar integrally incorporated in the case and electrically connected to the second terminal electrodes. The first bus bar includes one or more first connection portions connected to the respective first terminal electrodes of the capacitors disposed in the recesses, and the second bus bar includes one or more second connection portions connected to the respective second terminal electrodes of the capacitors disposed in the recesses.
In another exemplary aspect, a method for fabricating a capacitor module is provided that includes preparing a case integrally incorporating a first bus bar and a second bus bar, the case being provided with a recess for housing a capacitor having a first terminal electrode and a second terminal electrode; disposing the capacitor in the recess in the case; and connecting the first bus bar and the first terminal electrode to each other, and connecting the second bus bar and the second terminal electrode to each other.
According to the exemplary aspects of the present disclosure, a capacitor module is provided with improved insulation and a reduced size. Moreover, a method is disclosed for fabricating the capacitor module.
Currently, there are known film capacitors that use laminate films as materials for exteriorly covering capacitors. For example, Japanese Patent No. 4354240 discloses a surface-mounted capacitor that includes a capacitor having extraction leads and exteriorly covered with a laminate film, and a fixing plate including an external connection terminal.
The capacitor exteriorly covered with the laminate film is excellent in weather resistance and, therefore, there is no need for covering the entire capacitor with a resin. On the other hand, when the capacitor covered with the laminate film is connected to a bus bar and used as a capacitor module, there are problems of difficulty of securing insulation between terminal electrodes in the capacitor, and difficulty of protecting the portions of bonding between the terminal electrodes and the bus bar.
In view of the foregoing, a capacitor module is provided with improved insulation between terminal electrodes and that is configured for easily protecting the portions of bonding between the terminal electrodes and bus bars. Moreover, a method for fabricating the capacitor module is described herein.
According to an exemplary aspect, a capacitor module is provided that includes one or more capacitors each comprising a main-body covered with a laminate film, and a first terminal electrode and a second terminal electrode exposed from the main-body; a case that includes one or more recesses configured to house the one or more capacitors; a first bus bar integrally incorporated in the case and electrically connected to the first terminal electrodes; and a second bus bar integrally incorporated in the case and electrically connected to the second terminal electrodes. Moreover, the first bus bar includes one or more first connection portions connected to the respective first terminal electrodes of the one or more capacitors disposed in the recesses, and the second bus bar includes one or more second connection portions connected to the respective second terminal electrodes of the one or more capacitors disposed in the recesses.
With this configuration, a small-sized capacitor module is provided while securing insulation between the first bus bar and the second bus bar.
In the capacitor module in a second exemplary aspect, each of the one or more recesses may include a first recess for disposing the main-body, a second recess for disposing the first terminal electrode, and a third recess for disposing the second terminal electrode. Moreover, the first connection portions may be positioned in the second recesses, and the second connection portions may be positioned in the third recesses.
With this configuration, the capacitors can be easily positioned with respect to the case, which makes it possible to easily bond the terminal electrodes and the bus bars to each other.
In the capacitor module in a third exemplary aspect, the second recess and the third recess may be arranged continuously with the first recess, and the second recess and the third recess may be spaced apart from each other.
With this configuration, insulation can be secured between the first terminal electrode and the second terminal electrode.
In the capacitor module in a fourth exemplary aspect, in the case, the first recesses may be aligned in a first direction, and the second recesses and the third recesses may be alternately aligned in the first direction.
With this configuration, the space in the case can be effectively utilized, which contributes to downsizing of the capacitor module.
In the capacitor module in a fifth exemplary aspect, the case may include a first case incorporating the first bus bar, and a second case incorporating the second bus bar.
With this configuration, a capacitor module having a smaller size can be provided.
In the capacitor module in a sixth exemplary aspect, the first connection portions may be disposed in an outer side surface of the first case, and the second connection portions may be disposed in an outer side surface of the second case. Moreover, the first terminal electrode may include a first extending portion extending from the capacitor toward the outer side surface of the first case, and a first bend that is bent from the first extending portion along the outer side surface of the first case, and the second terminal electrode may include a second extending portion extending from the capacitor toward the outer side surface of the second case, and a second bend that is bent from the second extending portion along the outer side surface of the second case.
