Claims
- 1. A billet of an aluminum alloy having been thermally transformed from a dendritic microstructure to a globular or non-dendritic structure and for forming in a semi-solid condition into a shaped aluminum alloy article,
- the billet having a dendritic microstructure having a grain size in the range of 20 to 250 .mu.m provided by a solidification rate in the range of 5.degree. to 100.degree. C./sec between liquidus and solidus temperatures after the aluminum alloy is cast into billet,
- said billet having a dendritic microstructure when is thermally transformed to the globular structure or non-dendritic structure by heat applied to said billet at a heat-up rate greater than 30.degree. C. per minute to a superheated temperature of 3.degree. to 50.degree. C. above solidus temperature of said aluminum alloy, the thermally transforming providing said globular structure or non-dendritic structure dispersed in a lower melting eutectic phase,
- the billet in the globular structure or non-dendritic structure and in said semi-solid condition having the ability to be formed into said shaped aluminum article.
- 2. The billet in accordance with claim 1 wherein said aluminum base alloy comprises 2.5 to 11 wt. % Si.
- 3. The billet in accordance with claim 1 wherein said aluminum base alloy comprises 5 to 7.5 wt. % Si.
- 4. The billet in accordance with claim 1 wherein said aluminum base alloy comprises 0.2 to 2.0 wt. % Mg.
- 5. The billet in accordance with claim 1 wherein said aluminum base alloy comprises 0.01 to 0.05 wt. % Ti.
- 6. The billet in accordance with claim 1 wherein said aluminum base alloy comprises 0.02 to 0.15 wt. % Ti.
- 7. The billet in accordance with claim 1 wherein said aluminum base alloy comprises than 0.1 wt. % Ti.
- 8. The billet in accordance with claim 1 wherein 2 to 11 wt. % silicon, 0.2 to 0.7 wt. % Mg and 0.02 to 0.15 wt. % Ti.
- 9. The billet in accordance with claim 1 wherein said microstructure is thermally transformable by inductively heating said solidified body to a superheated temperature.
- 10. The billet in accordance with claim 1 wherein said alloy comprises 0.2 to 5 wt. % Cu.
- 11. The billet in accordance with claim 1 wherein said heat is applied by resistance heating to a superheated temperature.
- 12. The billet in accordance with claim 1 wherein said heat is applied by induction heating to a superheated temperature.
- 13. The billet in accordance with claim 1 wherein said billet is heated at a rate in the range of 30.degree. to 1000.degree. C./min.
- 14. The billet in accordance with claim 1 wherein said billet is heated at a rate greater than 45.degree. C./min.
- 15. A billet of an aluminum alloy for thermally transforming from a dendritic microstructure to a globular structure and for forming in a semi-solid condition into a shaped aluminum alloy article,
- the billet of aluminum alloy comprising 4 to 9 wt. % Si, 0.2 to 2 wt. % Mg, and 0.02 to 0.15 wt. % Ti, the balance aluminum and incidental elements and impurities, the billet having a dendritic microstructure having a grain size in the range of 20 to 250 .mu.m provided by a solidification rate in the range of 50 to 100.degree. C./sec between liquidus and solidus temperatures when the aluminum alloy is cast into billet, the billet having a dendritic microstructure thermally transformable to the globular structure or non-dendritic structure by heat applied to said billet at a heat-up rate of 200.degree. to 1000.degree. C./min to a superheated temperature of 30 to 50.degree. C. above solidus temperature of said aluminum alloy,
- the billet in the globular structure or non-dendritic structure and in said semi-solid condition formable into said shaped aluminum article.
- 16. The method in accordance with claim 15 wherein said alloy comprises 0.2 to 5 wt. % copper.
