Patent Application
20200015359
The present invention relates to a carrier and, more particularly, to a carrier adapted to load an electronic device.
In manufacturing an electronic device, a carrier is usually used to load an electronic device. A common electronic device includes rigid needlelike leads, and the electronic device may be put directly in a tray. However, some electronic devices, for example, a heat sensitive sensor made of heat sensitive material, include fine flexible leads. During manufacturing such electronic devices, the flexible leads of the electronic devices are easily pulled off or deformed, and thus the current tray is not suitable to load such electronic devices. The electronic devices with flexible leads are usually manufactured in an artificial way, which not only lowers manufacturing efficiency, but also easily damages the leads of the electronic device.
A carrier includes a base on which a circuit board is mounted, a loading device mounted on the base, a first pressing device mounted on the base, and a second pressing device mounted on the base. The loading device is configured to load an electronic device on the base. The first pressing device is configured to press a first lead end protruding from the electronic device on the circuit board to electrically contact the circuit board. The second pressing device is configured to press a second lead end of the electronic device on the base.
The invention will now be described by way of example with reference to the accompanying Figures, of which:
The present disclosure will be described hereinafter in further detail with reference to the following embodiments, taken in conjunction with the accompanying drawings. In the specification, the same or similar reference numerals indicate the same or similar parts. The description of the embodiments of the present disclosure hereinafter with reference to the accompanying drawings is intended to explain the general inventive concept of the present disclosure, and should not be constructed as a limitation to the present disclosure.
In addition, in the following detailed description, for the sake of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, one or more embodiments may also be practiced without these specific details. In other instances, well-known structures and devices are illustrated schematically in order to simplify the drawing.
A carrier according to an embodiment, as shown in
As shown in
The carrier, as shown in
The loading device 111, as shown in
In an exemplary embodiment, the electronic device 1 may be a fine flexible heat sensitive resistance sensor made of a heat sensitive material. In this embodiment, the electronic device 1 may be tested by an electrical contact of the first lead end 1a of the electronic device 1 and the circuit board 121. In the embodiment, after the second lead end 1b of the electronic device 1 is mounted on the base 100, a tin plating process may be performed on the second lead end 1b.
The first pressing device, as shown in
As shown in
The second pressing device, as shown in
The carrier, as shown in
The base 100, as shown in
In an embodiment, as shown in
The first pressing device and the second pressing device are adapted to hold the first lead end 1a and the second lead end 1b of the electronic device 1, and thereby, the carrier is adapted to load the electronic device 1 automatically, improve the manufacturing efficiency and effectively protecting the lead ends 1a, 1b.
It should be appreciated by those skilled in the art that the above embodiments are intended to be illustrative, modifications may be made to the above embodiments by those skilled in the art, and structures described in various embodiments may be freely combined without having structural or principle conflict.
Although the present disclosure has been described with reference to the attached drawings, the embodiments disclosed in the drawings are intended to illustrate embodiments of the present disclosure, but should not be construed as a limitation to the present disclosure. Although some embodiments of the general concept of the present disclosure have been shown and described, it would be appreciated by those skilled in the art that modifications may be made to these embodiments without departing from the principle and spirit of the disclosure, the scope of which is defined in the claims and their equivalents.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201710160075.X | Mar 2017 | CN | national |
This application is a continuation of PCT International Application No. PCT/EP2018/056521, filed on Mar. 15, 2018, which claims priority under 35 U.S.C. § 119 to Chinese Patent Application No. 201710160075.X, filed on Mar. 17, 2017.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/EP2018/056521 | Mar 2018 | US |
| Child | 16571541 | US |
