The field relates generally to fabrication of conductors, and more specifically to conductors that incorporate carbon nanotubes (CNTs) and the methods for fabricating such conductors.
Utilization of CNTs in conductors has been attempted. However, the incorporation of carbon nanotubes (CNTs) into polymers at high enough concentrations to achieve the desired conductivity typically increases viscosities of the compound containing the nanotubes to very high levels. The result of such a high viscosity is that conductor fabrication is difficult. A typical example of a high concentration is one percent, by weight, of CNTs mixed with a polymer.
Currently, there are no fully developed processes for fabricating wires based on carbon nanotubes, but co-extrusion of CNTs within thermoplastics is being contemplated, either by pre-mixing the CNTs into the thermoplastic or by coating thermoplastic particles with CNTs prior to extrusion. Application of CNTs to films has been shown, but not to wires.
Utilization of CNTs with thermosets has also been shown. However, thermosets are crosslinked and cannot be melted at an elevated temperature. Finally, previous methods for dispersion of CNTs onto films have not focused on metallic CNTs in order to maximize current-carrying capability or high conductivity.
The above-mentioned proposed methods for fabricating wires that incorporate CNTs will encounter large viscosities, due to the large volume of CNTs compared to the overall volume of CNTs and the polymer into which the CNTs are dispersed. Another issue with such a method is insufficient alignment of the CNTs. Finally, the proposed methods will not produce the desired high concentration of CNTs.
In one aspect, a conductor wire is provided. The conductor includes an aramid fiber and at least one layer attached about the aramid fiber. The at least one layer includes at least one of aligned carbon nanotubes and graphene platelets.
In another aspect, a method for fabricating a conductive wire is provided. The method includes aligning at least one of carbon nanotubes and graphene platelets dispersed within a solution, partially dissolving an aramid fiber through chemical treatment, passing the treated aramid fiber through the solution such that a portion of the at least one of carbon nanotubes and graphene platelets aligned and dispersed within the solution adheres to the treated aramid fiber, and washing and drying the fiber.
In still another aspect, a method for fabricating a conductor is provided. The method includes partially dissolving an aramid fiber through chemical treatment and adhering at least one of aligned carbon nanotubes and aligned graphene platelets to the partially dissolved aramid fiber.
The described embodiments seek to overcome the limitations of the prior art by placing high volume fractions of carbon nanotubes (CNTs) and/or graphene platelets onto the surface of a lightweight substrate to produce high-conductivity wires. One embodiment uses a continuous process and avoids the processing difficulties associated with dispersion of CNTs within the polymer (or other matrix resin) that may unacceptably raise viscosity of the mixture and make the materials unprocessable before fabrication of the conductor. One result of the described embodiments is a continuous, low-cost method for producing high-conductivity electrical wires containing a high concentration of metallic CNTs, graphene platelets, or a combination of the two, using layer-by-layer (LBL) application.
One embodiment, illustrated by the flowchart 10 of
Now referring to the flowchart 10, a thermoplastic filament, sometimes referred to herein as a substrate, is provided 12. In one embodiment, a sulfonated thermoplastic layer is applied 14 to the outer surface of the thermoplastic filament. A coating, including CNTs, is then applied 16 to the sulfonated thermoplastic layer. Several alternating layers of sulfonated thermoplastic and the coating may be applied 18 to the thermoplastic filament. The assembly is then melt-processed 20 to form CNT-enhanced, high-conductivity thermoplastic conductor. The melt-processing 20 step bonds the coating to the individual thermoplastic layers. After melt-bonding, an outer coating, such as wire insulation, can be applied to the layered assembly.
The process illustrated by the flowchart 10 allows for high volume fractions of aligned carbon nanotubes to be applied to the surface of a thermoplastic to produce high-conductivity wires using a layer-by-layer process. Such a process avoids the necessity for having to mix nanoparticles and/or nanotubes into a matrix resin, since the combination of the two may result in a compound having an unacceptably high viscosity. Continuing, the high viscosity may make processing of the resulting compound difficult.
Generalizing beyond sulfonization, in layer-by-layer fabrication, layers are applied from solutions generally having different charges. As such, the substrates are chemically prepared for layer-by-layer deposition by appropriately treating the surface, of which sulfonization is one example.
The illustrated embodiment shown in
Now referring specifically to
In a separate process, a concentrated solution 170 is created that includes, at least in one embodiment, thermoplastic material 172, a solvent 174, and carbon nanotubes (CNTs) 176. The solution 170, in at least one embodiment, is an appropriate solution of CNTs 176, solvent 174, and may include other materials such as surfactants suitable for adhering to the outer surface of thermoplastic filaments. In one embodiment, the solution 170 includes one or more chemicals that de-rope, or de-bundle, the nanotubes, thereby separating single-walled nanotubes from other nanotubes. The solution 170 is further suitable for coating thin, flexible filaments with multiple monolayers of CNTs, for example in a configuration as illustrated by
Continuing, to fabricate the above described conductor, one or more separate creels 180 of individual thermoplastic filaments 158 are passed through a bath 184 of the above described solution 170. As the filaments 158 pass through the bath 184, a magnetic field 186 is applied to the solution 170 therein in order to align the carbon nanotubes 176. In a specific embodiment, which is illustrated, the CNTs 176 that are to be attached to the filaments 158 are the single-walled nanotubes.