- 17. A billet of an aluminum alloy having been thermally transformed from a dendritic microstructure to a globular or non-dendritic structure and for forming in a semi-solid condition into a shaped aluminum alloy article,
- the billet of aluminum alloy comprising 2 to 10.6 wt. % Mg, less than 2.5 wt. % Si, and 0.02 to 0.15 wt. % Ti, the remainder aluminum and incidental elements and impurities,
- the billet having a dendritic microstructure having a grain size in the range of 20 to 250 .mu.m provided by a solidification rate in the range of 5.degree. to 100.degree. C./sec between liquidus and solidus temperatures after the aluminum alloy is cast into billet,
- said billet having a dendritic microstructure which is thermally transformed to the globular structure or non-dendritic structure by heat applied to said billet at a heat-up rate of 200.degree. to 1000.degree. C./min to a superheated temperature of 3.degree. to 50.degree. C. above solidus temperature of said aluminum alloy, the thermally transforming providing said globular structure or non-dendritic structure dispersed in a lower melting eutectic phase,
- the billet in the globular structure or non-dendritic structure and in said semi-solid condition formable into said shaped aluminum article.
- 18. The billet in accordance with claim 17 wherein said dendritic grain structure has a grain size in the range of 20 to 200 .mu.m.
- 19. The billet in accordance with claim 17 wherein said heat is applied by induction.
- 20. A billet of an aluminum alloy for thermally transforming from a dendritic microstructure to a globular structure and for forming in a semi-solid condition into a shaped aluminum alloy article,
- the billet of aluminum alloy comprising 0.2 to 2.4 wt. % Mg, 2 to 8 wt. % Zn, the remainder aluminum and incidental elements and impurities,
- the billet having a dendritic microstructure having a grain size in the range of 20 to 250 .mu.m provided by a solidification rate in the range of 50 to 100.degree. C./sec between liquidus and solidus temperatures when the aluminum alloy is cast into billet,
- the billet having a dendritic microstructure thermally transformable to the globular structure or non-dendritic structure by heat applied to said billet at a heat-up rate greater than 30.degree. C./min to a superheated temperature of 3.degree. to 50.degree. C. above solidus temperature of said aluminum alloy,
- the billet in the globular structure or non-dendritic structure and in said semi-solid condition formable into said shaped aluminum article.
- 21. The billet in accordance with claim 20 wherein said billet is thermally transformed to a globular structure contained in a lower melting eutectic upon superheating for a period of 0.5 to 5 minutes.
- 22. The billet in accordance with claim 20 wherein said microstructure has a grain size in the range of 20 to 200 .mu.m.
- 23. The billet in accordance with claim 20 wherein said heat is applied by induction.
- 24. A billet of an aluminum alloy for thermally transforming from a dendritic microstructure to a globular structure and for forming in a semi-solid condition into a shaped aluminum alloy article,
- the billet comprised of an aluminum based alloy containing 6.5 to 7.5 wt. % Si, 0.25 to 0.45 wt. % Mg, less than 0.15 wt. % Ti, the remainder aluminum and incidental elements and impurities,
- the billet having a dendritic microstructure having a grain size in the range of 20 to 250 .mu.m provided by a solidification rate in the range of 50 to 100.degree. C./sec between liquidus and solidus temperatures when the aluminum alloy is cast into billet,
- the billet having a dendritic microstructure thermally transformable to the globular structure or non-dendritic structure by heat applied to said billet at a heat-up rate greater than 30.degree. C. per minute to a superheated temperature of 3.degree. to 50.degree. C. above solidus temperature of said aluminum alloy,
- the billet in the globular structure or non-dendritic structure and in said semi-solid condition having the ability to be formed into said shaped aluminum article.
- 25. A billet of an aluminum alloy having been thermally transformed from a dendritic microstructure to a globular or non-dendritic structure and for forming in a semi-solid condition into a shaped aluminum alloy article substantially free of porosity,
- the billet having a dendritic microstructure having a grain size in the range of 20 to 250 .mu.m provided by a solidification rate in the range of 5.degree. to 100.degree. C./sec between liquidus and solidus temperatures after the aluminum alloy is cast into billet,
- the billet having a thermally treated structure to provide an homogenized billet,
- said thermally treated billet having a microstructure which is thermally transforming to the globular structure or non-dendritic structure by heat applied to said billet to a superheated temperature above solidus temperature of said aluminum alloy, the thermally transforming providing said globular structure or non-dendritic structure dispersed in a lower melting eutectic phase,
- the billet in the globular structure or non-dendritic structure and in said semi-solid condition having the ability to be formed into said shaped aluminum article substantially free of porosity.