With this configuration, the terminal electrodes and the bus bars are connected to each other in the outer side surface of the case, which enables the capacitor module to have a smaller size.
In the capacitor module in a seventh exemplary aspect, the first case and the second case may have a same shape, and the first bus bar and the second bus bar may have a same shape.
With this configuration, the number of components can be reduced, thereby reducing the fabrication cost.
In the capacitor module in an eighth exemplary aspect, the first case may be provided, in the outer side surface, with an opening for exposing the first connection portion(s), and the second case may be provided, in the outer side surface, with an opening for exposing the second connection portion(s).
With this configuration, the size of the capacitor module can be reduced, and the terminal electrodes can e easily bonded to the bus bars.
In another exemplary aspect, a method is provided for fabricating a capacitor module that includes preparing a case integrally incorporating a first bus bar and a second bus bar, the case being provided with a recess for housing a capacitor having a first terminal electrode and a second terminal electrode; disposing the capacitor in the recess in the case; and connecting the first bus bar to the first terminal electrode, and connecting the second bus bar to the second terminal electrode.
With this configuration, the terminal electrodes can be easily bonded to the bus bars.
In yet another exemplary aspect, a method is provided for fabricating a capacitor module that includes preparing a first case integrally incorporating a first bus bar and provided with a recess for housing a capacitor having a first terminal electrode and a second terminal electrode; preparing a second case integrally incorporating a second bus bar and provided with a recess for housing the capacitor; disposing the capacitor in the recess provided in the first case; bending the first terminal electrode and the second terminal electrode; overlaying the second case on the first case; connecting the first terminal electrode to the first bus bar; and connecting the second terminal electrode to the second bus bar.
With this configuration, positioning in assembling the capacitor module can be easily performed, which enables easily bonding the terminal electrodes and the bus bars to each other.
Hereinafter, exemplary embodiments will be described with reference to the accompanying drawings. Incidentally, in the respective drawings, respective components are exaggerated in order to facilitate the description.
As illustrated in
As illustrated in
The capacitor 11 is, for example, a film capacitor formed by a dielectric film that is wound or laminated. In the present embodiment, the capacitor 11 is a columnar film capacitor having an oval cross section. As the dielectric film forming the capacitor 11, a plastic film can be used that is formed from, for example, polyethylene terephthalate, polypropylene, polyphenylene sulfide, or polyethylene naphthalate. As a vapor-deposited metal film formed on the surface of the plastic film, a metal can be used such as aluminum or zinc, for example.
The capacitor 11 includes, on both the end surfaces, end surface electrodes (not illustrated) formed through metal spraying. A first terminal electrode 13 and a second terminal electrode 14 each having a flat plate shape are electrically connected to the respective end surface electrodes.
The first terminal electrode 13 and the second terminal electrode 14 are exposed to the outside of the laminate film 15 from the main-body 12. In the present embodiment, the first terminal electrode 13 and the second terminal electrode 14 are formed to extend outward from a side surface of the main-body 12 having a columnar shape.
The main-body 12 of the capacitor 11 is covered with the laminate film 15, which can secure the humidity resistance of the capacitor 11. As the laminate film 15, a film can be used that is formed by resin films and an aluminum foil that are attached to each other. Specifically, an aluminum laminate film formed by a resin film can be used that has heat-sealability, which is formed from cast polypropylene (CPP) or the like, a resin film having excellent strength that is formed from nylon, polyethylene terephthalate or the like, and an aluminum foil attached therebetween through an adhesive agent or thermocompression bonding. The aluminum layer is excellent in water-vapor barrier property. By covering the main-body 12 with the aluminum laminate film having the aluminum layer, the moisture resistance of the capacitor 11 is improved. It should be appreciated that the effects of the exemplary embodiment are not limited by the materials forming the laminate film, and it is possible to appropriately adopt materials of the laminate film that provide higher adhesiveness between the laminate films and have higher water-vapor barrier properties, strength, or durability.
In the present embodiment, three capacitors 11 are housed in the case 20 according to an exemplary aspect.
