Patent Grant
7365697
This application is based on Japanese Patent Application No. 2005-158915 filed on May 31, 2005, the disclosure of which is incorporated herein by reference.
The present invention relates to a card type wireless device, an antenna coil, and a method for manufacturing a communication module.
In recent years, an electronic key system (also called a smart entry system, etc.) is spread. In this electronic key system, ID authentication is performed by wireless communication between this system and a wireless electronic key (also called a portable device) carried by a user. Further, controls of locking/unlocking of a door lock, engine starting, etc. can be performed by commands from this portable device. In the above wireless electronic key, a demand for constructing this wireless electronic key as the card type wireless device made thin is raised to improve carrying convenience property by storing this wireless electronic key into a purse, etc. with a dramatic spread of an IC card, etc. as the background (3 mm or more and 5 mm or less in thickness).
The above electronic key system adopts a communication system able to execute a control operation such as the locking/unlocking of the door lock and the engine starting if the user approaches the automobile within a constant distance even when no user performs a special button operation, etc. with respect to the wireless electronic key. Concretely, a request radio wave sent out of the automobile side in one direction is received. ID authentication information, control command information relating to the above locking/unlocking or the engine starting, etc. are superposed on the transmitted radio wave and are sent out to the automobile side. In this case, when the user is distantly located, the wireless electronic key and the automobile do not react on communication. On the other hand, when the user approaches, there are many cases in which near distance type direct communication using a low frequency band (50 kHz or more and 500 kHz or less) is adopted so as to detect the radio wave by detouring the radio wave even when the user holds the wireless electronic key in any portion of the user's body.
The radio wave of the low frequency band has a very long wavelength. Therefore, in an antenna used for this radio wave, a so-called LF (Low Frequency) antenna provided by combining an antenna coil and a capacitor resonantly coupled to this antenna coil in a desirable frequency band is normally adopted. When the LF antenna is assembled into the card type wireless device, it is also necessary to reduce the thickness of this antenna coil in conformity with the thickness of a box body of the card type (e.g., 1 mm or more and 3 mm or less). In this case, it is desirable to mount the antenna coil onto a substrate in a shape for largely setting the aperture diameter of the antenna coil as much as possible to raise sensitivity with respect to the radio wave perpendicularly incident to the substrate face. It is effective to adopt the antenna coil with a core of high inductance so as to raise an antenna gain. However, a flat ferrite core is small in mechanical strength, and a crack, a fragment, etc. are easily caused by handling, etc. at a coil winding time. Accordingly, an air-core coil is normally adopted.
In the above-mentioned antenna coil, a demand for constructing this antenna coil as a surface mounting type discrete part is also raised from a viewpoint for improving productivity. Concretely, a coil main body is wound around a bobbin manufactured by resin, or the coil main body wound in outer setup is packaged in a case manufactured by resin to cope with such a demand. In the antenna coil formed as the discrete part in this way, a coil side terminal portion is positioned onto a substrate side pad through solder paste. Soldering processing is then performed by inserting this antenna coil into a reflow furnace and heating this antenna coil every substrate.
However, in the antenna coil mounted onto the substrate, the heating within the reflow furnace is not necessarily uniformly advanced and a temperature distribution is generated. Therefore, there is a case in which a warp is generated by its thermal stress. In this case, there are defects in that the coil side terminal portion is floated from the substrate side pad by this warp, and a soldering defect is easily caused.
In view of the above-described problem, it is an object of the present invention to provide a card type wireless device having a communication module. It is another object of the present invention to provide an antenna coil having high sensitivity and high antenna gain. It is further another object of the present invention to provide a manufacturing method of a communication module having an antenna coil.
An antenna coil includes: an air-core type flat coil body having a thickness in an axial direction of the coil body; a coil case made of resin; and a reinforce frame. The thickness of the coil body is smaller than a radius of a circle, an area of which is equal to an area of a region surrounded with an outline of a projected coil body, the projected coil body provided by projecting the coil body on a projection plane perpendicular to the axial direction of the coil body. The coil case has a ring shape, which corresponds to the coil body. The coil case includes a coil accommodation space for accommodating the coil body. The coil accommodation space is disposed in a circumferential direction of the ring shape of the coil case. The coil case further includes a coil side terminal for mounting the coil body on a substrate with a solder member. The reinforce frame is integrated with the coil case along with the circumferential direction of the ring shape of the coil case. The reinforce frame is made of a material having a Young' modulus higher than that of the resin of the coil case.