- 26. The billet in accordance with claim 25 wherein said billet having said thermally treated structure is thermally transformed to a globular structure by heat applied to the homogenized billet at a heat-up rate greater than 30.degree. C./min to a superheated temperature of 3.degree. to 50.degree. C. above solidus temperature of said aluminum base alloy.
- 27. The billet in accordance with claim 25 wherein said aluminum base alloy comprises 2.5 to 11 wt. % Si.
- 28. The billet in accordance with claim 25 wherein said aluminum base alloy comprises 5 to 7.5 wt. % Si.
- 29. The billet in accordance with claim 25 wherein said aluminum base alloy comprises 0.2 to 2.0 wt. % Mg.
- 30. The billet in accordance with claim 25 wherein said aluminum base alloy comprises 0.01 to 0.2 wt. % Ti.
- 31. The billet in accordance with claim 25 wherein said aluminum base alloy comprises 0.02 to 0.15 wt. % Ti.
- 32. The billet in accordance with claim 25 wherein said heat is applied by induction.
- 33. The billet in accordance with claim 25 wherein said aluminum alloy contains 0.2 to 5 wt. % Cu.
- 34. A billet of an aluminum alloy, having been thermally transformed from a dendritic microstructure to a globular or non-dendritic structure and for forming in a semi-solid condition into a shaped aluminum alloy article,
- the billet of aluminum alloy selected from Aluminum Association 2000 alloys,
- the billet having a dendritic microstructure having a grain size in the range of 20 to 250 .mu.m provided by a solidification rate in the range of 50 to 100.degree. C./sec between liquidus and solidus temperatures after the aluminum alloy is cast into billet, the microstructure adapted for and thermally transforming to the globular structure or non-dendritic structure by induction heating said billet at a heat-up rate of 200.degree. to 1000.degree. C./min to a superheated temperature of 3.degree. to 50.degree. C. above solidus temperature of said aluminum alloy, the thermally transforming providing said globular structure or non-dendritic structure dispersed in a lower melting eutectic phase,
- the billet in the globular structure or non-dendritic structure and in said semi-solid condition having the ability to be formed into said shaped aluminum article.
- 35. A billet of an aluminum alloy having been thermally transformed from a dendritic microstructure to a globular or non-dendritic structure and for forming in a semi-solid condition into a shaped aluminum alloy article,
- the billet of aluminum alloy selected from Aluminum Association 5000 alloys,
- the billet having a dendritic microstructure having a grain size in the range of 20 to 250 .mu.m provided by a solidification rate in the range of 5.degree. to 100.degree. C./sec between liquidus and solidus temperatures after the aluminum alloy is cast into billet,
- said billet having a dendritic microstructure which is thermally transformed to the globular structure or non-dendritic structure by induction heating said billet at a heat-up rate of 200.degree. to 1000.degree. C./min to a superheated temperature of 3.degree. to 50.degree. C. above solidus temperature of said aluminum alloy, the thermally transforming providing said globular structure or non-dendritic structure dispersed in a lower melting eutectic phase,
- the billet in the globular structure or non-dendritic structure and in said semi-solid condition formable into said shaped aluminum article.
- 36. A billet of an aluminum alloy having been thermally transformed from a dendritic microstructure to a globular or non-dendritic structure and for forming in a semi-solid condition into a shaped aluminum alloy article,
- the billet of aluminum alloy selected from Aluminum Association 7000 alloys,
- the billet having a dendritic microstructure having a grain size in the range of 20 to 250 .mu.m provided by a solidification rate in the range of 50 to 100.degree. C./sec between liquidus and solidus temperatures after the aluminum alloy is cast into billet,
- said billet having a dendritic microstructure which is thermally transformed to the globular structure or non-dendritic structure by induction heating said billet at a heat-up rate of 200.degree. to 1000.degree. C./min to a superheated temperature of 3.degree. to 50.degree. C. above solidus temperature of said aluminum alloy, the thermally transforming providing said globular structure or non-dendritic structure dispersed in a lower melting eutectic phase,
- the billet in the globular structure or non-dendritic structure and in said semi-solid condition formable into said shaped aluminum article.
