Patent Application
20210212754
The instant disclosure relates to catheters, such as catheter handles. In one example, the instant disclosure relates to catheter handles including a compliant circuit.
For many years, catheters have been used for cardiac medical procedures. For example, catheters can be used to diagnose and treat cardiac arrhythmias. Catheters can be positioned at a specific location within a body that is otherwise inaccessible without a more invasive procedure. Often, catheters can be in communication with a control unit for receiving signals from electrodes or sensors of the catheter. The signals can be communicated through one or more insulated wires. The insulated wires can be routed through a handle of the catheter. The wires can be terminated with a connector or soldered to complete electrical connection between the electrodes, sensors, and the control unit. The size and shape of the handle can be configured to fit into the hand of an operator and to provide proper control of the catheter by the operator.
In many instances, catheters are used in surgical operating rooms. Surgical operating rooms can be an electrically noisy environment. For instance, the electronic components within the surgical operating rooms can be exposed to electro-magnetic interference from other devices within the surgical operating room. In an example, an electric-field-based positioning system can generate an electronic field for identifying a position of a medical device, such as the catheter, within a patient's body. The electronic field can contribute to the electro-magnetic interference.
The foregoing discussion is intended only to illustrate the present field and should not be taken as a disavowal of claim scope.
The instant disclosure relates to a catheter, such as a high-density mapping catheter, a mapping catheter for diagnosis, or a catheter for medical treatment. For example, the catheter can be used for the treatment of cardiac arrhythmias, for instance, via ablation. Some examples of the catheter can include irrigation. In particular, the instant disclosure relates to a handle of a catheter, such as a handle including a compliant circuit configured to be disposed on a non-planar surface of the handle. As used herein, the term compliant layer or circuit should be understood to mean a layer or circuit that conforms closely to the shape of an adjacent proximate surface, including a non-planar surface.
In an example, a catheter can include a catheter shaft, an electrical conductor, a catheter handle, and a compliant circuit. The catheter shaft can include a proximal end and a distal end having at least one electrode or sensor. The electrical conductor can be coupled to the catheter shaft. The electrical conductor can be communicatively coupled to the electrode or the sensor located at the distal end of the catheter shaft. The handle can be coupled to the proximal end of the catheter shaft and can include a non-planar surface. The compliant circuit can be configured for communication with an electronic control unit and to conform to the non-planar surface. In an example, the compliant circuit can be electrically coupled to the electrode or the sensor through the electrical conductor. In various examples, the compliant circuit can include a material characteristic to stretch and comply with the non-planar surface. In further examples, the compliant circuit can include at least one dielectric layer and at least one conductive layer. At least one of the dielectric layers and at least one of the conductive layers can include a respective material characteristic. In an example, the conductive layer can include a printable conductive polymer, such as a conductive ink.
In some examples, the compliant circuit can include a logic component embedded within the compliant circuit. The logic component can be electrically coupled to at least one of the conductive layers. In various examples, the logic component can be configured as one of an analog-to-digital converter, a multiplexer, a filter, an amplifier, or a combination thereof. In an example, the logic component can include a semiconductor. For instance, the logic component can include a p-type material or an n-type material.
In an example, a method of making a catheter handle can include disposing a compliant circuit along a non-planar surface of the catheter handle. The method can further include conforming the compliant circuit to the non-planar surface. In some examples, the compliant circuit includes a dielectric layer, a plurality of conductive layers, a first connection interface, and a second connection interface. The dielectric layer can include a dielectric material characteristic, and each of the plurality of conductive layers can include a conductive material characteristic. The first connection interface can be electrically coupled to at least one of the conductive layers. The second connection interface can be electrically coupled to at least one of the conductive layers. In some instance, the at least one conductive layer can include a strain relief feature. In an example, at least one of the conductive layers can be a printed conductive layer, such as a printed conductive polymer, conductive ink, or the like. In further examples, a logic component can be formed within the compliant circuit. The logic component can include a semiconductor. For instance, the logic component can include a p-type material, an n-type material, or both.