The case 20 is a member that houses the capacitors 11. In the present embodiment, the case 20 includes a first case 21 provided with three recesses 22 for housing the capacitors 11, and a second case 26 which covers the first case 21. A first bus bar 31 and a second bus bar 36 are integrally incorporated in the first case 21 in the case 20. The first case 21 corresponds to a main body of the case 20, and the second case 26 corresponds to a lid of the case 20.
In the present embodiment, as illustrated in
When the main-body 12 of the capacitor 11 is housed in the first recess 23, the first terminal electrode 13 in the capacitor 11 is disposed in the second recess 24, and the second terminal electrode 14 in the capacitor 11 is disposed in the third recess 25. The first recess 23 and the second recess 24, and the first recess 23 and the third recess 25 are arranged continuously with each other.
In the present embodiment, the first recesses 23 are aligned in a row in the lateral direction (a first direction), in order to enable disposing three capacitors 11 side by side in a row. Further, the second recesses 24 and the third recesses 25 are alternately disposed in the first direction with intervals interposed therebetween.
The second case 26 is a member for covering the first case 21 and housing the capacitors 11 inside the case 20. In the present embodiment, the capacitors 11 can be housed in the case 20 such that the three capacitors 11 are sandwiched between the first case 21 and the second case 26. As illustrated in
In the present embodiment, the first case 21 is provided, on its outer side surface, with fixing portions 21b for fixing the capacitor module to an external substrate, device, or the like. For example, by fastening a screw or the like to the fixing portions 21b, the capacitor module can be fixed to an external substrate, device, or the like.
As a material forming the first case 21 and the second case 26, a synthetic resin can be used such as polyphenylene sulfide, polybutylene terephthalate, or a liquid crystal polymer, for example. It is preferable that glass fibers or inorganic fillers are blended in these materials in order to improve the dimensional stability or the strength according to an exemplary aspect.
The first bus bar 31 is connected to the first terminal electrodes 13 in the capacitors 11. The second bus bar 36 is connected to the second terminal electrodes 14 in the capacitors 11. The first bus bar 31 and the second bus bar 36 are connected to, for example, electrodes (not illustrated) on an external substrate, device, or the like, thereby electrically connecting the capacitors 11 to the external substrate, device, or the like. As illustrated in
The first bus bar 31 and the second bus bar 36 are formed from, for example, a plate-shaped conductive member made of copper, brass, aluminum, or the like. Among them, it is preferable to use oxygen-free copper or pure copper called tough pitch copper, which has excellent conductivity. The first bus bar 31 and the second bus bar 36 may have a metal film formed from nickel, tin, or the like on their surfaces through plating or the like.
As illustrated in
As illustrated in
Similarly, as illustrated in
It is possible to position the terminal electrodes 13, 14 by housing the capacitors 11 in the recesses 22. This can improve the workability during the ultrasonic welding.
As illustrated in
First, as illustrated in
Next, as illustrated in
Next, as illustrated in
The second case 26 is attached to the first case 21 to complete the capacitor module according to the first exemplary embodiment.
The capacitor module according to the first exemplary embodiment and the method for fabricating the capacitor module according to the first embodiment can achieve the following effects.
The capacitor module according to the first exemplary embodiment includes the three capacitors 11, the case 20, the first bus bar 31, and the second bus bar 36. Each capacitor 11 includes the main-body 12 covered with the laminate film 15, and the first terminal electrode 13 and the second terminal electrode 14 exposed from the main-body 12. The case 20 houses the capacitors 11. The case 20 is provided with the three recesses 22 which house the respective capacitors 11. The first bus bar 31 is integrally incorporated in the case 20 and has the first connection portions 32 electrically connected to the first terminal electrodes 13. The second bus bar 36 is integrally incorporated in the case 20 and has the second connection portions 37 electrically connected to the second terminal electrodes 14.
With this configuration, it is possible to secure insulation between the bus bars 31, 36, which enables provision of the exemplary capacitor module with improved insulation. In addition, since the bus bars 31, 36 are integrally incorporated in the first case 21 (the case 20), it is possible to provide the exemplary capacitor module with a reduced size.
