The present application is based on and claims priority to Japanese Patent Application No. 2008-15472 filed on Jan. 25, 2008, the contents of which are incorporated in their entirety herein by reference.
1. Field of the Invention
The present invention relates to a card edge connector and a method of manufacturing a card edge connector.
2. Description of the Related Art
JP-A-2000-164273 discloses a connector that includes a housing and a plurality of terminals protruding from the housing. One end portions of the terminals are soldered with respective lands on a circuit board. The other end portions of the terminals are configured to be connected with an external connector. The other end portions of the terminals are arranged in a plurality of steps in a direction vertical to a planer direction of the circuit board in addition to the planer direction of the circuit board so that a width of the connector in the planer direction of the circuit board is reduced.
In the connector, each of the terminals is required to be soldered with the corresponding land on the circuit board. Thus, the number of components and the number of manufacturing process increase. In addition, when the circuit board is discarded, a segregated disposal of the circuit board requires time and effort.
In view of such circumstances, JP-A-2003-178834 discloses a card edge connector that includes a housing and a plurality of connector terminals disposed in the housing. In the present case, a plurality of contact terminals is disposed on a surface of a circuit board. When the circuit board is inserted into the housing, the contact terminals come in contact with the connector terminals, and thereby the contact terminals and the connector terminals are electrically coupled with each other.
In the card edge connector, the connector terminals are arranged in the housing so that the connector terminals can come in contact with the contact terminals disposed on the surface of the circuit board. Thus, the connector terminals are difficult to be arranged in a plurality of steps in a direction vertical to a planer direction of the circuit board.
JP-U-6-86366 discloses a card edge connector in which connector terminals are arranged in a plurality of steps in a direction vertical to a planer direction of a circuit board. The circuit board includes a multilayered substrate. An end portion of an inner substrate extends to an outside of an end portion of an outer substrate, and a plurality of terminals is disposed at the end portion of the inner substrate and the end portion of the outer substrate. Thus, a step is provided between an inner card edge part formed at the end portion of the inner substrate and an outer card edge part formed at the end portion of the outer substrate. In the card edge connector, a plurality of connector terminals are arranged in a plurality of steps in the direction vertical to the planer direction of the circuit board so as to correspond to the terminals of the circuit board.
In a case where the step is provided by using a thickness of one substrate in the multilayered substrate, it is difficult to provide a step having an enough height. Thus, the connector terminals of the card edge connector are formed into a shape fitted into a height of the step and the connector terminals are required to be closely arranged. As a result, a short circuit may occur.
In view of the foregoing problems, it is an object of the present invention to provide a card edge connector. Another object of the invention is to provide a method of manufacturing a card edge connector.
A card edge connector according to a first aspect of the invention includes a housing, a first conductive part, a second conductive part, a connecting element, a first harness, and a second harness. The housing has an insertion hole for receiving an end portion of an electronic substrate therein. The electronic substrate includes a first terminal and a second terminal disposed on a surface of the end portion, and the first terminal is located in front of the second terminal in an insertion direction that the end portion of the electronic substrate is inserted into the card edge connector. The first conductive part is disposed in the insertion hole and is configured to come in contact with the first terminal when the end portion of the electronic substrate is received by the housing. The second conductive part is disposed in the insertion hole and is configured to come in contact with the second terminal when the electronic substrate is received by the housing. The connecting element has a penetrated part and an end portion that is coupled with the second conductive part. The connecting element extends in a direction approximately vertical to a planer direction of the electronic substrate so as to be away from the surface. The first harness is coupled with the first conductive part and protrudes to an outside of the housing. The second harness penetrates the penetrated part of the connecting element and protrudes to an outside of the housing.
In the present card edge connector, the first harness configured to be coupled with the first terminal and the second harness configured to be coupled with the second terminal can be arranged in the direction approximately vertical to the planer direction of the electronic substrate so as to have a predetermined distance between the first harness and the second harness.
In a method of manufacturing a card edge connector according to a second aspect of the invention, a first harness is coupled with a first conductive part, and the first conductive part coupled with the first harness is disposed in a first cavity of a first housing. A connecting element is coupled with a second conductive part. The second conductive part coupled with the connecting element is disposed in a second cavity of a second housing in such a manner that the connecting element comes in contact with a contact surface of the second housing and an end portion of the connecting element protrudes from the second housing over an edge of the contact surface of the second housing. The first housing is fitted with the second housing in such a manner that a contact surface of the first housing comes in contact with the contact surface of the second housing and the first cavity communicates with the second housing so as to configurate an insertion hole for receiving an electronic substrate therein. A second harness is inserted into a storage cavity of the first housing from an opposite side of the contact surface of the first housing so that an end portion of the second harness reaches an opening of a groove provided at the end portion of the connecting element. A third housing is fitted with the second housing in such a manner that the end portion of the connecting element is covered with the third housing, the end portion of the second harness is pushed into the groove by the third housing, an insulating film covering a conductive portion of the second harness is peeled off at the end portion of the second harness, and the exposed conductive portion is fitted into the groove.