The foregoing and other aspects, features, details, utilities, and advantages of the present disclosure will be apparent from reading the following description and claims, and from reviewing the accompanying drawings.
The instant disclosure relates to a catheter, such as a high-density mapping catheter, a mapping catheter for diagnosis, or a catheter for medical treatment. For example, the catheter can be used for the treatment of cardiac arrhythmias, for instance, via ablation. In some examples, the catheter of the present disclosure can include an irrigated catheter configured to irrigate tissue during an ablation procedure. In particular, the instant disclosure relates to a handle of a catheter, such as a handle including a compliant circuit configured to be disposed on a surface, such as a non-planar surface, of the handle. Details of the various examples of the present disclosure are described below with specific reference to the figures.
Referring still to
The handle 124 provides a location for the physician to hold the catheter 114 and can further provide means for steering or guiding the shaft 128 within the body 112. For example, the handle 124 can include means to change the length of one or more pull wires extending through the catheter 114 from the handle 124 to the distal end 132 of shaft 128. The construction of the handle 124 can vary. In various examples, the handle 124 can be configured to fit within a user's hand, for instance, to provide control over the operation of the catheter 114. Accordingly, the size and shape of the handle 124 can be important for the function and usability of the catheter 114.
The shaft 128 can be made from conventional materials such as polyurethane and can define one or more lumens configured to house and/or transport electrical conductors 156, fluids, or surgical tools. The shaft 128 can be introduced into a blood vessel or other structure within the body 112 through a conventional introducer. The shaft 128 can then be steered or guided through the body 112 to a desired location such as the tissue 116 using guide wires or pull wires or other means known in the art including remote control guidance systems. The shaft 128 can also permit transport, delivery, and/or removal of fluids (including irrigation fluids and bodily fluids), medicines, and/or surgical tools or instruments. It should be noted that any number of methods can be used to introduce the shaft 128 to areas within the body 112. This can include introducers, sheaths, guide sheaths, guide members, guide wires, or other similar devices. For ease of discussion, the term introducer will be used throughout.
The system 100 can include an electric-field-based positioning system 136, a magnetic-field-based positioning system 138, a display 140, and an electronic control unit (ECU) 142 (e.g., a processor). Each of the exemplary system components is described further below.
The electric-field-based positioning system 136 and the magnetic-field-based positioning system 138 are provided to determine the position and orientation of the catheter 114 and similar devices within the body 112. The position and orientation of the catheter 114 and similar devices within the body 112 can be determined by the system 136 and/or the system 138. The system 136 can comprise, for example, the EnSite™ NavX™ system sold by St. Jude Medical, Inc. of St. Paul, Minn., and described in, for example, U.S. Pat. No. 7,263,397 titled “Method and Apparatus for Catheter Navigation and Location Mapping in the Heart,” the entire disclosure of which is hereby incorporated by reference as though fully set forth herein. The systems 136 and 138 can comprise, for example, the EnSite Precision™ system sold by St. Jude Medical, Inc., of St. Paul, Minn. The system 136 operates based upon the principle that when low amplitude electrical signals are passed through the thorax, the body 112 acts as a voltage divider (or potentiometer or rheostat) such that the electrical potential or field strength measured at one or more electrodes 134 on the catheter 114 can be used to determine the position of the electrodes, and, therefore, of the catheter 114, relative to a pair of external patch electrodes using Ohm's law and the relative location of a reference electrode (e.g., in the coronary sinus).
In the configuration shown in
In accordance with this exemplary system 136 as depicted in
The magnetic-field-based positioning system 138 in this example employs magnetic fields to detect the position and orientation of the catheter 114 within the body 112. The system 138 can include the GMPS system made available by MediGuide, Ltd. and generally shown and described in, for example, U.S. Pat. No. 7,386,339 titled “Medical Imaging and Navigation System,” the entire disclosure of which is hereby incorporated by reference as though fully set forth herein. In such a system, a magnetic field generator 152 can be employed having three orthogonally arranged coils (not shown) to create a magnetic field within the body 112 and to control the strength, orientation, and frequency of the field. The magnetic field generator 152 can be located above or below the patient (e.g., under a patient table) or in another appropriate location. Magnetic fields are generated by the coils and current or voltage measurements for one or more position sensors (not shown) associated with the catheter 114 are obtained. The measured currents or voltages are proportional to the distance of the sensors from the coils, thereby allowing determination of a position of the sensors within a coordinate system 154 of system 138.