Each recess 22 includes the first recess 23, the second recess 24, and the third recess 25. The main-body 12 of the capacitor 11 is disposed in the first recess 23. The first terminal electrode 13 in the capacitor 11 is disposed in the second recess 24. The second terminal electrode 14 in the capacitor 11 is disposed in the third recess 25. The first connection portions 32 of the first bus bar 31 are positioned in the second recesses 24. The second connection portions 37 of the second bus bar 36 are positioned in the third recesses 25.
With this configuration, it is possible to easily bond the terminal electrodes 13, 14 in the capacitors 11 to the bus bars 31, 36.
The second recess 24 and the third recess 25 are arranged continuously with the first recess 23. The second recess 24 and the third recess 25 are spaced apart from each other.
With this configuration, it is possible to secure insulation between the first terminal electrode 13 and the second terminal electrode 14 in the capacitor 11.
In the first case 21 in the case 20, the first recesses 23 are aligned in the first direction (the X direction), and the second recesses 24 and the third recesses 25 are alternately aligned in the first direction.
With this configuration, it is possible to effectively utilize the space in the case 20, which contributes to downsizing of the capacitor module according to the first exemplary embodiment.
The method for fabricating the capacitor module according to the first exemplary embodiment includes forming the case 20; disposing the capacitors 11 in the case 20; and connecting the bus bars 31, 36 and the terminal electrodes 13, 14 to each other.
With this method, it is possible to easily attain positioning in assembling the capacitor module according to the first exemplary embodiment, which makes it possible to easily bond the terminal electrodes 13 and 14 and the bus bars 31 and 36 to each other.
Although in the aforementioned embodiment, there has been described an example where the exemplary capacitor module includes three capacitors 11, the exemplary embodiments are not limited thereto. The capacitor module according to the first exemplary embodiment can include one or more capacitors 11 in alternative embodiments.
In the aforementioned embodiment, there has been described an example where the capacitor 11 is formed to have a columnar shape having an oval cross section. However, the capacitor 11 may be also formed to have a circular column shape in another exemplary embodiment. Also, the capacitor 11 may be a wound film capacitor or a laminated film capacitor, for example.
Further, in the aforementioned embodiment, there has been described an example where the capacitor 11 includes one first terminal electrode 13 and one second terminal electrode 14. However, the capacitor 11 may have a plurality of first terminal electrodes 13 and a plurality of second terminal electrodes 14 in alternative aspects. Also, the capacitor 11 may have a metal terminal that is not connected to the end surface electrodes and is exposed from the main-body 12. In this case, the capacitor module has improved heat dissipation. In the case of providing the metal terminal, the case can be provided with a recess for disposing and positioning the metal terminal.
Further, in the aforementioned embodiment, there has been described an example where the bus bars 31 and 36 and the terminal electrodes 13 and 14 are bonded to each other by ultrasonic welding. However, the bus bars 31 and 36 and the terminal electrodes 13 and 14 can be electrically connected to each other by, for example, solder bonding, resistance welding, laser welding, or the like in alternative aspects.
Further, in the aforementioned embodiment, there has been described an example where the first case 21 and the second case 26 are fixed to each other by the hook 26a provided in the second case 26 and the recess 21a provided in the first case 21. However, the first case 21 and the second case 26 can be fixed to each other by, for example, a screw or an adhesive agent in an alternative aspect.
Also, it is possible to dispose a thermal pad or the like having high thermal conductivity and flexibility between the capacitors 11 and the case 20. By disposing such a thermal pad or the like, it is possible to improve the heat dissipation of the exemplary capacitor module. Further, since the thermal pad has flexibility, the thermal pad can absorb impacts on the capacitors 11, which can improve the durability of the capacitor module according to the first exemplary embodiment.
A capacitor module according to a second exemplary embodiment will be described.
In the second embodiment, differences from the first embodiment will be mainly described. In the second embodiment, the same or equivalent configurations as or to those of the first embodiment will be described with the same reference numerals. Further, in the second embodiment, description overlapping with that of the first embodiment will be omitted.
The second embodiment is different from the first embodiment in that a case 120 includes a first case 121 and a second case 126, the first case 121 incorporates a first bus bar 131, and the second case 126 incorporates a second bus bar 136. Namely, the second embodiment is different from the first embodiment in that the two bus bars 131, 136 are not incorporated in one case, out of the two separated cases 120, but the bus bars 131, 136 are separately incorporated in the respective cases.