In the present manufacturing method, the first harness coupled with the first conductive part and the second harness coupled with the second conductive part can be arranged in the direction approximately vertical to a planer direction of the electronic substrate so as to have a predetermined distance between the first harness and the second harness.
In a method of manufacturing a card edge connector according to a third aspect of the invention, a first harness is coupled with a first conductive part, and the first conductive part coupled with the first harness is disposed in a first cavity of a first housing. A connecting element is coupled with a second conductive part. The second conductive part coupled with the connecting element is disposed in a second cavity of a second housing in such a manner that the connecting element comes in contact with a contact surface of the second housing and an end portion of the connecting element protrudes from the second housing over an edge of the contact surface of the second housing. The first housing is fitted with the second housing in such a manner that a contact surface of the first housing comes in contact with the contact surface of the second housing and the first cavity communicates with the second cavity so as to configurate an insertion hole for receiving an electronic substrate therein. A second harness is inserted into a storage cavity of the first housing from an opposite side of the contact surface of the first housing so that an end portion of the second harness penetrates a penetrated part provided at the end portion of the connecting element. An insulating film covering a conductive portion of the second harness is removed at the end portion of the second harness. The end portion of the second harness is soldered with the end portion of the connecting element. The third housing is fitted with the second housing in such a manner that the end portion of the connecting element is covered with the third housing.
In the present manufacturing method, the first harness coupled with the first conductive part and the second harness coupled with the second conductive part can be arranged in the direction approximately vertical to a planer direction of the electronic substrate so as to have a predetermined distance between the first harness and the second harness.
Additional objects and advantages of the present invention will be more readily apparent from the following detailed description of preferred embodiments when taken together with the accompanying drawings. In the drawings:
A card edge connector 25 according to an exemplary embodiment of the invention will be described with reference to
The first housing 1 has a first cavity 9 and the second housing 2 has a second cavity 3. The first cavity 9 and the second cavity 3 communicate with each other so as to configurate an insertion hole for receiving the electronic substrate 31 therein. The electronic substrate 31 is inserted into the insertion hole from the second cavity 3 to the first cavity 9.
The electronic substrate 31 is housed in a substrate housing 30. At an end portion of the substrate housing 30, a cover 30a is provided. The first housing 1, the second housing 2, and the third housing 7 are fitted into the cover 30a. The electronic substrate 31 extends to an inside of the cover 30a. The electronic substrate 31 has an upper surface and a lower surface. At an end portion of each of the upper surface and the lower surface of the electronic substrate 31, a plurality of front terminals 32 and a plurality of inner terminals 33 are disposed. The front terminals 32 are located in front of the inner terminals 33 in the insertion direction of the electronic substrate 31. The front terminals 32 are arranged on the upper surface and the lower surface of the electronic substrate 31 in a direction approximately perpendicular to the insertion direction of the electronic substrate 31. The inner terminals 33 are also arranged on the upper surface and the lower surface of the electronic substrate 31 in a direction approximately perpendicular to the insertion direction. In the electronic substrate 31 illustrated in
The first housing 1 has a plurality of first connector pins 10 that is disposed in the first cavity 9. Each of the first connector pins 10 corresponds to a first conductive element. The first connector pins 10 are arranged so as to correspond to the front terminals 32 disposed on each of the upper surface and the lower surface of the electronic substrate 31. When the electronic substrate 31 is inserted into the first cavity 9, the electronic substrate 31 is interposed between the first connector pins 10 located on an upper side of the first cavity 9 and the first connector pins 10 located on a lower side of the first cavity 9. The first connector pins 10 are inserted into the first housing 1 from an opposite side of the contact surface of the first housing 1. The first housing 1 has a first partition 16. The first partition 16 divides a space where the first connector pins 10 are disposed into two.