The display 140 is provided to convey information to a physician to assist in diagnosis and treatment. The display 140 can comprise one or more conventional computer monitors or other display devices. The display 140 can present a graphical user interface (GUI) to the physician. The GUI can include a variety of information including, for example, an image of the geometry of the tissue 116, electrophysiology data associated with the tissue 116, graphs illustrating voltage levels over time for various electrodes 134, and images of the catheter 114 and other medical devices and related information indicative of the position of the catheter 114 and other devices relative to the tissue 116.
The ECU 142 provides a means for controlling the operation of various components of the system 100, including the catheter 114, the ablation generator 122, and magnetic generator 152 of the magnetic-field-based positioning system 138. The ECU 142 can also provide a means for determining the geometry of the tissue 116, electrophysiology characteristics of the tissue 116, and the position and orientation of the catheter 114 relative to tissue 116 and the body 112. The ECU 142 also provides a means for generating display signals used to control the display 140.
As the catheter 114 moves within the body 112, and within the electric field generated by the electric-field-based positioning system 136, the voltage readings from the electrodes 134 change, thereby indicating the location of catheter 114 within the electric field and within the coordinate system 146 established by the system 136. The ring electrodes 134 can be adapted to communicate position signals to the ECU 142.
In some examples, the dielectric layer 202 and the conductive layer 204 can be compliant. For instance, the conductive layer 204 can be compliant (also referred to herein as a compliant conductive layer), and the dielectric layer 202 can be compliant (also referred to herein as a compliant dielectric layer). The compliant conductive layer 204 and the compliant dielectric layer 202 can be used independently or in combination with less compliant materials, such as copper foil, polyimide, FR4, or the like.
In various examples, a material of the compliant dielectric layer (dielectric material) can include, but is not limited to, silicone, polydimethylsiloxane (PDMS), polyethylene terephthalate (PET), polyurethane [e.g., thermal plastic polyurethane (TPU)], poly(p-xylylene) polymer, poly(methyl-methacrylate)(PMMA), poly[styrene-b-(ethylene-co-butylene)-b-styrene] triblock copolymer (SEBS), ionic liquid [1-butyl-3-methylimidazolium bis (trifluoromethanesulfonyl)imide (BMITFSI)], fluorinated copolymer, fluorinated rubber, silicone, cellulose fibers, polyester fibers, poly(styrene-co-ethylenebutylene-co-styrene), graphene, polyacrimide hydrogel with Sodium chloride (NaCl) electrolyte, poly(2-methacrylolyloxyethyltrimethylammonium chloride)(PMETAC), silicon dioxide (SiO2), poly(tert-butylacrylate-co-acrylic acid) poly(TBA-co-AA) film (a bistable electroactive polymer), Polytetrafluoroethylene (PTFE), or the like.
In some examples, a material of the compliant conductive layer (conductive material) can include, but is not limited to, a conductive stretchable polymer, a printable conductive polymer, a conductive stretchable ink, indium tin oxide (ITO), single-wall carbon nanotubes, multi-wall carbon nanotubes, carbon nanotube ribbons, carbon nanotube aerogel, poly[styrene-b-(ethylene-co-butylene)-b-styrene] triblock copolymer compounded with single-wall or multi-wall carbon nanotubes, Polyaniline (PAM) covalently bonded to poly(styrene-co-ethylenebutylene-co-styrene, Poly(3,4-ethylenedioxythiophene) :poly(styrenesulfonate)(PEDOT:PSS), poly(3,4-ethylenediox-ythiophene):p-tosylate (PEDOT), polyacrylic acid (PAA) implanted gold (Au) or titanium (Ti) or palladium (Pd) ions, copper (e.g., copper nanoparticles), gold (e.g., gold nanoparticles), silver (e.g., silver nanoparticles), zinc (e.g., zinc nanoparticles), spherical citrate stabilized Au nanoparticles, Au nanowires, gallium arsenide (GaAs) nanoribbons, silicon (Si) nanoribbons, silicon nanowires, graphene and silver nanowire hybrid foam, or the like. Where compliant conductive layer includes a rigid material, such as gold, titanium, palladium, copper, silver, zinc, or the like, the conductive material can be combined with a more compliant material to form a composite material. In another example, the conductive material can include at least one strain relief feature 206 (as described below) to increase the extensibility and compliance of the conductive material to form the compliant conductive material.