In the above antenna, since the reinforce frame is integrated with the resin coil case along with the circumferential direction of the coil case, the rigidity of the coil case is improved. This is because the reinforce frame is made of a material having a Young' modulus higher than that of the resin of the coil case. Thus, although the coil case has the air-core type flat ring shape corresponding to the coil body, the coil case is protected from warpage even when thermal stress is applied to the coil case in a solder reflow step. The solder reflow step is performed in a manufacturing process of the communication module having the antenna coil. Accordingly, soldering failure ratio of the coil side terminal of the antenna coil is much reduced.
Further, a method for manufacturing a communication module having an antenna coil and a transmitting/receiving circuit, which are mounted on a substrate, is provided. The antenna coil is connected to the transmitting/receiving circuit. The method includes the steps of: positioning a coil side terminal of the antenna coil together with a solder member for connecting between a substrate side terminal of the substrate and the coil side terminal of the antenna coil; and heating the substrate together with the antenna coil in a solder reflow furnace so that the solder member is melted and soldered between the coil side terminal and the substrate side terminal.
In the above communication module, since the reinforce frame is integrated with the resin coil case along with the circumferential direction of the coil case, the rigidity of the coil case is improved. Thus, although the coil case has the air-core type flat ring shape corresponding to the coil body, the coil case is protected from warpage even when thermal stress is applied to the coil case in a solder reflow step. Accordingly, soldering failure ratio of the coil side terminal of the antenna coil is much reduced.
Further, a card type wireless device includes: a communication module having an antenna coil, a transmitting/receiving circuit connecting to the antenna coil, and a substrate; and a card type casing. The coil body includes an axis, which coincides with a normal line of the substrate, and the card type casing accommodates the communication module in such a manner that a thickness direction of the substrate coincides with a thickness direction of the card type casing.
In the above wireless device, since the reinforce frame is integrated with the resin coil case along with the circumferential direction of the coil case, the rigidity of the coil case is improved. Thus, although the coil case has the air-core type flat ring shape corresponding to the coil body, the coil case is protected from warpage even when thermal stress is applied to the coil case in a solder reflow step. Accordingly, soldering failure ratio of the coil side terminal of the antenna coil is much reduced. Further, the card type wireless device is suitably used for a wireless entry key of an automotive vehicle. Further, the card type wireless device is thin. Therefore, it is preferable to put the card type wireless device into a wallet or the like.
When a user carries the wireless device having the antenna coil together with the wallet and the like, a coin in the wallet may interrupt the antenna coil since the coin is a conductor having a large area. Thus, the sensitivity and the C-value of the antenna coil may be reduced. Here, the Q-value is a degree of selectivity of frequencies. However, even when the coin overlaps the principal surface of the card type wireless device, the antenna coil has sufficient area so that the coil does not interrupt the antenna coil completely. Further, the card type wireless device has high sensitivity.
The above and other objects, features and advantages of the present invention will become more apparent from the following detailed description made with reference to the accompanying drawings. In the drawings:
An embodiment mode of the invention will next be explained by using the drawings.
As shown in
The coil axis of the antenna coil 1 is conformed to the normal direction of the substrate face so that directivity with respect to transmission and reception of a radio wave in this direction is raised. Separate coils 7, 8 having axes conformed to two independent directions within the substrate face may be also mounted to the substrate 17 (these coils 7, 8 are drawn by omitting connection wiring in
As shown in
As shown in
On the other hand, when the dry battery 16 of the card type wireless device 3 is consumed and no signal transmitting-receiving circuit 14 is operated, the request radio wave received by the LF antenna 13 is sent to the transponder circuit 15. In the transponder circuit 15, electromotive force excited in the antenna coil 10 by the request radio wave is set to electric power, and the transponder circuit 15 sends out an ID code radio wave from the LF antenna 13. In the automobile 105, this ID code radio wave is received by antennas 113 and 119, and processings after the authentication can be similarly performed. Namely, the transponder circuit of the card type wireless device 3 functions as a backup circuit at a battery running-out time.