The first connector pins 10 are made of a metal having a high electronic conductivity, for example, a copper alloy. As illustrated in
The first harnesses 18 joined with the respective first connector pins 10 are attached with respective individual seals 14. The individual seals 14 are press-fitted into respective seal-housing parts provided at an end portion of the first housing 1. The individual seals 14 prevent moisture and the like from seeping to the first housing 1 from a clearance between each of the first harnesses 18 and the first housing 1. The individual seals 14 are separated for each of the first harnesses 18 as illustrated in
The first housing 1 has the storage cavities on an upper side and a lower side of the first cavity 9. The storage cavities are provided for housing second harnesses 19 that are coupled with connecting elements 5. Each of the storage cavities opens on the contact surface of the first housing 1 and a side surface of the contact surfaces so as to provide an opening portion 13. Each of the second harnesses 19 extends from the storage cavity to a groove 5b through the opening portion 13. When each of the second harnesses 19 is disposed so as to extend through the corresponding connecting element 5, an end portion of each of the second harness 19 is required to be bent toward the side surface of the contact surface. Thus, the opening portion 13 of the storage cavity opens on the side surface of the contact surface.
As illustrated in
On an external surface of the first housing 1, a sealing member 17 having a ring shape is disposed. The sealing member 17 is made of silicon rubber, for example. When the first housing 1, the second housing 2, and the third housing 7 of the card edge connector 25 are fitted into the cover 30a of the substrate housing 30, the sealing member 17 prevents moisture and the like from seeping into the substrate housing 30 from a clearance between an inner surface of the cover 30a and the external surfaces of the first housing 1, the second housing 2, and the third housing 7.
The first housing 1 is formed by resin injection molding. When the resin injection molding is performed, metal plates 12 are insert-molded in the second partitions 11. Because the metal plates 12 are insert-molded in the second partitions 11 and the metal plates 12 are located adjacent to the first connector pins 10, the metal plates 12 can improve the strength of the second partitions 11 that is a part of the first housing 1. Thus, the second partitions 11 are restricted from being creep-deformed and a contact pressure between the contact elements of the first connector pins 10 and the front terminals 32 of the electronic substrate 31 is restricted from being reduced.
In the second cavity 3 of the second housing 2, a plurality of second connector pins 4 is disposed. Each of the second connector pins 4 corresponds to a second conductive element. The second connector pins 4 are arranged so as to correspond to the inner terminals 33 disposed on the upper surface and the lower surface of the electronic substrate 31. When the electronic substrate 31 is inserted into the second cavity 3, the electronic substrate 31 is interposed between the second connector pins 4 located on the upper side of the second cavity 3 and the second connector pins 4 located on the lower side of the second cavity 3. Each of the second connector pins 4 includes a body section and a contact section. In addition, each of the second connector pins 4 is coupled with the respective connecting element 5. Each of the connecting elements 5 extends from an end of the body section of the corresponding second connector pin 4 adjacent to the first housing 1, and each of the connecting elements 5 extends approximately vertically along the contact surface of the second housing 2 in a direction away from the electronic substrate 31. An end portion of each of the connecting element 5 protrudes from the second housing 2 over an edge of the contact surface of the second housing 2.
The second connector pins 4 and the connecting elements 5 are inserted into the second housing 1 from the side where the electronic substrate 31 is inserted. The second housing 2 has a holding part that holds the second connector pins 4. On an external surface of the second housing 2, a recess portion for receiving an end portion of each of the second harnesses 19 is provided. The holding part includes a plurality of projections 2a on a surface defining the second cavity 3, as illustrated in
When the second connector pins 4 are fixed to the holding part, the connecting elements 5 coupled with the second connector pins 4 are attached firmly to the contact surface of the second housing 2. At the end portion of each of the connecting elements 5, the groove 5b is provided so that a conductive portion 19b of the corresponding second harness 19 penetrates through the groove 5b. The groove 5b has an opening 5a on an end side of the connecting element 5. Each of the second harnesses 19 includes the conductive portion 19b and an insulating film 19a covering the conductive portion 19b. Each of the second harnesses 19 is arranged at the opening 5a of the corresponding connecting element 5. Then, each of the second harnesses 19 is pressed into the corresponding groove 5b when the third housing 7 is fitted with the first housing 1 and the second housing 2. A width of the grooves 5b is less than a diameter of the conductive portions 19b of the second harnesses 19. Thus, when each of the second harnesses 19 is pressed into the corresponding groove 5b, the insulating film 19a of each of the second harnesses 19 is peeled off by the corresponding connecting elements 5 and the conductive portion 19b is exposed to an outside. Thereby, the exposed conductive portion 19b comes in contact with the corresponding connecting element 5 and the second harness 19 is electrically coupled with the corresponding connecting element 5.