The dielectric layer 202, the conductive layer 204, or both can each include a respective material characteristic (e.g., elasticity characteristic), such as a dielectric material characteristic and a conductive material characteristic. For instance, the compliant circuit 200 can be conformable along a length and a width of the compliant circuit 200 based on the respective dielectric material and conductive material characteristics of the various layers (e.g., dielectric layer 202 and conductive layer 204), other elements of the compliant circuit 200, and the compliant circuit 200 as a whole. In an example, the compliant circuit 200 can bend or stretch along a first axis (e.g., X-axis 216), a second axis (e.g., Y-axis 218), or any combination thereof simultaneously based on the respective materials characteristics of the compliant circuit 200. For instance, the compliant circuit can stretch or bend along the first and second axes simultaneously while conforming to a non-planar surface. In some examples, the conductive material characteristic, the dielectric material characteristic, or both can include an elastic modulus that is less than that of steel, aluminum, ceramic, glass, polycarbonate, polyimide, or the like. For instance, the elastic modulus of the material can be 0.1 GPa to 2.0 GPa, 0.1 GPa to 1.5 GPa, 0.1 GPa to 1.0 GPa, or 0.1 GPa to 0.5 GPa. In a further example, the material, such as the dielectric material or the conductive material can permanently deform when stretched or conformed to the non-planar surface based on the respective material characteristics. For instance, when stretched or conformed, the dielectric material or the conductive material, in some examples, will not return to an original shape. Accordingly, the compliant circuit 200 can be disposed along a non-planar surface. The compliant circuit 200 can conform to the non-planar surface as shown in
In an example, the conductive layer 204 can include a strain relief feature 206. The strain relief feature 206 can increase the flexibility of the one or more traces, such as trace 214, of the conductive layer 204. The strain relief feature 206 can include, but is not limited to, a zigzag, horseshoe, wave, open loop, or other geometry that can mitigate failure of the conductive layer 204 when under strain. For instance, the strain relief feature 206 can increase the extensible length of the trace 214. In some examples, the conductive layer 204 can be a metallic layer, such as copper or a copper alloy. The strain relief feature 206 can provide compliant properties to the conductive layer 204 so the conductive layer 204 can be conformable. For instance, the material characteristic of the conductive layer 204 can be based, at least in part, on the strain relief feature 206.
As shown in the example of
As further depicted in
In another example, the logic component 212 can convert the signal between analog and digital. In some instances, digital signals can be less sensitive to interferences than analog signals. For instance, interference is often analog. The analog interference can be filtered from the digital signal to reduce the signal-to-noise ratio.
In a further example, the logic component 212 can multiplex the signal to reduce the number of electrical conductors for communicating with the ECU 142. Accordingly, the size of the compliant circuit can be reduced. Correspondingly, the size of the handle 124 can be reduced, for instance to provide an ergonomic shape.
By conforming the compliant circuit 300 to the non-planar surface 322 (e.g., inner surface of the handle 324) the internal volume within the handle 324 can remain unobstructed by the compliant circuit 314. Accordingly, the compliant circuit 314 can save space within the handle 324, for instance, to accommodate irrigation tubing, pull wires, or the like.