- 37. A billet of an aluminum alloy for thermally transforming from a dendritic microstructure to a globular structure and for forming in a semi-solid condition into a shaped aluminum alloy article,
- the billet of aluminum alloy comprising 2 to 9 wt. % Si, 0.3 to 1.7 wt. % Mg, 0.3 to 1.2 wt. % Cu, optionally 0.01 to 1 wt. % Mn, 0.01 to 0.35 wt. % Cr, max. 0.2 wt. % Ti, max. 0.3 wt. % V, the balance aluminum and incidental elements and impurities,
- the billet having a dendritic microstructure having a grain size in the range of 20 to 250 .mu.m provided by a solidification rate in the range of 5.degree. to 100.degree. C./sec between liquidus and solidus temperatures when the aluminum alloy is cast into billet,
- the billet having a dendritic microstructure thermally transformable to the globular structure or non-dendritic structure by heating applied inductively to said billet at a heat-up rate of 200.degree. to 1000.degree. C./min to a superheated temperature of 3.degree. to 50.degree. C. above solidus temperature of said aluminum alloy,
- the billet in the globular structure or non-dendritic structure and in said semi-solid condition formable into said shaped aluminum article.
- 38. A billet of an aluminum alloy for thermally transforming from a dendritic microstructure to a globular structure and for forming in a semi-solid condition into a shaped aluminum alloy article,
- the billet of aluminum alloy comprising 11 to 30 wt. % Si, 0.4 to 5 wt. % Cu, 0.45 to 1.3 wt. % Mg, max. 1.5 wt. % Fe, max. 0.6 wt. % Mn, max. 2.5 wt. % Ni, max. 0.3 wt. % Sn and max. 0.3 wt. % Ti, the balance aluminum and incidental elements and impurities,
- the billet having a dendritic microstructure having a grain size in the range of 20 to 250 .mu.m provided by a solidification rate in the range of 50 to 100.degree. C./sec between liquidus and solidus temperatures when the aluminum alloy is cast into billet,
- the billet having a dendritic microstructure thermally transformable to the globular structure or non-dendritic structure by heating applied inductively to said billet at a heat-up rate of 200.degree. to 1000.degree. C./min to a superheated temperature of 3.degree. to 50.degree. C. above solidus temperature of said aluminum alloy,
- the billet in the globular structure or non-dendritic structure and in said semi-solid condition formable into said shaped aluminum article.
CROSS REFERENCE TO RELATED APPLICATIONS
This application is a continuation-in-part of U.S. Ser. No. 08/743,145, filed Nov. 4, 1996 now abandoned, which is a continuation of U.S. Ser. No. 08/422,242, filed Apr. 14, 1995, now U.S. Pat. No. 5,571,346, issued Nov. 5, 1996.
US Referenced Citations (35)
Foreign Referenced Citations (11)
Number |
Date |
Country |
0090253 |
Oct 1983 |
EPX |
0093248 |
Nov 1983 |
EPX |
0120584 |
Oct 1984 |
EPX |
0411329 |
Feb 1991 |
EPX |
0453833 |
Oct 1991 |
EPX |
0554808 |
Jan 1993 |
EPX |
59-50147 |
Mar 1984 |
JPX |
60-155655 |
Aug 1985 |
JPX |
1400624 |
Jul 1975 |
GBX |
1444274 |
Jul 1976 |
GBX |
1543206 |
Mar 1979 |
GBX |
Non-Patent Literature Citations (3)
Entry |
Wan et al, "Thixoforming of Aluminum Alloys Using Modified Chemical Grain Refinement for Billet Production", Int. Conf. Aluminum Alloys: New Process Technologies, Marina di Ravenna, Italien, 3.-4, Jun. 1993, pp. 129-141. |
Hirt et al, "SSM-Forming of Usually Wrought Aluminum Alloys", The 3rd Int'l. Conf. on Semi Solid Processing of Alloys and Composites 1994.6, pp. 107-116. |
Loue, W.R., "Evolution Microstructurale et Comportement Rheologique D'Alliages Al-Si a L'etat Semi-Solide", These preparee au sein du Laboratoire Genie Physique et Mecanique des Materiaux, pp. 65-94. |
Continuations (1)
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422242 |
Apr 1995 |
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Continuation in Parts (1)
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743145 |
Nov 1996 |
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