Each of the connecting elements 5 has a plurality of projections 5c protruding from side surfaces of each of the connecting elements 5. The second housing 2 has a plurality of recess portion (not shown) at the contact surface so as to correspond to the projections 5c of the connecting elements 5. Each of the projections 5c of the connecting elements 5 are fitted into the corresponding recess portion of the second housing 2 so that the connecting elements 5 are fixed to the contact surface of the second housing 2. Thus, even if each of the connecting elements 5 is applied with a pressure when each of the second harnesses 19 is pressed into the groove 5b of the corresponding connecting element 5, the connecting element 5 is restricted from falling off the second housing 2. Thus, an electric connectivity between the second harnesses 19 and the corresponding connecting element 5 is ensured. The projections 5c of the connecting element 5 may protrude toward the contact surface of the second housing 2. The second housing 2 may have recess portions at the contact surface so that the projections 5c protruding toward the contact surface are fitted into the respective recess portions.
The second housing 2 is formed by resin injection molding in a manner similar to the first housing 1. At the time of the injection molding, metal plates 6 are insert-molded so that the metal plates 6 are located in the holding part. Thereby, the strength of the holding part that holds the second connector pins 4 is improved. Thus, the holding part is restricted from being creep-deformed and a contact pressure between the contact elements of the second connector pins 4 and the inner terminals 33 of the electronic substrate 31 is restricted from being reduced.
In the first cavity 9 of the first housing 1, a supporting member 20 is disposed for stably fixing the first connector pins 10 and the second connector pins 4. The supporting member 20 has an open box shape. The supporting member 20 has a through hole at a bottom portion thereof so that the electronic substrate 31 is inserted into the first cavity 9 from the through hole. An inner side surface of the supporting member 20 is in contact with side surfaces of the body sections of the first connector pins 10. An inner bottom surface of the supporting member 20 is in contact with end surfaces of the body sections of the first connector pins 10. An outer bottom surface of the supporting member 20 is in contact with end surfaces of the second connector pins 4.
The third housing 7 is attached to the first housing 1 and the second housing 2. The third housing 7 has recess portions at an attached surface thereof for receiving the end portions of the second harnesses 19. In addition, the third housing 7 has slits 8 at portions corresponding to the end portions of the connecting elements 5 protruding from the second housing 2. Thus, the third housing 7 can be attached to the first housing 1 and the second housing 2 so as to cover the end portions of the second harnesses 19 protruding from the first housing 1 and the end portions of the connecting elements 5 protruding from the second housing 2. When the third housing 7 is attached to the first housing 1 and the second housing 2, the third housing 7 presses the end portions of the second harnesses 19 into the corresponding grooves 5b of the connecting elements 5.
An exemplary method of manufacturing the card edge connector 25 will now be described with reference to
At a process illustrated in
Next, as illustrated in
Next, as illustrated in
The integrated seals 15 to be attached with the second harnesses 19 are preliminarily press-fitted into the first housing 1. The second harnesses 19 are inserted into the first housing 1 through the corresponding integrated seal 15. When the second harnesses 19 penetrate through the corresponding integrated seal 15, the conductive portions 19b of the second harnesses 19 are covered with the insulating films 19a. Thus, the conductive portions 19b of the second harnesses 19 are prevented from being attached with oil included in the integrated seal 15. The second harnesses 19 are inserted into the first housing 1 until the end portions the second harnesses 19 reach the connecting elements 5 over the opening portion 13 of the first housing 1. The width of the grooves 5b of the connecting elements 5 is less than the diameter of the conductive portions 19b of the second harnesses 19. Thus, the second harnesses 19 cannot penetrate through the grooves 5b, and the end portions of the second harnesses 19 are bent and are put on the openings 5a of the grooves 5b of the connecting elements 5. The second harnesses 19 have a bendability so that the end portions of the second harnesses 19 are bendable. The opening portions 13 of the first housing 1 are provided so as to communicate with the storage cavity for the second harnesses 19. Thus, as illustrated in
At last, as illustrated in
In the above-described method, the second housing 2 is fixed to the first housing 1 before the first connector pins 10 are inserted into the first housing 1. The second housing 2 may also be fixed to the first housing 1 after the first connector pins 10 are inserted into the first housing 1 and are arranged at predetermined positions. The second harnesses 19 may be inserted into the first housing 1 before the first housing 1 and the second housing 2 are fitted with each other.