In some examples, the compliant circuit 314 can be sized and shaped to conform with the non-planar surface 322. Adapting the shape of the compliant circuit 314 to fit along the non-planar surface 322 can increase the size of the compliant circuit 314 that will fit into the handle 324. For instance, a flat circuit can be located across a width (e.g., diameter) of the handle 324. The compliant circuit 314 can conform to the non-planar surface 322 (e.g., along the cross sectional perimeter or circumference of the handle 324), which provides for a greater surface area for the conformal circuit 314 to fit within the handle 324. Accordingly, the surface area of the compliant circuit 314 that fits into the handle 324 can be increased when the size and shape is adapted for the non-planar surface 322. Accordingly, the area used for routing signals (e.g., for traces) and for logic components 312 can be increased.
In some examples, at least a portion of the compliant circuit 314 can be attached to the non-planar surface 322. For instance, the compliant circuit 314, or at least a portion thereof, can be bonded to the non-planar surface 322 with an adhesive. The adhesive can include, but is not limited to, a pressure sensitive adhesive, a thermally activated adhesive, a photo activated adhesive, or other adhesive. In another example, at least a portion of the compliant circuit 314 can be insert molded into the non-planar surface 322. In a further example, the compliant circuit 314 can be thermally formed or thermally bonded to the non-planar surface 322.
The catheter 300 can be communicatively coupled with the shaft 302 and the electrical cable 318. In the example of
At the proximal end, the handle 324 can be communicatively coupled with the electrical cable 318. The electrical cable 318 can include a plurality of electrical conductors 320. The electrical cable 318 can include, or can be electrically coupled to, one or more flexible circuits 326. In the example of
In the example of
In some examples, the logic component 418 can be compliant. For instance, the logic component 418 can include a material characteristic that can stretch and comply with a non-planar shape. The semiconductor can include, but is not limited to, organic polymers (e.g., Poly (3-hexylthiophene), polydimethylsiozane, Poly (triarylamines)-Poly(bis04butylphenly-N,N-bisphenyl) benzidine), Ion gel (e.g., (Poly (3-hexylthiophene))), tri-block polymer (e.g., poly (styrene-b-methyl methacrylate-b-styrene), conductive polymer (e.g., poly[(4,8-bis-(2-ethylhexyloxy)-benzo(1,2-b:4,5-′dithiophene)-2,6-diyhalt-(4-(2-ethylhexanoyl)-thieno[3,4-b]thiophene-)2-6-diyl)] (PBDTTT-c) p-doped with the dopant tris-[1-(trifluoroethanoyl)-2-(trifluoromethyl)ethane-1,2-dithiolene] (Mo(tfd-COCF3)3), PMMA, polyvinly alcohol, Polydimethylsilozane, Polyacrylate, acrylaet monoers and oligomers, mercapto-esters and tetrahydrofurfuryl methacrylate), pentacene, a-sexithiophene, dihexyl pentathiophene, copper phthalocyanine, copper hexadecafluorophthalocyanine, poly(3-hexylthiophene) or other semiconductive material. Accordingly, the compliant circuit 400, including the logic components 418 therein, can be compliant to stretch and conform to a non-planar surface.
The logic component 418 can be included in, or configured as, a logic circuit or integrated circuit. In various examples, the logic component 418 can include, but is not limited to, an amplifier, multiplex circuit, transistor, diode, switch, analog-to-digital converter, isolator (filter), or other logic element. Accordingly, the logic component 418 can be embedded within the compliant circuit 400. In some examples, the logic component 418 can be embedded within the compliant circuit 400 and other logic components (e.g., a surface mount electronic component) can be attached (e.g., soldered) to the compliant circuit 400. In further examples, a plurality of logic components 418 can be stacked within the various layers (e.g., conductive and dielectric layers) of the compliant circuit 400. For instance, one or more logic components 418 can be located within inner layers or outer layers of the compliant circuit 400. Accordingly, the logic component 418 can be located above, below, or in between other logic components. By locating one or more logic components 418 within the inner layers of the compliant circuit 400, the overall size (e.g., surface area) of the compliant circuit 400 can be reduced as not all of the logic components need to be located on the outer layers of the compliant circuit 400.