When the above card type wireless device 3 is carried together with a purse, etc., there is a fear that a conductor of a comparatively large area such as a coin, etc. covers the antenna coil 1, and the sensitivity of the antenna and Q (frequency selecting degree) are reduced. However, even when a situation for overlapping the coin with the main surface of the card type wireless device 3 is supposed, it is possible to reduce the probability that the antenna coil 1 is perfectly covered with the coin, etc. as mentioned above if the antenna coil 1 is mounted to the substrate as a flat air-core type coil of a constant area or more as shown in
The planar outer shape of the card type wireless device 3 can be set to have short sides of 40 mm or more and 60 mm or less (e.g., 50 mm), and 75 mm or more and 95 mm or less (e.g., 85 mm), and a thickness of 2 mm or more and 5 mm or less (e.g., 4 mm) (e.g., this planar outer shape has about the same size as the size of a credit card). In the assembled antenna coil, the area of a planar outer shape area can be set to 8 cm2 or more and 15 cm2 or less (e.g., 12 cm2). The width of the coil main body 10 at a projecting time to a projecting face perpendicular to the axis can be set to 1 mm or more and 4 mm or less (e.g., 3 mm). Further, the thickness of the coil case 20 in its axial direction can be set to 1 mm or more and 3 mm or less (e.g., 1.6 mm). As described later, in this embodiment mode, the antenna coil 1 is constructed so as to have a planar mode of a rectangular shape, and have a short side of 25 mm or more and 35 mm or less (e.g., 30 mm), and a long side of 35 mm or more and 45 mm or less (e.g., 40 mm).
Further, the diameter of a winding wire of the coil is set to 50 μm or more and 70 μm or less (a resin (e.g., polyurethane) coating wire having a coating thickness of 2 μm or more and 5 μm or less (e.g., 3 μm)). The number of turns is set to 200 or more and 300 or less (the intrinsic inductance of the coil main body 10 is set to 4 mH or more and 6 mH or less). The electrostatic capacity of the capacitor 12 is set to 300 pF or more and 400 pF or less (e.g., 350 pF). Thus, a resonance frequency of the LF antenna 13 can be adjusted to 100 kHz or more and 150 kHz or less (e.g., 134 kHz). The Q-value of the antenna is set to 18 to 21 and 100 to 110 dBμ/m in sensitivity can be realized.
As shown in
However, in accordance with the construction of the antenna coil 1 shown in
As shown in
In
The terminal pad 21 can be also arranged on the bottom face of the coil case 20. However, in this case, a lead portion 11 of the coil main body 10 must be connected to a position corresponding to the above terminal pad 21 of the bottom face of the coil storing portion 24 of a narrow width, and an assembly work of the coil main body 10 into the case becomes very complicated. Therefore, as shown in
In the material of resin constituting the coil case 20, it is desirable to adopt a material able to be injection-molded and not easily softened and deformed even when a thermal hysteresis at the reflow time is applied. As a particularly preferable material from this viewpoint, polyphenylene sulfide (PPS: 282° C. in melting point, about 240° C. in upper limit temperature able to be continuously used, and 260° C. or more in thermal deformation temperature) is adopted in this embodiment mode. However, instead of this material, thermoplastic polyimide (melting point: 388° C.) can be also adopted.
In
The metallic frame is a conductor. As shown by quoting
In the constructional material of the metallic frame 30, aluminum or an aluminum alloy is comparatively excellent in strength and corrosive property and is preferable in processing property and can be therefore preferably adopted in the invention. On the other hand, the constructional material of the metallic frame 30 can be also set to an iron system material. In this case, a non-magnetic material such as austenite system stainless steel can be also used (aluminum or the aluminum alloy is also non-magnetic), but an iron system soft magnetic material can be also adopted. The soft magnetic material is a ferromagnetic material and is high in magnetic permeability and a radio wave magnetic field relating to the antenna signal transmission and reception can be concentrated onto the metallic frame 30. Accordingly, it is possible to contribute to the improvements of sensitivity and gain of the antenna. As the iron system soft magnetic material, it is possible to adopt a silicon steel plate, general carbon steel, an Fe—Ni alloy (e.g., permalloy, etc.) or ferrite system stainless steel, etc. in addition to electromagnetic soft iron (it can be also said that the electromagnetic soft iron and the ferrite system stainless steel are advantageous from the viewpoint of processing property).
