Claims
- 1. A method for applying a magnetic layer on a non-metallic substrate, said method comprising:
- applying a seedlayer selected from the group consisting of carbon and silicon over the surface of the substrate;
- applying a magnetic layer over the seedlayer.
- 2. A method as in claim 1, further comprising applying an underlayer over the seedlayer below the magnetic layer.
- 3. A method as in claim 2, wherein the underlayer comprises chromium sputtered to a thickness in the range from 100 .ANG. to 2500 .ANG..
- 4. A method as in claim 2, further comprising applying a protective layer and a lubricating layer over the magnetic layer.
- 5. A method as in claim 2 wherein applying the seedlayer comprises sputtering carbon to a thickness in the range from 50 .ANG. to 400 .ANG..
- 6. A method as in claim 5 wherein the sputtering comprises depositing from a carbon source having at least a 99.9% purity.
Parent Case Info
This is a division of application Ser. No. 08/435,440, filed May 10, 1995, U.S. Pat. No. 5,599,632, the disclosure of which is incorporated by reference.
US Referenced Citations (18)
Foreign Referenced Citations (1)
Number |
Date |
Country |
WO 8805953 |
Aug 1988 |
WOX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
435440 |
May 1995 |
|