Further, the second embodiment is different from the first embodiment in that first connection portions 132 of the first bus bar 131 are positioned in the outer side surface of the first case 121, and second connection portions 137 of the second bus bar 136 are positioned in the outer side surface of the second case 126. Namely, the second embodiment is different from the first embodiment in that the portions of the bus bars 131, 136 and capacitors 111, which are connected to each other are not provided inside the case 120 but are exposed through the outer side surface of the case 120.
Further, the second embodiment is different from the first embodiment in that a first terminal electrode 113 and a second terminal electrode 114 of the capacitor 111 have extending portions 113a, 114a and bends 113b, 114b. Namely, the second embodiment is different from the first embodiment in that the terminal electrodes 113 and 114 are bent, rather than being extended in one direction.
As illustrated in
As further shown, the first case 121 is provided with recesses 122, similarly to in the first embodiment. Specifically, each recess 122 includes a first recess 123, a second recess 124, and a third recess 125. The first recess 123 and the second recess 124 are continuously arranged, and the first recess 123 and the third recess 125 are continuously arranged. Similarly, the second case 126 is provided with first recesses, second recesses, and third recesses.
In the present embodiment, the first case 121 is provided, in an outer side surface 121c thereof, with openings 121b. Similarly, the second case 126 is provided, in an outer side surface 126c thereof, with openings 126b. The first connection portions 132 of the first bus bar 131 are positioned in the openings 121b in the first case 121. Similarly, the second connection portions 137 of the second bus bar 136 are positioned in the openings 126b in the second case 126.
As illustrated in
As illustrated in
First, the first case 121 is prepared (step S21). The first case 121 can be formed by, for example, insert molding. The first case 121 is provided with recesses 122 for housing the capacitors 111. As illustrated in
Next, the second case 126 is prepared (step S22). The second case 126 can be formed by, for example, insert molding. Similarly to the first case 121, the second case 126 is provided with recesses.
In the present embodiment, the first case 121 and the second case 126 have the same shape and, therefore, the first case 121 and the second case 126 can be formed using the same mold.
Next, the capacitors 111 are disposed in the recesses 122 in the first case 121 (step S23). At this time, the tip end of each first terminal electrode 113 is bent to form the first bend 113b in advance. Similarly, the tip end of each second terminal electrode 114 is bent to form the second bend 114b in advance. By disposing the main-bodies 112 of the capacitors 111 in the recesses 122 in the first case 121, the first bends 113b are inserted into the slits 124a.
After the capacitors 111 are disposed in the first case 121, the second case 126 is overlaid on and fixed to the first case 121 (step S24). At this time, the second bends 114b are inserted into the slits in the second case 126.
Next, the first bus bar 131 and the first terminal electrodes 113 are connected to each other (step S25). Similarly, the second bus bar 136 and the second terminal electrodes 114 are connected to each other (step S26). By forming the first bends 113b and the second bends 114b, the terminal electrodes 113 and 114 and the bus bars 131 and 136 are disposed so as to be overlaid on each other in the longitudinal direction (Y direction). This makes it possible to easily bond the terminal electrodes 113 and 114 and the bus bars 131 and 136 to each other by welding, for example.
The bus bars 131 and 136 and the terminal electrodes 113 and 114 can be connected to each other by, for example, ultrasonic welding. The bus bars 131 and 136 and the terminal electrodes 113 and 114 are connected to each other to complete the capacitor module of the exemplary embodiment.
The capacitor module according to the second exemplary embodiment can achieve the following effects.
In the capacitor module of the second exemplary embodiment, the case 120 includes the first case 121 and the second case 126. The first case 121 incorporates the first bus bar 131. The second case 126 incorporates the second bus bar 136.
With this configuration, the bus bars 131 and 136 are incorporated in the first case 121 and the second case 126, respectively, which enables downsizing in the longitudinal direction (i.e., the Y direction), thereby contributing to size reduction of the capacitor module of the second exemplary embodiment, as compared with the first exemplary embodiment.