As shown in
In
A modified example of the antenna coil 1 of the invention will next be explained (portions common to
In
On the other hand, in the construction of
In the construction of
In the construction of each of
Further, in the constructions of
Next, the material of the reinforcing frame is not particularly limited if the Young's modulus of this material is higher than that of resin constituting the coil case 20. For example, it is also possible to adopt an insulating inorganic material such as glass, ceramic of alumina, etc., sintering soft ferrite, etc. Further, the material of the reinforcing frame can be also constructed by a resin composite material strengthened by a filler of glass, ceramic, etc. In this case, since the reinforcing frame 37 becomes an insulator, there is no fear of a reduction in apparent inductance by inductive coupling to the coil main body 10 even when the reinforcing frame 37 is constructed in the mode of a continuous ring shape in the circumferential direction in the coil case 20 as shown in
The present inventions have the following aspects.
An antenna coil includes: an air-core type flat coil body having a thickness in an axial direction of the coil body; a coil case made of resin; and a reinforce frame. The thickness of the coil body is smaller than a radius of a circle, an area of which is equal to an area of a region surrounded with an outline of a projected coil body, the projected coil body provided by projecting the coil body on a projection plane perpendicular to the axial direction of the coil body. The coil case has a ring shape, which corresponds to the coil body. The coil case includes a coil accommodation space for accommodating the coil body. The coil accommodation space is disposed in a circumferential direction of the ring shape of the coil case. The coil case further includes a coil side terminal for mounting the coil body on a substrate with a solder member. The reinforce frame is integrated with the coil case along with the circumferential direction of the ring shape of the coil case. The reinforce frame is made of a material having a Young' modulus higher than that of the resin of the coil case.
In the above antenna, since the reinforce frame is integrated with the resin coil case along with the circumferential direction of the coil case, the rigidity of the coil case is improved. This is because the reinforce frame is made of a material having a Young' modulus higher than that of the resin of the coil case. Thus, although the coil case has the air-core type flat ring shape corresponding to the coil body, the coil case is protected from warpage even when thermal stress is applied to the coil case in a solder reflow step. The solder reflow step is performed in a manufacturing process of the communication module having the antenna coil. Accordingly, soldering failure ratio of the coil side terminal of the antenna coil is much reduced.
Alternatively, the coil accommodation space may be a groove with an opening, which is disposed on one side of the coil case in the axial direction. The coil case may further include a bottom and a pair of sidewalls so that the bottom and the sidewalls provide the coil accommodation space. The reinforce frame may be embedded in at least one of the bottom and the sidewalls. In this case, the coil body, which is formed in another process for winding, is easily accommodated and mounted in the coil accommodation space from the opening of the groove. Further, in this case, the reinforce frame can be embedded in the bottom or the sidewall of the coil case. The coil case provides the coil accommodation space.
Alternatively, the reinforce frame may include an outside surface, which coincides with an outside surface of the bottom or the sidewalls, and the reinforce frame may be insert-molded in at least one of the bottom and the sidewalls. Thus, the reinforce frame is integrated with the coil case, and the manufacturing method of the antenna coil is simplified.
Alternatively, the reinforce frame may be embedded in the bottom and the sidewalls. In this case, the cross section of the reinforce frame is a L-shape or a C-shape, which is provided by the bottom and the sidewall of the reinforce frame. Thus, bending strength of the reinforce frame is improved. Accordingly, the coil case is protected from warpage sufficiently.
Alternatively, the coil side terminal of the coil case may be a terminal pad for surface mounting the coil case on the substrate, and the bottom of the coil case may be mounted on the substrate. In this case, the antenna coil provides as a surface mounting part for performing automatic mounting process. Conventionally, since only a solder paste pattern is formed between the terminal pad of an antenna coil side and a substrate side pad of a substrate side by a printing method or the like, the soldering failure may be occurred when the solder paste pattern is melted in a solder reflow step. This is because the melted solder paste pattern does not have sufficient resistance to prevent a displacement of the terminal pad of the antenna coil side from the substrate pad. However, in the above antenna coil, the coil case is protected from warpage so that the ratio of soldering failure is reduced.