The magnetic field 186 operates to provide, at least as close as possible, individual carbon nanotubes for layered attachment to the filaments 158. The magnetic field 186 operates to align CNTs along the principal direction of the filaments.
The embodiments represented in
In one embodiment, the filaments 158 emerge from the solution 170 as coated strands 190 which are then washed and subsequently gathered onto spools 192 for post-processing. As shown in
In mentioned in the preceding paragraph, the process incorporates layer-by-layer coating, which includes the introduction of sufficiently high concentrations of carbon nanotubes and/or graphene platelets into a solution that includes polymeric materials for layer-by-layer fabrication of high-conductivity wire as opposed to the mixing of carbon nanotubes and/or platelets into a resin.
The embodiments described in the preceding paragraphs are further illustrated by the flowchart 300 of
Now referring to the flowchart 300, a solution of CNTs and/or graphene platelets are provided 302 in a solution that includes one or more solvents and one or more polymers. An aramid fiber is also provided, the fiber being partially dissolved 304 using, for example, a chemical treatment. The CNTs and/or graphene platelets are aligned 306 within the solution along an axis. Aligning the CNTs and/or platelets in the solution in the same direction as the fiber passes through the solution is accomplished, for example, using one or more of a magnetic field, an electric field or another alignment process.
The aramid fiber is then passed 308 through the solution along an axis that is substantially collinear with the nanotube/platelet alignment axis such that a portion of the aligned CNTs and/or graphene platelets attach to the partially dissolved aramid fiber. The fiber containing the aligned CNTs and/or graphene platelets is than rinsed 310 and dried 312. If the rinsed 310 and dried 312 fiber includes 314 the desired quantity of CNTs and/or graphene platelets, the process ends 316. Otherwise, the passing 308 through solution, rinsing 310, and drying 312 steps are repeated until the desired number of layers have been added to the aramid fiber or the desired quantity of CNTs and/or graphene platelets are attached to the fiber. After fabrication, an outer coating, such as wire insulation, may be applied to the layered assembly and the assembly gathered, for example, onto a take-up spool. Alternatively, the coated strands may be collected on to spools for post-processing into wire or the twisting of multiple strands into wire may be performed in line after the layer-by-layer processing. Other processing may include the twisting of multiple coated strands.
The process illustrated by the flowchart 300 allows for high volume fractions of aligned carbon nanotubes and/or graphene platelets to be applied to an aramid fiber to produce high-conductivity wires using layer-by-layer fabrication. Such a fabrication process avoids the necessity for having to mix nanoparticles and/or nanotubes into a matrix resin, as described above.
The illustrated embodiment shown in
In one embodiment, and as described above, the solution includes one or more chemicals that de-rope, or de-bundle, the nanotubes and/or platelets into as close to individual particles as possible, thereby separating individual nanotubes from other nanotubes. The de-bundled CNTs/platelets may be separated into different types, for example via centrifugation, and the metallic CNTs with “armchair” configuration (having the hexagonal crystalline carbon structure aligned along the length of the tube) are extracted as the CNTs configured in this fashion have the highest conductivity. Further processing allows for these “armchair”-configured CNTs to be predominately, or substantially exclusively in the fabrication of the conductor. Similarly, the highest-conductivity graphene platelets are isolated. These processes are generally done in separate operations from the layer-by-layer deposition described herein.
The described embodiments do not rely on dispersing CNTs into a resin as described by the prior art. Instead, layers of CNTs are placed about the circumference of small-diameter thermoplastic filaments or aramid fibers as described above. Specific embodiments utilize only high-conductivity, single-walled, metallic CNTs to maximize electrical performance. Such an embodiment relies on very pure solutions of specific CNTs instead of mixtures of several types to ensure improved electrical performance. The concentrations levels of CNTs to coating are optimized for conductivity, in all embodiments, as opposed to concentrations that might be utilized with, or dispersed on, films, sheets and other substrates.
This written description uses examples to disclose certain embodiments, including the best mode, and also to enable any person skilled in the art to practice those embodiments, including making and using any devices or systems and performing any incorporated methods. The patentable scope is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal languages of the claims.
This application is a continuation-in-part application of U.S. patent application Ser. No. 12/348,623 which was filed on Jan. 5, 2009 and titled “THERMOPLASTIC-BASED, CARBON NANOTUBE-ENHANCED, HIGH-CONDUCTIVITY WIRE”, the contents of which is incorporated by reference in its entirety.
This invention was made with United States Government support under ATP/NIST Contract 70NANB7H7043 awarded by NIST. The United States Government has certain rights in the invention.
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Number | Date | Country | |
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Parent | 12348623 | Jan 2009 | US |
Child | 12756603 | US |