The invention relates to the electrical connector, particularly to the electrical connector equipped with the solder balls on the contact tails in a dense arrangement.
China Patent No. CN201638992 discloses a card edge connector for receiving a card type memory module wherein the solder pads formed on the tails of the contacts are closely neighbored with one another, thus tending to result in crosstalk therebetween to jeopardize the communication in high frequency.
It is desired to have the electrical connector having the solder balls on the solder pads of the contact tails in a appropriate dense arrangement to be fit for the high frequency communication.
A card edge connector includes an insulative elongated housing, two rows of contacts disposed in the housing. The housing includes a pair of side walls extending along the longitudinal direction with a receiving slot therebetween in a transverse direction perpendicular to the longitudinal direction. The receiving slot is configured to receive a card type memory module. Each contact is equipped with the solder ball for surface mounting upon the printed circuit board. The contact includes a retaining section secured to the housing, a deflectable contacting section extending upwardly from the retaining section, and a tail section extending downwardly from the retaining section and including a connecting section and a solder pad. The solder pads of the contacts in a same row along the longitudinal direction are alternately arranged in opposite directions in the transverse direction perpendicular to the longitudinal direction. In the paired contacts in the transverse direction, the corresponding solder pads are spaced from each other with a constant distance in the transverse direction optimally, thus avoiding the significant crosstalk therebetween. A centerline of the solder pad along the transverse direction is either aligned with the corresponding retaining section in the transverse direction or offset from the corresponding retaining section in the longitudinal direction.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
Referring to
In details, the solder pads 25 include the outward/first solder pad 26 extending outwardly to be exposed to the exterior in the vertical direction perpendicular to both the longitudinal direction and the transverse direction, and the inward/second solder pad 27 extending inwardly to be hidden under the housing 1. The outward solder pads 26 and the inward solder pads 27 are alternately arranged with each other along the longitudinal direction. In this embodiment, in the same row the outward solder pads 26 are paired and the inward solder pads 27 are also paired for such alternate arrangement. Notably, in this embodiment, the distance between centerlines X1 and X3 of the two/paired neighboring solder pads 25 in the same row, is 1.25 mm, thus avoiding the improper crosstalk therebetween. +
In brief, on one hand because either the paired outward solder pads 26 or the paired inward solder pads 27 extend away from each other in the longitudinal direction, the distance A between the centerlines X1, X3 of the two neighboring contacts 2 in the same row, is larger that that between two centerlines X2 of the neighboring contacts 2. On the other hand, the neighboring outward solder pad 26 and inward solder pad 27 in the same row are also spaced from each other with a distance in the transverse direction for avoiding improper crosstalk therebetween, even though the neighboring outward solder pad 26 and inward solder pad 27 essentially extend toward each other in the longitudinal direction so as to have the distance between the centerlines of the neighboring outward solder pad 26 and inward solder pad 27 smaller than that between the centerlines of the corresponding connecting sections 24 of the same contacts 2. Therefore, the arrangement of the neighboring solder pads may avoid the improper crosstalk in the electrical connector having the fine pitch arranged contacts 2. Notably, in this arrangement, the neighboring outward solder pad 26 and inward solder pad 27 are partially overlapped in the transverse direction. Also, in this embodiment, for the paired contacts 2 in the transverse direction, of which one belonging to one row of the contacts 2 has the inward solder pad 26 and the other belong to the other row of the contacts 2 has the outward solder pad 27 so as to keep a distance from each other for avoid improper crosstalk therebetween.
As shown in
In conclusion, all five embodiments disclose the solder pad arrangement for the fine pitch contact connector without improper crosstalk therebetween. Notably, the retaining sections of the contacts in the same row are located on corresponding outer sides of the corresponding passageways, and the corresponding solder pads are alternately arranged in a staggered manner so as to increase the distance between the neighboring solder pads for lessening the crosstalk. It is also noted that the centerline of the retaining section is also essentially the centerline of the corresponding passageway receiving the contact. In other words, the spirit of the some embodiments of the invention is to have the distance between the centerlines of the solder pads of the paired neighboring contacts larger than the pitch of the passageways in the longitudinal direction. It can be noted that some embodiments of the invention use the paired solder pads which are both either the outward solder pads or the inward solder pads so as to form the paired solder pads alternately arranged with one another in a staggered manner along the longitudinal direction, compared with the traditional designs using the individual solder pads alternately arranged with one another in the staggered manner along the longitudinal direction. This is because some contacts are of differential pair contacts which are preferred to coupled with each other side by side in a balanced or symmetrical manner. It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the members in which the appended claims are expressed.
Number | Date | Country | Kind |
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2018 1 0717668 | Jul 2018 | CN | national |
2018 1 0717678 | Jul 2018 | CN | national |
2018 1 0720336 | Jul 2018 | CN | national |
2018 2 1047222 U | Jul 2018 | CN | national |
2018 2 1047225 U | Jul 2018 | CN | national |
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Number | Date | Country |
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201638992 | Nov 2010 | CN |
Number | Date | Country | |
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20200014136 A1 | Jan 2020 | US |