The current method and system relate to power capacitors and in particular to mounting of high frequency, high voltage power capacitors on cooling devices.
High voltage alternating current (AC) power capacitors are designed to meet the mechanical, electrical, and performance requirements of high voltage high frequency AC electrical circuits. Such capacitors commonly used in electrical circuits carrying peak voltages of, for example, 1400Vpeak and electrical current of 3000 Arms are prone to Ohmic, dielectric and inductive energy losses mainly in the form of heat. For example, in a common high and medium frequency (e.g., 1 kHz to 1 MHz) power capacitor each 500 kVAr reactive power can generate a loss of 500 to 1000 Watt in the form of heat.
The large amount of heat lost by most high voltage alternating current (AC) power capacitors sometimes limits the number of capacitors one can use in a high voltage alternating current (AC) circuit as well as the configuration in which the capacitors can be lined up. For example, certain configurations of mounting more than one capacitor to a buss such as, for example, in series, may bring one or more capacitors, e.g., the last in the series, to overheat.
Solutions currently practiced include running a coolant such as water through an individual capacitor or mounting capacitors on cooling busses that dissipate the heat via conduction.
However, employing the above and other commonly practiced solutions requires mounting of one or more capacitors on a cooling bus and then connecting the system to a cooling fluid supply. This procedure may be time and labor consuming.
A system that will support fast and simple mounting of a number of capacitors to a cooling bus and that will concurrently provide a cooling system for all mounted on the cooling bus capacitors will not only cut back on labor but also make heat dissipation from each and every capacitor more efficient removing any limitations to capacitor-bus mounting configurations.
The present disclosure seeks to provide an efficient capacitor-cooling bus bar mounting system that provides adding one or more capacitors to an electrical circuit, mechanical mounting thereof and completing a capacitor advection-conduction capacitor cooling system in a single step.
In accordance with an example there is thus provided a capacitor including one or more coolant fluid passageways having one or more coolant fluid outlet openings and/or inlet openings that when brought into congruence and mounted onto a cooling bus bar with corresponding coolant fluid outlet openings and/or inlet openings in one or more cooling bus bars completes a advection-conduction capacitor cooling system.
In accordance with another example there is thus provided a capacitor—cooling bus mounting system in which a fixing element driven through a through hole coolant fluid passageway in a capacitor into a compatible bore in the bus bar that is also a coolant fluid passageway outlet or inlet providing a continuous fluid pathway for flow of coolant fluid from the cooling bus to and through the capacitor.
In accordance with another example there is thus provided a capacitor—cooling bus mounting system in which a fixing element driven through a through hole coolant fluid passageway in a capacitor into a compatible bore in the bus bar brings the capacitor and cooling bus into contact and supports cooling the capacitor by conduction.
In accordance with yet another example the fixing element can include a head having one or more cutouts extending from a contact surface of the head with the capacitor. The cutouts support coolant fluid flowing from a main in the bus bar over and around a stem of the fixing element to bypass the head of the fixing element via the cutouts and flow into passageways in the capacitor.
The present method and system will be understood and appreciated more fully from the following detailed description, taken in conjunction with the drawings in which:
Reference is made to
Cooling bus 104 can include a high-low coolant fluid pressure heat removing system in one or more high pressure heat-removing bars 114 and low pressure heat-removing bars 114-1.
It is a particular feature of the present example that in cooling bus—capacitor mounting system 100 of
Cooling bus 104 does not comprise any capacitor fixing element accommodating bores other than bores that include a coolant fluid passageway outlet or inlet such as outlet 106-2 and inlet 106-4. Alternatively, any capacitor fixing element accommodating bores in cooling bus 104 also include a coolant fluid passageway.
As shown in
Coolant fluids in cooling bus 104 can include water; oils such as, for example, mineral oil or silicone oils; suitable organic chemicals such as, for example, ethylene glycol or propylene glycol, refrigerants and others.
This configuration provides for the cooling of capacitor 102 not only by conduction of heat, through direct contact, from capacitor 102 to cooling bus 104, but also for concurrent cooling by heat advection, driving heat away from capacitor 102 via coolant fluid flowing therethrough thus creating a heat advection-conduction capacitor cooling system.
The capacitor heat advection system can include a high pressure coolant fluid portion, indicated in
O-rings 402 made of a suitable material can be placed between capacitor 102 and cooling bus 104 around bores 206/208 between cooling bus 104 bars 114 and capacitor 102.
Reference is now made to
It is a particular feature of the present example that coolant fluid mains 202/204 of cooling bus 104, do not communicate with each other and the coolant fluid passageway is only complete when one or more capacitors are mounted on the cooling bus. Hence, the configuration of cooling bus 104 as shown in the example of
High pressure coolant fluid main 202 can communicate with one or more high pressure coolant fluid passageway outlets 106-2 via a bore 206 in cooling bus bar 104. Low pressure coolant main 204 communicates with one or more low pressure coolant fluid inlets 106-4 via a bore 208 in cooling bus bar 104-1. As seen in
A locking receptacle 210 can be drilled through Bores 206/208 beyond mains 202/204 and bores 206/208 respectively meeting points and into the body of cooling busses 104 and 104-1 respectively to accommodate and lock a tip 152 (
As will be explained in greater detail below, locking receptacle 210 can include a locking mechanism that locks fixing element 150 and thereby mounts capacitor 102 onto cooling bus 104 while concurrently creating a continuous fluid pathway from cooling bus 104 high pressure coolant main 202 through capacitor 102 through hole 108 and from through hole 108-1 through capacitor 102 and into low pressure coolant main 204.
The longitudinal axes of bores 206/208 can be at any suitable angle in respect to the longitudinal axes of mains 202/204. In the example of
Reference is now made to
Stem 160 can be attached on a first end thereof to head 154 contact surface 158 and include on a second free end thereof a tip 152 including a locking mechanism 162. In the example shown in
Cutouts 156 provide a bypass for coolant fluid to bypass head 154 of fixing element 150 by allowing a flow of coolant fluid therethrough. It is a particular feature of the present example that coolant fluid flow is maintained once capacitor coolant fluid through holes outlet openings and/or inlet openings are brought into congruence with corresponding coolant fluid outlet openings and/or inlet openings in one or more cooling bus bars and one or more capacitors 102 are mounted and fixing element 150 is locked in position. Thus, mounting capacitor 102 to bus bars 104 becomes a single step process both fixing capacitors 102 in position and connecting the coolant fluid passageways. As will be explained in greater detail below, the diameter of stem 160 can be smaller than the diameter of bores 206/208 to allow for coolant fluid to flow around stem 160. Additionally, the diameter of head 154 at the level Q-Q, i.e., the level of one or more cutouts 156, can be smaller than the diameter of bores 206/208 to provide a passageway for coolant fluid to flow from bore 206 to through hole 108 and/or from through hole 108-1 to bore 208 through one or more cutouts 156 with fixing element 150 locked into position.
Referring now to
A coolant fluid flow pathway, depicted in
It will be appreciated by persons skilled in the art that the present systems methods are not limited to what has been particularly shown and described hereinabove. Rather, the scope of the method and system includes both combinations and sub-combinations of various features described hereinabove as well as modifications and variations thereof which would occur to a person skilled in the art upon reading the foregoing description and which are not in the prior art.
Filing Document | Filing Date | Country | Kind |
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PCT/IL17/50372 | 3/26/2017 | WO | 00 |
Number | Date | Country | |
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62353627 | Jun 2016 | US |