Alternatively, the coil body may have an outline, which has a rectangular shape, and the coil case may have an outline, which has a rectangular shape. The terminal pad may be disposed on one of short sides of the rectangular shape of the coil case. In this case, the warpage on the short side is smaller than that on the long side so that soldering failure is much prevented.
Alternatively, the coil case may further include a pin embedded portion and a connection pin. The pin embedded portion may protrude from an outer circumference of the coil case. The connection pin may be embedded in the pin embedded portion along with the axial direction of the coil case. The connection pin may include a top and a bottom, which are exposed from the pin embedded portion. The top of the connection pin may be exposed on a top surface of the pin embedded portion in the axial direction of the coil case. The bottom of the connection pin may be exposed on a bottom surface of the pin embedded portion in the axial direction of the coil case. The top of the connection pin may be electrically connected to a lead terminal of the coil body. The terminal pad may be disposed on the bottom surface of the pin embedded portion so that the bottom of the connection pin is electrically connected to the terminal pad.
Alternatively, the reinforce frame may be made of another material such as glass, ceramics such as alumina, insulation inorganic material such as sintered soft ferrite. Further, the reinforce frame may be made of resin complex material including a filler of glass or ceramics.
Alternatively, the reinforce frame may be made of metal. The reinforce frame may include an insulation portion for dividing a current path of the reinforce frame, which surrounds around an axis of the coil body. The insulation portion of the reinforce frame may be disposed at an intermediate part of the reinforce frame in a circumferential direction of the reinforce frame. The metal has high Young's modulus and excellent machinability so that the reinforce frame having a shape corresponding to the air-core type coil case is easily formed by a punching method or the like. Further, the frame shape can be easily formed to be a L-shape or a C-shape by using a press method.
Alternatively, the reinforce frame may be made of aluminum or aluminum alloy. Alternatively, the reinforce frame may be made of iron soft magnetic material.
When the reinforce frame is made of metal, the frame provides a current path surrounding around the axis of the coil body in a case where the frame provides a ring shape along with the coil case. This is because the metal is a conductor. Therefore, the current path is inductively coupled with the coil body, so that an apparent inductance of whole antenna coil is reduced. Specifically, when the magnetic field of an electric wave penetrating through the coil body is deviated, or changed, inductive current flows through the reinforce frame. Inverse magnetic field corresponding to the inductive current cancels the magnetic field of the electric wave regarding transmission or reception of the antenna, so that the apparent inductance of the antenna is reduced. Especially, when the antenna is a LF type antenna, the antenna coil connects to a capacitor in parallel. Here, the capacitor has a capacitance to adjusted to generate resonance at a predetermined frequency. The capacitance is adjusted in accordance with the inductance of the coil body. Thus, the Q-value of the antenna is determined on the basis of the characteristics of a LC parallel resonant circuit. However, when the metallic reinforce frame causes the inductive coupling, the apparent inductance of the antenna coil is reduced, so that the resonant frequency is deviated from the predetermined frequency. Thus, the Q-value and the antenna gain are much reduced. In this case, it is considered that the current path surrounding around the coil body is divided. Thus, alternatively, the reinforce frame may be disposed along with the ring shape of the coil case so that the reinforce frame has a ring shape. The insulation portion of the reinforce frame may be provided by a notch of the reinforce frame. The notch of the reinforce frame may be disposed in a part of the ring shape of the reinforce frame. In this case, the notch prevents the current path, so that the resonant frequency is not deviated from the predetermine frequency.
Alternatively, the coil body may have an outline, which has a rectangular shape. The coil case may have an outline, which has a rectangular shape. The reinforce frame may have a C-shape so that the C-shape of the reinforce frame is provided by one of short sides and two long sides of the rectangular shape of the coil case. The notch of the reinforce frame may be disposed on a part of or whole of the other one of the short sides of the rectangular shape of the coil case.