In a further example, embedding the logic component 418 within the compliant circuit 400 can occupy less of the internal volume of the handle (e.g., handle 124, 324) than integrated circuit components attached to the exterior layers of the compliant circuit 400. For instance, logic components, such as surface mount integrated circuits, often can include connection interfaces (e.g., solder connections), overmolds, substrates, leads, and other components that sometimes facilitate a particular application of the logic component. By embedding the logic component 418 in the compliant circuit 400, the size of the logic component can be reduced. For example, the conductive layers 404, 406, 408 of the compliant circuit 400 can be used to electrically couple the logic component 418 to various electrical circuits within the compliant circuit 400, reducing or eliminating the need for leads, connection interfaces, or additional signal routing. In another example, the overmold or cover are unnecessary as the logic component 418 can be supported by a substrate 414. For instance, the substrate 414 can provide mechanical structure for the logic component 418 or for the compliant circuit 400 as a whole. In another example, an encapsulate 416 can protect the logic component 418, such as the semiconductor 410 and conductive layers 404, 406. In some examples, only the desired elements of the logic component 418 can be included in the compliant circuit 400 and unnecessary or duplicative elements can be omitted. Accordingly, the size of the compliant circuit 400 can be reduced or an increased number of logic components 418 can be included in the compliant circuit 400.
At 502, a compliant circuit can be disposed along a non-planar surface of the catheter handle. The non-planar surface can include the non-planar surface 522 as described herein. For instance, the compliant circuit can include any of the compliant circuits 200, 314, or 400 described herein. In some examples, the compliant circuit can include a dielectric layer having a dielectric material characteristic, such as the dielectric layer 202, 402. The compliant circuit can include a plurality of conductive layers, such as conductive layers 204, 404, 406, 408. For example, each conductive layer can include a conductive material characteristic. In various examples, the conductive layer can include a printable conductive polymer (e.g., a conductive ink), such as a compliant conductive ink having a material characteristic, such as the conductive material characteristic previously described herein. For instance, the conductive layer can be disposed on the dielectric layer using a process including, but not limited to, aerosol jet printing, inkjet printing, screen printing, valve jetting, photolithography & chemical processing, vapor deposition, fused deposition, stereolithography, digital light processing, or the like. In an example. For instance, a first layer including at least one dielectric layer or at least one conductive layer can be printed directly on the non-planar surface. A second layer of at least one dielectric layer or at least one conductive layer can be printed on the first layer or on subsequent layers.
In a further example, the conductive layer can include a strain relief feature, such as strain relief feature 206 as described herein. In a further example, the compliant circuit can include a first connection interface electrically coupled to at least one of the conductive layers and a second connection interface electrically coupled to at least one of the conductive layers.
In some examples, the compliant circuit can include one or more logic components, such as one or more of logic components 212, 312, or 418 as shown and described herein. In an example, the logic component can include a semiconductor, for instance, semiconductor 410 shown in
Disposing the compliant circuit on the non-planar surface can include, but is not limited to, insert molding the compliant circuit on to the non-planar surface or bonding the compliant circuit to the non-planar surface. For example, insert molding can include insert molding the catheter handle (e.g., the non-planar surface) to the compliant circuit. In some examples, bonding the compliant circuit to the non-planar surface can include, but is not limited to, attaching the compliant circuit to the non-planar surface with a pressure sensitive adhesive, a thermally activated adhesive, a photo activated adhesive, or other adhesive. In a further example, the compliant circuit can be thermally formed or thermally bonded to the non-planar surface.