In the present card edge connector 25, the first connector pins 10 are configured to come in contact with the respective front terminals 32 when the electronic substrate 31 is received by the first housing 1 and the second housing 2. The second connector pins 4 are configured to come in contact with the respective inner terminals 33 when the electronic substrate 31 is received by the first housing 1 and the second housing 2. The first connector pins 10 located on the upper side of the first cavity 9 and the second connector pins 4 located on the upper side of the second cavity 3 are located in a plan approximately parallel to the planer direction of the electronic substrate 31. In addition, the first connector pins 10 located on the lower side of the first cavity 9 and the second connector pins 4 located on the lower side of the second cavity 3 are located in a plan approximately parallel to the planer direction of the electronic substrate 31.
The connecting elements 5 are joined with the respective second connector pins 4 and the connecting elements 5 extend approximately vertically in the direction away from the surfaces of the electronic substrate 31. Each of the connecting elements 5 has the groove 5b through which the conductive portion 19b of the corresponding second harness 19 penetrate. Thus, even if the front terminals 32 and the inner terminals 33 are arranged along the insertion direction of the electronic substrate 31, the first connector pins 10, which are electrically coupled with the front terminals 32, and the end portions of the connecting elements 5 which are electrically coupled with the inner terminals 33 through the second connector pins 4 can be arranged in the direction approximately vertical to the planer direction of the electronic substrate 31 so that a predetermined distance is provided between the first connector pins 10 and the end portions of the connecting elements 5. As a result, the first harnesses 18 electrically coupled with the front terminals 32 and the second harnesses 19 electrically coupled with the inner terminals 33 through the connecting elements 5 can be arranged in a plurality of steps in the direction approximately vertical to the planer direction of the electronic substrate 31.
Although the present invention has been fully described in connection with the exemplary embodiments thereof with reference to the accompanying drawings, it is to be noted that various changes and modifications will become apparent to those skilled in the art.
For example, the first harnesses 18 joined with the first connector pins 10 may be coupled with a power source (PS) as illustrated in
In the above-described embodiment, the front terminals 32 and the inner terminals 33 are disposed on both of the upper surface and the lower surface of the electronic substrate 31. The first harnesses 18 coupled with the first connector pins 10 and the second harnesses 19 coupled with the connecting elements 5 are arranged in two steps in the direction approximately vertical to the planer direction of the electronic substrate 31 so as to correspond to the front terminals 32 and the inner terminals 33 disposed on the upper surface of the electronic substrate 31. In addition, the first harnesses 18 coupled with the first connector pins 10 and the second harnesses 19 coupled with the connecting elements 5 are arranged in two steps in the direction approximately vertical to the planer direction of the electronic substrate 31 so as to correspond to the front terminals 32 and the inner terminals 33 disposed on the lower surface of the electronic substrate 31. The front terminals 32 and the inner terminals 33 may also be disposed only one of the upper surface and the lower surface of the electronic substrate 31. Alternatively, the front terminals 32 may be disposed on both of the surfaces, the inner terminals 33 may be disposed on one of the surfaces, and the first harnesses 18 and the second harnesses 19 may be arranged in a plurality of steps on only one side corresponding to the one of the surfaces. When the first harnesses 18 and the second harnesses 19 are arranged in a plurality of steps, the number of step may be greater than two.
In the above-described exemplary embodiment, the insulating film 19a of the second harnesses 19 are peeled off when the second harnesses 19 are pressed into the corresponding grooves 5b by the third housing 7, and thereby the conductive portion 19b of the second harnesses 19 and the corresponding connecting elements 5 are electrically coupled with each other. Alternatively, the insulating films 19a at the end portions of the second harnesses 19 may be removed before or after the second harnesses 19 are inserted into the first housing 1. In the present case, the exposed conductive portions 19b may be fitted into penetrated parts provided at the end portion of the connecting elements 5, and the conductive portions 19b and the connecting elements 5 may be soldered. By soldering the conductive portions 19b of the second harnesses 19 and the connecting elements 5, an electric conductivity and a mechanical conductivity between the second harnesses 19 and the connecting elements 5 can be improved. In the present case, each of the penetrated parts may be the groove 5b or a though hole, for example. The third housing 7 is attached to the first housing 1 and the second housing 2 after the conductive portions 19b and the connecting elements 5 are soldered.
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2008-015472 | Jan 2008 | JP | national |
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Number | Date | Country | |
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20090191764 A1 | Jul 2009 | US |