The first connection portions 132 of the first bus bar 131 are disposed in the outer side surface 121c of the first case 121, and the second connection portions 137 of the second bus bar 136 are disposed in the outer side surface 126c of the second case 126. The first terminal electrode 113 has the first extending portion 113a extending from the capacitor 111 toward the outer side surface 121c of the first case 121, and the first bend 113b bent from the first extending portion 113a along the outer side surface 121c of the first case 121. The second terminal electrode 114 has the second extending portion 114a extending from the capacitor 111 toward the outer side surface 126c of the second case 126, and the second bend 114b bent from the second extending portion 114a along the outer side surface 126c of the second case 126.
Since the terminal electrodes 113 and 114 are bent, it is possible to realize space saving, which contributes to size reduction of the capacitor module of the second exemplary embodiment.
The first case 121 and the second case 126 have the same shape, and the first bus bar 131 and the second bus bar 136 have the same shape.
Since the first case 121 and the second case 126 have the same shape and the first bus bar 131 and the second bus bar 136 have the same shape, it is possible to reduce the number of components and the number of molds for the capacitor module of the second exemplary embodiment, which can reduce the fabrication cost.
The first case 121 is provided, in its outer side surface 121c, with the openings 121b for exposing the first connection portions 132, and the second case 126 is provided, in it's the outer side surface 126c, with the openings 126b for exposing the second connection portions 137.
The terminal electrodes 113 and 114 and the bus bars 131 and 136 can be bonded to each other in the outer side surfaces 121c and 126c of the cases 121 and 126, which enables further reducing the size of the capacitor module of the second exemplary embodiment.
A method for fabricating the capacitor module according to the second exemplary embodiment includes preparing the first case 121; preparing the second case 126; disposing the capacitors 111 in the first case 121; overlaying the second case 126 on the first case 121; and connecting the bus bars 131, 136 and the terminal electrodes 113, 114 to each other.
In assembling the capacitor module of the second exemplary embodiment, the capacitors 111 are positioned by the recesses 122, which facilitates assembling. In addition, since the terminal electrodes 113 and 114 have the bends 113b and 114b, the bends 113b and 114b can be exposed from the outer side surfaces 121c and 126c of the cases 121 and 126, which makes it possible to easily bond the terminal electrodes and the bus bars to each other.
As illustrated in
Further, first connection portions 232 of a first bus bar 231 are positioned in the openings 221b in the first case 221, and second connection portions 237 of a second bus bar 236 are positioned in the openings 226b in the second case 226.
Further, the first case 221 and the second case 226 can be fixed to each other by, for example, fastening through screws or the like, using fixing portions 221a and 226a provided on the cases 221 and 226, respectively.
After the first case 221 and the second case 226 are prepared, capacitors 211 are disposed in the recesses 222 in the first case 221 (step S33). At this time, the capacitors 211 have terminal electrodes having a flat-plate shape as illustrated in
Next, the tip end of each first terminal electrode 213 is bent along the outer side surface 221c of the first case 221 to form a first bend 213b, and the tip end of each second terminal electrode 214 is bent along the outer side surface 226c of the second case 226 to form a second bend 214b (step S34).
After the first bends 213b and the second bends 214b are formed, the second case 226 is disposed, and the bus bars 231 and 236 and the terminal electrodes 213 and 214 are connected to each other to complete the capacitor module of the present embodiment (step S5˜37).
Since the openings 221b are arranged continuously with the second recesses 224, the capacitors 211 can be disposed in the recesses 222 in the first case 221, then the bends 213b, 214b can be formed and, thereafter, the second case 226 can be disposed on the first case 221. This makes it easier to assemble the capacitor module of the current exemplary embodiment.
The exemplary embodiments of the present disclosure are applicable to capacitor modules for use in various types of electronic apparatuses, electric apparatuses, industrial apparatuses, vehicle apparatuses, and the like.
Number | Date | Country | Kind |
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2022-005991 | Jan 2022 | JP | national |
The present application is a continuation of PCT/JP2023/000020 filed Jan. 4, 2023, which claims priority to Japanese Patent Application No. 2022-005991, filed Jan. 18, 2022, the entire contents of each of which are incorporated herein by reference.
Number | Date | Country | |
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Parent | PCT/JP2023/000020 | Jan 2023 | WO |
Child | 18773852 | US |