Alternatively, the reinforce frame may include a main part having a C-shape and a rib. The main part of the reinforce frame may be disposed on the bottom of the coil case. The reinforce frame may have a L-shaped cross section perpendicular to the circumferential direction of the ring shape of the coil case. The rib may be disposed on an outer circumferential surface or an inner circumferential surface of the coil case so that the rib and the main part of the reinforce frame provide the L-shaped cross section. The rib may be disposed on at least two long sides of the rectangular shape of the coil case.
Alternatively, the rib may be only disposed on two long sides of the rectangular shape of the coil case.
Alternatively, the rib may be disposed on two long sides and one short side of the rectangular shape of the coil case so that the rib provides a C-shape.
Alternatively, the rib and the main part of the reinforce frame may be disposed on two long sides, one short side and a part of the other one short side of the rectangular shape of the coil case.
Alternatively, the reinforce frame may include four parts. Each part of the reinforce frame may include a main part and a rib, which are integrated each other. The main part of each part of the reinforce frame may be disposed on the bottom of the coil case. Each part of the reinforce frame may have a L-shaped cross section perpendicular to the circumferential direction of the ring shape of the coil case. The rib of each part of the reinforce frame may be disposed on an outer circumferential surface or an inner circumferential surface of the coil case so that the rib and the main part in each part of the reinforce frame provide the L-shaped cross section. The reinforce frame may be divided into four parts by four notches so that four parts of the reinforce frame are disposed on two long sides and two short sides of the rectangular shape of the coil case, respectively. Each notch may be disposed at a corner of the rectangular shape of the coil case.
Further, a method for manufacturing a communication module having an antenna coil and a transmitting/receiving circuit, which are mounted on a substrate, is provided. The antenna coil is connected to the transmitting/receiving circuit. The method includes the steps of: positioning a coil side terminal of the antenna coil together with a solder member for connecting between a substrate side terminal of the substrate and the coil side terminal of the antenna coil; and heating the substrate together with the antenna coil in a solder reflow furnace so that the solder member is melted and soldered between the coil side terminal and the substrate side terminal.
In the above communication module, since the reinforce frame is integrated with the resin coil case along with the circumferential direction of the coil case, the rigidity of the coil case is improved. Thus, although the coil case has the air-core type flat ring shape corresponding to the coil body, the coil case is protected from warpage even when thermal stress is applied to the coil case in a solder reflow step. Accordingly, soldering failure ratio of the coil side terminal of the antenna coil is much reduced.
Further, a card type wireless device includes: a communication module having an antenna coil, a transmitting/receiving circuit connecting to the antenna coil, and a substrate; and a card type casing. The coil body includes an axis, which coincides with a normal line of the substrate, and the card type casing accommodates the communication module in such a manner that a thickness direction of the substrate coincides with a thickness direction of the card type casing.
In the above wireless device, since the reinforce frame is integrated with the resin coil case along with the circumferential direction of the coil case, the rigidity of the coil case is improved. Thus, although the coil case has the air-core type flat ring shape corresponding to the coil body, the coil case is protected from warpage even when thermal stress is applied to the coil case in a solder reflow step. Accordingly, soldering failure ratio of the coil side terminal of the antenna coil is much reduced. Further, the card type wireless device is suitably used for a wireless entry key of an automotive vehicle. Further, the card type wireless device is thin. Therefore, it is preferable to put the card type wireless device into a wallet or the like.
When a user carries the wireless device having the antenna coil together with the wallet and the like, a coin in the wallet may interrupt the antenna coil since the coin is a conductor having a large area. Thus, the sensitivity and the C-value of the antenna coil may be reduced. Here, the Q-value is a degree of selectivity of frequencies. However, even when the coin overlaps the principal surface of the card type wireless device, the antenna coil has sufficient area so that the coil does not interrupt the antenna coil completely. Further, the card type wireless device has high sensitivity.
While the invention has been described with reference to preferred embodiments thereof, it is to be understood that the invention is not limited to the preferred embodiments and constructions. The invention is intended to cover various modification and equivalent arrangements. In addition, while the various combinations and configurations, which are preferred, other combinations and configurations, including more, less or only a single element, are also within the spirit and scope of the invention.
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