At 504, the compliant circuit can be conformed to the non-planar surface. The non-planar surface can include any non-planar shape, such as an arcuate shape, angular shape, irregular shape, or other non-planar shape. As previously described herein, the compliant circuit can be conformable along a length and a width of the compliant circuit 200 based on the respective material characteristics of the various layers and elements of the compliant circuit as well as the compliant circuit 200 as a whole. In an example, the compliant circuit 200 can be bent or stretched along a first axis (e.g., X-axis 216), a second axis (e.g., Y-axis 218), or any combination thereof simultaneously based on the respective material characteristics of the compliant circuit 200. Accordingly, the compliant circuit 200 can conform to the non-planar surface. For instance, the compliant circuit can stretch and conform to the non-planar surface to take a shape that corresponds to a shape of the non-planar surface. Stated another way, the compliant circuit can be conformable to the non-planar surface. In some examples, a form can be used to dispose the compliant circuit on the non-planar surface. For instance, the form can include a shape that corresponds with the non-planar shape. The form can be used to stretch and conform the compliant circuit to the non-planar shape in situ or before the compliant circuit is disposed on the non-planar shape. For instance, the compliant circuit can be conformed to the non-planar shape and then attached to the non-planar surface of the catheter handle. In a further example, where the non-planar shape is insert molded to the compliant circuit, conforming the compliant circuit to the non-planar surface can include positioning the compliant circuit within a mold (e.g., prior to injection molding the catheter handle).
In further examples, the method 500 can include fabricating the compliant circuit. For instance, fabricating the compliant circuit can include disposing a conductive layer having a conductive material characteristic on a dielectric layer having a dielectric material characteristic. As described previously herein, fabricating the compliant circuit can include printing (e.g., aerosol jet printing) one or more dielectric layers or one or more conductive layers.
Although several examples have been described above with a certain degree of particularity, those skilled in the art could make numerous alterations to the disclosed examples without departing from the spirit of the present disclosure. It is intended that all matter contained in the above description or shown in the accompanying drawings shall be interpreted as illustrative only and not limiting. Changes in detail or structure can be made without departing from the present teachings. The foregoing description and following claims are intended to cover all such modifications and variations.
Various examples are described herein of various apparatuses, systems, and methods. Numerous specific details are set forth to provide a thorough understanding of the overall structure, function, manufacture, and use of the examples as described in the specification and illustrated in the accompanying drawings. It will be understood by those skilled in the art, however, that the examples can be practiced without such specific details. In other instances, well-known operations, components, and elements have not been described in detail so as not to obscure the examples described in the specification. Those of ordinary skill in the art will understand that the examples described and illustrated herein are non-limiting examples, and thus it can be appreciated that the specific structural and functional details disclosed herein can be representative and do not necessarily limit the scope of the examples, the scope of which is defined solely by the appended claims.
Reference throughout the specification to “various examples,” “some examples,” “one example,” “an example,” or the like, means that a particular feature, structure, or characteristic described in connection with the example is included in at least one example. Thus, appearances of the phrases “in various examples,” “in some examples,” “in one example,” “in an example,” or the like, in places throughout the specification are not necessarily all referring to the same example. Furthermore, the particular features, structures, or characteristics can be combined in any suitable manner in one or more examples. Thus, the particular features, structures, or characteristics illustrated or described in connection with one example can be combined, in whole or in part, with the features structures, or characteristics of one or more other examples without limitation.
It will be appreciated that the terms “proximal” and “distal” can be used throughout the specification with reference to a clinician manipulating one end of an instrument used to treat a patient. The term “proximal” refers to the portion of the instrument closest to the clinician and the term “distal” refers to the portion located furthest from the clinician. It will be further appreciated that for conciseness and clarity, spatial terms such as “vertical,” “horizontal,” “up,” and “down” can be used herein with respect to the illustrated examples. However, surgical instruments can be used in many orientations and positions, and these terms are not intended to be limiting and absolute.
Any patent, publication, or other disclosure material, in whole or in part, that is said to be incorporated by reference herein is incorporated herein only to the extent that the incorporated materials does not conflict with existing definitions, statements, or other disclosure material set forth in this disclosure. As such, and to the extent necessary, the disclosure as explicitly set forth herein supersedes any conflicting material incorporated herein by reference. Any material, or portion thereof, that is said to be incorporated by reference herein, but which conflicts with existing definitions, statements, or other disclosure material set forth herein will only be incorporated to the extent that no conflict arises between that incorporated material and the existing disclosure material.
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/US2019/034725 | 5/30/2019 | WO | 00 |
| Number | Date | Country | |
|---|---|---|---|
| 62678763 | May 2018 | US |
